Huawei G610-U15 Maintenance Manual

G610-U15 Smartphone

Maintenance Manual

Issue

1.0

Date

2013-04-22

HUAWEI TECHNOLOGIES CO., LTD.

Issue 1.0 (2013-04-22)

Huawei Proprietary and Confidential

i

No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd.

Trademarks and Permissions

and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.

All other trademarks and trade names mentioned in this document are the property of their respective holders.

Notice

The purchased products, services and features are stipulated by the contract made between Huawei and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied.

The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.

Address:

Huawei Industrial Base Bantian, Longgang Shenzhen 518129 People's Republic of China

Website:

http://www.huawei.com

Email:

support@huawei.com

G610-U20 Smartphone Maintenance Manual

About This Document

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Author

Prepared by

Tian Haitao

Date

2013-04-22

Reviewed by

Date

Approved by

Date

Version

Change Reason

Changed Section

Description

Author

About This Document

Change History

G610-U20 Smartphone Maintenance Manual

Contents

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Contents

About This Document .........................................................................................................................ii

1 Product Overview .............................................................................................................................. 1

1.1 Appearance ................................................................................................................................................................... 1

1.2 Product Specifications .................................................................................................................................................. 2

2 Applicable Scope and Precautions ................................................................................................ 3

2.1 Applicable Scope .......................................................................................................................................................... 3

2.2 Precautions .................................................................................................................................................................... 3

3 Exploded View.................................................................................................................................... 4

4 Component Layout ............................................................................................................................ 6

4.1 Main Board Components .............................................................................................................................................. 6

4.2 Speaker Sub-Board Components .................................................................................................................................. 9

4.3 Proximity Sensor FPC Components ........................................................................................................................... 10

4.4 Speaker FPC Components .......................................................................................................................................... 11

4.5 Component Lists ......................................................................................................................................................... 11

4.5.1 Main Board Components ......................................................................................................................................... 11

4.5.2 Speaker FPC Components ....................................................................................................................................... 14

4.5.3 Proximity Sensor FPC Components ........................................................................................................................ 15

4.5.4 Speaker FPC Components ....................................................................................................................................... 15

5 Software Upgrade ............................................................................................................................ 17

5.1 Upgrade Preparation ................................................................................................................................................... 17

5.2 Precautions .................................................................................................................................................................. 17

5.3 Installing the USB Driver ........................................................................................................................................... 18

5.4 Upgrading a Phone...................................................................................................................................................... 18

5.4.1 Performing a USB Upgrade ..................................................................................................................................... 18

5.4.2 Performing a mircoSD card Upgrade....................................................................................................................... 23

5.4.3 Upgrading Phones Simultaneously .......................................................................................................................... 27

5.5 Troubleshooting .......................................................................................................................................................... 32

6 Maintenance Tools .......................................................................................................................... 33

7 Disassembly Procedure .................................................................................................................. 35

8 Assembly Procedure........................................................................................................................ 39

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9 Circuit and Failure Analysis ......................................................................................................... 43

9.1 Solution Introduction .................................................................................................................................................. 43

9.2 Baseband Subsystem................................................................................................................................................... 44

9.2.1 Startup Management Circuit .................................................................................................................................... 44

9.2.2 Charging Management Circuit ................................................................................................................................. 50

9.2.3 Clock Circuit ............................................................................................................................................................ 55

9.2.4 Memory Circuit........................................................................................................................................................ 58

9.3 RF Subsystem ............................................................................................................................................................. 59

9.3.1 Overall Introduction ................................................................................................................................................. 59

9.3.2 Transmit Channel ..................................................................................................................................................... 63

9.3.3 GPS Channel ............................................................................................................................................................ 65

9.3.4 Wi-Fi Channel .......................................................................................................................................................... 66

9.4 Peripheral Circuits ...................................................................................................................................................... 67

9.4.1 LCD Circuit ............................................................................................................................................................. 67

9.4.2 Touchscreen Circuit ................................................................................................................................................. 70

9.4.3 Front Camera Circuit ............................................................................................................................................... 72

9.4.4 Rear Camera Circuit ................................................................................................................................................ 74

9.4.5 G-Sensor Circuit ...................................................................................................................................................... 76

9.4.6 Light Sensor Circuit ................................................................................................................................................. 78

9.4.7 Key Circuit............................................................................................................................................................... 79

9.4.8 Motor Circuit ........................................................................................................................................................... 81

9.4.9 Receiver Circuit ....................................................................................................................................................... 82

9.4.10 Microphone Circuit ................................................................................................................................................ 84

9.4.11 Speaker Circuit....................................................................................................................................................... 86

9.4.12 Headset Circuit ...................................................................................................................................................... 88

9.4.13 SIM Card Circuit ................................................................................................................................................... 90

9.4.14 microSD Card Circuit ............................................................................................................................................ 92

9.4.15 USB Port Circuit .................................................................................................................................................... 94

9.4.16 Wi-Fi Module Circuit............................................................................................................................................. 96

9.4.17 Bluetooth Circuit.................................................................................................................................................... 98

9.4.18 GPS Circuit ............................................................................................................................................................ 99

9.4.19 FM Circuit ........................................................................................................................................................... 100

10 Solder Points on the PCB and BGA Chips ............................................................................ 103

11 Functional Tests ........................................................................................................................... 105

11.1 Keys ........................................................................................................................................................................ 105

11.2 MMI Test................................................................................................................................................................. 105

11.2.2 Voice Call Test ..................................................................................................................................................... 107

G610-U20 Smartphone Maintenance Manual

1 Product Overview

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1.1 Appearance

Figure 1-1 G610-U15

1 Product Overview

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1 Product Overview

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1.2 Product Specifications

Item

Description

Dimensions

141.5 mm x 73.6 mm x 9.9 mm (5.57 in. x 2.90 in. x

0.39 in.)

Technical standard

UMTS/GSM

Frequency bands

GSM: 850/1800/1900 MHz UMTS: 850/1900 MHz

Weight

About 180 g (with battery)

Type

Bar type with touchscreen

Antenna

Built-in

UIM

Standard SIM card

Power supply

5 V, 1 A

Battery

2150 mAh Li-polymer battery

Standby time: more than 120 hours Talk time: more than 180 minutes (network

dependent)

Display

Resolution

540 x 960 pixels

LCD type

TFT

Color

16.7M

LCD size

5 inches

Interfaces

Charging interface

Micro USB port

USB interface

Micro USB port

microSD card interface

microSD card slot Headset interface

3.5 mm headset jack

Maximum transmit power

B2/5:24 dBm(wired) G850:33dBm(wired) G1800/1900:30dBm(wired)

Static sensitivity

<-108 dBm (wired); BER ≤ 0.001 (UE)

Temperature

Operating temperature: –10°C to +45°C Storage temperature: –40°C to +70°C

Humidity

Operating humidity: 5% to 95% RH

Table 1-1 G610-U15 specifications

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2 Applicable Scope and Precautions

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2 Applicable Scope and Precautions

2.1 Applicable Scope

This document provides maintenance instructions for technical support at Huawei authorized service centers. Being Huawei proprietary, this document is accessible only for authorized service centers. Although every effort was made to ensure the accuracy of the document, errors may still exist. If you find any errors or have any suggestions, please report them through Huawei service platform ComPartner.

2.2 Precautions

To obtain product and maintenance information, visit the Huawei service website. It is highly recommended that you install the Huawei service platform ComPartner.

To obtain the ComPartner installation package, visit http://support.huaweidevice.com/service/, search for ComPartner. You will find the ComPartner installation package.

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3 Exploded View

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Figure 3-1 G610-U15 exploded view

3 Exploded View

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3 Exploded View

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The components listed in Table 3-1 are structural parts of the phone and cannot be used as

No.

Name

Description

Quantity

1

TP

G610 TP

1 2 LCD

G610 LCD

1

3

Front cover assembly

G610 front cover assembly

1 4 Receiver

G610 receiver

1

5

Proximity sensor FPC

G610 proximity sensor FPC

1 6 Front camera

G610 front camera

1

7

Speaker sub-board

G610 speaker sub-board

1

8

Main board

G610 main board

1

9

Rear camera

G610 rear camera

1

10

Rear cover assembly

G610 rear cover assembly

1

11

Battery

G610 battery

1

12

Battery cover assembly

G610 battery cover assembly

1

reference when requesting spare parts.

Table 3-1 Components in the exploded view

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4 Component Layout

4.1 Main Board Components

Figure 4-1 Components on side A of the main board

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J902 USB connector

Fault symptom: charging

failure or USB detection

failure

U2403 RF multi-functional

component:

Fault symptom: signal

reception failure

X700 26 MHz crystal

oscillator

Fault symptom: startup

failure

U700 TD-WCDMA baseband

processing IC

Fault symptom: signal reception

failure

LCD backlightshielding

case

Fault symptom: LCD failure

Q302 triode

Fault symptom: charging

failure

U201 PM IC

Fault symptom: startup

failure

U2200 4-in-1 chip Fault

symptom: FM, Wi-Fi,

Bluetooth, and GPS

failures

J1101 headset

connector

Fault symptom: headset

failure

J1001 front camera

connector

Fault symptom: front

camera failure

U1801 memory

Fault symptom: startup

failure

J1502, J1503, J1504， and

J1501 power and volume

keys

Fault symptom: startup

failure and volume key

failure

J901 battery connector Fault symptom: startup

failure

U401 processor

Fault symptom: startup

failure

Figure 4-2 Components on side B of the main board

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Main antennapad Fault symptom:Signal

J1301 LCD Connector,Fault symptom:LCD

J808 SPK Sub board connector,Fault

SD Connector, Fault symptom:SD

GPSshielding： case fault symptom:GPS

J2301 WIFI GPS antenna springs Fault

Microphone Fault symptom:Sound collection failure

SIM Connector, Fault symptom:SIM

J1002 camera connector, Fault symptom:rear

J801 Proximity sensor FPC connector Fault

J1501 TP conneetor Fault

symptom:：TP

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4.2 Speaker Sub-Board Components

U101 motor

Fault symptom:

motor failure

J101 speaker sub-

board connector

Fault symptom:

speaker failure and

motor failure

D101, D102, and D103

LEDs

Fault symptom: LED

failure

Figure 4-3 Components on side A of the speaker sub-board

Figure 4-4 Components on side B of the speaker sub-board

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4.3 Proximity Sensor FPC Components

U101 proximity sensor

Fault symptom: proximity

sensor failure

D101 tri-color LED

Fault symptom: tri-

color LED failure

J101 BTB connector

Fault symptom: tri-color LED

failure and proximity sensor

failure

Figure 4-5 Components on side A of the proximity sensor FPC

Figure 4-6 Component on side B of the proximity sensor FPC

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4.4 Speaker FPC Components

J101 and J102 BTB

connectors

Fault symptom: motor

failure and speaker failure

PN

Description

Component

03022BTG

G610-U00,HD1G610MG,G610 WCDMA Handset Main Board,Plan G,2*1

03010URW

UMTS G610,HD1G610M,G610 Handset Main Board,2*1

15010397

Schottky Barrier Diode,40V,1A,0.6V,SOD1608,5A,Terminal Dedicated

D1301

14240460

BTB Connector,female,10Pin,0.4mm,0.9mm,SMT,Terminal Dedicated

J801 and J808

14240582

Card Socket,Battery connector,4PIN,Mid Mount,Side Contact,2.50mm,With Plastic Peg,0.50mm,Terminal Dedicated

J901 14240656

IO Connector,Micro_B Type Female,5pins,Side Plugging Type,SMT,4 Dip,above PCB,Terminal Dedicated

J902

Figure 4-7 Components on the speaker FPC

4.5 Component Lists

4.5.1 Main Board Components

Table 4-1 Components on the main board

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14240181

BTB Connector,Female,24Pin,0.4mm,SMT,Mating Height 1.0mm,Terminal Dedicated

J1001 and J1002

14240663

Headphone Connector,12.6*6.7*4.2,6pin,arc,SMT,cambered surface

2.5mm under board,Terminal Dedicated

J1101 14240496

BTB Connector,Female,24Pin,0.4mm,SMT,Mating Height 0.8mm,Terminal Dedicated

J1301

14240155

Card Socket Connector,SIM Card Socket,6pin,Horizontal,2.54mm,Without Lock,Without Hold Peg,Height 0.95mm,Terminal Dedicated

J1401 and J1402

14240303

Card Block Connector,Micro-SD,8,PUSH-PULL,1.1mm,Detect PIN

J1403

51621023 108-5785,Ground Spring,U1250

J1501, J1502, J1503, and J1504

14240226

BTB Connector,Female,50Pin,0.4mm,Mating Height

1.0mm,SMT,Width 3.74mm After Mating,Terminal Dedicated

J1506 51621024

WN9149-N83-7F-W,Antenna Spring,U1250

J1601, J1602, and J1610

51621274 DKBA8.382.0615,Main Antenna SMT Spring,C5600

J1611, J2301, J2302, J3202, J3203, and J3204

14240004

Coaxial Connector,RF Switch,Straight,Female,SMT,Terminal Dedicated

J3201

10100565

Terminal Power Inductor,0.68uH,+/-20%,1.8A,0.06ohm,2.0*2.0*1.2mm,S PL0202D,2.9A,Terminal Dedicated

L201, L202, and L203

10070019 EMI beads,+/-25%,1000ohm,1.25ohm,0.25A,0402

LB1303, LB1304, and LB1305

15020175

LED,180cd,white,350mA,2.0mm*1.6mm*0.7mm,Termin al Dedicated

LED301

22050091 Microphone,-44dB.,D4*1.5mm,wideband,terminal

MIC1101 and MIC1102

15060238

MOSFET,N Channel,20V,0.7A,530mohm,6V,SC,75

Q201 and Q901

15050211

Transistor,PNP,20V,2.5A,545mW,320mV,TSOP-6,100S, Terminal Dedicated

Q302

12070061

Temperature Compensated Oscillator,26MHz,+/-1.5ppm(max),+1.8V,+/-0.5ppm(ma x),-40degC,85degC,Terminal Dedicated

TCXO2200

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39200503

Terminal Baseband process IC,PMIC,Input range:3.4-4.3V;Charger input of up to 10V,TFBGA

U201

39200524

Terminal Baseband process IC,WSCDMA/GSM BASEBAND PROCESSOR MT6589M,1.2V/1.8V/2.8V/3.3V,TFBGA-515,Terminal Dedicated

U401

39200510

Terminal Baseband process IC,WCDMA/HSDPA/HSUPA RF transceiver MT6167,1.2V /1.8V/ 2.8V RF,HBGA-Terminal Dedicated

U700

38140098

Semiconductor Sensor,Accelerometer,LGA,3axis,Terminal Dedicated

U1201

39110762

Switching Regulators,dual channel backlight driver,2.7V~6.5V,30mA*2,1.2MHz,CSP-9L,Terminal Dedicated

U1301 43140187

Interface Controller,TP IC,2.85V,UFBGA60, Terminal Dedicated

U1501

40060486

MCP,4GB(x8) eMMC,52MHz,1024KB,3.3V/1.8V,FBGA162,8Gb(x32) LPDDR2,G610 Dedicated,Terminal Dedicated

U1801 39110756

Switching Regulators,DC/DC buck,2.5V~5.5V,Voadj,1.2A,DFN/QFN

U2001

39210101

Terminal Baseband process IC,WLAN-BT-GPS-FM Transmitter and Receiver,2.3~5.5V,151pin WLCSP, Terminal Dedicated

U2200

47990034

RF Impedance Converter,50:50 Balun,2300MHz~2700MHz,50:50,1.2dB max.,0.5W,1608SMD,Terminal Dedicated

U2301 47090053

RF LNA,1575MHz,14dB min.,1.6dB max.,SOT886,Terminal Dedicated

U2302

47150274

RF Multi-Functional Component,Linear EDGE PAM(Polar GPRS(2Tx+6TRx),824~849MHz/880~915MHz/1710~17 85MHz/1850~1910MHz,QFN,Terminal Dedicated

U3201

12020125

Crystal,0.032768MHz,12.5pF+/-30ppm,60/80kohm,3.2*1 .5 SMD,Terminal Dedicate,ELOM,TS16949

X301

12020268

Crystal Oscillitor,26MHz,7.5pF,+/-10ppm,30ohm,3225,Terminal Dedicated

X700 15040393

Transient Suppression Diode,6V,25V,0.1w,3A,400um 15pin SMT,Terminal Dedicated

Z1401

13030067

Ceramic Filter,2450MHz,1.8dB,20125,Terminal Dedicated

Z2301

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13010180

SAW filter,1575.42MHz,0.9dB,1.4*1.1mm,for terminal using only

Z2302

13080106

Duplexer,1565~1607MHz/2400~2500MHz,0.8dB./0.9dB .,13dB./18dB,1608,Terminal Dedicated

Z2303 51624486

DKBA80200824,G610U-Shielding-Cpu-Frame,G610U

J1609

51624490

DKBA80200828,G610U-Shielding-PMU-Frame,G610U

J1608

51624492

DKBA80200830,G610U-Shielding-LCD LDO-Case,G610U

J1603 51624493

DKBA80200831,G610U-Shielding-GPS-Case,G610U

J1605

51624494

DKBA80200842,G612C-Shielding-Charge-Case,G610U

J1606

51624587

DKBA80201219,g610TD-Shielding-rf-Frame,G610

J1607

51624589

DKBA80201221, G610TD-Shielding-RF-Cover-2,G610TD

J1612 51624495

DKBA80200970,G610C-Shielding-B2B-Case,G610C

J1604

13080175

Duplexer,1850~1910MHz;1930~1990MHz;,3dB.,3.7dB., 45dB.,2016,Terminal Dedicated

U3302

47100621

RF Power Amplifying Module,1850~1920MHz,28dB typ. at Pout=27.5dBm for LTE,28.5dBm,QFN,Terminal Dedicated

U3301 13080136

Duplexer,824~849MHz/869~894MHz,2.3dB.,2.5dB.,55d B./50dB.,2016,Terminal Dedicated-Balance

U3402

47100596

RF Power Amplifying Module,815~849MHz,28dB typ. at Pout=28.25dBm for WCDMA,28.25dBm,QFN,Terminal Dedicated

U3401 13010258

1842.5MHz/1960MHz,2.8dB/3.0dB,50V,1814,Terminal Dedicated

Z3504

PN

Description

Component

15020099

LED,0.045cd,White,5mA,0603,SMD,Terminal Dedicated

D101, D102, and D103

15040311

Transient Suppression Diode,6V,12V,50W,5A,SOD923

D104 and D105

14240460

BTB Connector,female,10Pin,0.4mm,0.9mm,SMT,Terminal Dedicated

J101

4.5.2 Speaker FPC Components

Table 4-2 Components on the speaker FPC

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10100135

Mobile Dedicated,Chip Inductor,

0.082uH,+/-5%,0.05A,3.50ohm,0201,Chip Inductor,Mobile Dedicated

L101, L102, L103, L104, L105, and L106

10100044

Terminal Chip Inductor,0.082uH,+/-5%,0.15A,2.4ohm,0402,750000000 Hz,Multilayer Inductor,Terminal Dedicated

L107

10100047

Terminal Chip Inductor,0.068uH+/-5%,0.6A,0.34ohm,0603,1700000000 Hz,Wire Wound Inductor,Terminal Dedicated

L108 and L109

32050032

Oscillating Motor,SMT,2.7,75A,14000rpm,11mm*4.4mm*3.6mm,N ull,28ohm

U101

PN

Description

Component

08070704

Chip Multilayer Ceramic Capacitor,6.3V,100nF,+/-10%,X5R,0201,TS16949

C101

08070752

Chip Multilayer Ceramic Capacitor,6.3V,0.22uF,+/-20%,X5R,0201,Terminal Dedicated

C102 15020111

LED,0.05cd/0.1cd/0.18cd,B(470)R(632)G(525)nm,20mA ,SMD,Terminal Dedicated

D101

14240459

BTB Connector,male,10Pin,0.4mm,0.9mm,SMT,Terminal Dedicated

J101 38140032

Semiconductor Sensor,APS/ALS/IR Sensor,QFN8,Terminal Dedicated

U101

PN

Description

Component

14240459

BTB Connector,male,10Pin,0.4mm,0.9mm,SMT,Terminal Dedicated

J101 and J102

4.5.3 Proximity Sensor FPC Components

Table 4-3 Components on the proximity sensor FPC

4.5.4 Speaker FPC Components

Table 4-4 Components on the speaker FPC

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These component lists are for your reference only and subject to changes without notices. The latest component lists are available in Huawei's BOM information system. If you have any questions, contact technical support in your region.

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5.1 Upgrade Preparation

Item

Description

Remarks

Upgrade environment

Computer

Operating system: Windows XP or Windows 7

USB cable

Upgrade file

microSD card

512 MB available space or more

Battery

Ensure that the battery used for the upgrade has sufficient power remaining.

Upgrade file

Use the latest version for the upgrade.

Upgrade method

USB upgrade

microSD card upgrade is recommended. microSD card

upgrade

Table 5-1 Items to be prepared for an upgrade

5 Software Upgrade

5.2 Precautions



To ensure that the upgrade is not interrupted, check that the battery has sufficient power remaining.



Upgrading the phone will have the user data erased. Back up the important data before an upgrade.

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5.3 Installing the USB Driver

Double-click Handset WinDriver1.3.exe on your computer desktop and follow the onscreen instructions.

5.4 Upgrading a Phone

5.4.1 Performing a USB Upgrade

Step 1 Download the upgrade tool package SP_Flash_Tool_v3.1304.0.119-cust.rar. Check that the

version number is correct.

Figure 5-1 SP_Flash_Tool_v3.1304.0.119-cust.rar

Step 2 Decompress the package and double-click Flash_tool.exe in the package. On the displayed

dialog box, select USB MODE under Options and click the Download tab.

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Figure 5-2 Flash_tool.exe in the upgrade tool package

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Figure 5-3 Download tab page

Step 3 Decompress the upgrade package prestored on the computer. On the Download tab page,

click Scatter-loading.

Figure 5-4 Clicking Scatter-loading

Step 4 Select the MT6589_Android_scatter_emmc.txt file in the upgrade package and click Open.

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Figure 5-5 Selecting MT6589_Android_scatter_emmc.txt

Step 5 Click Firmware->Upgrade.

Figure 5-6 Clicking Firmware->Upgrade

The dialog box shown in Figure 5-7 is displayed.

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Figure 5-7 Dialog box displayed after you click Firmware->Upgrade

Step 6 Install the battery into the phone and connect the phone to the computer using a USB cable.

The upgrade tool automatically upgrades the phone. The tool displays the upgrade progress, as shown in Figure 5-8.

Figure 5-8 Upgrade progress

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The dialog box shown in Figure 5-9 is displayed when the upgrade succeeds. If any error message is displayed during the upgrade. Start over from step 1.

Figure 5-9 Upgrade succeeded

----End

5.4.2 Performing a mircoSD card Upgrade

Step 1 Prepare the microSD card used for the upgrade.

1. Format the microSD card using FAT32.

2. Create a dload folder in the microSD card's root directory.

3. Copy the upgrade package UPDATE.APP to the dload folder.



Do not change the names for the upgrade package and folder.



A microSD card upgrade will have the internal memory of the phone erased.

Step 2 Choose the microSD upgrade method.



Forcible upgrade Remove and then re-install the battery, and press and hold the power, volume up, and

volume down keys. When the motor vibrates, release the power key. Do not release the volume up or volume down keys unless the screen shown in Figure 5-11 is displayed.



Normal upgrade Power on the phone, enter *#*#1673495#*#* on the dialer. The screen shown in Figure

5-10 is displayed.

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Figure 5-10 Engineering menu

Step 3 Touch SD 卡升级 then 确定. The phone automatically restarts and displays the startup logo

and then the upgrade screen, as shown in Figure 5-11.

G610-U20 Smartphone Maintenance Manual

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Figure 5-11 Upgrade screen

When the screen shown in Figure 5-12 is displayed, the upgrade succeeds.

Step 4 Remove and then re-install the battery, and power on the phone.

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