HSMC HMBD4148 Datasheet

HI-SINCERITY

MICROELECTRONICS CORP.

HMBD4148

HIGH-SPEED SWITCHING DIODE

Description

The HMBD4148 is designed for high-speed switching application in hybrid
thick-and thin-film circuits. The devices is manufactured by the silicon
epitaxial planar process and packed in plastic surface mount package.

Features

• Small SMD Package (SOT-23)

• Ultra-high Speed

• Low Forward Voltage

• Fast Reverse Recovery Time

Spec. No. : HE6802
Issued Date : 1995.12.09
Revised Date : 2002.10.25
Page No. : 1/2

SOT-23

Absolute Maximum Ratings

• Maximum Temperatures

Stora ge Temperature........................................................................................................ -65 ~ +150 °C

Junction Temperature................................................................................................................ +150 °C

• Maximum Power Dissipation

Total Power Dissipation (Ta=25°C)............................................................................................. 225 mW

• Maximum Voltages and Currents (Ta=25°C)

Continuous Reverse Voltage.......................................................................................................... 70 V

Continuous Forward Current....................................................................................................... 200 mA

Peak Forward Surge Current...................................................................................................... 500 mA

Characteristics (Ta=25°C)

Characteristic Symbol Condition Min Max Unit

Forward Voltage VF IF=10mA - 1 V
Reverse Breakdown VR IR=100uA 100 - V
Reverse Current IR VR=75V - 5 uA
Total Capacitance CT VR=0, F=1MHz - 4 pF

Reverse Recovery Time Trr

IF=IR=10mA, RL=100Ω
Measured at IR=1mA

-4nS

HMBD4148 HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

SOT-23 Dimension

Spec. No. : HE6802
Issued Date : 1995.12.09
Revised Date : 2002.10.25
Page No. : 2/2

A

L

3

B

S

21

GV

3-Lead SOT-23 Plastic Surface Mounted Package

HSMC Package Code: N

C

JK

DIM

Style: Pin 1.Anode 2.NC 3.Cathode

Min. Max. Min. Max.

DIM

D

H

Inches Millimeters Inches Millimeters

Min. Max. Min. Max.
A 0.1102 0.1204 2.80 3.04 J 0.0034 0.0070 0.085 0.177
B 0.0472 0.0630 1.20 1.60 K 0.0128 0.0266 0.32 0.67
C 0.0335 0.0512 0.89 1.30 L 0.0335 0.0453 0.85 1.15
D 0.0118 0.0197 0.30 0.50 S 0.0830 0.1083 2.10 2.75
G 0.0669 0.0910 1.70 2.30 V 0.0098 0.0256 0.25 0.65
H 0.0005 0.0040 0.013 0.10

Diagram:

Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.

Material:

• Lead: 42 Alloy; solder plating

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

2.Controlling dimension: millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.

Marking:

5 H

Rank Code

Control Code

*: Typical

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or appl ication assistance.

Head Office And Factory:

• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: [phone] Fax: [phone]

• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: [phone]~5 Fax: [phone]

HMBD4148 HSMC Product Specification