HSMC HBU407 Datasheet
HI-SINCERITY
MICROELECTRONICS CORP.
HBU407
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HBU407 is designed for use in TV Horizontal output and
Switching applications.
Features
High Breakdown Voltage
•
Spec. No. : HE6716
Issued Date : 1996.02.01
Revised Date : 2001.05.28
Page No. : 1/2
Absolute Maximum Ratings
Maximum Temperatures
•
Storage Temperature............................................................................................ -50 ~ +150 °C
Junction Temperature..................................................................................... 150 °C Maximum
Maximum Power Dissipation
•
Total Power Dissipation (Tc=25°C) .................................................................................... 60 W
Maximum Voltages and Currents (Ta=25°C)
•
VCEO Collector to Emitter Voltage ................................................................................... 150 V
VEBO Emitter to Base Voltage ............................................................................................. 6 V
IC Collector Current ............................................................................................................. 7 A
IB Base Current.................................................................................................................... 4 A
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
*BVCEO 150 - - V IC=100mA, IB=0
ICES - - 5 mA VCE=400V
IEBO - - 1 mA VEB=6V, IC=0
*VCE(sat) - - 1 V IC=5A, IB=0.5A
*VBE(sat) - - 1.2 V IC=5A, IB=0.5A
*hFE1 25 - - IC=500mA, VCE=5V
*hFE2 35 - 200 IC=2A, VCE=5V
*hFE3 10 - - IC=5A, VCE=5V
FT 10 - - MHz IC=500mA, VCE=10V, f=1MHz
(Ta=25°C)
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
Classification Of hFE2
Rank B C D
Range 35-85 75-125 115-200
HBU407 HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-220AB Dimension
A B
D
H
I
G
Spec. No. : HE6716
Issued Date : 1996.02.01
Revised Date : 2001.05.28
Page No. : 2/2
Marking :
E
M
C
K
HSMC Logo
Part Number
Date Code
Style : Pin 1.Base 2.Collector 3.Emitter
Product Series
Rank
3
2
N
4
1
P
3-Lead TO-220AB Plastic Package
HSMC Package Code : E
DIM
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
A 0.2197 0.2949 5.58 7.49 I -
O
DIM
*:Typical
Min. Max. Min. Max.
*
0.1508 B 0.3299 0.3504 8.38 8.90 K 0.0295 0.0374 0.75 0.95
C 0.1732 0.185 4.40 4.70 M 0.0449 0.0551 1.14 1.40
D 0.0453 0.0547 1.15 1.39 N -
*
0.1000 E 0.0138 0.0236 0.35 0.60 O 0.5000 0.5618 12.70 14.27
G 0.3803 0.4047 9.66 10.28 P 0.5701 0.6248 14.48 15.87
H-*0.6398 -
Notes :
Material :
• Lead : 42 Alloy ; solder plating
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your l ocal HSMC sales office.
*
16.25
*
3.83
*
2.54
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or appl ication assistance.
Head Office And Factory :
•
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
•
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
HBU407 HSMC Product Specification
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
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