Hunter WRCTX Users Manual
TOP VIEW
.360
.500
PINOUTS
LC SERIES TRANSMITTER MODULE DATA GUIDE
■ Remote control
■ Keyless entry
■ Garage / Gate openers
■ Lighting control
■ Medical monitoring / Call systems
■ Remote industrial monitoring
■ Periodic data transfer
■ Home / Industrial automation
■ Fire / Security alarms
■ Remote status / Position sensing
■ Long-range RFID
■ Wire Elimination
APPLICATIONS INCLUDE:
■ Low Cost
■ No External RF Components
Required
■ Ultra-low Power Consumption
■ Compact Surface-Mount Package
■ Stable SAW-based Architecture
■ Supports Data Rates to 5,000 bps
■ Wide Supply Range (2.7-5.2 VDC)
■ Direct Serial Interface
■ Low Harmonics
■ No Production Tuning
The LC Series is ideally suited for volume use
in OEM applications such as remote control,
security, identification, and periodic data
transfer. Packaged in a compact SMD package,
the LC transmitter utilizes a highly optimized
SAW architecture to achieve an unmatched
blend of performance, size, efficiency and cost.
When paired with a matching LC series
receiver, a highly reliable wireless link is
formed, capable of transferring serial data at
distances in excess of 300 Feet. No external RF
components, except an antenna, are required,
making design integration straightforward, even
for engineers lacking previous RF experience.
TXM-315-LC
TXM-418-LC
TXM-433-LC
PHYSICAL DIMENSIONS
DESCRIPTION:
FEATURES:
Revised 12/21/01
PART # DESCRIPTION
EVAL-***-LC Basic Evaluation Kit
MDEV-***-LC Master Development Kit
TXM-315-LC Transmitter 315 MHZ
TXM-418-LC Transmitter 418 MHZ
TXM-433-LC Transmitter 433 MHZ
RXM-315-LC Receiver 315 MHZ
RXM-418-LC Receiver 418 MHZ
RXM-433-LC Receiver 433 MHZ
*** Insert Frequency
Not covered in this manual
LC Transmitters are supplied in tube
packaging - 50 pcs.per tube.
ORDERING INFORMATION
Page 3
PERFORMANCE DATA– TXM-***-LC
Page 2
Parameter
LCTX 418MHz Designation Min. Typical Max. Units Notes
Frequency of Carrier F
C
417.925 418 418.075 MHz –
Harmonic Emissions P
H
– – -40 dBc 4
Parameter
LCTX 315MHz Designation Min. Typical Max. Units Notes
Frequency of Carrier F
C
314.925 315.0 315.075 MHz –
Harmonic Emissions P
H
––-40 dBc 4
Parameter
LCTX 433MHz Designation Min. Typical Max. Units Notes
Frequency of Carrier F
C
433.845 433.92 433.995 MHz –
Harmonic Emissions P
H
––-45 dBc 4
figure 1:Test/Basic application circuit
ABOUT THESE MEASUREMENTS
The performance parameters listed
below are based on module
operation at 25°C from a 3.3Vdc
supply unless otherwise noted.
Figure 1 at the right illustrates the
connections necessary for testing
and operation. It is recommended
that all ground pins be connected
to the groundplane.
Absolute Maximum Ratings:
Supply voltage VCC, using pin 7 -0.3 to +6 VDC
Operating temperature -30°C to +70°C
Storage temperature -45°C to +85°C
Soldering temperature +225°C for 10 sec.
Any input or output pin -0.3 to V
CC
*NOTE* Exceeding any of the limits of this section may lead to
permanent damage of the device. Furthermore, extended operation at
these maximum ratings may reduce the life of this device.
1. Current draw with data pin held continuously high.
2. Current draw with 50% mark/space ratio.
3. Current draw with data pin low.
4. RF out connected to 50Ω load.
5, Ladj (pin 4) through 430Ω resistor.
Notes:
Parameters
LCTX 433, 418, 315MHz Designation Min. Typical Max. Units Notes
Operating V oltage Range V
CC
2.7 – 5.2 Volts –
Current Continuous I
CC
– 3.0 6.0 mA 1, 5
Current Average I
CA
– 1.5 – mA 2, 5
Current In Sleep I
SLP
–– 1.5 µA 3
Data Input Low V
IL
0 – 0.4 Volts –
Data Input High V
IH
2.5 – V
CC
Volts –
Oscillator Start-up Time T
OSU
–– 80 µS 4
Oscillator Ring-down Time T
ORD
––100 nSec 4
Output Power P
O
-4 0 +4 dBm 4
0
-1
-4
-5
-6
-7
2.5
3.0
3.5
4.0 4.5
-2
-3
SUPPLY VOLTAGE
+1
+3
+2
+4
+5
+6
+7
+8
5.0
(V)
2.5
3.0
3.5
4.04.0 4.54.5
5.0
(V)(V)
SUPPLY VOLTAGESUPPLY VOLTAGE
1
3
2
4
5
6
7
8
9
10
11
12
0
With 430Ω resistor at Iadj (pin)
With Iadj tied to ground
Supply Current (mA)
0
-1
-4
-5
-6
-7
2.5
3.0
3.5
4.0 4.54.5
-2
-3
SUPPLY VOLTAGESUPPLY VOLTAGE
+1+1
+3+3
+2
+4+4
+5+5
+6+6
+7+7
+8+8
5.0
(V)
dBm
With 430Ω resistor at Iadj (pin)
With Iadj tied to ground
pg
Output Power
figure 4: Typical Oscillator
Turn-On Time
figure 2: Consumption vs. Supply Voltage
TYPICAL PERFORMANCE GRAPHS
figure 5: Typical Oscillator
Turn -Off Ti me
figure 3: Typical RF power into 50Ω
Data
Carrier
Data
Carrier
Page 5
PRODUCTION GUIDELINES
The LC modules are packaged in a hybrid SMD package which has been
designed to support hand- or automated-assembly techniques.Since LC devices
contain discrete components internally, the assembly procedures are critical to
insuring the reliable function of the LC product.The following procedures should
be reviewed with and practiced by all assembly personnel.
PAD LAYOUT
The following pad layout diagrams are designed to facilitate both hand and
automated assembly.
TRANSMITTER HAND ASSEMBLY
The LC transmitter's primary mounting
surface is eight pads located on the bottom
of the module. Since these pads are
inaccessible during mounting, castellations
that run up the side of the module have
been provided to facilitate solder wicking to
the module's underside. If the recommended pad placement (Rev.2) has been
followed, the pad on the board will extend
slightly past the edge of the module.Touch
both the PCB pad and the module
castellation with a fine soldering tip. Tack
one module corner first, then work around
the remaining attachment points using
care not to exceed the solder times listed
below.
Absolute Maximum Solder Times
Hand-Solder Temp. TX +225°C for 10 Sec.
Hand-Solder Temp. RX +225°C for 10 Sec.
Recommended Solder Melting Point +180°C
Reflow Oven: +220° Max. (See adjoining diagram)
figure 7: Suggested Pad Layout
Figure 8: LC-TX Soldering Technique
0.100"
0.310"
0.100"
0.070"
.100
0.150
.070
0.775
TX Layout Pattern Rev. 2
(Not to Scale)
LC-P RX Layout Pattern Rev. 3
Pinned SMD Version
(Not to Scale)
LC-S RX Layout Rev. 1
Compact SMD Version
(Not to Scale)
Page 4
TRANSMITTER AUTOMATED ASSEMBLY
For high-volume assembly most users will want to auto-place the modules. The
modules have been designed to maintain compatibility with most pick-and-place
equipment; however, due to the module's hybrid nature certain aspects of the
automated assembly process are far more critical than for other component
types.
Following are brief discussions of the three primary areas where caution must be
observed.
Reflow T emperature Profile
The single most critical stage in the automated assembly process is the reflow
process. The reflow profile below should be closely followed since excessive
temperatures or transport times during reflow will irreparably damage the
modules. Assembly personnel will need to pay careful attention to the oven's
profile to insure that it meets the requirements necessary to successfully reflow
all components while still meeting the limits mandated by the modules
themselves.
Shock During Reflow Transport
Since some internal module components may reflow along with the components
placed on the board being assembled, it is imperative that the module not be
subjected to shock or vibration during the time solder is liquidus.
Washability
The modules are wash resistant, but are not hermetically sealed. They may be
subject to a standard wash cycle;howev er, a twenty-four-hour drying time should
be allowed before applying electrical power to the modules. This will allow any
moisture that has migrated into the module to evaporate, thus eliminating the
potential for shorting during power-up or testing.
figure 6: Required reflow profile
0.065"
0.610"
0.100"
0.070"
300
°C
250
200
Temperature
150
100
50
Ideal Curve
Limit Curve
125°C
Preheat Zone
Ramp-up
1-1.5 Minutes
0
30 90 150 210 270 330 360
2-2.3 Minutes
600
Forced Air Reflow Profile
220°C
210°C
180°C
Reflow Zone
Soak Zone
2 Minutes Max.
120 180 240 300
20-40 Sec.
Cooling
Time (Seconds)
Soldering Iron
Tip
Solder
PCB Pads
Castellations
Loading...