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Doc. Title
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.
QUARTZ Service Manual
Issued Date 2008/9/1
Revised Date 2008/12/10
Page 1 of 80
QUARTZ
Service Manual
UHTC Proprietary
Confidential T reatment Requested
A05
Rev . A05
HTC Corporation
Engineering Mobility
HTC CONFIDENTIAL
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Doc. No. DOC-00046130 REV.
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Doc. Title
REVISION CONTROL TABLE
REV DATE CONTENTS DEPT REVISED STAGE
AX01 2008/04/14 Fist Draft PSE Jason.Cl_Lee DVT
A01 2008/10/7 Formal release PSE Jason.Cl_Lee PVT
A02 2008/10/29
A03 2008/11/19
QUARTZ Service Manual
1. Add tamper evident label.
2. Revise chapter 11.1
3. Add internal storage content pre-load process.
4. Update chapter 9.1 SPL list for repai r
1. Add “write engineer ID” in the diagnostic process.
2. Add “
Adjust the backlight to lowest” in the
LCM and Bezel replacement.
power management for idle and sleep
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PSE Jason.Cl_Lee MV
PSE Jason.Cl_Lee MP
current measurement.
1. Remove some parts of board level 2.5.
2. Add document no for internal storage pre-load tool.
3. Add the last step of internal storage pre-load
A04 2008/11/26
A05 2008/12/10 1. Add TV out test in the chapter 4.1 Win CE test item PSE Jason.Cl_Lee MP
process to check the internal storage content.
4. Add chapter 9.3 FRU M/B addition parts location.
5. Add unit water sensitive label location.
6. Update chapter 9.1 SPL for repair.
PSE Jason.Cl_Lee MP
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Table of Contents
1. INTRODUCTION......................................................................................................................................................4
1.1 Product overview...............................................................................................................................................6
2. DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE...........................................................................10
2.1 Tools List..........................................................................................................................................................10
2.2 Disassembling procedure................................................................................................................................1 1
2.3 Assembling procedure......................................................................................................................................17
3. ROM RE-FLASH PROCEDURE............................................................................................................................23
3.1 Internal storage pre-load .................................................................................................................................23
3.2 ROM upgrade thru RUU (Re-flash Upgrade Utility) ........................................................................................25
3.3 Rom Image upgrade thru SD card ..................................................................................................................29
4. DIAGNOSTIC PROGRAM .....................................................................................................................................31
4.1 List of Diagnostic / WinCE Test Items..............................................................................................................31
5. POWER MEASUREMENT TEST...........................................................................................................................45
5.1 Main board leakage current Test Procedure ...................................................................................................45
5.2 Battery rundown test procedure ......................................................................................................................48
6. COSMETIC INSPECTION CRITERIA....................................................................................................................54
6.1 Classes definition of inspective area...............................................................................................................54
6.2 Display inspection............................................................................................................................................55
6.3 Main unit inspection.........................................................................................................................................55
7. GENERIC TROUBLESHOOTING..........................................................................................................................56
8. GENERIC LABELING PLAN..................................................................................................................................61
9. GENERIC SPARE PART LIST AND PHOTOS.......................................................................................................65
9.1 SPL for Repair.................................................................................................................................................65
9.2 Board Level 2.5 Repairs..................................................................................................................................70
9.3 FRU M/B addition parts location......................................................................................................................73
10. RF ANTENNA SPECIFICATION..........................................................................................................................74
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11. APPENDIX ...........................................................................................................................................................76
11.1 LCM and LCM bezel replacement...................................................................................................................76
11.2 2nd camera and daughter board assembly ......................................................................................................80
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1. Introduction
This manual provides the technical information to support the service activities of Diamond.
This document contains highly confidential information, so any or all of this document should not be reveal ed to
any third party.
z Chapter 1: Introduction-This Chapter is about Products features and basic Product
function. After reading this chapter , you will know what feature the product has
and basic hardware operation. Also you will know how to perform soft-rest and
hard-rest in this chapter.
z Chapter 2: Device Dissembling and Assembling Procedure- After reading this chapter,
you will learn how to disassemble and assemble the product. Also, you will
know what tools to use and the torque. Please follow the instruction to
dissemble the unit to prevent from damaging the unit.
z Chapter 3: ROM Re-flash Procedure- After reading this chapter, you will learn how to
perform the ROM image re-flesh by using RUU and SD-Card. Also you can
find the steps of enter the boot loader mode.
z Chapter 4: DIAGNOSTIC PROGRAM- After reading this chapter, you will learn
z How to use the diagnostic program to perform unit function test
z How to test some functions in Windows Mobile mode (ex. WLAN,
Bluetooth, and USB etc…)
z Chapter 5: Power measurement test- After reading this chapter, you will learn how to use
MB leakage test procedure and battery run-down test (Battery Capacity
Measurement).
z Chapter 6: Cosmetic Inspection Criteria- After reading this chapter you will learn the
appearance quality inspection criteria, ex. Display, bezel, and housing etc…
z Chapter 7: Generic Troubleshooting- After reading this chapter, you will learn how to do
generic trouble-shooting.
z Chapter 8: Generic Labeling Plan- In this chapter, you will find generic labels for
reference, ex. Regulation label, and battery label etc…
z Chapter 9: Generic Spare Part List and Photos- In this chapter, you will find Spar parts
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reference list and photos for repairing, including unit and Board level.
z Chapter 10: RF Antenna Specification- Reference Spec for RF test.
z Appendix: Additional information.
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1.1 Product overview
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2. Device Disassembling and Assembling Procedure
2.1 Tools List
level No. Item Vendor P/N
1 Mini USB DATA interface Cable
2 Earphone Headset
3 AC Adapter
4 WLAN AP
L 1
L 2
L 2.5
5 Micro Memory Card with Diag. test
program (need be encoded by
HTC)
6 Micro memory card for ROM code
re-flash ( must be encoded by HTC)
7 Micro memory card for internal
storage pre-load
7 Universal leakage current tester HTC design MLT-00001
8 Battery holder HTC design
9 Unit current consumption test
fixture
10 Power supply
11 Current Meter
12 Mobile tester
13 TV out cable HTC option parts
14 TV
13 Special Made Plastic Stick HTC special tools RTT-00006
14 Hand tools
19 Label printer
( 400 dpi resolution and up )
18 Lead-free Soldering station
19 Air heater
HTC design DCT-00062
HTC design
HTC design
73H00274-02M
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2.2 Disassembling procedure
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Tools needed for Assembling and Disassembling
process.
1. Lens Cleaning Cloth.
2. Screw Driver T6X40.
3. Flat Plastic Stick.
4. Plastic Tweezers.
Press the battery cover and push the battery cover
as shown photo.
Use your finger to lift up battery.
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Use Torx bit no 6 to remove five screws.
Use Flat Plastic Stick to separate LCM and
housing.
Disconnect vibrator.
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Use flat plastic stick to disconnect LCM connector .
Use flat plastic stick to disconnect 2nd camera.
Use flat plastic stick to disconnect main camera.
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Use flat plastic stick to remove speaker.
Use flat plastic stick to remove receiver.
Remove one gasket on the LCM.
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Place the LCM module into the oven by 60℃ and
5 minutes.
Press LCM as shown the photo to separate LCM
and bezel.
Lift up the LCM as shown the photo.
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The disassembly process is finished.
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2.3 Assembling procedure
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Tools needed for Assembling and Disassembling
process.
1. Lens Cleaning Cloth.
2. Screw Driver T6X40.
3. Flat Plastic Stick.
4. Plastic Tweezers.
Place LCM into bezel as shown the photo.
For LCM and LCM bezel assembly, please
also refer appendix 11.1
Stick one EMI gasket on the LCM a s sh own the
photo.
EMI gasket P/N: 72H02659-00M
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Place receiver on the LCM bezel. The pins of
receiver should direct LCM side.
Place speaker into housing.
Assemble main camera and then stick one EMI
gasket on it.
EMI gasket P/N: 72H02659-00M
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Place 2nd camera on the main board as shown the
photo especially the red circle must toward the
bottom.
Please replace 2nd camera and daughter
BD in the same time if 2nd camera is
defective.
For 2nd camera and daughter BD
assembly, please refer appendix 11.2
Connect LCM cable and main board.
Place main board on the LCM and then ensure the
main board is locked by the two hooks.
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Remove protector of vibrator tape.
Connect vibrator with main board and then ensure
the cable of vibrator is fixed on the vibrator tape.
Combine housing with LCM bezel.
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Fasten five screws.
Torque: 1.5±0.05 kg-cm2
72H02643-00M * 1
72H01059-00M * 4
Stick one tamper evident label as shown the
photo.
tamper evident label P/N: 77H00460-01M
Place battery into device.
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Place battery cover.
Insert stylus into device.
The assembly process is finished.
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3. ROM Re-flash Procedure
3.1 Internal storage pre-load
Internal storage pre-load-1
1. Download the internal storage content from
SDO (
http://htcscm10.htc.com.tw/SDO
2. Download the autorun.exe from SDO
(DOC-00049134).
http://htcscm10.htc.com.tw/SDO
3.
Un-zip the image file.
GSD-00005788).
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Internal storage pre-load-2
4. Format the Micro SD card with FAT32.
5. Create a folder named 2577 in the Micro
SD card.
6. Copy autorun.exe into 2577 folder.
7. Copy all the files of internal storage content
into the 2577 folder as shown the photo.
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8. Insert the micro SD into the device and
then the device will copy the files to internal
storage automatically.
QUARTZ Service Manual
Internal storage pre-load-3
Internal storage pre-load-4
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9. After completing the data copy, the program
will compare the checksum value with the
checksum file in the micro SD card.
Internal storage pre-load-5
10. You can also check the internal storage if
have the folder as shown the photo.
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3.2 ROM upgrade thru RUU (Re-flash Upgrade Utility)
Connect device to PC
1. Setting and allow USB connections in
Microsoft ActiveSync.
2. Connect your device and desktop/ or
laptop via USB cable.
3. Check the pop-up message from
Microsoft ActiveSync when device is
synchronized with PC.
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Download OS Image from SDO
4. Download OS image from SDO.
http://htcscm10.htc.com.tw/SDO
5. Un-zip the file and execute RUU
program.
Check the setting of menu
6. Select the type of USB connection with
“ActiveSync” mode in the settings of
menu.
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7. Tap the RUU to execute ROM code
8. Read the pop-up message form
9. Click “Next” to proceed.
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re-flash.
ROM update utility and select the “I
understand…” checkbox.
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RUU-1
RUU-2
10. Read the pop-up message form
ROM update utility to follow and
perform the instructions and select
the “I completed…” checkbox.
11. Click “Next” to proceed.
12. Current image version
confirmation.
13. Click “Update” to proceed
RUU – 3
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14. Double verify the ROM revision
15. Click “Next” to proceed.
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which you want to update before
re-flash procedure.
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RUU-4
RUU-5
16. Read the information from
pop-up message and the OS
update procedure will takes 10
minutes long.
17. Click “Next” to proceed.
18. You can see the update
progress from your PC and in
your device.
RUU – 6
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19. The OS upgrade is finished,
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click “Finish” to close the utility.
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RUU – 7
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3.3 Rom Image upgrade thru SD card
Download OS Image from SDO
10. Download OS image from
SDO.
http://htcscm10.htc.com.tw/SDO
11.
Un-zip the image file.
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Format SD card and copy image file to SD card
12. Format the Micro SD card to
FAT32 mode.
13. Copy image file XXX.nbh to
the micro SD card and
re-name to QUARIMG.NBH.
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14. T urn off the device and insert
Micro SD card.
15. Press and hold Volume
down
+ Power button to
entry boot loader mode.
16. Press Volume up
upgrade procedure.
QUARTZ Service Manual
button to
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SD Upgrade - 1
SD Upgrade - 2
17. After finishing re-flash
process, press reset button
to re-boot the device.
[Note]: This process will takes 10
minutes, please don’t power off
the device.
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4. DIAGNOSTIC PROGRAM
4.1 List of Diagnostic / WinCE Test Items
Mode No Item Description Remark
Function Test
1 Auto Auto Regular Tests (Display, B.L, Vibrator, etc…)
2 F/T1 Test
3 Back Light Test LCD back light test
4 ROM Checksum Calculate ROM code size
5 RAM Test SDRAM test
A05
6 SD Card Test Micro SD card read / write test
7 Key Test
Power, Volume up, Volume down, APP1,
App2 and App3.
8 Display Test Pattern display test
9 T/P Test Touch panel calibration
10 Vibrator Test Vibrator on test
11 LED Test Device status LED test
12 Read Batt Info Read battery information
13 MoviNand Test Internal storage read / write test
14 G-Sensor Test Motion G sensor function test
15 Read WiMAX MAC Read WiMAX MAC address
Diagnostic mode
Read WiMax
16
( SQN1130 ) ID
Get WiMax ID information
17 Get Wlan ID Get WLAN ID information
18 Exit Exit the function test
Run-in Test
1 2 Hour 2 Hour Run-in Test/Press Volume-up key. Option
2 4 Hours
4 Hours Run-in Test/Press Volume-down
key.
3 8 Hours 8 Hours Run-in Test/Press Phone-on key. Option
Option
4 12 Hours 8 Hours Run-in Test/Press Home key Option
5 No Limited No limited Run-in Test/Press Phone-end key. Option
Format FAT (Clear Personal information, talk times and format storage)
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Device Info
Erase MoviNand ( Clear internal storage )
Write Engineer ID
1 Bluetooth Test Bluetooth Function Test
2 USB Test USB link test (Microsoft ActiveSync)
3 Camera Test Camera Function Test
4 WLAN Test WLAN Function Test
5 GPS Test GPS Function Test
6 FM Radio Test FM Radio Function Test
Win CE mode
7 Audio Test
8 WIMAX Test
9 TV out Test
HTC Corporation
QUARTZ Service Manual
All Audio Function Test
WIMAX Function Test
TV out function Test
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Diagnostic mode
How to select test item: Using Volume -"Up" or "Down" to select the test items
How to execute the test program: Press “Home” button
at the bottom of touch panel to start each of test items.
Main Menu/Function Test Menu
1. Turn the device power off and insert
Diagnostic SD card into the device.
2. Press and hold Volume down
Power
button then enter Diagnostic
mode.
3. Using to select the test item and
move to next page as well.
4. Select item “Function Test” to find
+
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the Function test menu.
Auto Test
1. Press the Action key to start the
Auto-test.
2. It will perform the regular tests, please
follow the system instruction to do the
test.
F/T1 Test
1. Press V olume key to select F / T1 Test
on Function test menu.
2. Connect device and computer via
USB cable. The device will start to
sync
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2. Press V olume key to select Back Lig ht
3. Press Home icon to switch the LCD
4. Press Home icon to exit and return to
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.
QUARTZ Service Manual
Back Light Test
Test on Function test menu.
backlights level from Level1, Level2,
Level3 and Level4
Function test menu.
.
ROM Checksum Test
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1. Press Volume key to select ROM
Checksum on function test menu.
2. The Rom Checksum will be
displayed on the screen.
3. Press Home icon to exit and return to
Function test menu.
RAM Test
1. Press Volume key to select RAM Test
on function test menu.
2. The test result will be displayed on the
screen.
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1. Press Volume key to select SD Card
2. The test result will be displayed on the
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Test on function test menu.
screen.
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SD Card Test
Key Test
1. Press Volume key to select Key Test
on function test menu.
2. Follow the instruction on screen to
perform the Key/Button test. ( Volume
Up / Down, App1, App2 and APP3)
Display Test
1. Press Volume key to select Display
Test
on Function test menu.
2. After the test pattern is show up,
please check the pattern if any
un-uniform color or chromatist.
3. Press Home icon to continue the next
test pattern.
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Press Volume key to select T/P Test on
function test menu.
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T/P Test
Vibrator Test
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1. Press Volume key to select Vibrator
Test on function test menu.
2. Press Home icon to exit vibrator test.
1. Press Volume key to select LED Test
on function test menu.
2. Check LED behavior if correct or not.
LED Test
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1. Press Volume key to select Read Batt
2. Press Home icon to exit.
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Info on function test menu.
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Read Batt Info
MoviNand Test
1. Press Volume key to select NoviNand
Test on function test menu.
2. The test result will be displayed on the
screen.
G-Sensor Test
1. Press Volume key to select G-
Sensor Test
on Function test menu.
2. Put the unit on the table with when
performing this G sensor testing.
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1. Press Volume key to select Read
2. Press Home icon to exit.
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Read WiMAX ( SQN1130 ) ID
Wimax ( SQN1130 ) ID on function
test menu.
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Get Wlan ID
1. Press Volume key to select Get Wlan
ID on function test menu.
2. Press Home icon to exit.
Main Menu/Engineer ID
1. Choose Engineer ID item and then
tap Home icon.
2. Choose A1 LCM or A2 LCM to
write engineer ID in the main
board.
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WinCE mode Test
1. Tap icon Comm Manager on the
Today screen and turn on Bluetooth.
2. Tap the icon “Settings” down-right
the corner of the screen and select
the “Make this device….” Checkbox.
3. Press Action key (Jog-ball) to go
next test pattern.
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Bluetooth Test - 1
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Bluetooth Test-2
4. Tap Start->Settings->Connections->
Beam and select “Receive all….”
Checkbox.
5. To create a file, tap Start->Programs
->Notes->New
6. Tap and select the “Beam file…”
Bluetooth Test-3
7. Once device is searched, tap the
device to send the file.
8. Return to Today screen and tap
Start->Program->Comm Manager
->Bluetooth to turn off Bluetooth.
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1. Start up the Microsoft®
2. Select ActiveSync in the setting of
3. Insert USB cable and connect unit to
4. The USB to PC icon
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QUARTZ Service Manual
ActiveSync®program in the PC.
menu
desktop/ or laptop.
-> is
appears on the Today screen when
your device is connected to your
desktop/ or laptop.
Camera Test
Issued Date 2008/9/1
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Revised Date 2008/12/10
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USB Test
1. Tap Start->Program->Camera or
Press Camera button to turn on the
Camera.
2. Make sure the device will present
and enter the preview display.
3. Check camera pre-view and image
quality.
WLAN Test
1. Tap icon Comm Manager on the
Today screen and turn on WLAN.
2. Select the hot-spot/ or access point
which searchable and appears on
screen.
3. Once the hot-spot (access point) is
connected, press the IE button and
logon Internet.
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1. Download test program from SDO
http://htcscm10.htc.com.tw/SDO
2. Setup the COM port to COM4.
3. Place device in GPS receptor
4. Check the GPS status as picture
HTC Corporation
.
QUARTZ Service Manual
(DOC-00042190)
coverage area and tap the icon
“Open GPS”.
shown.
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GPS Test
FM Radio Test
1. Insert the headset into the USB
connector before doing the testing.
2. Tap icon FM Radio in the programs
of the menu.
3. Select the different channels for
testing.
Audio Test-1
1. Download test program from SDO
(DOC-00046466)
http://htcscm10.htc.com.tw/SDO
2. Un-zip the image file.
3. Copy “mfgtest.dll” and “Audio
Test.exe” to Micro SD card.
4. Execute ”Audio Test” program from
internal storage.
5. Choose the each test in the menu of
“Tools”
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6. Select the Speaker Test then press
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QUARTZ Service Manual
Play button for testing.
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Audio Test-2
Audio Test-3
7. Select the Receiver Test then press
Play button for testing
Audio Test-4
8. Connect the headset into the USB
port before doing the testing
9. Select the Headset Test then press
Play button for testing
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10. Select the Int-Rec Test then press
11. Stop the voice record then press
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QUARTZ Service Manual
the “Record” button for voice
recording first
“Play” button for internal receiver
test
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Audio Test-5
Audio Test-6
12. Connect the headset into the USB
port before doing the testing
13. Select the Ext-Rec Test then press
the “Record” button for voice
recording first
WIMAX Test-1
1. In Comm Manager, turn on WiMAX
function.
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2. Tap St art > Settings > WiMAX > list t ab.
3. Check if device can search WiMAX
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QUARTZ Service Manual
base station or simulator.
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WIMAX Test-2
WIMAX Test-3
4. In Status tab, check if device can
receive base station information.
1. Insert TV out cable into the device.
2. The device will detect the TV out
cable and then choose the signal type
of TV. If device doesn’t detect the TV
out cable, please tap Start > Setting >
System tab > TV out.
3. Connect the TV out cable to TV.
4. Play one video file to check if there
are video and audio output on TV
TV out Test
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QUARTZ Service Manual
5. Power Measurement Test
5.1 Main board leakage current Test Procedure
This is a quick method to measure if any abnormal leakage current on main board
which caused high power consumption compare to GOOD main board.
(1) Requirement：
- Control box
Equipment list
1. Control box
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2. 4 colors cable
Cable A: Red
Cable B: Yellow
Cable C: Green
Cable D: Black
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Jig-D
Equipment set up
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C. types Jig
Jig - D (6 pins-Short)
1. Connect control box and jig through
3 colors cable with red, black and yellow
2. Set up each button by row A~D
according to product specification
A
B
Following is an setting for QUARTZ
MODEL JIG TYPE
QUARTZ D 1 8 0 1
It means, press button A1,B8,C0, D1
C
D
Button set up matrix
A B C D
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Start testing
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3. Install jig to device
(the photo is for reference only)
1. Turn on control box power button
2. Press Power button to turn on the
device.
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Idle current test
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2. In “main page”, Check phone status,
Click “Turn on flight mode”.
Set the unit to :
* Flight mode
* Make sure all RF function is off (phone,
BT, Wifi..)
* Adjust the backlight to lowest.
4. Measure Idle mode current. Idle current
value must under 64mA, if over the
criteria, it means M/B failed, please
replace M/B for repair.
Sleep current test
the unit. Unit is turn off and no display.
Sleep current value must less than 3 mA,
if over the criteria, it means M/B failed,
please replace M/B for repair.
Conclusion:
If current consumption is passed at both of idle and sleep mode, it means M/B is GOOD. If
there is any item FAILED at idle or sleep mode, it means M/B is failed, please replace M/B
for repair.
5.2 Battery rundown test procedure
Test Requirement:
-Windows 2000/XP
-USB Cable
-ActiveSync 4.2 above (WINCE 6.0 should use ActiveSync 4.5)
-Master Unit
-Battery in Warranty
5. After idle current checked, Switch OFF
Caution: Please charge your unit to full capacity for battery (until the green light
is displayed) before doing the test.
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TEST PROCEDURE
I. Setting and allow USB
connections in Microsoft
ActiveSync.
II. Connect your device and desktop/
or laptop via USB cable.
III. Check the pop-up message from
Microsoft ActiveSync when
device is synchronized with PC.
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Connect device to PC
Copy the Battery Rundown tool into the device
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IV. Make a folder in the device.
V. Copy
PowerDetect.exe into the
folder.
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VI. Adjust the Backlight brightness
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.
QUARTZ Service Manual
Battery Rundown-1
into the maximum level on battery
power.
Battery Rundown-2
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VII. Disable Turn of f backlight if device
is not used for in Battery power.
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VIII. Execute PowerDetect.exe under
WinCE
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Battery Rundown-3
Battery Rundown-4
IX. Set the Sleep as 1hour
X. Set the Record as 2Mins
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XI. After running 1 hour, the test will be
XII. Press the Power Button to turn on the
XIII. Click ok to quit the program.
finished.
power.
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Battery Rundown-5
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Battery Rundown-6
XIV. Test result is generated into the log
file as PowerCap(x).
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XV. Tag the log file to check the capacity.
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Battery Rundown-7
Caution: If the capacity is under 70%,
Please replace a new battery.
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6. Cosmetic Inspection Criteria
6.1 Classes definition of inspective area
z Class A area => The front side of main unit involve all buttons and LED lens except LCD.
z Class C area => 4 sides and back views of main unit.
z Class D area => The socket of battery, inner side of battery cover.
Photo of inspection areas
A05
Class A area Class C area Class D area
IT IS GENERIC COSMETIC INSPECTION CRITERIA FOR ALL PRODUCTS IF THERE HAVE ANY CONFLICT
WITH THESE GENERIC CRITERIONS; PLEASE FOLLOW THE PRODUCT INSPECTION CRITERIA
RESPECTIVELY.
Description
¾ D: Diameter / L: Length / W: Width / N: Number of defects/ S: Distance from dot to dot
¾ Inspecting distance: 30
¾ LCM inspection angle: 90
¾ Ambient illumination is to be 500-1100 Lux
± 5cm / Mechanical inspection angle: 90 degrees /
± 15 degrees / Inspection time: 5 seconds per surface.
¾ The inspection condition of Newton ring:
a. Inspection distance: 30cm / Inspection time: 5 sec
b. Ambient illumination is to be 500-1000 Lux (Incandescent lamp)
c. Inspection should be performed under the condition that LCD screen could reflect the mirror image of lamp.
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.
Doc. Title
d. The criteria of Newton ring's tinges and measure of are a must follow up the worst-case sample.
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6.2 Display inspection
Inspection Defects Accept Level Level
5mm.
5mm.
5mm.
Electrical
Characteristic
Defects
Foreign Scratch,
Objects or Lint
on power off
status
Single
Bright Dots
Dark Dots
Dark or Bright lines 0 Minor
ll Allowable Dots Defects
Shift and tilt of screen viewed area
Scratch
Lint (linear foreign objects)
Spots
Fish eye on film
Breakage on film surface Not acceptable Minor
Total acceptable defect quantity ≦ 10
2 adjacent 0 Minor
3 or more adjacent 0 Minor
Single
2 adjacent 0 Minor
Red+ Green+ Blue ≦ 3, S >
Total Number ≦ 2, S >
Total Number ≦ 3, S >
The black edge around display area must be
detected by front view.
0.03 < W ≦ 0.1 (mm)
L ≦ 5 (mm), N ≦ 2 (mm)
0.03 < W ≦ 0.1 (mm)
0.3 < L ≦ 3.0 (mm)
N ≦ 5
0.1 < D ≦ 0.3 (mm), N ≦ 4
0.1 < D ≦ 0.4 (mm), N ≦ 4
A05
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
Minor
6.3 Main unit inspection
GAP & STEP INSPECTION
DESCRIPTION ACCEPT CRITERIA LEVEL
1 GAP BETWEEN ALL GENERIC ME PARTS < 0.4 MM MINOR
2 GAP BETWEEN TOUCH WINDOW AND A PARTS < 0.3 MM MINOR
3 STEP BETWEEN MATING PAR TS < 0.3 MM MINOR
IT IS GENERIC COSMETIC INSPECTION CRITERIA FOR ALL PRODUCTS IF THERE HAVE ANY CONFLICT
WITH THESE GENERIC CRITERIONS; PLEASE FOLLOW THE PRODUCT INSPECTION CRITERIA
RESPECTIVELY.
HTC CONFIDENTIAL
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.
Doc. Title
QUARTZ Service Manual
7. Generic Troubleshooting
1．Main Unit Does Not Respond to Power Button
(1) Connect the AC adapter, maybe the battery pack is exhaust and wait few minutes for battery recharging.
(2) Check if battery installed well.
(3) Check the Power Button whether it’s damaged.
(4) Replace another battery pack.
(5) Try to start boot-loader mode [refer to section 4.1]. Re-flash ROM if boot loader mode is enabled.
(6) Check all connectors including LCD FPC to Main Board.
(7) Replace Main Board if necessary.
(8) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.
Issued Date 2008/9/1
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2．Touch Panel Does Not Respond to Screen Tap
(1) Check the connection of LCM FPC cable whether is properly connected.
(2) Try to cold boot the unit then perform screen tap again.
(3) Try with another T/P with bezel assembly.
(4) Try with another Main Board.
(5) Replace T/P with bezel if necessary
(6) Replace Main Board if necessary.
(7) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.
3．Buttons Do Not Respond
(1) Try to cold boot the unit then tries again.
(2) Dismantle the unit; check the status of switches on the Main Board and the plastic parts of the Button not
responding.
(3) Try with another Main Board or Front Bezel.
(4) Replace Main Board or Front Bezel if necessary.
(5) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.
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.
Doc. Title
4．Unusual Vertical / Horizontal lines or partial display
(1) Check the connection of LCM FPC whether is properly conne cted.
(2) Try to cold boot the unit then tries again.
(3) Try to re-flash the ROM code.
(4) Try with another T/P with bezel assembly.
(5) Try with another Main Board.
(6) Replace T/P with bezel assembly if necessary
(7) Replace Main Board if necessary.
(8) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.
5．Back Light Does Not Turn ON/OFF
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(1) Check the connection of LCM FPC whether is properly conne cted.
(2) Try to re-flash the ROM code.
(3) Try with another T/P with bezel assembly.
(4) Try with another Main Board.
(5) Replace T/P with bezel assembly if necessary
(6) Replace Main Board if necessary.
(7) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.
6．PC Connection not possible
(1) If test result is NFF, it is possible caused by user connect cradle to computer before ActiveSync is
installed.
(2) Check whether “Connection Settings” in the MS ActiveSync is properly set.
(3) Check whether it connects with other cables or cradle, customer’s cable might be damaged.
(4) Check the external appearance of the connector on the unit whether it is physically damaged.
(5) Try to re-flash the ROM code.
(6) Replace Main Board if necessary.
(7) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.
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7．Battery Pack does not start
(1) Make sure the battery cover is closed properly.
(2) Connect to the AC Adapter and see if it takes charge. Also check AC Adapter condition.
(3) Check whether AC Adapter is functioning properly.
(4) Check whether the condition of Battery Charging status is correct.
(5) Check the appearance of Battery Pack if any abnormal..
(6) Try with another Battery Pack or Replace Battery Pack if necessary
(7) Try with another Main Board or Replace Main Board if necessary.
(8) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.
8．Battery discharges quickly even after fully charged
(1) Make sure the Battery Pack takes fully charge with AC Adapter.
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(2) Check whether the condition of Battery Charging status is correct.
(3) Dismantle the unit and check the appearance of Battery Pack.
(4) Try with another Battery Pack or Replace Battery Pack if necessary
(5) Try with another Main Board or Replace Main Board if necessary.
(6) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.
9．Battery Pack does not recharge
(1) Make sure the Battery Pack takes fully charge with AC Adapter.
(2) Check whether the condition of Battery Charging status is correct. Charge should be done no more than 4
hours.
(3) Dismantle the unit and check the appearance of Battery Pack.
(4) Try with another Battery Pack or Replace Battery Pack if necessary
(5) Try with another Main Board or Replace Main Board if necessary.
(6) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.
10．No Sound from Speaker or Distorted sound
(1) Check “Sound & Notifications” Settings in the unit for Sound Enabling.
(2) Make sure it’s not MUTED.
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Doc. Title
(3) Try to re-flash the ROM code.
(4) Clean up the speaker connection side on MB if there is any contamination.
(5) Dismantle and Check whether the Speaker is properly installed (Orientation)
(6) Replace Speaker if necessary.
(7) Replace Main Board if necessary.
(8) Once the defective part has been identified, verify it again with the defective part whether the symptom
could be duplicated.
11．No Recorded Sound or Distorted sound
(1) Check “Sound & Notifications” Settings in the unit for Sound Enabling.
(2) Make sure it’s not MUTED.
(3) Try to re-flash the ROM code.
(4) Replace Main Board if necessary.
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(5) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.
12．Wireless connection (WLAN/BT) not functioning
(1) Make sure the wireless environment is OK before connecting to WLAN.
(2) Make sure the wireless connection setting has properly set.
(3) Make a life connection with Internet or another device.
(4) Try to re-flash the ROM code.
(5) Try with another main board if necessary.
(6) Once the defective part has been identified, verify the defective part again whether the symptom could be
duplicated with another unit.
13．WIMAX connection not functioning
(1) Make sure the wireless environment is OK before connecting to WIMAX.
(2) Make sure the wireless connection setting has properly set.
(3) Make a life connection with Internet.
(4) Go into boot loader mode and check CA data checksum is correct or not.
(5) Try to re-flash the ROM code.
(6) Try with another main board if necessary.
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12．GPS not functioning
(1) Make sure the GPS environment is outside of room before connecting to satellite.
(2) Make sure the GPS connection setting has properly set in navigation map.
(3) Try to re-flash the ROM code.
(4) Try with another main board if necessary
(5) Once the defective part has been identified, verify the defective part again whether the symptom coul d be
duplicated with another unit.
12．Internal storage device not functioning
(1) Make sure the GPS environment is outside of room before connecting to satellite.
(2) Make sure the GPS connection setting has properly set in navigation map.
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(3) Try to re-flash the ROM code.
(4) Once the defective part has been identified, verify the defective part again whether the symptom coul d be
duplicated with another unit.
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Doc. Title
QUARTZ Service Manual
8. Generic Labeling Plan
Agency label
The brand name is shown on Bezel.
HTC P/N: 77H00672-00M
Size: 66.53*44.36mm
Issued Date 2008/9/1
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HTC P/N Description
99HGC000-00 SKU,GENERIC,English-WWE,Quartz,w/o SIM Lock
99HGC000-01 FRU,Main Unit,GENERIC,English-WWE,w/o SIM Lock,QUARTZ
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Doc. Title
Agency label_QUAR100
The brand name is shown on Bezel.
HTC P/N: 77H00672-01M
Size: 66.53*44.36mm
QUARTZ Service Manual
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HTC P/N Description
99HGC001-00
SKU,HTC,Russian,RUS,HTC/Yota co-brand,HTC T8290,Black,w/o SIM
Lock,QUARTZ-C9#EMEA
99HGC001-01
FRU,Main Unit,HTC,Russian,RUS,HTC/Yota co-brand,HTC
T8290,Black,w/o SIM Lock,QUARTZ-C9#EMEA
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Unit label location explanation
Tamper evident label
HTC P/N: 77H00460-01M
Qty: 1
QUARTZ Service Manual
Tamper evident label
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Unit Water sensitive label
HTC P/N: 77H00668-00M
Qty: 2
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Doc. Title
QUARTZ Service Manual
Battery label
BATTERY_LI-ION,1500mAh, 3.7V
HTC P/N: 35H00077-13M (DYNAPACK)
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9. Generic Spare Part List and Photos
9.1 SPL for Repair
P/N Description
35H00077-13M BA TTERY_LI-ION,1500m A h,3.7V,SONY Li -P ol ymer cel l 454261,DYNAPACK,DAK520159-02B800L,66.8*44.6*5.15mm,60/-20
36H00632-00M Recei ver,2403 266 00028 ,PHILIPS
36H00748-00M Vibrator,GE0406BRC3,JNTECH,Quartz
36H00755-00M Speaker,SBI171029P-BS02B8M,BLUECOM
51H00489-00M PCB A ,2nd Camera Daughter bo ard,QUARTZ
51H40474-00M PCBA-MAIN BOA RD, G S M 900,1800,1900/ Wimax BC3,QUARTZ
54H00279-00M Camera Modul e,PREM IER, CM HT-3A403D, AF,TDK, LA RGA N,相互,M icron MI-3130,3. 1M pi xel,M i c ron,19.2*8. 9* 6. 3m m ,Raphael
54H00281-00M Camera Modul e,FF,Largan,Largan,LITEON,07P C03,APCB ,0.3Mpi x el ,5*5*2.55m m ,Raphael
72H01059-00M Sc rew, POINT Me c ha ni c al ,P,1.6*4.5, B Z+NY LO K
72H02643-00M Sc rew,M1.6L7,Ni+NYLO K ,POINT SCREW,QUARTZ
72H02654-00M EM I Gas ket,Cam era,Holder,Quart z
72H02659-00M EM I Gas ket,Cam era,Quartz
72H02883-00M EMI Gasket , U-TEK , 41* 46* 0. 05m m ,Quartz
72H02898-00M Conduct i ve Fabric , LCM _ 2, Q uart z
72H02911-00M Conduct i ve Fabric , LCM ,Quartz
74H01195-00M St ylus Pre-Assy,Q uartz
74H01196-00M Housi ng P re-A ssy ,Quartz
74H01198-00M Cover P re-A ssy ,Battery,Q uart z
74H01200-00M Bez el Pre-Assy,Q uartz
76H02703-00M Tape,Touch_Window,Quartz
76H02704-00M Tape,Vibrator,Quartz
76H02803-00M Rubber,2nd_Camera,Quartz
76H03038-00M Kapton,Camera,Quartz
76H03291-00M Tape,Touch_Window_2,Quartz
76H03298-00M Mylar,Gap,Quartz
77H00460-01M Tamper-Evident Label, VOID wording,blac k back ground,3*3mm, MING JYE
77H00668-00M Wa t er S ensiti ve Label,MING JYE,4* 2.5mm, 3M 5558,Diamond
77H00672-01M Regulation Label,W/PCT MJ04, 66.53*44.36m m ,HTC T8290,MING JYE,Quartz-EMEA
83H00054-00S Sub-A ssy t o 82H, HTC,S ubcontrac tor BOM,
部份代工代料
,HTC logo w/camera hole,YFO LAM,YFO TW,Sharp LCM
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00046130 REV.
Doc. Title
NOTE:
HTC Corporation
.
QUARTZ Service Manual
Issued Date 2008/9/1
Revised Date 2008/12/10
Page 66 of 80
THE PHOTO OF SPL IS GENERIC AND ONLY FOR REFERENCE, THE COLOR AND
APPEARANCE MAY BE DIFFERENT FROM THE SHIPPED PAR TS, IF YOU WANT T O APPLY
THOSE PARTS, PLEASE CONTACT YOUR SERVICE ACCOUNT MANAGER FOR MORE
INFORMATION.
AS FOR PICTURE, PLEASE REFER TO THE TABLE AS BELOW.
FOR REFURBISHMENT PARTS, THE TABLE IS FOR YOUR REFERENCE. YOU CAN DO THE
REFURBISHMENT ONLY WHEN YOUR SERVICE MODEL IS ALLOWED TO DO IT.
A05
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00046130 REV.
Doc. Title
Part no
Description
Q'ty
Refurbishment
Repair Code
Return to HTC
Part no
Description
Q'ty
Refurbishment
Repair Code
Return to HTC
Part no
74H01198-00M
Cover Battery
1
YES
C112
NO
74H01196-00M
Housing
1
YES
C102
NO
51H40474-00M
HTC Corporation
.
QUARTZ Service Manual
Part no
Description
Q'ty
Refurbishment
Repair Code
Retur n t o HTC
Part no
Description
Q'ty
Refurbishment
Repair Code
Retur n t o HTC
Part no
Issued Date 2008/9/1
A05
Revised Date 2008/12/10
Page 67 of 80
35H00077-13M
Battery
1
NO
B101
YES
54H00279-00M
Main Camera
1
NO
G117
NO
36H00632-00M
Description
Q'ty
Refurbishment
Repair Code
Return to HTC
Part no
Description
Q'ty
Refurbishment
Repair Code
Return to HTC
Part no
escription
D
Q'ty
Refurbishment
Repair Code
Return to HTC
Part no
Main board
1
NO
M001
YES
54H00281-00M
Camera Module,
0.3Mpixel
1
NO
G117
NO
36H00755-00M
Speaker
1
NO
G103
NO
83H00054-00S
Description
Q'ty
Refurbishment
Repair Code
Retur n t o HTC
Part no
Description
Q'ty
Refurbishment
Repair Code
Retur n t o HTC
Part no
Description
Q'ty
Refurbishment
Repair Code
Retur n t o HTC
Part no
Receiver
1
NO
G103.1
NO
51H00489-00M
2n d Ca mera Da ughter
board
1
NO
G117
NO
74H01200-00M
LCM Bezel
1
YES
C101.5
NO
74H01195-00M
Description
Q'ty
Refurbishment
Repair Code
Return to HTC
LCM with T/P
1
NO
L101
YES
Description
Q'ty
Refurbishment
Repair Code
Retur n t o HTC
Stylus
1
NO
G102
NO
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00046130 REV.
Doc. Title
Part no
Description
Q'ty
Refurbishment
Repai r Cod e
Retu rn to HTC
Part no
Description
Q'ty
Refurbishment
Repai r Cod e
Retu rn to HTC
Part no
.
72H01059-00M
Screw,POINT
Mechanical,P,1.6*4.5
4
NO
N/A
NO
72H02883-00M
EMI Gasket,U-
TEK,41*46*0.05mm
1
Yes
N/A
NO
36H00748-00M
HTC Corporation
QUARTZ Service Manual
Part n o
Description
Q'ty
Refurbishment
Repai r Co de
Retur n t o HTC
Part n o
Description
Q'ty
Refurbishment
Repai r Co de
Retur n t o HTC
Part n o
Issued Date 2008/9/1
A05
Revised Date 2008/12/10
Page 68 of 80
72H02643-00M
Screw,M1.6L7
1
NO
N/A
NO
77H00672-01M
Regulation Label
1
Yes
N/A
NO
76H02704-00M
Description
Q'ty
Refurbishment
Repai r Cod e
Retu rn to HTC
Part no
Description
Q'ty
Refurbishment
Repai r Cod e
Retu rn to HTC
Part no
scription
De
Q'ty
Refurbishment
Repai r Cod e
Retu rn to HTC
Part no
Description
Vibrator
1
NO
G105
NO
76H02703-00M
Tape,Touch_Window
1
NO
NO
NO
77H00460-01M
Tamper-Evident
Label,VOID wording
1
Yes
NO
NO
76H03291-00M
Tape,Touch_Window_2
Description
Q'ty
Refurbishment
Repai r Co de
Retur n t o HTC
Part n o
Description
Q'ty
Refurbishment
Repai r Co de
Retur n t o HTC
Part n o
Description
Q'ty
Refurbishment
Repai r Co de
Retur n t o HTC
Part n o
Description
Tape,Vibrator
1
NO
NO
NO
72H02659-00M
EMI G asket , Camera
1
NO
NO
NO
72H02911-00M
Conductive Fabric,LCM
2
NO
NO
NO
72H02898-00M
Conductive
Fabric,LCM_2
Q'ty
Refurbishment
Repai r Cod e
Retu rn to HTC
NO
NO
NO
1
Q'ty
Refurbishment
Repai r Co de
Retur n t o HTC
NO
NO
NO
1
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00046130 REV.
Doc. Title
Part no
Description
Q'ty
Refurbishment
Repair Code
Retur n t o HTC
Part no
Description
Q'ty
Refurbishment
Repair Code
Retur n t o HTC
Part no
Description
.
76H03298-00M
Mylar,Gap
2
NO
NO
NO
77H00668-00M
Wat er Sens itive La b el
1
Yes
NO
NO
72H02654-00M
EMI
Gasket,Camera,Holder
HTC Corporation
QUARTZ Service Manual
Part no
Description
Q'ty
Refurbishment
Repair Code
Retu r n to HTC
Part no
Description
Q'ty
Refurbishment
Repair Code
Retu r n to HTC
Part no
Description
Issued Date 2008/9/1
A05
Revised Date 2008/12/10
Page 69 of 80
77H00668-00M
Wat e r Se nsitive Label
1
Yes
NO
NO
76H03038-00M
Kapton,Camera
1
NO
NO
NO
76H02803-00M
Rubber,2nd_Camera
Q'ty
Refurbishment
Repair Code
Retur n t o HTC
NO
NO
NO
3
Q'ty
Refurbishment
Repair Code
Retu r n to HTC
2
NO
NO
NO
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00046130 REV.
Doc. Title
HTC Corporation
.
QUARTZ Service Manual
Issued Date 2008/9/1
Revised Date 2008/12/10
Page 70 of 80
9.2 Board Level 2.5 Repairs
Basic Repair Instructions for Component Replacement:
Step 1 Place the solder-proof tape to cover the surrounding area of the components which being replaced.
Warning：DO NOT overheat the tape and components to avoid the tape melted and the components damaged
Step 2 Use Heater Gun (HAKO850B, set the temperature between 3 50°C, Air Speed 3 ~ 5) to remove the
components.
Step 3 Wait till the temperature cool down before removing the solder-proof tape to avoid other components
being removed
Step 4 After the damaged or defective components have been replaced; clear the surroundings fo r solder
and flux residues.
Notice:
A. Checking the polarity of CON8, and the position can't be shifted.
A05
B. Checking the polarity of SW8、SW7, and it can't be reversed.
C. All the parts of the PCB should be checked if it is missing or not.
D. The OP must to wear antistatic wrist band .Don't put boards together and avoid hitting them.
E. When you solder and repair that the soldering iron, temperature must be setup 415 .℃ (The
temperature range is 415 ±5 ),℃℃ and the solder wire's diameter is 0.4/0.5/0.6mm (SAC 305 (1.1%)
F. Please be noticed to follow below steps for main board repair which is equipped with Golden
Capacitor:
1. When replacing level 2.5 components located around the golden capacitor:
I. The temperature of the hot air blower must be under 400°c
II. When apply the hot air to the part / component, the heating time must be under 20
seconds (including the time of removing and soldering)
III. The temperature of the soldering iron must be under 350°c
IV. When apply the solder tip to the part / component, the heating time must be under 5
seconds
V. The solder tip must not contact with the golden capacitor
2. For BGA replacement: The golden capacitor must be removed befo re pe rform pre-heating,
heating, soldering and de-soldering process, and then it must be replaced with a new one
(please refer to 1.c. and 1.d. steps)
3. For main board which failed to pass the function test, the golde n capacitor must be replaced with
a new one and must follow below soldering criteria: The temperature of the soldering iron must
be under 350°c When apply the solder tip to the part / component, the heating time must be
under 5 seconds The solder tip must not have a contact with the body of golden capacitor
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00046130 REV.
Doc. Title
HTC Corporation
.
QUARTZ Service Manual
Issued Date 2008/9/1
A05
Revised Date 2008/12/10
Page 71 of 80
51H40474-XXM PCBA-MAIN BOARD
Location P/N Description Remark
MAM12 75H00706-00M Connector SIM Card,9P,1.27Pitch,SPPN08-D0-1000,PROCONN Side A
MAM13
PAC36
MIM1 / MIM2 /
MIM3
PAF1
AAU1
MAM3
PAM2
MAM11
75H00760-10M Connector SD Ca rd,11P,1.1pitch,502702-0891,MOLEX,0.5A,10V Side A
16H00012-01M Gold Cap,0.02F,3.3V,XH311HG IV07E,SEIKO,-78/89%
36H00515-00M Switch,LS12K2-T,CITIZEN,3.85*2.9*1.55mm
36H00300-00M Fuse,046702.5,2.5A/32V,LITTLEFUSE,Apache
36H01865-00M Microphone,KNOWLES,SPM0204LE5-QB,4.72*3.76*1.25mm
Side A
Side A
Side A
Side A
75H00766-00M Connector I/O,11P,0.45Pitch,302-11101-24,ACT,1A,3 0V Side B
75H00529-00P Connector Battery,6P,2.5mm,2A,12V,BTR1S-6K20 00,ACON Side B
36H00410-00M Switch,SKRKAEE010,ALPS Side B
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00046130 REV.
HTC Corporation
.
Doc. Title
SIDE A PHOTO AND COMPONENT LOCATION
PAF1
QUARTZ Service Manual
MAM12
Side A
MIM1
Issued Date 2008/9/1
A05
Revised Date 2008/12/10
Page 72 of 80
MIM2
MIM3MAM13
AAU1
SIDE B PHOTO AND COMPONENT LOCATION
MAM3
PAC36
Side B
PAM2
MAM11
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00046130 REV.
HTC Corporation
.
Doc. Title
QUARTZ Service Manual
9.3 FRU M/B addition parts location
76H03038-00M
76H02803-00M
Issued Date 2008/9/1
A05
Revised Date 2008/12/10
Page 73 of 80
72H02654-00M
72H02654-00M
77H00688-00M
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00046130 REV.
HTC Corporation
.
Doc. Title
QUARTZ Service Manual
10. RF Antenna Specification
Quartz WiMAX Antenna Test Specification
Item Test Name Channel Cell Power level Note
Receiver Test Conducted level:20+/-0.75dBm
3 Receiver Sensitivity 0
4 Receiver Sensitivity 368
5 Receiver Sensitivity 736
Transmitter Test Conducted level:20+/-0.75dBm
6TX Power 0
7 TX Power 368
8 TX Power 736
≦ -85dBm
EIRP≧14dBm
RX frame:1000
Issued Date 2008/9/1
A05
Revised Date 2008/12/10
Page 74 of 80
Quartz GSM Antenna Test Specification
1st Downlink
Item Test Name TX Level TCH
cell power
1 Wait_Signal 0 600 -65
2 Power_Class 0 600 -65
PCS 1900 Receiver Test
3 Fast Bit Error Rate 0 512 -104
4 Fast Bit Error Rate 0 661 -104
5 Fast Bit Error Rate 0 810 -104
PCS 1900 Transmitter Test
6 TX Power 0 512 -65
7 TX Power 0 661 -65
8 TX Power 0 810 -65
EGSM 900 Receiver Test (For EU SKU)
9 Fast Bit Error Rate 5 975 -104
10 Fast Bit Error Rate 5 37 -104
11 Fast Bit Error Rate 5 124 -104
note
≦ 2 %
≧ 26 dbm
≦ 2 %
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00046130 REV.
HTC Corporation
.
Doc. Title
21 Fast Bit Error Rate 0 512 -104
22 Fast Bit Error Rate 0 698 -104
23 Fast Bit Error Rate 0 885 -104
24 TX Power 0 512 -65
25 TX Power 0 698 -65
26 TX Power 0 885 -65
QUARTZ Service Manual
DCS 1800 Receiver Test
DCS 1800 Transmitter Test
Issued Date 2008/9/1
A05
Revised Date 2008/12/10
Page 75 of 80
≦ 2 %
≧ 26 dbm
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00046130 REV.
Doc. Title
HTC Corporation
.
QUARTZ Service Manual
Issued Date 2008/9/1
Revised Date 2008/12/10
Page 76 of 80
11. Appendix
11.1 LCM and LCM bezel replacement
When you just want to replace a new LCM or LCM bezel, please take the steps as below.
Use flat plastic stick to remove the rest of glue on
the LCM bezel and make sure all glue is cleaned
completely.
Be carefully not to scrap LCM bezel.
A05
Use flat plastic stick to remove the rest of glue on
the LCM and make sure all glue is cleaned
completely.
Be carefully not to scrap LCM.
Swap the three conductive fabrics if defective.
72H02911-00M * 2
72H02898-00M * 1
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00046130 REV.
Doc. Title
HTC Corporation
.
QUARTZ Service Manual
Issued Date 2008/9/1
A05
Revised Date 2008/12/10
Page 77 of 80
After clean the glue on the LCM bezel, stick one
touch window tape on the bezel as shown the
photo.
76H02703-00M
Use plastic stick to press the touch window tap to
make sure the tap is well pasted on the bezel.
Stick one 2nd camera tape on the bezel as shown
the photo and make sure the tap is well pasted on
the bezel.
76H03291-00M
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00046130 REV.
Doc. Title
HTC Corporation
.
QUARTZ Service Manual
Issued Date 2008/9/1
A05
Revised Date 2008/12/10
Page 78 of 80
Lightly remove the protector of 2nd camera tape.
Lightly remove the protector of touch window tape.
Stick two mylar ga p at both sides of bezel.
P/N: 76H03298-00M * 2
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00046130 REV.
Doc. Title
HTC Corporation
.
QUARTZ Service Manual
Issued Date 2008/9/1
A05
Revised Date 2008/12/10
Page 79 of 80
Assemble LCM with LCM bezel.
After assembling LCM and LCM bezel, remove the
two mylars.
Use your finger to press around LCM to make sure
the LCM is well combined the bezel.
HTC CONFIDENTIAL
SM-TP001-0704
Doc. No. DOC-00046130 REV.
Doc. Title
11.2 2
HTC Corporation
.
QUARTZ Service Manual
nd
camera and daughter board assembly
Prepare one 2nd camera.
Issued Date 2008/9/1
A05
Revised Date 2008/12/10
Page 80 of 80
Prepare one daughter board.
Use plastic tweezers to place 2nd camera into
daughter board and then make sure the 2nd
camera is well assembled.
HTC CONFIDENTIAL
SM-TP001-0704
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