HTC Breeze Service manual

Service Manual

for

Breeze

HTC Proprietary

Confidential T reatment Requested

Rev . A02

Aug. 24, 2006

HTC Corp.

Engineering Mobility

HTC confidential

TITLE: Service Manual for Breeze

REV.

NO. A01 07/05/2006 First release TSE Tracy

A02 08/24/2006 Revised page 32. test item TSE Tracy

DATE CONTENTS DEP. REVISED

APP

´

D

STGE.PER.

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Table of contents

Chapter 1 - Introduction 5

1.1 History Chapter 2 - Product Specifications 6

Chapter 3 - Servicing Tools 9

Chapter 4 - Assembling and Disassembling 10

4.1 Disassembling

4.2 Assembling

4.3 MB Pre-Assembling

4.4 LCD Pre-Assembling Chapter 5 - Diagnostic Programs 32

5.1 List of Test Items (Diagnostics in SD card)

5.2 Test Procedure

5.3 Test Procedure and Description

Chapter 6 - Leakage current Measurement on MB 36

6.1 Leakage current measurement with Fixture

6.2 Battery Capacity Test

Chapter 7 - Software Upgrade procedure 40

7.1 Software upgrade

7.2 Smartphone Reset

7.4 Software Backup to SD card

Chapter 8 - RF Antenna test spec and criteria 47

8.1 Antenna Test Specification

8.2 Antenna Test Criteria

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Chapter 9 - Inspection Criteria 49

9.1 Definition

9.2 Inspection Area

9.3 Criteria

Chapter 10 - Trouble Shooting 51

Chapter 11 - Labeling Plan 58

Chapter 12 - Spare parts list 66

12.1 Spare parts list for repair

12.2 Accessory Spare parts list

12.3 Board level parts list

Chapter 13 - Board Level Repair 71

13.1 Problem Identification &Troubleshooting

13.2 Components to be Replaced

Chapter 14 – Return to Vendor(RTV) 75

Chapter 15 – Repair report format and definition 76

Chapter 16 – HTC service document on line (SDO) 79

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Chapter 1 – Introduction

This manual provides the technical information to support the service activities of Breeze. It contains highly confidential information, so any or all of this document should not be revealed to any third party.

1.1 History Reversion Update item Pages effected A01 First release N/A

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Chapter 2 - Product Specifications

Function Specification

Platform

Dimensions Weight Processor

Memory

HSDPA/UMTS/GP RS/ EDGE/GSM Functional block

Display

z Bar type form factor with Tri-mode HSDPA/ z UMTS and Tri-band GSM/ GPRS/ EDGE, z Bluetooth, and mega-pixel camera z Microsoft Windows Mobile Version 5.0 -Smartphone z 112.4mm(L) x 49mm(W) x 14.8mm(T)

z 120g (with battery pack) z Qualcomm MSM6275

z Samsung 2442M stacked CPU with 300MHz

z Flash ROM: 128MB

z RAM: 64MB SDRAM z HSDPA/UMTS/GPRS/ EDGE/GSM Functional z Internal antenna z Tri-Mode (HSDPA/UMTS, EDGE, GSM/GPRS) z UMTS/HSDPA(TBD) z 2100: 1920-1980, 2110-2170MHz z EDGE/GSM/GPRS z 900: 880-915, 925-960MHz z 1800: 1710-1785, 1805-1880MHz

1900: 1850-1910, 1930-1990MHz

z 2.2" 64K colors TFT LCD z LED backlight

Keyboard/Button

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z Power Button/Quick List (Wake up key) z Two Soft-key Buttons (Wake up key) z 5 ways navigation pad z Send Button (Wake up key) z Quick Press: Start a phone call z Long Press: Switch On/Off loud speaker z End button (Wake up key) z Quick Press: End a phone call z Long Press: Switch On Key Lock z Video Telephony Button (Wake up key) z Home (Wake up key)

z Quick Press: Home z Long Press (Press and Hold): BT/PDP Quick list z Back/Clear Button (Wake up key) z Text Editing mode: Clear one character (Long press to delete

whole text field)

z Non-Text mode: Back key z Operator Portal Button (Wake up key) z Numerical dialing keypad (12 buttons / Wake up key) z Keypad is labeled as GSM 02.30 z Camera Button (Right Lower Side / Wake up Key) z 3-Way Jog Wheel (Left Upper Side/ Wake up Key) z Normal function: up/down/action key z Voice volume control function: voice volume up/down in voice call

or in video call.

z Voice Dial/ Voice Record Button (Right Upper Side / Wake up

Interface

Power

Key)

z 1.8V/3V of UICC z USIM Application at least according to 3GPP TS 31.102 z One Infrared IrDA SIR z 11-pin mini-USB (USB1.1 full speed) / audio jack in one z Micro SD card slot z External RF connector with cover

z Battery

 Rechargeable battery, Li-Ion 1190 mAh

 RTC backup battery - golden capacitor for min.20minutes  Battery Meter Showing available battery  Low Battery Warning

z AC Adapter:

 AC input rating: 100 ~ 240 VAC, 50/60Hz  DC output: 5VDC, 1A

z Ambient light sensor for Keypad LED power consumption

Sensor

z Support Mi-ni-USB charging

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Device to device connectivity

z Bluetooth

 Compliant with v2.0 without EDR

Ö Class 2 transmit power Ö Serial Port Profile Ö ActiveSync

z Infrared IrDA SIR z USB 1.1 with mini-USB plug and receptacle

Digital Camera

z Main Camera: 1.3 Mega Pixels CMOS z Second Camera: CIF CMOS for Video Telephony z Support Landscape mode z Lighting: Min. 5 Lux

Notification

Accessories

z Notification z One bi-color LED (Green, Red and Amber) for UMTS/GSM

standby, UMTS/GSM network status, Event Notification, Power Charging status, PDA Notification

z One Blue LED for Bluetooth connectivity status z Vibration for notification and incoming call z Notification by LED, Sound, Message, Vibration Motor

z AC adapter (Mini-USB Plug) z USB Sync. Cable z Stereo wired headset with microphone z Standard Battery z User Manual, Quick Start Guide, Sync. z Software CD z Option : Car adapter ,Carrying Case, Bluetooth Headset

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Chapter 3 - Servicing Tools

This chapter provides information for the servicing tools for Riemann.

List of Servicing Tools

No. Item Use Remark

Disassembly tools Plastic stick for dismantle the unit

1

2

Mini USB cable For Synchronization Test

Cleaning wipers Philips Screw driver Protective Film Tweezers Air Gun

Clean Bench (Mandatory)

**

3

Mini SD Memory Card For SD card test

4

Headset For Hand free / Recording test

5

AC Adapter Power supply to this model

6

Diagnostic Test Program Test Program for Functional Test

7

Software Upgrade tools For software version upgrade or re-flash

8

Label Printer & Scanner For Printing & Scanning regulation label when

housing or M/B is changed.

9 Battery Test Jig For Main Battery judgment.

10 Mini SD card for OS reflash Optional method besides of using RUU via PC

**

How to purchase repair tool:

Please place your order for item you need to correspond BSO window; normally it will need 2 ~4 weeks for purchasing lead time.

Note: Not suitable for (** IN REMARK)

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Chapter 4 - Assembling and Disassembling

4.1 Disassembling

Tools needed for Assembling and Disassembling the Smart Phone

1. Glove & Lens Cleaning Tissue.

2. Plastic type tweezers.

3. Philip Screw Driver #0.

4. Philip Screw Driver type T6

5. Special Made Plastic Stick

6. Precision flat driver type 0.9mm (Θ)

Front side

Remove antenna rubber, battery cover, battery from unit

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Release the antenna radiator by inserting Use flat plastic tool to insert into the open gap (1) and the same method with gap (2)

1

2

Release the antenna

Unfasten 6 screws located on the back side

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Insert plastic stick into the gap between upper cover and housing to release hooks which fix them.

The same method to release hooks on other side.

Release the Speaker cable before removing the frame.

Separate the Upper cover from frame housing

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1. To remove the speaker, release speaker rubber from the Housing.

Separate the speaker rubber and the speaker.

Release 6 hooks which hold the MB with upper cover, starting from left side.

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Same as the other side.

*.Disconnect the switch board connector first

Remove the MB together with the LCD from the Bezel, pay attention to the hooks.

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Take out the MB and LCD Please put on soft surface to protect the LCD Main board and Bezel parts.

Un-fasten 2 screws to release the LCD from main board.

Dis-connect the LCD connector.

Be slightly on this to avoid the connector damaged.

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Take out the LCD

Remove the tape from the camera connector

To remove Camera use soft tool such as stylus to take out the camera.

Caution: Please do not pull out the Camera from its FPC side

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Camera module

Release the antenna hook

Take out the antenna module from the main board

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Antenna module

Take out the receiver from the bezel .

Receiver and the rubber .

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Unfasten 4 screws to release the APP switch board switch board .

Dis-assembly the switch board connector before take out the APP switch board

APP Switch board

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Take off the Navigation key cap.

Remove the switch board from the Bezel.

Switch board

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Take out the APP key pad and switch board key pad from the bezel.

APP pad and key pad.

4.2 Assembly Process

The dis-assembly process is done.

Put the receiver into the rubber.

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Assemble Receiver into its place, notice the two pins should not bent on assembly process.

Assemble APP keypad and numeric keypad on bezel.

Assembly the navigation key cap.

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Assembly Switch Board into bezel.

Add the navigation switch board on the switch board and connecting the switch board’s connector.

Fasten 4 screws to fix the switch board. Upper part assembly is done

Torque 0.6±0.1 kgf-cm

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LCD assembly.

Insert the LCD into MB connector which refer to white guide line Use your finger to push the FPC black Mylar on FPC

Lock the connector. Note: Once down the white line should be in parallel with connector cover.

Remark: Make sure the LCD is installed properly. *.Note Please don’t pull the LCD FPC directly ,hold the edge of LCD instead.

Connecting the camera module as the picture shown.

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Fasten 2 screws to fix the LCD with main board.

Remember to put the MIC rubber on the MIC.

Assembly the Antenna on the main board .

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Assemble the MB AND LCD into the bezel. Make sure the LCD & MB is inserted properly into hooks.

Connecting the switchboard connector with main board.

Put the speaker rubber into the Housing .

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b

Assembly the speaker into the rubber .

Assemble housing to bezel part.

Starting from

ottom part, match the connector into

their place.

Fix along each side of unit

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Remember to connect the speaker cable.

Fasten 2 screws to fix the housing part.

Torque: 1.0+-0.1kgf-cm

Assembly the antenna cover.

Be aware of install the antenna cover when insert the volume switch.

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Fasten 2 screws follow the sequence on picture.

Torque: 1.0+-0.1kgf-cm

Attach the battery.

Put the battery cover.

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Add the antenna rubber into the antenna cover.

If the warranty seal is broken on receiving,please treat as out of Warranty(F216).

The assembly proc The unit now is ready for Functional TEST ess is done.

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4.3 MB Pre-assembly MB Pre-assembly (P/N:) Parts that need to pre-assembled first upon replacing to new one:

Main board.( A SIDE)

Rubber

P/N: 76H01179-00M

Sponge 76H01218-00M

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Chapter 5. Diagnostics Program

5.1 List of Test Item

- You will see HTC Copy right on the first page of Diagnostic program.

- Totally there are 20 items content of Diagnostic test.

No. Item Description Remark

* 1 2 3 4 5 6 7 8 9 10 11 12 13 14 *

*

Function test Auto-test SDRAM TEST DISP TEST LED Test LED (BLUE/GREEN/RED/Key ) test Key Test Keypad & soft-key pressing test Timer Test RTC timer test VIB. Test Vibrator On/Off test FLight TEST SD TEST SD card read / write test Receiver TEST INT Audio TEST Ext Audio TEST LI Sensor Checksum Device Info RUN IN

Perform RUN IN Test

Functional test automatically RAM Memory Test

LCD pattern display test

Front light Test

Test Receiver output Internal Audio test External Audio test Light Sensor Test Checksum value check after Reflash Show Unit Serial No and IMEI No.

Some items need to test under OS Mode

1 2

3 4

USB TEST SIR Test Infrared port test

Camera Test Bluetooth Test Bluetooth function

Link with PC/Notebook to check USB Link function

Test Camera Function

Test with second unit

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5.2 Test procedure

(a) Power OFF. (b) Insert Diagnostic Micro SD card (provide by HTC) to Smart phone Unit (c) Set the Unit into Boot loader Mode (Press & Hold Capture + Power button).

Then press Action key into Diagnostic test.

(d) On test menu, use Navigation button to select the item then press Action key for testing, you could also

use numeric key to select the test item. Use Right/Left to change to other page.

(e) Remove the battery directly to exit the Diagnostic program when finish the testing.

(f ) If the system fails while testing, please also remove the battery directly to turn off power.

IMPORTANT NOTICE:

1. Please do not leave the mini SD diagnostic card left on the unit while boo ting to Windows mode. Because mini SD card do not have lock mechanism, easily to be formatted accidentally.

2. Once the unit has been entering Windows mode (HOME SCREEN), the SD card might be formatted already and once executing the diagnostic will stop on “CHECKSUM ERROR “without successfully entering the Diagnostic.

3. Once happen, you might need to ask HTC assistance for card replacement.

4. Please use one of SD card with diagnostic program pre-loaded as your master sd card ,in case of your SD card accidentally formatted, use it to restore the diagnostic software.

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5.3 Test procedure and description

No. Item Description Remark

1

2

3

Auto TEST

DISP TEST Press Action to change display mode

LED Test LED ON for RED>GREEN>BLUE>AMBER >Keypad Press Action to NEXT

Functional test by automatically Will stop once FAILED.

Press Action to change display

JOGACT>JOGAUP>JOGADN>Record>Launch(cap

mode

4

5

6 7

8

9

10

11

Button Test

Time Test RTC timer test

Vibrator . Test Select this item will activate Vibrator FLight TEST

SD TEST Performing SD R/W test

Receiver Test

Int. Audio T est

Ext. Audio Test

ture)> Key up> Key Down> Key Left >Key Right>Key Action> AP1 >AP2 >AP3 >AP4 >Talk >HOME>End > Back>Numeric(1 ~ # )

Back light adjust from MAX >DIM > OFF Press Action to MENU

Select this item to check Receiver quality

Recording test via MIC > Speaker

Recording test via MIC > Receiver Back to Main MENU

Back to Main MENU automatically

Back to Main MENU automatically Press Action to MENU

Back to Main MENU automatically Back to Main MENU automatically Back to Main MENU automatically

automatically Put your finger into light sensor

12

13 14 15

16

17

LI Sensor

Batt Info Unit Info RUN IN

CheckSum

SD RAM test

Light Sensor Test

Show Battery capacity(ref) Press Action to exit Show Unit Serial No and IMEI No. Press “ 0 “ to exit For RUN IN Test Could be selected as 1,2,4,8.

Calculate checksum of Flash-ROM

RAM Memory test

on bottom part of unit, under 0 keypad. Follow procedure on screen.

Could be use for verifying after OS reflash

Some items need to test under OS Mode

1

USB TEST

Link with PC/Notebook to check USB Link function

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2

SIR Test Infrared port test

Test with second unit

3 4

Camera Test Bluetooth Test Bluetooth function

Test Camera Function

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Chapter 6 – Leakage current measurement

This is a quick method to measure if any abnormal leakage current on main board which caused high power consumption compare to GOOD main board.

(1) Requirement：

- Power Supply

- Micro-current Meter

- Current series JIG

- CABLE

- Battery JIG

Equipment :

A. Power Supply (set at 4 V /1A). B. Micro-Current Meter (support 0.5mA ~ 1A).

Fixture :

C. Current series jig.( with black and red

cable). D. Cable. E. Battery with extension cable.

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Connect cable (D) to positive polarity of power supply (A) and current meter (B).

Connect cable of fixture (C) to negative polarity of power supply (A) and current meter (B).

Setting is Ready now for testing.( Don’t turn the power on at this moment )

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T urn on power supply ( 4V) and current meter ( 2A)

Set the unit to :

* Flight mode * Turn off Bluetooth

Measure flight mode current

Wait about 1 minutes, display will be off, in this condition, please check current value on the current meter, Current value must under 64 mA, if over, it means M/B failed, please replace M/B for repair.

Switch OFF the unit. Unit is turn off and no display. Measure power off current

Check current value on the current meter,

Current value must less than 4.2 mA, if over, it means M/B failed, please replace M/B for repair.

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Conclusion:

If current consumption is passed at both of flight and power off mode, it means M/B is GOOD.

If there is any item FAILED at flight or power off mode, it means M/B is failed, please replace M/B for repair.

Measurement parameter

Measurement mode

Flight Mode & Display off

POWER OFF

Measured Current

Under 64mA

Over 64mA

Under 4.2 mA

Over 4.2mA

REMARK

MB is good

Fail, MB need to be further repaired MB is good

Fail, MB need to be further repaired

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Chapter 7 – Software Upgrade Procedure

7.1 Software upgrades

(1) System Requirement：

- Windows XP on PC

- USB Cable

- ActiveSync v4.0 above

- RUU tool for Smart phone

- 128MB Micro SD card with latest software version (optional)

(2) Software upgrades procedure

(a) Enable the USB Connection Settings in ActiveSync.

(b) Set the Smartphone into OS Mode. (c) Sync Smartphone to PC via USB cable and synchronize with PC. (d) Make sure the battery capacity is more than 50%

(e) Run “RUU” tool under Window XP. Then Click “Next” to continue.

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(f) Select the location to save file then click “Next” to continue.

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(g) During the process, PC will show current information about your smart phone, choose update after

confirm.

(k) Choose NEXT if you have verified and want to update (l)It will take about 20 minutes to complete.

(j) PC will show the RUU progress

(k) When software upgrade is finished, the Unit will reboot automatically.

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(3) Software upgrade from 128MB Micro SD card (with latest software version)

Caution: The unit must have at least 50% of battery capacity before starting the re-flash process. Charge the battery in advance if necessary.

(a) Take one smartphone unit and turn off power. (b) Insert 128MB Micro SD card (with latest software version) to unit and set it into SPL Mode (Press and

Hold Camera + Power button). The screen shows as below. (c) Press power button to start update image. (d) This will need about 20 minutes to finish the update process.

BREEIMG.nbh –

IPL – BOOTLOADER – SPLASH1 – SPLASH2 – GSM – OS –

Press power button To start up date image

BREEIMG.nbh –

IPL – OK BOOTLOADER – OK SPLASH1 – OK SPLASH2 – OK GSM –

OS –

Update In Progress ... IIIIIIIIIIIIIIIIIIIIII

(e) Once update complete, remove battery and reboot it.

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7.2 Smart phone Hard-Reset.

In case if the system is freezing or not working under OS mode, service center could perform “RESET” the

smart phone to fix the problem: (a) Release the battery and attached again to unit. (b) Hold two soft key together, then press power button till the display shows:

Press 0 to restore factory default, Press 1 to quit.

Restore…Completed Press 5 to boot

Warning: This will set phone to original factory setting , there is risk of loosing customer data.

(c) Press 0 to restore

(d) Press 5 to boot (e) Device will reboot.

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7.3 Smartphone rebuild

-Use only if you feel system is slow performance (weight loading may cause system run slowly).

-Please be noted that there is a Risk of Loosing customer data and back to factory default setting.

Procedure:

(1) On Windows mode, Press Start > More > tools > Clear Storage.

On display it will show:

Clear storage will make all Of your data lost, and reset all settings to manufacturer default. Do you want to proceed? Please enter the following word “1234” and press YES button

Windows Mobile

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7.4 Software back up to SD card (A) Build your own Golden MicroSD card

1. Download the up to date ROM code file (BreeIMG.nbh).

2. Format 128M micro SD card to FAT32 by PC

3. Copy BREEIMG.nbh to micro SD card

“Your Micro SD card is ready now for doing Reflash”

(B) Flash unit with golden Micro SD"

1. Insert micro-SD card into unit.

2. Enter SPL: Press and hold camera button + Power button

3. SPL will ask if you want to flash the unit.

4. IF Yes, Press Power button. Check the screen. Wait for the percentage bar reach to the end.

5. After it is completed, power down device by taking out battery.

7. Remove micro-SD card.

8. Insert SIM card.

9. Power on the unit.

10. Boot into OS.

CAUTIONS:

- Per customer request, due to security reason, UPGRADE/ Reflash to different CID will be blocked, and will not continue.

- Repair for different region or Customer ID should be treated as OOW repair.

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Chapter 8 – RF Antenna test spec and criteria

Items Test Name TxLevel TCH

1

2 BS Originate Call 0 512 -75

3 Fast Bit Error Rate 5 975 -104 <= 2 %

4 Fast Bit Error Rate 5 37 -104

5 Fast Bit Error Rate 5 124 -104

15 Check TX Power 5 975 -104 >=28 dBm

16 Check TX Power 5 37 -104

17 Check TX Power 5 124 -104

1 Fast Bit Error Rate 0 512 -104 <= 2 %

2 Fast Bit Error Rate 0 698 -104

3 Fast Bit Error Rate 0 885 -104

Camp @ DCS Band

E-GSM 900 ReceiverTest

E-GSM 900 Ttansmitter Test

DCS 1800 ReceiverTest

0 512 -75 BCCH=600

lst Downlink

Note

CellPower

DCS 1800 Ttansmitter Test

13 Check TX Power 0 512 -104 >=26 dBm

14 Check TX Power 0 698 -104

15 Check TX Power 0 885 -104

PCS 1900 ReceiverTest

1 Fast Bit Error Rate 0 512 -104 <= 2 %

2 Fast Bit Error Rate 0 661 -104

3 Fast Bit Error Rate 0 810 -104

PCS 1900 Ttansmitter Test

13 Check TX Power 0 512 -104 >=26 dBm

14 Check TX Power 0 661 -104

15 Check TX Power 0 810 -104

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Items Test Name TxLevel

1

2 BS Originate Call 3 9613/10563 -60

3 Bit Error Rate 3 9613/10563 -104 <= 0.1 %

4 Bit Error Rate 3 9750/10700 -104

5 Bit Error Rate 3 9887/10837 -104

6 Check TX_Max Power 3 9613/10563 -60 >= 18 dBm

7 Check TX_Max Power 3 9750/10700 -60

8 Check TX_Max Power 3 9887/10837 -60

Camp @ W-CDMA Band I

Uplink/Downlink

UARFCN

3 9613/10563 -60

ReceiverTest

Ttansmitter Test

lst Downlink

CellPower

Note

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Chapter 9 – Inspection Criteria

9.1 Definition

The inspection criteria HTC defined is for service center repair ONLY. All service centers must follow below inspection criteria to judge if customer returned unit is exactly “defective” caused by out of HTC’s specification.

9.2 Inspection Area

The inspection area of Smartphone is for LCD module ONLY.

9.3 Criteria

Definition:

D: Diameter; L: Length; W: Width ;N: Number of defects ; S: Distance from dot to dot ;H: Height.

Viewing distance for LCM is, approximately: 30cm Inspection time:5 secs

Ambient illumination is to be 500~1000lux Inspection viewing angle range: ±30degree Horizontal and ±45 degree Vertical:

(1) Defective Dot

Item Status Criteria

Defective dot ＞ 0.25mm

1

0.15＜ Defective dot ≦ 0.25mm

2

Defective dot ≦ 0.15mm

3

Total dot ≦6; Distance between dot and dot >5mm Defective Pixel

If the Q’ty of defective dot ≦ 6, Pass

Fail

Neglect

Item Description/Specifications Notes

1) Bright Defect n≦3pcs

2) Dark Defect n≦2pcs

Missing Sub-Pixels

3)1+2. n≦5pcs

MA

4)Bright Defects Conjunction

MA

n≦0set

5)Dark Defects Conjunction

MA

n≦0set

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6) 4+5

MA

n≦0set

7)Bright Defect to Bright

MA

S≧5mm

Defect Distance

8)Dark Defect to Dark Defect

MA

S≧5mm

Distance

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Chapter 10 - Trouble Shooting Guide

(1) Power / Battery

No Power /

Can not Boot

with Battery

ONLY

Can not hold

charge

Attach Battery / AC adapter.

Power LED No indication

Attach Battery / AC adapter. Power LED indicates Red or

Amber

Can into bootloader mode

Can not Boot with Battery

ONLY

Battery full charge.

Battery rundown test fail.

Main Board defects

Battery damage

Battery connector on M/B defects

Power Switch on M/B defects

Main Board defects

Re-flash Software

Main Board defects

Battery power run out

Battery connector on M/B defects

Battery damage

Main Board defects

Battery damage

Main Board defects

Battery over

discharge

Can not

charge

Battery full charge. Use

Battery test fixture test fail.

Attach AC adapter.

Power LED No indication

Attach AC adapter.

Power LED indicates

Battery damage

Battery connector on M/B defects

Battery damage

22 pins connector on M/B defects

Power LED on M/B defects

Main Board defects

AC Adapter defects

DC Converter defects

Cradle defects

Battery damage

Main Board defects

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Reset the phone (x Storage)

Can not turn

power off

Power off

during

operation

Press power button for 3

seconds but can not turn off

Power off automatically

Shutdown immetiately

in anytime

Re-flash Software

Main Board defects

Battery power run out

Battery can not hold charge

Main Board defects

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Defective

Vibrator

Vibrator doesn not work Unit Re-assembly

Vibrator defects

Main Board defects

Defective LED

System hang

at booting

Can not detect

SD card

SD card can't

hold in place

System hang

under OS

No indication on Power LED

No indication on keypad LED

System boot up but lock

on LOGO screen

System can not detect SD card

SD card can not hold in unit SD socket on Switch-board defects

System lock often under

operation in anytime ; press

any key does not help

Power LED defetcs

Main Board defects

Keypad LED defetcs

Switch Board defects

Reset the phone (x Storage)

Re-flash Software

Main Board defects

SD socket on Switch-board defects

Switch Board defects

Main Board defects

Battery power run out

Reset the phone (x Storage)

Re-flash Software

Main Board defects

(2) System

SD card can

not eject

SD card stuck in the unit

SD socket on Switch-board defects

Switch Board defects

Main Board defects

SD card write

protection

malfunction

SD write protection fail

under OS

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(3) Communication

(4) Audio

RS232 / USB

port fail

Defective IR

Dump Speaker

Defective

Recording

Can not sync with PC

by ActiveSync

IR Test fail under

Diagnostic program

No sound in internal speaker

No voice be recorded

Check connection setting in AtiveSync

USB/Serial Cradle or Cable defects

22 pins connector on M/B defects

Main Board defects

Check the setting (Sounds, Profile)

Something stuck in audio jack

Unit Re-assembly

The spring of internal speaker bent

Internal speaker defects

Main Board defects

Unit Re-assembly

The spring of microphone bent

Microphone defects

Something stuck in audio jack

Main Board defects

Audio play

problem with

speaker

Nosie, deformed sound

by recording

Voice Note function does not

work under OS

Noise sound when playing

music or ringtones thru

internal speaker

Abnormal volumn

Microphone defects

Main Board defects

Reset the phone (x Storage)

Internal speaker defects

Main Board defects

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(5) Screen

Defective Backlight/ Frontlight

Half screen

shown

LCD no

display

Screen

Flickering

Defective

Earphone Jack

Defective

Earphone set

Half screen displays on LCD

Audio Jack broken or

something stuck inside

No sound or can not record

on headset

No front-light on LCD

No video appears on LCD,

front-light turn on only

Video or back-light flashing

Audio Jack on M/B defects

Earphone defects

Check the setting (power management)

Unit Re-assembly

LCD defects

Main Board defects

Unit Re-assembly

LCD defects

Main Board defects

LCD defects

Main Board defects

Line in LCD either

horizotal or vertical

The Q'ty of bad pixels is out

of spec (inspection criteria)

Dust on LCD surface

LCD defects

Clean LCD then Re-assembly

Line in Display

Defective

pixels on LCD

LCD

contamination

HTC confidential

(6) Mechanical

Defective

Numeric

keypad

Defective

App3/4 button

Defective

Home button

Defective

power button

Defective

record button

Defective Volume Up / Down button

Key (0~9, *, #, Talk/End,

Home, Return) stuck

Numeric key (0~9, *, #,

Talk/End, Home, Return)

Power button does not work

Record button does not work

Volume Up button does not

Volume Down button does not

does not work

or button stuck

work or button stuck

Power button (housing) defetcs

Power switch on M/B defects

Record button (housing) defetcs

Record switch on M/B defects

Volume Up button (housing) defetcs

Volume Up switch on M/B defects

Volume Down button (housing) defetcs

Volume Down switch on M/B defects

Keypad defects

Metal Dome defects

Switch Board defects

Defective

Return button

Defective

App1/2 button

Defective

Navigation

button

Left / right key stuck

Left / right key does not work

Navigation button does not

work properly

Bezel defects

Metal Dome defects

Switch Board defects

Navigation button defects

Navigation switch defects

HTC confidential

Camera

Digital

Camera

malfunction

(7) RF / Wireless

RF / Wireless

malfunction

Camera is not detected Camera re-assembly

Camera defetcs

Main Board defects

Abnormal color on video

No phtotgraphing image on

screen before taking photos

Camera can not focus

Abnormal color on picture

after capture

Camera lens dirty

SIM detection fail SIM connector defects

No service (signal) Reset the phone (x Storage)

Camera defetcs

Main Board defects

Camera defetcs

Main Board defects

Clean camera and re-assembly

Main Board defects

Testing fail by RF Tester

(other phone function )

Antenna defects

Main Board defects

HTC confidential

Chapter 11 – Label Plan

11-1 Regulation label-main unit

11-1.1 Regulation Label (on the rear housing of main unit ) HTC P/N: 77H00355-00M

Size:26.0*36.0 mm Barcode Type: Code 128 symbology The brand or trademark will be shown on front Bezel.

Vendor’s

Controlled

HTC confidential

Above label will support following SKU

HTC Part Number Countries Supported

99HBV000-00 Generic

For S/N: SSYWWPPZZZZZ

SS: SITE CODE --> HT Y: Year Last Digital of the Year. WW: Week Code : 01 ~ 54 PP: Product Code : EZ ZZZZZ: Serial Number (00001 ~ 99999) Use Base 10

MODEL ID: BREE100

Label Characteristic : Material: polyester Color:pantone 422c Ink:pantone 425c

HTC confidential

11-2. Battery Label

11-2.1

Main Battery label (Main source)

HTC P/N: 35H00068-00M Size: 60.9 x 40.7 mm

Manufacture by battery vendor.

Label characteristic:

Material : TBD

Color: TBD

Ink: TBD

HTC confidential

11-2.2 Main Battery label (2’nd source)

HTC P/N: 35H00068-01M Size: 63.5 x 39.5 mm

Manufacture by battery vendor.

Label characteristic:

Material : TBD

Color: TBD

Ink: TBD

HTC confidential

11-3. Packing Label

11-3.1 Overpack Box label 1 HTC P/N: 77H30025-00M Size:93.0 × 48.0 mm

Table

HTC P/N

Country

99HBV000-00 Generic

Model name EAN Code Product Code SAR Value

Label Characteristic:

Material: Hi Fi printing paper

Color: pantone White

Ink: B110

HTC confidential

11-3.2 Overpack Box label 2 (on 5-in-1 box) HTC P/N: 77H30026-00M

Size:152.4 × 101.6 mm

Table

HTC P/N

99HBV000-0

Country

Generic

Model name EAN Code Product Code SAR Value

0

Label Characteristic:

Material: Hi Fi printing paper

Color: pantone White

Ink: B110

HTC confidential

11-4. Pallet label 11-4.1 Pallet ID label HTC P/N: 77H30026M-00 Size:101.6 × 152.4 mm

Label Characteristic:

Material: Hi Fi printing paper

Color: pantone White

Ink: B110

HTC confidential

11-4.2 Pallet ID label for Incomplete Pallet

HTC P/N: 77H30026-00M Size:101.6 × 152.4 mm

Label Characteristic:

Material: Hi Fi printing paper

Color: pantone White

Ink: B110

HTC confidential

Charpt 12 Spare parts list

12.1 Spare Part List for Repair (Please be noticed that Part no on the list below is for reference only, please refer to List from our

logistic team which differ per customer)

Photo

HTC P/N Description

Q'ty

36H00226-00M Receiver,EASG1D501E2,NAIS

1

36H00381-00M Antenna,GAN40034,AMPHENOL,Breeze

1

36H00389-00M Speaker,SAMBU,SBS001541P-CC02-K

1

51H00341-00M PCBA-MAIN BOARD,Breeze

1

51H00342-00M PCBA-SWITCH BOARD,Breeze

1

HTC confidential

54H10003-00P Multi-Module Assy,9*9*11.55mm,LITEON,05P142,Breeze

1

60H00047-00M

LCD,TD022THEC2,2.2inch,TOPPOLY,QVGA,262K

Colors,Breeze

1

72H00724-00M Screw,PH,FD,T1.4*2.9, Nickel,Black,AISI 1018

2

72H00739-00M Screw,1.6*3,D3,d0.5,Ni

4

72H01170-00M Holder,LCD,BREEZE

1

72H01182-00M Screw,M1.4*2.55,NECK,BREEZE

2

72H01261-01M

EMI Gasket,microSD shielding

case,8*2*0.5mm,U-TEK,Breeze

2

HTC confidential

72H01317-00M EMI Gasket,Mic,5.5*2*0.8mm,U-TEK,Breeze

1

72H30037-00M SCREW,M1.6*0.35P*6mm

4

73H20048-09M FPC Pre-Assy,CAREER,Breeze

1

74H00588-00M Bezel Pre-Assy,Generic,Metal Gray,BREEZE

1

74H00589-02M Button Pre-Assy,NAVI,Black,Breeze

1

74H00590-02M Keypad Pre-Assy,KEYPAD,Black,Breeze

1

74H00591-02M Keypad Pre-Assy,SOFTKEY,Black,Breeze

1

HTC confidential

74H00592-02M Housing Pre-Assy,Black,Breeze

1

74H00593-02M Cover Pre-Assy,Antenna,Black,Breeze

1

74H00594-00M Cover Pre-Assy,Battery,Generic,Metal Gray,Breeze

1

76H01179-00M Rubber,LCM_SUPPORT,BREEZE

1

76H01181-00M Rubber,BUTTON_NAVI_HOLDER,BREEZE

1

76H01182-00M Rubber,MIC,BREEZE

1

76H01185-00M Rubber,SPEAKER,RUBBER,BREEZE

1

HTC confidential

76H01218-00M Mylar,LCM,CONN,Breeze

1

76H01311-00M Tape,CAMERA,BREEZE

1

N/A

76H01313-00M Rubber,CONN,Breeze

77H00203-00M Water Sensitive Label,4*2.5mm,Ming Jye,BlueAngels

1

HTC confidential

Chapter 13- Board Level Repair

If you are authorized by HTC to perform board level repair, you could ask below material/parts from HTC .

13.1 Problem Identification & Troubleshooting

(1) Basic Repair Instructions for Component Replacement：

Step 1. Place the solder-proof tape to cover the surrounding area of the components which being replaced.

：

Warning

Step 2. Use Heater Gun (HAKO850B, set the temperature between 350℃, Air Speed 3~5) to remove the

Step 3. It has to wait the temperature cool down before the damaged components been removed. Or, the

DO NOT overheat the tape and components to avoid the tape melted and make the component damage.

components.

others components could be gone when the solder-proof tape been taken off.

Step 4. After the damaged component has been replaced, clear the surroundings for solder and flux

residues.

HTC confidential

13.2 Components to be replaced：

Front side:

NO 1 2

3

4

Parts that could be replaced from MB front side

Part location name HTC Part No REMARK

Power button Camera connector LCD connector Switch Board connector

36H00303-00M

75H00360-00M

75H00371-10M

75H00462-00M

SW1 CON4 CON1 CON7

HTC confidential

Back side:

NO 1 2

3

4

5

6

7

8

Parts that could be replaced from MB Back side

Part location name HTC Part No REMARK

Camera button Record button Jog wheel Vibrator RF connector USB connector Battery connector SIM connector

36H00303-00M

36H00311-00M

36H00355-00M

75H00321-00M

75H00465-00M

75H00475-00M

75H00477-00M

SW2 SW4 SW5 CON3 RFSW1

CON2 PCON1

BCON1

9

Antenna connector

75H00493-00M

RFANT1

HTC confidential

Switch Board:

NO 1 2

Parts that could be replaced from Switch Board

Part location name HTC Part No REMARK

Golden capacitor MIC

16H00012-00M

36H00208-00M

PCG1 AMIC1

HTC confidential

V

Chapter 14- Return to Vendor (RTV)

Please attached the DIC (Defect identity card)on each RTV part.

HTC Defect Identification Card

ASP

Date

RMA Number

Part Number

Series Number

IMEI Number

(optional)

Technician

Customer Reported Failure Symptom

erified HTC Failure

Teleplan

MM/DD/YYYY (repair date)

(HTC RMA number)

(bar code)

(number)

(bar code)

(number)

(bar code)

(number) (Name of the person repairing the device) (Original failure description reported by the end user) (ASP verified failure symptom

Code

erified HTC Failure

Description

Remark

in HTC failure code) (ASP verified failure symptom

in HTC failure descrption)

HTC confidential

Chapter 15 –Repair report format and definition

Repair Report Definition

Column Data Format Description Your Comments

No

1 2 3

4 5 6

7

8

9

10

Service Centre

A

RMA_No

B

Work_Order

C

RMA_Source

D

Claim Date

E

Receive_Date

F

Confirm_Date

G

ReStock_ShipDate

H

TAT

I

Service_Model

J

FreeFormat FreeFormat FreeFormat CallMail / Store / Hub

mm/dd/yy mm/dd/yy

mm/dd/yy

Column H Column F

Exchange / DOA / Express

Your Name of the Repair Sites Reference no. for tracking this RMA ASP internal tracking control code

WHERE the RMA comes from

WHEN the RMA is claimed WHEN the RMA is received WHEN the OOW charge/ repair is confirmed with the client WHEN the repair is done [Weekly Report is Based on this Date]

In House Repair Turn Around Time

WHAT is the SERVICE Model

11

12 13

14 15 16 17

Refurbishment

K

Warranty

L

Part_No

M

Product

N

Device_SN

O

Device_IMEI

P

OS_Rev

Q

Y/N

(0,1, 2, 3)

HTC 99 H Model and Mem Size HTC SN HTC IMEI ex: 3.14.16

Is Refurbishment reqired by POLICY

Warrany Status 0: In Warranty 1: OOW (Beyond warranty period) 2: OOW (Customer abuse/ misuse) 3: OOW (Broken warranty seal)

HTC unit Part Number 99Hxxxxxxx

HTC unit Description

RMA Unit Serial Number Unit under repair IMEI Number OS reversion of received unit

HTC confidential

18

Repeat_Return

R

Y/N

Did the same unit return more than once?

19

20 21 22

23

24

25 26

27

Reported_Code

S

Reported_Symptom

T

Failure_code

U

Failure_Description

V

Repair_Code

W

Repair_Description

X

Repair_Level

Y

SN_for_Replacement

Z

IMEI_for_Replacement

AA

Code or NA

Text description or NA HTC definition HTC definition

HTC definition

(1, 2, 3)

As labeled

The original failure/ claim code from customer

The original failure/ claim description from customer

Failure code after ASP verification Failure description after ASP Verification What your action for the Repair. Functional first. If NFF, you may add What your action for the Repair ; IF NFF, you may apply C001 or C003 or C004 according to your service model The repair level defined in HTC list and agreement Series Number of the unit replacement IMEI number of the unit or M/B replacement

28 29 30 31 32 33

34 35 36 37 38 39 40 41

Material Used_1

AB

Warranty1

AC

Material1_SN

AD

Material Used_2

AE

Warranty2

AF

Material2_SN

AG

Material Used_3

AH

Warranty3

AI

Material3_SN

AJ

Material Used_4

AK

Warranty4

AL

Material4_SN

AM

Material Used_5

AN

Warranty5

AO

HTC P/N

Y/N # HTC P/N Y/N #

HTC P/N

Y/N # HTC P/N Y/N # HTC P/N Y/N

Major material part number used for repair Material for IW or OOW purpose Major material Serial No. 2nd material Part Number used for repair Material for IW or OOW purpose 2nd material Serial No. 3rd material Part Number used for the repair Material for IW or OOW purpose 3rd material Serial No. 4th material Part Number used for repair Material for IW or OOW purpose 4th material Serial No. 5th material Part Number used for repair Material for IW or OOW purpose

42

AP

Material5_SN

#

5th material Series No.

HTC confidential

Cosmetic Material Part Number used for repair

43

Material Used_6

AQ

HTC P/N

44

45 46 47

Warranty6

AR

Material Used_7

AS

Warranty7

AT

Engineer_Badge_No

AU

Y/N

HTC P/N

Y/N FreeFormat

Material for IW or OOW purpose Cosmetic Material Part Number used for repair Material for IW or OOW purpose WHO did the Repair/Technician batch no.

HTC confidential

Chapter 16 – HTC service document on line (SDO)

http://htcscm10.htc.com.tw/sdo/index_RMAiii.asp

The HTC SDO system which you could down load such as following items

1. Failure/Repair code

2. ROM code

3. Service Advisory

4. Service Manual

5. Training VCD

Note: Please get the authorization from HTC Technical Support Center for access authorit y.

~End of Service Manual~

HTC confidential

HTC Breeze Service manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Rev . A02

Function Specification

Platform

4.2 Assembly Process

Measurement parameter

HTC Part Number Countries Supported

13.1 Problem Identification & Troubleshooting