HSMC HMBT4125 Datasheet

HI-SINCERITY
MICROELECTRONICS CORP.
HMBT4125
Description
The HMBT4125 is designed for general purpose switching and amplifier applicati ons.
Spec. No. : HE6844 Issued Date : 1994.07.29 Revised Date : 2002.10.25 Page No. : 1/2
Absolute Maximum Ratings
Maximum Temperatures
Stor age Temperature............................................................................................ -65 ~ +150 °C
Junction Temperature.................................................................................................... +150 °C
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)................................................................................ 225 mW
Maximum Voltages and Currents (Ta=25°C)
VCBO Collector to Base Voltage........................................................................................ -30 V
VCEO Collector to Emitter Voltage..................................................................................... -30 V
VEBO Emitter to Base Voltage.......................................................................................... -4.0 V
IC Collector Current....................................................................................................... -200 mA
SOT-23
Characteristics (Ta=25°C)
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO -30 - - V IC=-10uA BVCEO -30 - - V IC=-1mA BVEBO -4 - - V IE=-10uA
ICBO - - -50 nA VCB=-20V
IEBO - - -50 nA VBE=-3V *VCE(sat) - - -0.4 V IC=-50mA, IB=-5mA *VBE(sat) - - -950 mV IC=-50mA, IB=-5mA
*hFE1 50 - 150 VCE=-1V, IC=-2mA *hFE2 25 - - VCE=-1V, IC=-50mA
fT 200 - - MHz VCE=-20V, IC=-10mA, f=100MHz
Cob - - 4.5 pF VCB=-5V , f=1M H z
*Pulse T est: Pulse Width 380us, Duty Cycle≤2%
HMBT4125 HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6844 Issued Date : 1994.07.29 Revised Date : 2002.10.25 Page No. : 2/2
A
L
3
B
S
21
GV
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
Z D
Rank Code
Control Code
C
JK
DIM
Style: Pin 1.Base 2.Emitter 3.Collector
*: Typical
Min. Max. Min. Max.
DIM
D
H
Inches Millimeters Inches Millimeters
Min. Max. Min. Max. A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177 B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67 C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15 D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75 G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65 H 0.0005 0.0040 0.013 0.10
Marking:
Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBT4125 HSMC Product Specification
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