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HI-SINCERITY
MICROELECTRONICS CORP.
HMBT4125
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HMBT4125 is designed for general purpose switching and
amplifier applicati ons.
Spec. No. : HE6844
Issued Date : 1994.07.29
Revised Date : 2002.10.25
Page No. : 1/2
Absolute Maximum Ratings
• Maximum Temperatures
Stor age Temperature............................................................................................ -65 ~ +150 °C
Junction Temperature.................................................................................................... +150 °C
• Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 225 mW
• Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage........................................................................................ -30 V
VCEO Collector to Emitter Voltage..................................................................................... -30 V
VEBO Emitter to Base Voltage.......................................................................................... -4.0 V
IC Collector Current....................................................................................................... -200 mA
SOT-23
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -30 - - V IC=-10uA
BVCEO -30 - - V IC=-1mA
BVEBO -4 - - V IE=-10uA
ICBO - - -50 nA VCB=-20V
IEBO - - -50 nA VBE=-3V
*VCE(sat) - - -0.4 V IC=-50mA, IB=-5mA
*VBE(sat) - - -950 mV IC=-50mA, IB=-5mA
*hFE1 50 - 150 VCE=-1V, IC=-2mA
*hFE2 25 - - VCE=-1V, IC=-50mA
fT 200 - - MHz VCE=-20V, IC=-10mA, f=100MHz
Cob - - 4.5 pF VCB=-5V , f=1M H z
*Pulse T est: Pulse Width ≤380us, Duty Cycle≤2%
HMBT4125 HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6844
Issued Date : 1994.07.29
Revised Date : 2002.10.25
Page No. : 2/2
A
L
3
B
S
21
GV
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
Z D
Rank Code
Control Code
C
JK
DIM
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
Min. Max. Min. Max.
DIM
D
H
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10
Marking:
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
• Lead: 42 Alloy; solder plating
• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBT4125 HSMC Product Specification