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Raphael

HTC Raphael Service manual

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Doc. No. DOC-00043540 REV.
Doc. Title
HTC Corporation
.
Raphael Service Manual
Raphael
Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 1 of 98
U
HTC Proprietary
Confidential T reatment Requested
Rev . A10
HTC Corp.
Engineering Mobility
HTC CONFIDENTIAL
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Doc. Title
REVISION CONTROL TABLE
REV DATE CONTENTS DEPT REVISED STAGE
AX01 2008/7/2 Fist Draft PSE Budiman_Cheng DVT
A01 2008/7/23
A02 2008/8/11
A03 2008/9/1
A04 2008/10/15
A05 2008/10/20
A06 2008/10/31 A07 2008/11/10 A08 2008/11/20 A09 2008/11/26
A10 2008/12/01
Raphael Service Manual
1. Change picture of water sensitive label location on generic labeling plan
2. Update feature sheet (GSM/EDGE to quad band frequency, battery life and add extended battery with battery cover in the accessory list as an optional item)
3. Update sleep and idle current test on chapter 5.1
4. Add RF antenna spec on chapter 10
5. Add spare part list on chapter 9.1
1. Update assembling procedure and pictures on chapter 2.3
2. Update cosmetic inspection criteria
Update feature sheet: add eMobile SKU with 1700MHz UMTS band
1. Add picture and “Return to HTC” column on chapter 9.1
2. Update speaker installation notice on chapter 2.3
3. Update assembling procedure on page 27
1. Update repair code on chapter 9.1
2. Change hot key to enter diagnostic mode on chapter 4.1
Update board level 2.5 repair on chapter
9.2
Add sleep and idle current test condition on chapter 5.1 Add some part numbers on chapter 2.3 (Assembling procedure) Add FRU M/B additional parts location on chapter 9.3
1. Remove 76H02985-00M from chapter
9.1 SPL for repair (ECR#28037)
2. Change assembling procedure on chapter 2.3 (ECR#28037)
3. Add 76H03122-00M into chapter 9.3 (ECR#28037)
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 2 of 98
PSE Budiman_Cheng PVT
PSE Budiman_Cheng PVT
PSE Budiman_Cheng PVT
PSE Budiman_Cheng MV
PSE Budiman_Cheng MV
PSE Budiman_Cheng MV PSE Budiman_Cheng MV PSE Budiman_Cheng MV PSE Budiman_Cheng MV
PSE Budiman_Cheng MV
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Doc. Title
HTC Corporation
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Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 3 of 98
1. INTRODUCTION ....................................................................................................................................................................4
1.1 PRODUCT FEATURES..........................................................................................................................................5
1.2 PRODUCT OVERVIEW........................................................................................................................................10
2. DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE ................................................................................18
2.1 TOOLS LIST......................................................................................................................................................18
2.2
DISASSEMBLING PROCEDURE............................................................................................................................19
2.3 ASSEMBLING PROCEDURE ................................................................................................................................27
3. ROM RE-FLASH PROCEDURE........................................................................................................................................38
3.1 ROM UPGRADE THRU RUU (RE-FLASH UPGRADE UTILITY)................................................................................38
3.2 ROM IMAGE UPGRADE THRU SD CARD .............................................................................................................42
4. DIAGNOSTIC PROGRAM..................................................................................................................................................44
4.1 LIST OF DIAGNOSTIC TEST ITEMS......................................................................................................................44
5. POWER MEASUREMENT TEST ......................................................................................................................................59
5.1 MAIN BOARD LEAKAGE CURRENT TEST PROCEDURE ..........................................................................................59
5.2 BATTERY RUNDOWN TEST PROCEDURE..............................................................................................................63
6. COSMETIC INSPECTION CRITERIA...............................................................................................................................68
6.1 CLASSES DEFINITION OF INSPECTIVE AREA.........................................................................................................68
6.2 DISPLAY INSPECTION........................................................................................................................................71
6.3 MAIN UNIT INSPECTION .....................................................................................................................................72
7. GENERIC TROUBLESHOOTING .....................................................................................................................................73
8. GENERIC LABELING PLAN..............................................................................................................................................80
9. GENERIC SPARE PART LIST AND PHOTOS................................................................................................................82
9.1 SPL FOR REPAIR..............................................................................................................................................82
9.2 BOARD LEVEL 2.5 REPAIRS ..............................................................................................................................90
9.3
FRU M/B ADDITIONAL PAR TS LOCATION.............................................................................................................93
10. RF ANTENNA SPECIFICATION .......................................................................................................................93
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Doc. Title
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Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 4 of 98
1. Introduction
This manual provides the technical information to support the service activities of this product.
This document contains hi ghly confidential information, so any or all of this document should not be revealed to
any third party.
Chapter 1: Introduction-This Chapter is about Products features and basic Product function. After
Chapter 2: Device Disassembling and Assembling Procedure- After reading this chapter, you will
reading this chapter, you will know what feature the product has and basic hardware operation. Also you will know how to perform soft-rest and hard-rest in this chapter.
learn how to disassemble and assemble the product. Also, you will know what tools to use and the torque. Please follow the instruction to disassemble the unit to prevent from damaging the unit.
Chapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to perform
the ROM image re-flesh by using RUU and SD-Card. Also you can find the steps of enter the boot loader mode.
Chapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn
How to use the diagnostic program to perform unit function test How to test some functions in Windows Mobile mode (ex. WLAN, Bluetooth, and
USB etc…)
Chapter 5: Power measurement test- After reading this chapter, you will learn how to use MB
leakage test procedure and battery run-down test (Battery Capacity Measurement).
Chapter 6: Cosmetic Inspection Criteria- After reading this chapter you will learn the appearance
quality inspection criteria, ex. Display, bezel, and housing etc…
Chapter 7: Generic Troubleshooting- After reading this chapter, you will learn how to do generic
trouble-shooting.
Chapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for reference, ex.
Regulation label, and battery label etc…
Chapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts reference
list and photos for repairing, including unit and Board level.
Chapter 10: RF Antenna Specification- Reference Spec for RF test.
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Doc. Title
1.1 Product Features
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Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
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Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
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Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
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Raphael Service Manual
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Revised Date 2008/12/01
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Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
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1.2 Product overview
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Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
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Raphael Service Manual
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Revised Date 2008/12/01
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Installing the SIM card
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Page 14 of 98
Installing the SD card
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Raphael Service Manual
To install / remove the battery
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Charging the battery
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To perform a soft reset
1. Remove the back cover.
2. Pull out the stylus.
3. Use the stylus to press the RESET button located between the opening of the stylus compartment and USB connector on the back of the device. Your device restarts and displays the Today screen.
To perform a hard reset
Warning! Your device will be set back to factory default settings. Please ensure any additional installed
programs and/or user data have been backed up before a hard reset is performed.
1. Pull out the stylus
2. With the device turned on, press and hold the VOLUME DOWN and ENTER buttons, then press the RESET button with the stylus tip.
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Raphael Service Manual
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Revised Date 2008/12/01
Page 17 of 98
3. Release the RESET button, but continue pressing the VOLUME DOWN and ENTER buttons until you see this message on the screen:
4. Release the VOLUME DOWN and ENTER buttons, then press the VOLUME UP button to perform the hard reset, or press any other button to cancel the reset.
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2. Device Disassembling and Assembling Procedure
2.1 Tools list
level No. Item Vendor P/N
1 Mini USB DATA interface Cable 2 Earphone Headset 3 AC Adapter 4 WLAN AP
Level 2 Memory Card with Diag. test program
L 1
5
(need be encoded by HTC) Level 0 Memory Card with Diag. test program
6
(need be encoded by HTC)
7 3pin battery holder HTC special tools MLT-00006
HTC design DCT-00050
HTC design DCZ-00050
L 2
L 2.5
8 Universal Leakage Current Tester HTC special tools MLT-00001
9 Power supply 10 Current Meter 11 Mobile tester 12 Special Made Plastic Stick HTC special tools RTT-00006 13 Hand tools 14 Oven for rework purpose HTC special tools RTT-00007
15 Mylar,Assembly jig, for navi and TW,black, Raphael
Mylar,Assembly jig, for navi and A-cover,black,
16
Raphael
17 Navi board keycap assembly jig HTC special tools RTT-00016 18 Barcode label printer (400dpi resolution and up) 19 Lead-free Soldering station 20 Hot air gun
76H02974-00M
76H02973-00M
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2.2 Disassembling procedure
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 19 of 98
1. PHILLIPS SCREW-DRIVER 00X50
2. FLAT PLASTIC STICK (P/N: RTT-00006)
3. CLEANING CLOTH
4. PLASTIC TWEEZERS
5. ESD WRIST STRAP.
6. KEYCAP ASSEMBLY FIXTURE
(P/N: RTT-00016 )
7. OVEN FOR REPAIR / REWORK
PURPOSE (P/N: RTT-00007)
8. MYLAR FOR KEYCAP GAP
CONTROL (P/N: 76H02974-00M)
9. MYLAR FOR KEYCAP GAP
CONTROL (P/N: 76H02973-00M)
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1. TAKE OUT THE STYLUS.
2. REMOVE THE BATTERY COVER
AS SHOWN.
1. TAKE OUT THE BATTERY AS
SHOWN.
2. LOOSEN 4 SCREWS FROM THE
HOUSING.
1. EXTEND THE KEYBOARD BY
SLIDING THE DISPLAY UP.
2. INSERT THE FLAT PLASTIC
STICK BETWEEN THE HOUSING AND QWERTY KEYBOARD AND THEN FOLLOW THE ARROW DIRECTION.
3. DISASSEMBLE THE HOUSING AS
SHOWN.
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1. DISCONNECT THE SPEAKER
CONNECTOR AT THE LOCATION INDICATED.
2. REMOVE THE SOUND COVER BY
LIFTING IT UP.
1. REMOVE THE SPEAKER BY
LIFTING IT UP.
2. RELEASE THE ANTENNA WIRE
AS SHOWN.
1. LOOSEN THE SCREW AT THE
LOCATION INDICATED.
2. DISCONNECT QWERTY
KEYBOARD CONNECTOR FROM THE MB.
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1. REMOVE THE MYLAR AT THE
LOCATION INDICATED.
2. DISCONNECT THE MAIN FPC
FROM THE M/B.
1. REMOVE THE MYLAR AT THE
LOCATION INDICATED.
2. DISCONNECT THE ANTENNA
WIRE AT THE LOCATION INDICATED.
1. REMOVE THE MYLAR AT THE
LOCATION INDICATED.
2. DISCONNECT THE I/O BOARD
CONNECTOR.
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1. DISCONNECT THE SIM FPC
CONNECTOR.
2. DISCONNECT THE MAIN
CAMERA CONNECTOR.
3. INSERT THE FLAT PLASTIC
STICK BETWEEN THE SIM FPC AND SHIELDING COVER AND THEN FOLLOW THE ARROW DIRECTION TO SEPARATE THE
SIM FPC.
1. INSERT THE FLAT PLASTIC
STICK AS SHOWN TO SEPARATE THE MAIN CAMERA AND THE MAIN BOARD.
2. LOOSEN 6 SCREWS AT THE
LOCATION INDICATED.
1. LOOSEN 5 SCREWS FROM
B-COVER AND B-UPPER
COVER
2. DISASSEMBLE THE B-UPPER
COVER AS SHOWN.
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1. DISASSEMBLE THE B COVER AS
SHOWN
2. TAKE OUT THE VOLUME KEY AS
SHOWN.
1. DISCONNECT THE MAIN FPC
CONNECTOR FROM NAVI KEY ASSEMBLY.
2. REMOVE THE CONDUCTIVE
FABRIC AT THE LOCATION INDICATED
1. DISCONNECT THE LCM
CONNECTOR AND LOOSEN THE TWO SCREWS FROM THE MAIN FPC.
2. DO NOT DISASSEMBL Y THE 2
CAMERA, REPLACE BOTH THE
FPC AND 2
SAME TIME IF ONE OF THEM WAS F AILED (FOR MODEL WITH
ND
2
CAMERA)
ND
CAMERA AT THE
ND
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1. TAKE OUT THE POWER
BUTTON.
2. TAKE OUT THE RECIEVER AT
THE LOCATION INDICATED.
1. TAKE OUT THE MICROPHONE
RUBBER AT THE LOCATION INDICATED.
2. LOOSEN 4 SCREWS FROM THE
NAVI KEY ASSEMBLY AT THE LOCATION INDICATED.
LOOSEN ANOTHER 2 SCREWS AT
THE LOCATION INDICATED.
NOTE: BELOW STEPS CAN BE DONE
BY AUTHORIZED SERVICE PROVIDER ONLY AFTER SAFE LAUNCH.
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PUT THE NAVI PRE ASSY INTO AN
OVEN ABOUT 5 MINUTES AT 65 DEGREE CELCIUS.
INSERT THE FLAT PLASTIC STICK
BETWEEN THE KEY CAP AND THE
FPC AS SHOWN.
CONTINUE ABOVE STEP AND
FOLLOW THE ARROWS DIRECTION TO SEPARATE THE NAVI KEY CAP AND THE FPC.
INSERT THE FLAT PLASTIC STICK
BETWEEN THE CENTER NAVI KEY CAP AND THE FPC AS SHOWN TO SEPARATE THEM
The Disassemble process is done
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2.3 Assembling procedure
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1. REMOVE THE CONDUCTIVE FABRIC
ON THE MAIN CAMERA AT THE LOCATION INDICATED.
2. PASTE A CONDUCTIVE FABRIC (72H02844-0M) ON THE MAIN
CAMERA AT THE LOCATION INDICATED.
1. CONNECT THE MAIN CAMERA TO SIM FPC AND STICK THE CONDUCTIVE
FABRIC ON IT.
1. MAKE SURE THE MYLAR (76H02625-00M) AND THE
CONDUCTIVE FABRIC
(72H02843-00M, 76H03122-00M)
WAS ATTAHCED AT THE LOCATION INDICATED.
2. STICK THE SIM FPC TO THE MAIN
BOARD AT THE LOCATION INDICATED
NOTE: A. DO NOT BEND THE SIM FPC B. DO NOT TOUCH THE DOUBLE SIDED
TAPE
C. MAKE SURE THE SHIELDING COVER
SURFACE IS CLEAN
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1. CONNECT THE SIM FPC
CONNECTOR TO THE MAIN BOARD.
2. PASTE A LDI (77H00668-00M) AT
THE LOCATION INDICATED.
PASTE A CONDUCTIVE FABRIC (76H02985-00M) AT THE LOCATION
INDICATED.
PASTE A CONDUCTIVE FABRIC (72H02845-00M) AT THE LOCATION
INDICATED.
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1. CONNECT THE I/O BOARD
CONNECTOR TO THE M/B
2. STICK A MYLAR (76H02770-00M) AT
THE LOCATION INDICATED
1. CONNECT THE ANTENNA WIRE AT THE
LOCATION INDICATED.
2. FIX THE ANTENNA WIRE WITH A
CONDUCTIVE FABRIC
(72H02703-00M) AT THE LOCATION
INDICATED.
1. INSTALL THE RECEIVER AT THE
LOCATION INDICATED.
2. STICK THE LIGHT SENSOR LENS AT
THE LOCATION INDICATED.
NOTE: MAKE SURE THE SPEAKER’S
CONTACT SPRING IS FACING OUTSIDE
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1. ASSEMBLE THE NAVI KEY AND
TIGHTEN 2 SCREWS AT THE LOCATION INDICATED (P/N: 72H02450-00M).
TORQUE: 0.5 ±0.1 KGF-CM
2. TIGHTEN 4 SCREWS A T THE LOCATION
INDICATED (P/N: 72H02689-00M).
TORQUE: 0.7 ±0.1 KGF-CM
1. ASSEMBLE THE NAVI KEY CAP AS
SHOWN. PRESS THE KEY CAP FIRMLY.
2. REMOVE ALL OF THE MYLAR AFTER
ASSEMBLY PROCESS IS DONE.
NOTE: DO NOT TOUCH THE DOUBLE SIDED
TAPE & FPC AREA WHILE ASSEBLE THE NAVI KEYCAP AND MAKE SURE THE SURFACE OF THE NAVI KEY FPC IS CLEAN.
NOTE:
3. PLEASE PASTE MYLAR NO. 2 & 3 AT
THE LOCATION INDICA TED IF THERE IS NO MYLAR ON THE BEZEL
4. CLEAN THE NAVIKEY FPC SURFACE
WITH LABORATORY ALCOHOL (95% AND UP) WHILE DOING KEYCAP REWORK.
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1. DISASSEMBLE THE NAVI BOARD
2. PRESS THE KEYCAP WITH THE
KEYCAP JIG AS SHOWN.
3. RE-ASSEMBLY THE NAVI BOARD TO
THE BEZEL.
FOLD AND PASTE THE TRAN SPARENT TAPE
AT THE LOCATION INDICATED.
STICK A CONDUCTIVE FABRIC (72H02749-00M) TO THE LCD FPC AS
SHOWN
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1. PLACE THE MICROPHONE RUBBER AT
THE LOCATION INDICATED
2. STICK 2 SPONGE AT THE LOCATION
INDICATED (76H02982-00M,
76H02983-00M) AND REMOVE THE
RELEASE-TAPE.
3. PASTE A KAPTON TAPE (76H02823-00M) AND TWO SPONGE (76H02981-00M) AT THE LOCATION
INDICATED.
1. ASSEMBLE THE POWER BUTTON AT
THE LOCATION INDICATED.
2. CONNECT THE LCM CONNECTOR TO
THE NAVI BOARD.
NOTE: REPLACE BOTH THE FPC AND THE 2ND CAMERA AT THE SAME TIME IF ONE OF
THEM WAS FAILED
1. CONNECT THE MAIN FPC
CONNECTOR TO THE NAVI BOARD, STICK THE FPC AND TIGHTEN THE MAIN FPC SCREWS AT THE LOCATION INDICATED (P/N: 72H02450-00M).
TORQUE: 0.4 ±0.1 KGF-CM
2. STICK THE VOLUME FPC AT THE
LOCATION INDICATED.
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PASTE 2 CONDUCTIVE FABRICS (72H02854-00M & 72H02855-00M) AT
THE LOCATION INDICATED.
1. INSTALL THE VOLUME KEY AT THE
LOCATION INDICATED.
2. STICK A GASKET (72H02816-00M)
AT THE LOCATION INDICATED.
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1. STICK A DAMPER ON B PART AT T HE
LOCATION INDICATED.
1. ASSEMBLE THE B-COVER AS SHOWN.
2. INSERT A DAMPER AT THE LOCATION
INDICATED
1. ASSEMBLE B-UPPER COVER AS
SHOWN.
2. TIGHTEN 5 SCREWS A T THE LOCATION
INDICATED (P/N: 72H02450-00M FOR SCREW NO. 1, 2, 3 TORQUE:
0.4 ± 0.1 KGF-CM AND
72H01893-00M FOR SCREW NO.4, 5 TORQUE: 0.7 ±0.1 KGF-CM)
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1. ASSEMBLE THE QWERTY
KEYBOARD AS SHOWN.
2. TIGHTEN 6 SCREWS A T THE LOCATION
INDICATED (P/N:72H02865-00M).
TORQUE: 0.8 ±0.1 KGF-CM
3. CONNECT THE MAIN FPC
CONNECTOR TO THE M/B.
STICK A CONDUCTIVE FABRIC (72H02819-00M) AT THE LOCATION
INDICATED
1. CONNECT THE QWERTY KEYBOARD
CONNECTOR TO THE M/B
2. FIX THE M/B WITH A SCREW AT THE
LOCATION INDICATED (P/N:
72H02886-00M). TORQUE: 0.4 ±0.1
KGF-CM
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1. INSERT THE ANTENNA WIRE AT THE
LOCATION INDICATED.
2. STICK A GASKET (76H02984-00M)
AT THE LOCATION INDICATED
1. ASSEMBLE THE HOUSING AS SHOWN.
2. CONNECT THE SPEAKER TO THE M/B
AT THE LOCATION INDICATED.
NOTE: USE TWEEZERS TO KEEP THE
POSITION OF THE SPEAKER WIRES LOWER THAN THE MAIN BOARD AND KEEP AWAY FROM THE CONNECTOR TO PREVENT THE WIRES BEING PRESSED DURING ASSEMBLY.
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Issued Date 2008/7/2
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1. PRESS THE HOUSING ARROUND TO
FIX THE HOUSING .
2. TIGHTEN 4 SCREWS A T THE LOCATION
INDICATED (P/N: 72H02474-00M).
TORQUE: 1.0 ±0.1 KGF-CM
1. PUT THE BATTERY INTO THE BATTERY
COMPAR TMENT AS SHOWN.
2. PUT THE BATTERY COVER BACK AS
SHOWN.
PUT THE STYLUS BACK TO ITS PLACE.
The Assemble Process is Done. You may perform the Function Test or the following process.
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3. ROM Re-flash Procedure
3.1 ROM upgrade thru RUU (Re-flash Upgrade Utility)
Connect device to PC
1. Setting and allow USB connections in Microsoft ActiveSync.
2. Connect your device and desktop/ or
laptop via USB cable.
3. Check the pop-up message from
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Microsoft ActiveSync when device is synchronized with PC.
Download OS Image from SDO
4. Download OS image from SDO.
http://htcscm10.htc.com.tw/SDO
5. Un-zip the file and execute RUU
program.
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6. Select the type of USB connection with
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Check the setting of menu
“ActiveSync” mode in the settings of
menu.
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RUU-1
7. Hold the volume down key then
press power button to trigger the boot loader mode.
8. Read the pop-up message form
ROM update utility and select the “I understand…” checkbox.
9. Click “Next” to proceed.
10. Read the pop-up message form
ROM update utility to follow and perform the instructions and select the “I completed…” checkbox.
11. Click “Next” to proceed.
RUU-2
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12. Current image version
13. Click “Update” to proceed
.
confirmation.
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RUU – 3
RUU-4
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14. Double verify the ROM revision
which you want to update before re-flash procedure.
15. Click “Next” to proceed.
16. Read the information from
pop-up message and the OS update procedure will takes 10 minutes long.
17. Click “Next” to proceed.
RUU-5
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18. You can see the update progress
19. The OS upgrade is finished, click
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from your PC and in your device.
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RUU – 6
RUU – 7
“Finish” to close the utility.
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3.2 ROM Image upgrade thru SD card
Download OS Image from SDO
1. Download OS image from SDO.
http://htcscm10.htc.com.tw/SDO
2.
Un-zip the image file.
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Format SD card and copy image file to SD card
3. Select file system and format the
SD card to FAT32 mode.
4. Copy image file XXX.nbh to the micro SD card and rename to
RAPHIMG.NBH.
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5. Turn the device power off and insert micro SD card.
6. Press and hold Volume down
Power
release the power button first to enter Boot loader mode.
7. Press Power upgrade procedure.
button and then
Raphael Service Manual
button to start
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SD Upgrade - 1
+
SD Upgrade - 2
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8. Reading source code from micro SD card.
[Note]: Please don’t power off the device during this process.
9. After finish, press Reset
button to reboot.
SD Upgrade - 3
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4. DIAGNOSTIC PROGRAM
4.1 List of Diagnostic Test Items
Mode No Item Description Remark
Function Test
1 Auto Auto Regular Tests (Display, B.L, Vibrator, etc…) 2 ROM Checksum Test ROM size 3 Stylus Detect Test Stylus remove and insert 4 LED Test Backlight of Navi board module 5 Display Test Color bar/R/G/B/Black/White/Gray pattern. 6 Back Light Test LCD back light test (dim to bright).
7 Vibrator Test Vibrator on test. 8 Sliding Test QWERTY keyboard sliding test 9 SD card R/W Test SD card read / write test
10 Key Test
Power, Volume up, Volume down, Key action, Key left, Key up, Key right, Key down
11 QWERTY key Test QWERTY keyboard test
Diagnostic
12 Get Radio version Get Radio version test 13
G Sensor Test Motion G sensor function test
14
Touch Panel Test Touch Panel test
15
SDRAM test SDRAM read / write test
Run-in Test
1 1 Hour 1 Hour Run-in Test/Press Soft1 key. Option 2 2 Hours 2 Hours Run-in Test/Press Soft 2 key. Option 3 4 Hours 4 Hours Run-in Test/Press Start key. Option
4 8 Hours 8 Hours Run-in Test/Press OK key. Option Format Internal Storage (Personal information, talk times) Device Info
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Mode No Item Description Remark
1 Bluetooth Test Bluetooth Function Test
2 USB Test USB link test (Microsoft ActiveSync)
3 Camera Test Camera Function Test
4 WLAN Test WLAN Function Test
5 GPS Test GPS Function Test
Win CE
6 FM Radio FM Radio Function Test
7 Audio Test
8 Cap Sensor Test
All Audio Function T est Navi Cap Sensor Function Test
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Test Procedure
How to select test item: Using navigation button -"Up" or "Down" to select the test items How to execute the test program: Press “Action” button to start each of test items.
Diagnostic
1. T urn the device power off and insert Diagnostic SD card.
2. Press and hold Volume down
Power
the Power Diagnostic mode.
3. Using to select the test item and
move to next page as well.
4. Select item “Function Test” to find
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Main Menu/Function Test Menu
+
button and then release
button to enter
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the Function test menu.
5. Press the Action key to start the
Auto-test.
6. It will perform the regular tests,
please follow the system instruction to do the test.
Auto Test
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7. Press Action key to select
8. The Rom Checksum will be
.
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displayed on the screen
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ROM Checksum Test
Stylus Detect Test
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9. Press Action key to select
10. It will perform the stylus test, please
follow the system instruction to remove and insert the stylus.
11. Press Action key to select
12. It will perform the LED test, please
follow the system instruction to check the LED.
LED Test
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13. Press Action key to select Display
14.
15. Press Action key to continue the
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Display Test (and RED/ GREEN pattern)
on Function test menu.
Test
fter the test pattern is show up, please check the pattern if any un-uniform color or chromatist.
next test pattern.
Display Test (BLUE/ BLACK pattern)
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16. Press Action key to continue the next test pattern.
Display Test (WHITE/Color bar pattern)
17. Press Action key to continue the next test pattern.
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18. Press Action key to select B.L Test
19. Press
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LCD Back Light Test
on Function test menu.
ction key to switch the LCD
backlight level from Level 1,Level2,
Level3, Level4, Level5 Press
Action key to exit and return to Function test menu.
Vibrator Test
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20. Press Action key to select Vibrator Test on Function test menu.
21. Press Action key to exit and return to Function test menu.
22. Press Action key to select Sliding Test
on Function test menu.
23. Press Action key to exit and return to Function test menu.
Sliding Test
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24. Press Action key to select SD card
25. Press Action key to select Button
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SD card R/W Test
R/W Test on Function test menu.
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Key Test
on Function test menu.
Test
26. Follow the instruction on screen to
perform the Key/Button test
(Power, Volume up, Volume down, Key action, Key left, Key up, Key right, Key down).
The screen will return to Function test menu after the test is finished.
QWERTY Key Test
27. Press Action key to select QWERTY key Test menu.
on Function test
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28. Press Action key to select Get
29. Press Action key to exit and return
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Radio version on Function test menu.
to Function test menu.
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Get Radio Version
G Sensor Test
30. Press Action key to select G Sensor
on Function test menu.
Test
31. Put the unit on a horizontal and flat table when perform this test.
Touch Panel Test
32. Press Action key to select Get Radio version on Function test menu.
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33. Press Action key to select Get
34. Press Action key to exit and return
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Radio version on Function test menu.
to Function test menu.
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SDRAM Test
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WinCE Test
1. Tap icon Comm Manage r on the
Today screen and turn on Bluetooth.
2. Tap the icon “Settings” down-right
the corner of the screen and select the “Make this device….” Checkbox.
3. Press Action key (Jog-ball) to go
next test pattern.
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Bluetooth Test - 1
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Bluetooth Test-2
4. Tap Start->Settings->Connections-> Beam and select “Receive all….” Checkbox.
5. To create a file, tap Start->Programs
->Notes->New
6. Tap and select the “Beam file…”
Bluetooth Test-3
7. Once device is searched, tap the device to send the file.
8. Return to Today screen and tap Start->Program->Comm Manager
->Bluetooth to turn off Bluetooth.
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1. Start up the Microsoft®
2. Select ActiveSync in the setting of
3. Insert USB cable and connect unit to
4. The USB to PC icon
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.
Raphael Service Manual
ActiveSync®program in the PC.
menu
desktop/ or laptop.
-> is appears on the Today screen when your device is connected to your desktop/ or laptop.
Camera Test
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USB Test
1. Tap Start->Program->Camera or Press Camera button to turn on the Camera.
2. Make sure the device will present and enter the preview display.
3. Check camera pre-view and image quality.
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1. Tap icon Comm Manager on the
2. Select the hot-spot/ or access point
3. Once the hot-spot (access point) is
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WLAN Test
Today screen and turn on WLAN.
which searchable and appears on screen.
connected, press the IE button and logon Internet.
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GPS Test
1. Download test program from SDO (DOC-00042190)
http://htcscm10.htc.com.tw/SDO
2. Setup the COM port to COM4.
3. Place device in GPS receptor coverage area and tap the icon “Open GPS”.
4. Check the GPS status as picture shown.
FM Radio Test
1. Insert the headset into the USB
connector before doing the testing.
2. Tap icon FM Radio in the programs of the menu.
3. Select the different channels for testing.
Audio Test-1
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1. Download test program from SDO
http://htcscm10.htc.com.tw/SDO
2. Un-zip the image file.
3. Copy “mfgtest.dll” and “Audio
4. Execute ”Audio Test” program from
5. Choose the each test in the menu of
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.
Raphael Service Manual
(DOC-00043599)
Test.exe” to internal storage.
internal storage.
“Tools”
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Audio Test-2
6. Select the Speaker Test then press Play button for testing
Audio Test-3
7. Select the Receiver Test then press Play button for testing
Audio Test-4
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8. Connect the headset into the USB
9. Select the Headset Test then press
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port before doing the testing
Play button for testing
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Audio Test-5
10. Select the Int-Rec Test then press the “Record” button for voice recording first
11. Stop the voice record then press “Play” button for internal receiver test
Audio Test-6
12. Connect the headset into the USB port before doing the testing
13. Select the Ext-Rec Test then press the “Record” button for voice recording first
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1. Install CapSensorTest tool to device.
2. Execute the test tool.
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Cap Sensor Test-1
Cap Sensor Test-2
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3. Gently touch the surface of the keycap.
4. The program will exit automatically once the function is normal.
Cap Sensor Test-3
5. Find the “CapSensorTestOK” log file in the My Device folder and it means cap sensor function pass.
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5. Power measurement test
5.1 Main board leakage current Test Procedure
This is a quick method to measure if any abnormal leakage current on main board which caused high power consumption compare to GOOD main board.
Equipment list
1. Control box
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2. 4 colors cable Cable A: Red Cable B: Yellow Cable C: Green Cable D: Black
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Jig-E
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C. types Jig Jig - E (3 pins-Short)
Equipment set up
1. Connect control box and jig through 3 colors cable with red, black and yellow
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A
B
C
D
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2. Set up each button by row A~D according to product specification Following is an setting for Diamond
Button set up matrix
MODEL JIG TYPE
A B C D
Raphael E 0 8 X 0
It means, press button A0,B8,D0
3. Install jig to device
(the photo is for reference only)
Start testing
1. Turn on control box power button
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2. Press Power button to turn on the Device
3. In “main page”, Check phone status, Click “Turn on Airplane mode”
Set the unit to : * Airplane mode * Make sure all RF function is off (phone,
BT, Wifi..)
4. Switch OFF the unit. Unit is turn off and
Sleep current test
no display. Sleep current value must under 3mA, condition: Display&BL off/RF off/BT off/WiFi off, if over the criteria, it means M/B failed, please replace M/B for repair.
5. Measure Idle mode current. Idle current
Idle current test
value must under 82mA, condition: Display on / BL default / KB LED off / GSM standby / WiFi off / BT off, if over the criteria, it means M/B failed, please replace M/B for repair.
Conclusion:
If current consumption is passed at both of idle and sleep mode, it means M/B is GOOD. If there is any item FAILED at idle or sleep mode, it means M/B is failed, please replace M/B
for repair.
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5.2 Battery rundown test procedure
Test Requirement:
-Windows 2000/XP
-USB Cable
-ActiveSync 4.2 above (WINCE 6.0 should use ActiveSync 4.5)
-Master Unit
-Battery in Warrantee
Caution: Please charge your unit to full capacity for battery (until the green light
is displayed) before doing the test.
TEST PROCEDURE
Connect device to PC
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I. Setting and allow USB
connections in Microsoft ActiveSync.
II. Connect your device and desktop/
or laptop via USB cable.
III. Check the pop-up message from
Microsoft ActiveSync when device is synchronized with PC.
Copy the Battery Rundown tool into the device
IV. Make a folder in the device. V. Copy
PowerDetect.exe into the
folder.
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VI. Adjust the Backlight brightness
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Battery Rundown-1
into the maximum level on battery power. (Disable auto adjust
backlight and dim the backlight if the device is locked)
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Battery Rundown-2
VII. Disable Turn off backlight if device
is not used for and Turn of f device if not used for on Advanced menu.
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VIII. Execute PowerDetect.exe under
WinCE
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Battery Rundown-3
IX. Set the Sleep as 1hour X. Set the Record as 2Mins
Battery Rundown-3
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XI. After running 1 hour, the test will be
XII. Press the Power Button to turn on the
XIII. Click ok to quit the program.
finished.
power.
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Battery Rundown-4
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Battery Rundown-5
XIV. Test result is gene rated into the log
file as PowerCap(x).
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XV. Tag the log file to check the capacity.
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Battery Rundown-6
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Caution: If the capacity is under 70%,
Please replace a new battery.
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6. Cosmetic Inspection Criteria
6.1 Classes definition of inspective area
Class A area => The front side of main unit involve all buttons except LCD.  Class B area => View of QWERTY keyboard (involve stylus).  Class C area => 4 sides and back views of main unit.  Class D area => The socket of battery, inner side of battery cover.
Photo of inspection areas
Page 68 of 98
CLASS A
CLASS B
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CLASS C
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CLASS D
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IT IS GENERIC COSMETIC INSPECTION CRITERIA FOR ALL PRODUCTS IF THERE HAVE ANY CONFLICT WITH THESE GENERIC CRITERIONS; PLEASE FOLLOW THE PRODUCT INSPECTION CRITERIA RESPECTIVELY.
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Description
D: Diameter / L: Length / W: Width / N: Number of defects/ S: Distance from dot to dot  Inspecting distance: 30 ± 5cm / Mechanical inspection angle：90 degrees / LCM inspection angle：90±15 degrees / Inspection time:5 secs per surface.
Ambient illumination is to be 500-1100 lux  The inspection condition of Newton ring:
a. Inspection distance: 30cm / Inspection time: 5 sec b. Ambient illumination is to be 500-1000 Lux (Incandescent lamp) c. Inspection should be performed under the condition that LCD screen could reflect the mirror image of lamp. d. The criteria of Newton ring’s tinges and measure of area must follow up the worst-case sample.
6.2 Display inspection
Inspection Defects Accept Level Level
Electrical Characteristic
Defects
Foreign Scratch,
Objects or Lint
on power off
status
Bright Dots
Dark Dots
Single
Red+ Green+ Blue ≦ 3, S >
2 adjacent 0 Minor 3 or more adjacent Single
0 Minor Total Number ≦ 2, S >
2 adjacent 0 Minor
5mm.
5mm.
Minor
Minor
Dark or Bright lines 0 Minor
ll Allowable Dots Defects
Shift and tilt of screen viewed area
Scratch
Total Number ≦ 3, S > The black edge around display area must
be detected by front view.
0.03 < W ≦ 0.1 (mm) L ≦ 5 (mm), N ≦ 2 (mm)
5mm.
Minor Minor
Minor
0.03 < W ≦ 0.1 (mm)
Lint (linear foreign objects)
0.3 < L ≦ 3.0 (mm) N ≦ 5
Minor
Spots 0.1 < D 0.3 (mm), N 4 ≦≦ Minor Fish eye on film 0.1 < D 0.4 (mm), N ≦≦ 4 Minor
Breakage on film surface Not acceptable Minor Total acceptable defect quantity ≦ 10 Minor
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6.3 Main unit inspection
Cosmetic inspection generic spec :
1. Exposure of substratum is not acceptable for peeling. (Area 4 i s included)If not exposure of substratum, please check by SPEC of dot or scratch. (Area 4 is not included)
2. Logo may not have blurred or double print., the peeling on logo is not acceptable.
3. The character printing of main unit does not allow bad printing, scratch, dirty, lacquered peeling, dark/white dot on it)
4 .Camera Lens: Contamination dot / foreign matter D 0.25mm, S 3mm≦≧；Lint: L 1.5mm , W 0.2mm≦≦。
5. Accessori es include Cradle; please follow Class B for inspection.
6. Main unit cosmetic inspection criteria of class D, please follow dummy class C for
inspection criteria.
GAP & STEP INSPECTIONS
Description
Status of main unit assembly
Gap between upper / lower slide
part
QWERTY key gap and around gap Gap between keypad and C part < 0.35mm Minor
Touch window and Navi key gap
Gap around power button, record
button, volume key, PTT button
Stylus
Gap between battery cover and
main unit
Gap between touch window and A
part
Gap between navi and A part Gap between navi and A part < 0.3mm Minor
Gap between touch window and
navi key
Step between upper / lower slide
part
Others between upper / lower parts Step < 0.40mm Minor
Step between touch window and
Navi key
Step between bezel and Navi key
Accept criteria
Defective assembly and deformed shape were not
allowed
Gap between upper / lower slide part < 0.7mm Minor
Gap between touch window and Navi key <
0.3mm
Key stuck are not allowed Minor
Stylus assembly protruding, loose, missing, falling
and deformed are not allowed
Gap between D and E part < 0.3mm Minor
Gap between touch window and A part < 0.3mm Minor
Gap between touch window and navi key <
0.3mm
Step < 1.0mm Minor
Step between touch window and Navi key <
0.3mm (Navi should higher than touch window)
Step between bezel and Navi key < 0.25mm (Navi
should higher than bezel)
Level
Minor
Minor
Minor
Minor
Minor Minor
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COSMETIC INSPECTION:
Description Accept criteria
Class A
Class B
Class C
HTC Corporation
Raphael Service Manual
Scratch
Exposure of substrate do not accept Scratch : L≦4mm ,W≦0.2mm ,N≦2, S≧10mm
Exposure of substrate do not accept Scratch : L≦7mm ,W≦0.25mm ,N≦3, S≧10mm
If IR window has scratch without any effective feeling then don’t care
IR window scratch: L≦3mm,W≦0.2mm,N≦3
Label area don’t care Exposure of substrate do not accept Scratch : L≦10mm ,W≦0.4mm ,N≦5, S≧5mm
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 73 of 98
MI
MI
MI
Contamination dot/Granule dot/Cave granule
Description Accept criteria
D≦0.5mm ,N≦2,S ≧15 mm
Class A
Ignored if D D≦ 0.15mm
MI
Total: D<0.6mm ,N≦4,S ≧15 mm
Class B
Class C
Ignored if D D≦ 0.25mm
D<0.9mm ,N≦4,S ≧10 mm
MI
MI
Burr….etc.
Description Accept criteria
Burr. Don’t accept hand scrape
MI
HTC CONFIDENTIAL
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Doc. Title
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.
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Issued Date 2008/7/2
Revised Date 2008/12/01
Page 74 of 98
Imprint mark
Description Accept criteria
Class A
Class B
0.25≦diameter≦0.65mm ,N≦3
0.65mm<Diameter≦1.00mm,N≦3
Bright mark
Description Accept criteria
MI
MI
L≦2.5mm,W≦0.25mm,N≦3
MI
Class A
Class B
Class C
L≦3.0mm,W≦0.25mm,N≦4
L≦3.0mm,W≦0.3mm,N≦5
MI
MI
Lint
Description Accept criteria
L≦3mm , W≦0.2mm ,N≦2, S ≧5 mm
MI
Class A
Class B
Class C
L≦5mm , W≦0.3mm ,N≦3, S ≧5 mm
L≦10mm , W≦0.3 mm ,N≦3
MI
MI
This definition is not applicable to LCM.
HTC CONFIDENTIAL
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Doc. Title
Raphael Service Manual
7. Generic Troubleshooting
1．Main Unit Does Not Respond to Power Button
(1) Connect the AC adapter, maybe the battery pack is exhaust and wait few minutes for battery recharging. (2) Check if battery installed well. (3) Check the Power Button whether it’s damaged. (4) Replace another battery pack. (5) Try to start boot-loader mode [refer to section 4.2]. Re-flash ROM if boot loader mode is enabled. (6) Check all connectors including LCD FPC to Main Board. (7) Replace Main Board if necessary. (8) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 75 of 98
2．Touch Panel Does Not Respond to Screen Tap
(1) Check the connection of LCM FPC cable whether is properly connected. (2) Try to cold boot the unit then perform screen tap again. (3) Try with another LCM. (4) Try with another Main Board. (5) Replace LCM if necessary (6) Replace Main Board if necessary. (7) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.
3．Buttons Do Not Respond
(1) Try to cold boot the unit then tries again. (2) Dismantle the unit; check the status of switches on the Main Board and the plastic parts of the Button not
responding. (3) Try with another Main Board or Front Bezel. (4) Replace Main Board or Front Bezel if necessary. (5) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.
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4．Unusual Vertical / Horizontal lines or partial display
(1) Check the connection of LCM FPC whether is properly conne cted. (2) Try to cold boot the unit then tries again. (3) Try to re-flash the ROM code. (4) Try with another LCM. (5) Try with another Main Board. (6) Replace LCM if necessary (7) Replace Main Board if necessary. (8) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.
5．Back Light Does Not Turn ON/OFF
Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 76 of 98
(1) Check the connection of LCM FPC whether is properly conne cted. (2) Try to re-flash the ROM code. (3) Try with another LCM. (4) Try with another Main Board. (5) Replace LCM if necessary (6) Replace Main Board if necessary. (7) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.
6．CF/SD Card cannot be used
(1) Check whether CF/SD Card is fully inserted to the slot until you hear a click. (2) Try to re-flash the ROM code. (3) Try with another CF/SD Card. (4) Try with another Main Board. (5) Replace Main Board if necessary. (6) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.
HTC CONFIDENTIAL
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Doc. Title
Raphael Service Manual
7．PC Connection not possible
(1) If test result is NFF, it is possible caused by user connect cradle to computer before ActiveSync is
installed. (2) Check whether “Connection Settings” in the MS ActiveSync is properly set. (3) Check whether it connects with other cables or cradle, customer’s cable might be damaged. (4) Check the external appearance of the connector on the unit whether it is physically damaged. (5) Try to re-flash the ROM code. (6) Replace Main Board if necessary. (7) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.
8．Battery Pack does not start
HTC Corporation
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 77 of 98
(1) Make sure the battery cover is closed properly. (2) Connect to the AC Adapter and see if it takes charge. Also check AC Adapter condition. (3) Check whether AC Adapter is functioning properly. (4) Check whether the condition of Battery Charging status is correct. (5) Check the appearance of Battery Pack if any abnormal.. (6) Try with another Battery Pack or Replace Battery Pack if necessary (7) Try with another Main Board or Replace Main Board if necessary. (8) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.
9．Battery discharges quickly even after fully charged
(1) Make sure the Battery Pack takes fully charge with AC Adapter. (2) Check whether the condition of Battery Charging status is correct. (3) Dismantle the unit and check the appearance of Battery Pack. (4) Try with another Battery Pack or Replace Battery Pack if necessary (5) Try with another Main Board or Replace Main Board if necessary. (6) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.
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10．Battery Pack does not recharge
(1) Make sure the Battery Pack takes fully charge with AC Adapter. (2) Check whether the condition of Battery Charging status is correct. Charge should be done no more than 4
hours. (3) Dismantle the unit and check the appearance of Battery Pack. (4) Try with another Battery Pack or Replace Battery Pack if necessary (5) Try with another Main Board or Replace Main Board if necessary. (6) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.
11．No Sound from Speaker or Distorted sound
Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 78 of 98
(1) Check “Sound & Notifications” Settings in the unit for Sound Enabling. (2) Make sure it’s not MUTED. (3) Try to re-flash the ROM code. (4) Clean up the speaker connection side on MB if there is any contamination. (5) Dismantle and Check whether the Speaker is properly installed (Orientation) (6) Replace Speaker if necessary. (7) Replace Main Board if necessary. (8) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.
12．No Recorded Sound or Distorted sound
(1) Check “Sound & Notifications” Settings in the unit for Sound Enabling. (2) Make sure it’s not MUTED. (3) Try to re-flash the ROM code. (4) Dismantle and Check whether the Microphone is properly installed. (5) Replace Microphone if necessary. (6) Replace Main Board if necessary. (7) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.
HTC CONFIDENTIAL
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13．Wireless connection (WLAN/BT) not functioning
(1) Make sure the wireless environment is OK before connecting to WLAN. (2) Make sure the wireless connection setting has properly set. (3) Make a life connection with Internet or another device. (4) Try to re-flash the ROM code. (5) Try with another main board if necessary (6) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.
Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 79 of 98
HTC CONFIDENTIAL
SM-TP001-0704
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HTC Corporation
.
Doc. Title
Raphael Service Manual
8. Generic Labeling Plan
Main unit
Agency label_RAPH100
The brand name is shown on bezel HTC P/N: 77H00623-00M Size: 40.3X 38.55mm
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 80 of 98
HTC CONFIDENTIAL
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Doc. Title
HTC Corporation
.
Raphael Service Manual
Water sensitive label
HTC P/N: 77H00668-00M
Qty: 1
Tamper evident label
HTC P/N: 77H00460-01M
Qty: 1
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 81 of 98
HTC CONFIDENTIAL
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9. Generic Spare Part List and Photos
9.1 SPL for Repair
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 82 of 98
HTC CONFIDENTIAL
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Issued Date 2008/7/2
Revised Date 2008/12/01
Page 83 of 98
HTC CONFIDENTIAL
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Doc. No. DOC-00043540 REV.
Doc. Title
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
72H02689-00M
Screw
4
N/A
No No
72H01893-00M
Screw
HTC Corporation
.
Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 84 of 98
Picture for SPL 80H Kernel and Accessories
(Part no on picture is for Generic version only, please check SPL for detail per customer)
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
72H02474-00M
Screw
4
N/A
No No
72H02450-00M
Screw
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
2
N/A
No No
72H02886-00M
Screw, Main PCB
1
N/A
No No
72H02749-00M
Conductive Fabric,
LCD FPC
1
N/A
No No
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
7
N/A
No No
72H02865-00M
Screw, Hinge
6
N/A
No No
77H00623-00M
Regulation Label
1
N/A
No No
HTC CONFIDENTIAL
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Doc. No. DOC-00043540 REV.
Doc. Title
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
74H01285-00M
Light-sensor-lens-
assy
1
G118
Yes
No
76H02981-00M
Poron, Navipcb-
bottom-sponge
2
N/A
No No
HTC Corporation
.
Raphael Service Manual
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 85 of 98
72H02819-00M
EMI Gasket, Gasket
between MB and C
parts
1
N/A
No No
72H02756-00M
EMI Gasket,
Navi-board
1
N/A
No No
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
76H02982-00M
Poron, Navipcb-
sponge-lcm-
connector
1
N/A
No No
72H02843-00M
EMI Gasket,
MPCB for Main
Camera
1
N/A
No No
72H02854-00M
Conductive Fabric,
Main-FPC_upper
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
76H02983-00M
Poron, Navipcb-
sponge-main-fpc-
connector
1
N/A
No No
72H02844-00M
EMI Gasket,
Main Camera
1
N/A
No No
76H02770-00M
Mylar,
IO-BD_connector
Q'ty
Repair Code
Refurbishment
Return to HTC
1
N/A
No No
Q'ty
Repair Code
Refurbishment
Return to HTC
N/A
No No
1
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00043540 REV.
Doc. Title
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
72H02703-00M
Conductive Fabric,
Co-axial cable
1
N/A
No No
51H40450-01M
Main Board
1
M101
No
Yes
HTC Corporation
.
Raphael Service Manual
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 86 of 98
51H10078-02M
IO-Board
1
M201.2
No No
80H00736-00
NAVI key assy
1
M201.1
No No
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
73H20177-41M
Sliding BD with 2nd
camera, w/o PTT
1
C122.3
No No
73H20145-09M
SIM FPC
1
C122
No No
77H00711-00M
Tamper evident label
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
74H01154-00M
Navi Keycap
1
C109
Yes
No
80H00735-01
LCM with A-cover
1
L101.2
Yes Yes
54H00279-00M
Main Camera
Q'ty
Repair Code
Refurbishment
Return to HTC
1
N/A
No No
Q'ty
Repair Code
Refurbishment
Return to HTC
1
G117
Yes
No
HTC CONFIDENTIAL
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Doc. No. DOC-00043540 REV.
Doc. Title
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
74H01152-00M
Stylus
1
G102
No No
35H00111-08M
Battery
1
B101
No
Yes
HTC Corporation
.
Raphael Service Manual
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 87 of 98
74H01130-00M
B Cover
1
C102.8
Yes
No
36H00694-00M
Receiver
1
G103.1
No No
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
36H00717-00M
Speaker
1
G103
No No
73H00282-00M
Coaxial Cable
1
B108
No No
71H02564-00M
Damper, left-upper
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
72H02815-00M
EMI Gasket,
Gasket for Hinge
1
N/A
No No
76H02314-00M
Mic Rubber
1
N/A
No No
72H02863-00M
Damper, left-down
Q'ty
Repair Code
Refurbishment
Return to HTC
1
C113
No No
Q'ty
Repair Code
Refurbishment
Return to HTC
1
C113
No No
HTC CONFIDENTIAL
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Doc. No. DOC-00043540 REV.
Doc. Title
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
71H02305-00M
Volume Key
1
C106
Yes
No
74H01128-00M
Sound Cover
1
N/A
No No
HTC Corporation
.
Raphael Service Manual
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 88 of 98
71H02307-00M
Power Key
1
C106
Yes
No
74H01142-00M
Battery Cover
1
C112
Yes
No
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
74H01143-00M
D Part
1
C102.6
Yes
No
80H00740-00
QWERTY keyboard
assy
1
C122.1
Yes
No
72H02845-00M
EMI Gasket,
MicroSD Connector
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
74H01151-00M
B Upper Cover
1
C102.7
Yes
No
77H00668-00M
Water sensitive label
1
N/A
No No
76H02984-00M
ME Gasket,
Gasket-battery-room
Q'ty
Repair Code
Refurbishment
Return to HTC
1
N/A
No No
Q'ty
Repair Code
Refurbishment
Return to HTC
N/A
No No
1
HTC CONFIDENTIAL
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Doc. No. DOC-00043540 REV.
Doc. Title
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
76H03122-00M
ME Gasket, gasket
for GPS groun ding
1
N/A
No No
72H02816-00M
EMI Gasket,
Gasket for Hinge
(Navi board)
1
N/A
No No
HTC Corporation
.
Raphael Service Manual
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 89 of 98
76H02823-00M
Tape, For LCD
gasket. on navi-bo ard
1
N/A
No No
72H02855-00M
Conductive Fabric,
Main-FPC-lower
1
N/A
No No
Part No.
Description
Q'ty
Repair Co de
Refurbishment
Return to HTC
76H02625-00M
Mylar,
Main PCB
1
N/A
No No
Part No.
Description
Q'ty
Repair Code
Refurbishment
Return to HTC
NOTE:
THE PHOTO OF SPL IS GENERIC AND FOR REFERENCE ONLY, THE COLOR AND THE APPEARANCE MAY BE DIFFERENT FROM THE SHIPPED PARTS, IF YOU WANT TO APPLY THOSE PARTS, PLEASE CONTACT YOUR SERVICE ACCOUNT MANAGER FOR MORE INFORMATION.
AS FOR PICTURE, PLEASE REFER TO THE TABLE AS BELOW.
HTC CONFIDENTIAL
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Doc. No. DOC-00043540 REV.
Doc. Title
HTC Corporation
.
Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 90 of 98
9.2 Board Level 2.5 Repairs
Basic Repair Instructions for Component Replacement:
Step 1 Place the solder-proof tape to cover the surrounding area of the components which being replaced.
Warning：DO NOT overheat the tape and components to avoid the tape melted and the components damaged
Step 2 Use Heater Gun (HAKO850B, set the temperature between 350°C, Air Speed 3~5) to remove the
components.
Step 3 Wait till the temperature cool down before removing the solder-proof tape to avoid other components
being removed
Step 4 After the damaged or defective components have been replaced; clear the surroundings for solder
and flux residues.
Notice:
A. Check the polarity and the position of the components, it can't be shifted, reversed or lifted.
B. All the parts of the PCB should be checked if it is missing or not. C. The OP must to wear antistatic wrist strap .Don't put boards together and avoid hitting them. D. When you solder and repair that the soldering iron temperature must be setup 415 .℃ (The
temperature range is 415 ±5 ),and the solder wire's diameter is 0.4/0.5/0.6mm℃℃ (SAC 305 (1.1%)
E. Please be noticed to follow below steps for main board rep air which is equipped with Golden
Capacitor:
1. When replacing level 2.5 components located around the golden capacitor: I. The temperature of the hot air blower must be under 400°c
II. When apply the hot air to the part / component, the heating time must be under 20
seconds (including the time of removing and soldering) III. The temperature of the soldering iron must be under 350°c IV. When apply the solder tip to the part / component, the heating time must be under 5
seconds V. The solder tip must not contact with the golden capacitor
2. For BGA replacement: The golden ca pacitor must be removed before perform pre-heating, heating, soldering and de-soldering process, and then it must be replaced with a new one (please refer to 1.c. and 1.d. steps)
3. For main board which failed to pass the function test, the golden capacitor must be replaced
with a new one and must follow below soldering criteria: The temperature of the soldering iron must be under 350°c When apply the solder tip to the part / component, the heating time must be under 5 seconds The solder tip must not have a cont act with the body of golden capacitor
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00043540 REV.
HTC Corporation
.
Doc. Title
MAIN BOARD (51H40450-XXM)
Raphael Service Manual
TOP SIDE
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 91 of 98
PACON1
P/N Description Location Remark
75H00776-00M
HTC CONFIDENTIAL
Connector Device,60mohm,SUYIN,060062MB003GX01ZL, 3P,2.75Pitch,2A,12V
PACON1
Battery
connector
SM-TP001-0704
Doc. No. DOC-00043540 REV.
Doc. Title
PAC7
HTC Corporation
.
Raphael Service Manual
BOTTOM SIDE
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 92 of 98
P/N Description Location Remark
16H00019-00M
Gold Cap,0.02F,300ohm,SEIKO,XH311HGII45E, 60/-20degC,+/-30%,3.3V,5.8*3.8*1.45mm
PAC7 Gold Cap
HTC CONFIDENTIAL
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HTC Corporation
.
Doc. Title
Raphael Service Manual
9.3 FRU M/B additional parts location
76H02625-00M
72H02843-00M
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 93 of 98
76H03122-00M
76H02377-00M
P/N Description
76H02625-00M Mylar,Main PCB
72H02843-00M EMI Gasket,MPCB for Main Camera
76H03122-00M ME Gasket,gasket for GPS grounding
76H02377-00M Tape
HTC CONFIDENTIAL
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Doc. No. DOC-00043540 REV.
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HTC Corporation
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Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 94 of 98
HTC CONFIDENTIAL
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Doc. No. DOC-00043540 REV.
HTC Corporation
.
Doc. Title
Raphael Service Manual
10. RF Antenna Specification
Raphael WCDMA Antenna Test Specification
Item Test Name TX Level
Camp@ W-CDMA
1
Band ( 2100 )
Uplink / Downlink UA RF CN
3 9612 / 10562 -60
2 BS Originate Cell 3 9612 / 10562 -60
Receiver Test
3 Fast Bit Error Rate 3 9612 / 10562 -104
4 Fast Bit Error Rate 3 9750 / 10700 -104
5 Fast Bit Error Rate 3 9888 / 10838 -104
1st Downlink cell power
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 95 of 98
note
<= 0.1 %
Transmitter Test
6 TX Power 3 9612 / 10562 -60
7 TX Power 3 9750 / 10700 -60
8 TX Power 3 9888 / 10838 -60
Raphael WCDMA Antenna Test Specification
Item Test Name TX Level
Camp@ W-CDMA
1
Band ( 1900 )
Uplink / Downlink UA RF CN
3 9262 / 9662 -60
1st Downlink cell power
2 BS Originate Cell 3 9262 / 9662 -60
Receiver Test
3 Fast Bit Error Rate 3 9262 / 9662 -104
4 Fast Bit Error Rate 3 9400 / 9800 -104
5 Fast Bit Error Rate 3 9538 / 9938 -104
Transmitter Test
>= 18 dbm
note
<= 0.1 %
6 TX Power 3 9262 / 9662 -60
7 TX Power 3 9400 / 9800 -60
>= 18 dbm
8 TX Power 3 9538 / 9938 -60
Raphael WCDMA Antenna Test Specification
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00043540 REV.
HTC Corporation
.
Doc. Title
Item Test Name TX Level
Camp@ W-CDMA
1
Band ( 1700 )
2 BS Originate Cell 3 8762 / 9237 -60
3 Fast Bit Error Rate 3 8762 / 9237 -104
4 Fast Bit Error Rate 3 8787 / 9262 -104
5 Fast Bit Error Rate 3 8812 / 9287 -104
6 TX Power 3 8762 / 9237 -60
7 TX Power 3 8787 / 9262 -60
Raphael Service Manual
Uplink / Downlink UA RF CN
3 8762 / 9237 -60
Receiver Test
Transmitter Test
1st Downlink cell power
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 96 of 98
note
<= 0.1 %
>= 18 dbm
8 TX Power 3 8812 / 9287 -60
Raphael WCDMA Antenna Test Specification
Item Test Name TX Level
Camp@ W-CDMA
1
Band ( 900 )
Uplink / Downlink UA RF CN
3 2712 / 2937 -60
1st Downlink cell power
2 BS Originate Cell 3 2712 / 2937 -60
Receiver Test
3 Fast Bit Error Rate 3 2712 / 2937 -104
4 Fast Bit Error Rate 3 2788 / 3013 -104
5 Fast Bit Error Rate 3 2863 / 3088 -104
Transmitter Test
6 TX Power 3 2712 / 2937 -60
7 TX Power 3 2788 / 3013 -60
8 TX Power 3 2863 / 3088 -60
Raphael WCDMA Antenna Test Specification
note
<= 0.1 %
>= 18 dbm
Item Test Name TX Level
Camp@ W-CDMA
1
Band ( 850 )
HTC CONFIDENTIAL
Uplink / Downlink UA RF CN
3 4132 / 4357 -60
1st Downlink cell power
note
SM-TP001-0704
Doc. No. DOC-00043540 REV.
HTC Corporation
.
Doc. Title
2 BS Originate Cell 3 4132 / 4357 -60
3 Fast Bit Error Rate 3 4132 / 4357 -104
4 Fast Bit Error Rate 3 4175 / 4400 -104
5 Fast Bit Error Rate 3 4233 / 4458 -104
6 TX Power 3 4132 / 4357 -60
7 TX Power 3 4175 / 4400 -60
8 TX Power 3 4233 / 4458 -60
Item Test Name TX Level
Raphael Service Manual
Receiver Test
Transmitter Test
Raphael WCDMA Antenna Test Specification
Uplink / Downlink UA RF CN
1st Downlink cell power
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 97 of 98
<= 0.1 %
>= 18 dbm
note
Camp@ W-CDMA
1
Band ( AWS )
3 1312 / 1537 -60
2 BS Originate Cell 3 1312 / 1537 -60
Receiver Test
3 Fast Bit Error Rate 3 1312 / 1537 -104
4 Fast Bit Error Rate 3 1450 / 1675 -104
<= 0.1 %
5 Fast Bit Error Rate 3 1513 / 1738 -104
Transmitter Test
6 TX Power 3 1312 / 1537 -60
7 TX Power 3 1450 / 1675 -60
>= 18 dbm
8 TX Power 3 1513 / 1738 -60
Raphael GSM Antenna Test Specification
Item Test Name TX Level TCH
1st Downlink cell power
note
1 Wait_Signal 0 600 -65
2 Power_Class 0 600 -65
PCS 1900 Receiver Test
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00043540 REV.
HTC Corporation
.
Doc. Title
3 Fast Bit Error Rate 0 512 -104
4 Fast Bit Error Rate 0 661 -104
5 Fast Bit Error Rate 0 810 -104
6 TX Power 0 512 -65
7 TX Power 0 661 -65
8 TX Power 0 810 -65
9 Fast Bit Error Rate 5 128 -104
10 Fast Bit Error Rate 5 190 -104
11 Fast Bit Error Rate 5 251 -104
12 TX Power 5 128 -65
13 TX Power 5 190 -65
14 TX Power 5 251 -65
Raphael Service Manual
PCS 1900 Transmitter Test
GSM 850 Receiver Test (For US SKU)
GSM 850 Transmitter Test (For US SKU)
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 98 of 98
<= 2 %
>= 26 dbm
<= 2 %
>= 28 dbm
EGSM 900 Receiver Test (For EU SKU)
9 Fast Bit Error Rate 5 975 -104
10 Fast Bit Error Rate 5 38 -104
11 Fast Bit Error Rate 5 124 -104
EGSM 900 Transmitter Test (For EU SKU)
12 TX Power 5 975 -65
13 TX Power 5 38 -65
14 TX Power 5 124 -65
DCS 1800 Receiver Test
21 Fast Bit Error Rate 0 512 -104
22 Fast Bit Error Rate 0 699 -104
23 Fast Bit Error Rate 0 885 -104
DCS 1800 Transmitter Test
24 TX Power 0 512 -65
25 TX Power 0 699 -65
26 TX Power 0 885 -65
<= 2 %
>= 28 dbm
<= 2 %
>= 26 dbm
HTC CONFIDENTIAL
SM-TP001-0704
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