HSMC HM3019 Datasheet

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. :HE9526-A
Issued Date : 1998.07.01
Revised Date : 2000.10.01
Page No. : 1/2

HM3019

NPN EPITAXIAL PLANAR TRANSISTOR

Description

This device is designed for use as general purp ose am pli fi er and
switching requiring collector currents 1A

Absolute Maximum Ratings

Maximum Temperatures

•

Storage Temperature............................................................................................ -55 ~ +150 °C

Junction Temperature................................................................................... +150 °C Maximum

Maximum Power Dissipation

•

Total Power Dissipation (Ta=25°C)................................................................................... 1.2 W

Maximum Voltages and Currents (Ta=25°C)

•

VCBO Collector to Base Voltag e...................................................................................... 140 V

VCEO Collector to Emitter Voltage ..................................................................................... 80 V

VEBO Emitter to Base Voltage ............................................................................................. 7 V

IC Collector Current.............................................................................................................. 1 A

Characteristics

Symbol Min. Typ. Max. Unit Test Co nditions

BVCBO 140 - - V IC=100uA
BVCEO 80 - - V IC=30mA
BVEBO 7 - - V IE=100uA

ICBO - - 50 nA VCB=90V

IEBO - - 50 nA VEB=5V
*VCE(sat) - - 0.2 V IC=150mA, IB=15mA
*VBE(sat) - - 1.1 V IC=150mA, IB=15mA

*hFE1 50 - - IC=0.1mA, VCE=10V
*hFE2 90 - - IC=10mA, VCE=10V
*hFE3 100 - 300 IC=150mA, VCE=10V
*hFE4 50 - - IC=500mA, VCE=10V
*hFE5 15 - - IC=1000mA, VCE=10V

fT 100 - - MHz IC=50mA, VCE=10V, f=100MHz

Cob - - 12 pF VCE=10V, f=1MHz, IE=0

(Ta=25°C)

*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%

HSMC Product Specification

HI-SINCERITY

MICROELECTRONICS CORP.

SOT-89 Dimension

Spec. No. :HE9526-A
Issued Date : 1998.07.01
Revised Date : 2000.10.01
Page No. : 2/2

Marking :

C

B

D

321

E

H

HSMC Logo

Date Code

Part Number

Style : Pin 1.Base 2.Collector 3.Emitter

Package Code

I

F

G

A

3-Lead SOT-89 Plastic Surface Mounted Package

HSMC Package Code : M

DIM

Inches Millimeters Inches M illimeters

Min. Max. Min. Max.

DIM

Min. Max. Min. Max.
A 0.1732 0.1811 4.40 4.60 F 0.0583 0.0598 1.48 1.52
B 0.1594 0.1673 4.05 4.25 G 0.1165 0.1197 2.96 3.04
C 0.0591 0.0663 1.50 1.70 H 0.0551 0.0630 1.40 1.60
D 0.0945 0.1024 2.40 2.60 I 0.0138 0.0161 0.35 0.41
E 0.0141 0.0201 0.36 0.51

Notes :

Material :

• Lead : 42 Alloy ; solder plating

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0

1.Dimension and tolerance based on our Spec. dated May. 05,1996.

2.Controlling dimension : millimeters.

3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.

*:Typical

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to make changes to its products without notice.

•

HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.

Head Office And Factory :

•

Head Office

Tel : [phone] Fax : [phone]

•

Factory 1 :

Tel : [phone]~5 Fax : [phone]

•

Factory 2 :

Tel : [phone] Fax : [phone]

(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C

HSMC Product Specification