Hunter WRCTX Users Manual

TXM-315-LC

TXM-418-LC

TXM-433-LC

LC SERIES TRANSMITTER MODULE DATA GUIDE

DESCRIPTION:

The LC Series is ideally suited for volume use in OEM applications such as remote control, security, identification, and periodic data transfer. Packaged in a compact SMD package, the LC transmitter utilizes a highly optimized SAW architecture to achieve an unmatched blend of performance, size, efficiency and cost. When paired with a matching LC series receiver, a highly reliable wireless link is formed, capable of transferring serial data at distances in excess of 300 Feet. No external RF components, except an antenna, are required, making design integration straightforward, even for engineers lacking previous RF experience.

PHYSICAL DIMENSIONS

.360

.500

TOP VIEW

	FEATURES:			PINOUTS
	■	Low Cost	■	Supports Data Rates to 5,000 bps
	■	No External RF Components	■	Wide Supply Range (2.7-5.2 VDC)
		Required	■	Direct Serial Interface
	■	Ultra-low Power Consumption
			■	Low Harmonics
	■	Compact Surface-Mount Package
				No Production Tuning
	■	Stable SAW-based Architecture	■

APPLICATIONS INCLUDE:

■Remote control

■Keyless entry

■Garage / Gate openers

■Lighting control

■Medical monitoring / Call systems

■Remote industrial monitoring

■Periodic data transfer

■Home / Industrial automation

■Fire / Security alarms

■Remote status / Position sensing

■Long-range RFID

■Wire Elimination

ORDERING INFORMATION

PART #	DESCRIPTION
EVAL-***-LC	Basic Evaluation Kit
MDEV-***-LC	Master Development Kit
TXM-315-LC	Transmitter 315 MHZ
TXM-418-LC	Transmitter 418 MHZ
TXM-433-LC	Transmitter 433 MHZ
RXM-315-LC	Receiver 315 MHZ
RXM-418-LC	Receiver 418 MHZ
RXM-433-LC	Receiver 433 MHZ

*** Insert Frequency

Not covered in this manual

LC Transmitters are supplied in tube packaging - 50 pcs. per tube.

Revised 12/21/01

PERFORMANCE DATA– TXM-***-LC

ABOUT THESE MEASUREMENTS

The performance parameters listed

below are based on module operation at 25°C from a 3.3Vdc supply unless otherwise noted. Figure 1 at the right illustrates the

connections necessary for testing and operation. It is recommended

that all ground pins be connected to the groundplane.

figure 1: Test/Basic application circuit

Parameters
LCTX 433, 418, 315MHz	Designation	Min.		Typical	Max.	Units	Notes
Operating Voltage Range	VCC	2.7		–	5.2	Volts	–
Current Continuous	ICC	–		3.0	6.0	mA	1, 5
Current Average	ICA	–		1.5	–	mA	2, 5
Current In Sleep	ISLP	–		–	1.5	µA	3
Data Input Low	VIL	0		–	0.4	Volts	–
Data Input High	VIH	2.5		–	VCC	Volts	–
Oscillator Start-up Time	TOSU	–		–	80	µS	4
Oscillator Ring-down Time	TORD	–		–	100	nSec	4
Output Power	PO	-4		0	+4	dBm	4
Parameter
LCTX 315MHz	Designation	Min.		Typical	Max.	Units	Notes
Frequency of Carrier	FC	314.925		315.0	315.075	MHz	–
Harmonic Emissions	PH	–		–	-40	dBc	4
Parameter
LCTX 418MHz	Designation	Min.		Typical	Max.	Units	Notes
Frequency of Carrier	FC	417.925		418	418.075	MHz	–
Harmonic Emissions	PH	–		–	-40	dBc	4
Parameter
LCTX 433MHz	Designation	Min.		Typical	Max.	Units	Notes
Frequency of Carrier	FC	433.845		433.92	433.995	MHz	–
Harmonic Emissions	PH	–		–	-45	dBc	4

Notes:

1.Current draw with data pin held continuously high.

2.Current draw with 50% mark/space ratio.

3.Current draw with data pin low.

4.	RF out connected to 50Ω	load.
5,	Ladj (pin 4) through 430Ω	resistor.

Absolute Maximum Ratings:
Supply voltage VCC, using pin 7	-0.3	to	+6 VDC
Operating temperature	-30°C	to	+70°C
Storage temperature	-45°C	to	+85°C
Soldering temperature	+225°C for 10 sec.
Any input or output pin	-0.3	to	VCC

*NOTE* Exceeding any of the limits of this section may lead to permanent damage of the device. Furthermore, extended operation at these maximum ratings may reduce the life of this device.

TYPICAL PERFORMANCE GRAPHS

		12
		11
	(mA)	10
		9
	Current	8
		5
		7
		6
	Supply	4
		3
		2
		1
		0

2.5

3.0

3.5

4.0

4.5

5.0 (V)

SUPPLY VOLTAGE

With Iadj tied to ground

With 430Ω resistor at Iadj (pin)

figure 2: Consumption vs. Supply Voltage

	+8
	+7
	+6
	+5
Power	+4
	+3
	+2
Output	+1
	-2
	0
	-1
	-3
	-4				dBm
	-5
	-6
	-7
	2.5			3.0	3.5	4.0	4.5	5.0	(V)

SUPPLY VOLTAGE

With Iadj tied to ground

With 430Ω resistor at Iadj (pin)

figure 3: Typical RF power into 50Ω

Data

figure 4: Typical Oscillator Turn-On Time

Carrier

Data

figure 5: Typical Oscillator

Turn-Off Time

Carrier

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TRANSMITTER AUTOMATED ASSEMBLY

For high-volume assembly most users will want to auto-place the modules. The modules have been designed to maintain compatibility with most pick-and-place equipment; however, due to the module's hybrid nature certain aspects of the automated assembly process are far more critical than for other component types.

Following are brief discussions of the three primary areas where caution must be observed.

Reflow Temperature Profile

The single most critical stage in the automated assembly process is the reflow process. The reflow profile below should be closely followed since excessive temperatures or transport times during reflow will irreparably damage the modules. Assembly personnel will need to pay careful attention to the oven's profile to insure that it meets the requirements necessary to successfully reflow all components while still meeting the limits mandated by the modules themselves.

Shock During Reflow Transport

Since some internal module components may reflow along with the components placed on the board being assembled, it is imperative that the module not be subjected to shock or vibration during the time solder is liquidus.

300			Ideal Curve		Forced Air Reflow Profile
° C			Limit Curve
250					220° C
200					210° C
					180° C
Temperature
150	125° C					Reflow Zone
100				Soak Zone		20-40 Sec.
				2 Minutes Max.
50			Preheat Zone
	Ramp-up		2-2.3 Minutes							Cooling
0	1-1.5 Minutes
0	30	60	90	120	150	180	210	240	270	300	330	360

Time (Seconds)

figure 6: Required reflow profile

Washability

The modules are wash resistant, but are not hermetically sealed. They may be subject to a standard wash cycle; however, a twenty-four-hour drying time should be allowed before applying electrical power to the modules. This will allow any moisture that has migrated into the module to evaporate, thus eliminating the potential for shorting during power-up or testing.

PRODUCTION GUIDELINES

The LC modules are packaged in a hybrid SMD package which has been designed to support handor automated-assembly techniques. Since LC devices contain discrete components internally, the assembly procedures are critical to insuring the reliable function of the LC product. The following procedures should be reviewed with and practiced by all assembly personnel.

PAD LAYOUT

The following pad layout diagrams are designed to facilitate both hand and automated assembly.

TX Layout Pattern Rev. 2

LC-P RX Layout Pattern Rev. 3

(Not to Scale)

Pinned SMD Version

0.100"

(Not to Scale)

0.150

.100

0.310"

0.100"

.070

0.775

0.070"

LC-S RX Layout Rev. 1

Compact SMD Version

(Not to Scale)

0.065"

0.610"

0.070"

0.100"

figure 7: Suggested Pad Layout

TRANSMITTER HAND ASSEMBLY

The LC transmitter's primary mounting surface is eight pads located on the bottom of the module. Since these pads are inaccessible during mounting, castellations that run up the side of the module have been provided to facilitate solder wicking to the module's underside. If the recommended pad placement (Rev.2) has been followed, the pad on the board will extend slightly past the edge of the module. Touch both the PCB pad and the module castellation with a fine soldering tip. Tack one module corner first, then work around the remaining attachment points using care not to exceed the solder times listed below.

Soldering Iron

Tip

Solder

PCB Pads		Castellations

Figure 8: LC-TX Soldering Technique

Absolute Maximum Solder Times

Hand-Solder Temp. TX +225°C for 10 Sec. Hand-Solder Temp. RX +225°C for 10 Sec. Recommended Solder Melting Point +180°C Reflow Oven: +220° Max. (See adjoining diagram)

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