3. ROM RE-FLASH PROCEDURE........................................................................................................................................42
3.1 ROM UPGRADE THRU RUU(RE-FLASH UPGRADE UTILITY)................................................................................42
4.1 LIST OF DIAGNOSTIC TEST ITEMS......................................................................................................................48
5. POWER MEASUREMENT TEST ......................................................................................................................................62
5.1 MAIN BOARD LEAKAGE CURRENT TEST PROCEDURE ..........................................................................................62
5.2 BATTERY RUNDOWN TEST PROCEDURE..............................................................................................................66
6.3 MAIN UNIT INSPECTION .....................................................................................................................................75
9. GENERIC SPARE PART LIST AND PHOTOS................................................................................................................87
9.1 SPL FOR REPAIR..............................................................................................................................................87
This manual provides the technical information to support the service activities of this product.
This document contains highly confidential information, so any or all of this docu ment should not be revealed to
any third party.
z Chapter 1: Introduction-This Chapter is about Products features and basic Product function. After
z Chapter 2: Device Disassembling and Assembling Procedure- After reading this chapter, you will
reading this chapter, you will know what feature the product has and basic hardware
operation. Also you will know how to perform soft-rest and hard-rest in this chapter.
learn how to disassemble and assemble the product. Also, you will know what tools to
use and the torque. Please follow the instruction to disassemble the unit to prevent
from damaging the unit.
zChapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to perform
the ROM image re-flesh by using RUU and SD-Card. Also you can find the steps of
enter the boot loader mode.
z Chapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn
z How to use the diagnostic program to perform unit function test
z How to test some functions in W indows Mobile mode (ex. WLAN, Bluetooth, and
USB etc…)
zChapter 5: Power measurement test- After reading this chapter, you will learn how to use MB
leakage test procedure and battery run-down test (Battery Capacity Measurement).
zChapter 6: Cosmetic Inspection Criteria- After re ading this chapter you will learn the appearance
quality inspection criteria, ex. Display, bezel, and housing etc…
zChapter 7: Generic Troubleshooting- After reading this chapter , you will learn how to do generic
trouble-shooting.
zChapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for reference, ex.
Regulation label, and battery label etc…
zChapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts reference
list and photos for repairing, including unit and Board level.
zChapter 10: RF Antenna Specification- Reference Spec for RF test.
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Doc. No. DOC-00045694 REV.
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Doc. Title
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1.1 Product Features
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Revised Date 2008/11/6
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1.2 Product overview
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z To remove the Battery cover
z To install / remove the SIM card
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z To install / remove the SD card
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zTo install / remove the battery
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z Charging the battery
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zTo perform a soft reset
1. Remove the back cover.
2. Pull out the stylus.
3. Use the stylus to press the RESET button located between the SIM card and the storage card slots.
Your device restarts and displays the Today screen.
zTo perform a hard reset
Warning! Your device will be set back to factory default settings. Make sure that any additional installed
programs and/or user data have been backed up before you perform a hard re set.
1. Pull out the stylus
2. With the device turned off, press and hold the VOLUME UP and VOLUME DOWN buttons, then briefly
press the POWER button.
3. Continue pressing the VOLUME UP and VOLUME DOWN buttons until you see this message on the
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screen:
4. Release the VOLUME UP and VOLUME DOWN buttons.
5. Press the VOLUME UP button to perform the hard reset, or press any other button to cancel the reset.
zTo clear storage
You can also use Clear Storage to reset your device back to factory default settings.
1. On the Home screen, slide to the Settings tab and then tap All Settings.
2.
On the System tab, tap Clear Storage.
3. Enter “1234” and then tap Yes.
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2. Device Disassembling and Assembling Procedure
2.1 Tools list
level No. Item Vendor P/N
1 Mini USB DATA interface Cable
2 Earphone Headset
3 AC Adapter
4 WLAN AP
Memory Card with Diag. test program (need be
L 1
5
encoded by HTC)
Memory card for ROM code re-flash ( must be
6
encoded by HTC)
7 3pin battery holder HTC special tools MLT-00008
HTC design
HTC design
L 2
L 2.5
8 Universal Leakage Current Tester HTC special tools MLT-00001
9 Power supply
10 Current Meter
11 Mobile tester
12 Special Made Plastic Stick HTC special tools RTT-00006
13 Hand tools
14 Oven for rework purpose HTC special tools RTT-00007
15 Barcode label printer (400dpi resolution and up)
16 Lead-free Soldering station
17 Hot air gun