HTC Raphael Service manual

Doc. No. DOC-00043540 REV.
Doc. Title
HTC Corporation
.
Raphael Service Manual
Raphael
Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 1 of 98
U
HTC Proprietary
Confidential T reatment Requested
Rev . A10
HTC Corp.
Engineering Mobility
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Doc. Title
REVISION CONTROL TABLE
REV DATE CONTENTS DEPT REVISED STAGE
AX01 2008/7/2 Fist Draft PSE Budiman_Cheng DVT
A01 2008/7/23
A02 2008/8/11
A03 2008/9/1
A04 2008/10/15
A05 2008/10/20
A06 2008/10/31 A07 2008/11/10 A08 2008/11/20 A09 2008/11/26
A10 2008/12/01
Raphael Service Manual
1. Change picture of water sensitive label location on generic labeling plan
2. Update feature sheet (GSM/EDGE to quad band frequency, battery life and add extended battery with battery cover in the accessory list as an optional item)
3. Update sleep and idle current test on chapter 5.1
4. Add RF antenna spec on chapter 10
5. Add spare part list on chapter 9.1
1. Update assembling procedure and pictures on chapter 2.3
2. Update cosmetic inspection criteria
Update feature sheet: add eMobile SKU with 1700MHz UMTS band
1. Add picture and “Return to HTC” column on chapter 9.1
2. Update speaker installation notice on chapter 2.3
3. Update assembling procedure on page 27
1. Update repair code on chapter 9.1
2. Change hot key to enter diagnostic mode on chapter 4.1
Update board level 2.5 repair on chapter
9.2
Add sleep and idle current test condition on chapter 5.1 Add some part numbers on chapter 2.3 (Assembling procedure) Add FRU M/B additional parts location on chapter 9.3
1. Remove 76H02985-00M from chapter
9.1 SPL for repair (ECR#28037)
2. Change assembling procedure on chapter 2.3 (ECR#28037)
3. Add 76H03122-00M into chapter 9.3 (ECR#28037)
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 2 of 98
PSE Budiman_Cheng PVT
PSE Budiman_Cheng PVT
PSE Budiman_Cheng PVT
PSE Budiman_Cheng MV
PSE Budiman_Cheng MV
PSE Budiman_Cheng MV PSE Budiman_Cheng MV PSE Budiman_Cheng MV PSE Budiman_Cheng MV
PSE Budiman_Cheng MV
HTC CONFIDENTIAL
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Doc. Title
HTC Corporation
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Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 3 of 98
1. INTRODUCTION ....................................................................................................................................................................4
1.1 PRODUCT FEATURES..........................................................................................................................................5
1.2 PRODUCT OVERVIEW........................................................................................................................................10
2. DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE ................................................................................18
2.1 TOOLS LIST......................................................................................................................................................18
2.2
DISASSEMBLING PROCEDURE............................................................................................................................19
2.3 ASSEMBLING PROCEDURE ................................................................................................................................27
3. ROM RE-FLASH PROCEDURE........................................................................................................................................38
3.1 ROM UPGRADE THRU RUU (RE-FLASH UPGRADE UTILITY)................................................................................38
3.2 ROM IMAGE UPGRADE THRU SD CARD .............................................................................................................42
4. DIAGNOSTIC PROGRAM..................................................................................................................................................44
4.1 LIST OF DIAGNOSTIC TEST ITEMS......................................................................................................................44
5. POWER MEASUREMENT TEST ......................................................................................................................................59
5.1 MAIN BOARD LEAKAGE CURRENT TEST PROCEDURE ..........................................................................................59
5.2 BATTERY RUNDOWN TEST PROCEDURE..............................................................................................................63
6. COSMETIC INSPECTION CRITERIA...............................................................................................................................68
6.1 CLASSES DEFINITION OF INSPECTIVE AREA.........................................................................................................68
6.2 DISPLAY INSPECTION........................................................................................................................................71
6.3 MAIN UNIT INSPECTION .....................................................................................................................................72
7. GENERIC TROUBLESHOOTING .....................................................................................................................................73
8. GENERIC LABELING PLAN..............................................................................................................................................80
9. GENERIC SPARE PART LIST AND PHOTOS................................................................................................................82
9.1 SPL FOR REPAIR..............................................................................................................................................82
9.2 BOARD LEVEL 2.5 REPAIRS ..............................................................................................................................90
9.3
FRU M/B ADDITIONAL PAR TS LOCATION.............................................................................................................93
10. RF ANTENNA SPECIFICATION .......................................................................................................................93
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Doc. Title
HTC Corporation
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Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 4 of 98
1. Introduction
This manual provides the technical information to support the service activities of this product.
This document contains hi ghly confidential information, so any or all of this document should not be revealed to
any third party.
Chapter 1: Introduction-This Chapter is about Products features and basic Product function. After
Chapter 2: Device Disassembling and Assembling Procedure- After reading this chapter, you will
reading this chapter, you will know what feature the product has and basic hardware operation. Also you will know how to perform soft-rest and hard-rest in this chapter.
learn how to disassemble and assemble the product. Also, you will know what tools to use and the torque. Please follow the instruction to disassemble the unit to prevent from damaging the unit.
Chapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to perform
the ROM image re-flesh by using RUU and SD-Card. Also you can find the steps of enter the boot loader mode.
Chapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn
How to use the diagnostic program to perform unit function test How to test some functions in Windows Mobile mode (ex. WLAN, Bluetooth, and
USB etc…)
Chapter 5: Power measurement test- After reading this chapter, you will learn how to use MB
leakage test procedure and battery run-down test (Battery Capacity Measurement).
Chapter 6: Cosmetic Inspection Criteria- After reading this chapter you will learn the appearance
quality inspection criteria, ex. Display, bezel, and housing etc…
Chapter 7: Generic Troubleshooting- After reading this chapter, you will learn how to do generic
trouble-shooting.
Chapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for reference, ex.
Regulation label, and battery label etc…
Chapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts reference
list and photos for repairing, including unit and Board level.
Chapter 10: RF Antenna Specification- Reference Spec for RF test.
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Doc. Title
1.1 Product Features
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Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
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Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
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Raphael Service Manual
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Revised Date 2008/12/01
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1.2 Product overview
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Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
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Revised Date 2008/12/01
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Installing the SIM card
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Installing the SD card
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Raphael Service Manual
To install / remove the battery
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Charging the battery
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To perform a soft reset
1. Remove the back cover.
2. Pull out the stylus.
3. Use the stylus to press the RESET button located between the opening of the stylus compartment and USB connector on the back of the device. Your device restarts and displays the Today screen.
To perform a hard reset
Warning! Your device will be set back to factory default settings. Please ensure any additional installed
programs and/or user data have been backed up before a hard reset is performed.
1. Pull out the stylus
2. With the device turned on, press and hold the VOLUME DOWN and ENTER buttons, then press the RESET button with the stylus tip.
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Raphael Service Manual
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 17 of 98
3. Release the RESET button, but continue pressing the VOLUME DOWN and ENTER buttons until you see this message on the screen:
4. Release the VOLUME DOWN and ENTER buttons, then press the VOLUME UP button to perform the hard reset, or press any other button to cancel the reset.
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2. Device Disassembling and Assembling Procedure
2.1 Tools list
level No. Item Vendor P/N
1 Mini USB DATA interface Cable 2 Earphone Headset 3 AC Adapter 4 WLAN AP
Level 2 Memory Card with Diag. test program
L 1
5
(need be encoded by HTC) Level 0 Memory Card with Diag. test program
6
(need be encoded by HTC)
7 3pin battery holder HTC special tools MLT-00006
HTC design DCT-00050
HTC design DCZ-00050
L 2
L 2.5
8 Universal Leakage Current Tester HTC special tools MLT-00001
9 Power supply 10 Current Meter 11 Mobile tester 12 Special Made Plastic Stick HTC special tools RTT-00006 13 Hand tools 14 Oven for rework purpose HTC special tools RTT-00007
15 Mylar,Assembly jig, for navi and TW,black, Raphael
Mylar,Assembly jig, for navi and A-cover,black,
16
Raphael
17 Navi board keycap assembly jig HTC special tools RTT-00016 18 Barcode label printer (400dpi resolution and up) 19 Lead-free Soldering station 20 Hot air gun
76H02974-00M
76H02973-00M
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2.2 Disassembling procedure
Issued Date 2008/7/2
Revised Date 2008/12/01
Page 19 of 98
1. PHILLIPS SCREW-DRIVER 00X50
2. FLAT PLASTIC STICK (P/N: RTT-00006)
3. CLEANING CLOTH
4. PLASTIC TWEEZERS
5. ESD WRIST STRAP.
6. KEYCAP ASSEMBLY FIXTURE
(P/N: RTT-00016 )
7. OVEN FOR REPAIR / REWORK
PURPOSE (P/N: RTT-00007)
8. MYLAR FOR KEYCAP GAP
CONTROL (P/N: 76H02974-00M)
9. MYLAR FOR KEYCAP GAP
CONTROL (P/N: 76H02973-00M)
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1. TAKE OUT THE STYLUS.
2. REMOVE THE BATTERY COVER
AS SHOWN.
1. TAKE OUT THE BATTERY AS
SHOWN.
2. LOOSEN 4 SCREWS FROM THE
HOUSING.
1. EXTEND THE KEYBOARD BY
SLIDING THE DISPLAY UP.
2. INSERT THE FLAT PLASTIC
STICK BETWEEN THE HOUSING AND QWERTY KEYBOARD AND THEN FOLLOW THE ARROW DIRECTION.
3. DISASSEMBLE THE HOUSING AS
SHOWN.
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1. DISCONNECT THE SPEAKER
CONNECTOR AT THE LOCATION INDICATED.
2. REMOVE THE SOUND COVER BY
LIFTING IT UP.
1. REMOVE THE SPEAKER BY
LIFTING IT UP.
2. RELEASE THE ANTENNA WIRE
AS SHOWN.
1. LOOSEN THE SCREW AT THE
LOCATION INDICATED.
2. DISCONNECT QWERTY
KEYBOARD CONNECTOR FROM THE MB.
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1. REMOVE THE MYLAR AT THE
LOCATION INDICATED.
2. DISCONNECT THE MAIN FPC
FROM THE M/B.
1. REMOVE THE MYLAR AT THE
LOCATION INDICATED.
2. DISCONNECT THE ANTENNA
WIRE AT THE LOCATION INDICATED.
1. REMOVE THE MYLAR AT THE
LOCATION INDICATED.
2. DISCONNECT THE I/O BOARD
CONNECTOR.
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1. DISCONNECT THE SIM FPC
CONNECTOR.
2. DISCONNECT THE MAIN
CAMERA CONNECTOR.
3. INSERT THE FLAT PLASTIC
STICK BETWEEN THE SIM FPC AND SHIELDING COVER AND THEN FOLLOW THE ARROW DIRECTION TO SEPARATE THE
SIM FPC.
1. INSERT THE FLAT PLASTIC
STICK AS SHOWN TO SEPARATE THE MAIN CAMERA AND THE MAIN BOARD.
2. LOOSEN 6 SCREWS AT THE
LOCATION INDICATED.
1. LOOSEN 5 SCREWS FROM
B-COVER AND B-UPPER
COVER
2. DISASSEMBLE THE B-UPPER
COVER AS SHOWN.
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1. DISASSEMBLE THE B COVER AS
SHOWN
2. TAKE OUT THE VOLUME KEY AS
SHOWN.
1. DISCONNECT THE MAIN FPC
CONNECTOR FROM NAVI KEY ASSEMBLY.
2. REMOVE THE CONDUCTIVE
FABRIC AT THE LOCATION INDICATED
1. DISCONNECT THE LCM
CONNECTOR AND LOOSEN THE TWO SCREWS FROM THE MAIN FPC.
2. DO NOT DISASSEMBL Y THE 2
CAMERA, REPLACE BOTH THE
FPC AND 2
SAME TIME IF ONE OF THEM WAS F AILED (FOR MODEL WITH
ND
2
CAMERA)
ND
CAMERA AT THE
ND
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1. TAKE OUT THE POWER
BUTTON.
2. TAKE OUT THE RECIEVER AT
THE LOCATION INDICATED.
1. TAKE OUT THE MICROPHONE
RUBBER AT THE LOCATION INDICATED.
2. LOOSEN 4 SCREWS FROM THE
NAVI KEY ASSEMBLY AT THE LOCATION INDICATED.
LOOSEN ANOTHER 2 SCREWS AT
THE LOCATION INDICATED.
NOTE: BELOW STEPS CAN BE DONE
BY AUTHORIZED SERVICE PROVIDER ONLY AFTER SAFE LAUNCH.
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PUT THE NAVI PRE ASSY INTO AN
OVEN ABOUT 5 MINUTES AT 65 DEGREE CELCIUS.
INSERT THE FLAT PLASTIC STICK
BETWEEN THE KEY CAP AND THE
FPC AS SHOWN.
CONTINUE ABOVE STEP AND
FOLLOW THE ARROWS DIRECTION TO SEPARATE THE NAVI KEY CAP AND THE FPC.
INSERT THE FLAT PLASTIC STICK
BETWEEN THE CENTER NAVI KEY CAP AND THE FPC AS SHOWN TO SEPARATE THEM
The Disassemble process is done
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2.3 Assembling procedure
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1. REMOVE THE CONDUCTIVE FABRIC
ON THE MAIN CAMERA AT THE LOCATION INDICATED.
2. PASTE A CONDUCTIVE FABRIC (72H02844-0M) ON THE MAIN
CAMERA AT THE LOCATION INDICATED.
1. CONNECT THE MAIN CAMERA TO SIM FPC AND STICK THE CONDUCTIVE
FABRIC ON IT.
1. MAKE SURE THE MYLAR (76H02625-00M) AND THE
CONDUCTIVE FABRIC
(72H02843-00M, 76H03122-00M)
WAS ATTAHCED AT THE LOCATION INDICATED.
2. STICK THE SIM FPC TO THE MAIN
BOARD AT THE LOCATION INDICATED
NOTE: A. DO NOT BEND THE SIM FPC B. DO NOT TOUCH THE DOUBLE SIDED
TAPE
C. MAKE SURE THE SHIELDING COVER
SURFACE IS CLEAN
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1. CONNECT THE SIM FPC
CONNECTOR TO THE MAIN BOARD.
2. PASTE A LDI (77H00668-00M) AT
THE LOCATION INDICATED.
PASTE A CONDUCTIVE FABRIC (76H02985-00M) AT THE LOCATION
INDICATED.
PASTE A CONDUCTIVE FABRIC (72H02845-00M) AT THE LOCATION
INDICATED.
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1. CONNECT THE I/O BOARD
CONNECTOR TO THE M/B
2. STICK A MYLAR (76H02770-00M) AT
THE LOCATION INDICATED
1. CONNECT THE ANTENNA WIRE AT THE
LOCATION INDICATED.
2. FIX THE ANTENNA WIRE WITH A
CONDUCTIVE FABRIC
(72H02703-00M) AT THE LOCATION
INDICATED.
1. INSTALL THE RECEIVER AT THE
LOCATION INDICATED.
2. STICK THE LIGHT SENSOR LENS AT
THE LOCATION INDICATED.
NOTE: MAKE SURE THE SPEAKERS
CONTACT SPRING IS FACING OUTSIDE
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1. ASSEMBLE THE NAVI KEY AND
TIGHTEN 2 SCREWS AT THE LOCATION INDICATED (P/N: 72H02450-00M).
TORQUE: 0.5 ±0.1 KGF-CM
2. TIGHTEN 4 SCREWS A T THE LOCATION
INDICATED (P/N: 72H02689-00M).
TORQUE: 0.7 ±0.1 KGF-CM
1. ASSEMBLE THE NAVI KEY CAP AS
SHOWN. PRESS THE KEY CAP FIRMLY.
2. REMOVE ALL OF THE MYLAR AFTER
ASSEMBLY PROCESS IS DONE.
NOTE: DO NOT TOUCH THE DOUBLE SIDED
TAPE & FPC AREA WHILE ASSEBLE THE NAVI KEYCAP AND MAKE SURE THE SURFACE OF THE NAVI KEY FPC IS CLEAN.
NOTE:
3. PLEASE PASTE MYLAR NO. 2 & 3 AT
THE LOCATION INDICA TED IF THERE IS NO MYLAR ON THE BEZEL
4. CLEAN THE NAVIKEY FPC SURFACE
WITH LABORATORY ALCOHOL (95% AND UP) WHILE DOING KEYCAP REWORK.
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