HSMC HBD678 Datasheet

HI-SINCERITY
MICROELECTRONICS CORP.
HBD678
Description
The HBD678 is designed for use as output devices in complementary general purpose amplifier applications.
Features
High Current Gain
Monolithic Constructor
Spec. No. : HE6625-A Issued Date : 1994.10.04 Revised Date : 2000.10.01 Page No. : 1/2
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature............................................................................................ -50 ~ +150 °C
Junction Temperature................................................................................... +150 °C Maximum
Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) .................................................................................... 40 W
Maximum Voltages and Currents
BVCBO Collector to Base Voltage...................................................................................... 60 V
BVCEO Collector to Emitter Voltage................................................................................... 60 V
BVEBO Emitter to Base Voltage........................................................................................... 5 V
IC Collector Current.............................................................................................................. 4 A
IB Base Current.................................................................................................................... 1 A
Electrical Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
BVCBO 60 - - V IC=1mA BVCEO 60 - - V IC=50mA BVEBO 5 - - V IE=1mA
ICEO - - 200 uA VCB=30V ICBO - - 200 uA VCB=60V IEBO - - 2 mA VBE=5V
*VCE(sat) - - 2.5 V IC=1.5A, IB=30mA
*VBE(on) - - 2.5 V IC=1.5A, VCE=3V
*hFE 750 - - IC=1.5A, VCE=3V
(Ta=25°C)
(Ta=25°C)
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification
HI-SINCERITY
g
MICROELECTRONICS CORP.
TO-126ML Dimension
Spec. No. : HE6625-A Issued Date : 1994.10.04 Revised Date : 2000.10.01 Page No. : 2/2
Marking :
A
D
C
N
M L K
E
F
3 2
1
O
H
G
J
B
I
HSMC Logo
Part Number
Date Code
Ink Marking
Style : Pin 1.Emitter 2.Collector 3.Base
Product Series
Rank
3-Lead TO-126ML Plastic Package
DIM
HSMC Packa
Inches Millimeters Inches Millimeters
Min. Max. Min. Max.
e Code : D
DIM
Min. Max. Min. Max. A 0.1356 0.1457 3.44 3.70 I - *0.1795 - *4.56 B 0.0170 0.0272 0.43 0.69 J 0.0268 0.0331 0.68 0.84 C 0.0344 0.0444 0.87 1.12 K 0.5512 0.5906 14.00 15.00 D 0.0501 0.0601 1.27 1.52 L 0.2903 0.3003 7.37 7.62 E 0.1131 0.1231 2.87 3.12 M 0.1378 0.1478 3.50 3.75
F 0.0737 0.0837 1.87 2.12 N 0.1525 0.1625 3.87 4.12 G 0.0294 0.0494 0.74 1.25 O 0.0740 0.0842 1.88 2.14 H 0.0462 0.0562 1.17 1.42
Notes :
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, pleas e contact your l ocal HSMC sal es office.
*:Typical
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
HSMC Product Specification
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