HSMC HAD825SP Datasheet

HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. :Preliminary Data
Issued Date : 2000.10.01
Revised Date : 2001.05.01
Page No. : 1/2

HAD825SP

NPN EPITAXIAL PLANAR TRANSISTOR

Features

Darlington Transistor

Absolute Maximum Ratings

Maximum Temperatures

•

Storage Temperature .......................................................................................... -55 ~ +150 °C

Junction Temperature................................................................................... +150 °C Maximum

Maximum Power Dissipation

•

Total Power Dissipation (Ta=25°C) .............................................................................. 625 mW

Maximum Voltages and Currents (Ta=25°C)

•

VCBO Collector to Base Voltage........................................................................................ 80 V

VCES Collector to Emitter Voltage..................................................................................... 55 V

VEBO Emitter to Base Voltage........................................................................................... 12 V

IC Collector Current ...................................................................................................... 600 mA

(Ta=25°C)

Characteristics

Symbol Min. Typ. Max. Unit Test Conditions

BVCBO 80 - - V IC=100uA, IE=0
BVCES 55 - - V IC=100uA, IB=0
BVEBO 12 - - V IE=10uA, IC=0

ICBO - - 100 nA VCB=60V, IE=0
IEBO - - 100 nA VEB=10V, IC=0

ICES - - 500 nA VCE=50V, IB=0
*VCE(sat)1 - - 1.2 V IC=10mA, IB=0.01mA
*VCE(sat)2 - - 1.5 V IC=100mA, IB=0.1mA

*VBE(on) - - 1.5 V IC=100mA, VCE=5V

*hFE1 10K - - IC=10mA, VCE=5V
*hFE2 10K - 100K IC=100mA, VCE=5V

fT 125 - - MHz VCE=5V, IC=10mA, f =100MHz

Cob - - 8 pF VCB=10V, f=1MHz

*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%

HAD825SP HSMC Product Specific at i on

HI-SINCERITY

MICROELECTRONICS CORP.

TO-92SP Dimension

Spec. No. :Preliminary Data
Issued Date : 2000.10.01
Revised Date : 2001.05.01
Page No. : 2/2

Style : Pin 1.Emitter 2.Collector 3.Base

E

F

3

A

2

D

1

G

DIM

B

3-Lead TO-92SP Plastic Package, HSMC Package Code : N

Inches Millimeters Inches M illimeters

Min. Max. Min. Max.

C

DIM

Min. Max. Min. Max.
A 0.1450 0.1650 3.70 4.20 E 0.0160 0.0240 0.41 0.61
B 0.1063 0.1300 2.70 3.30 F - *0.0150 - *0.38
C 0.5000 - 12.7 - G 0.0800 0.1050 2.03 2.67
D - *0.1000 - *2.54

Notes :

Material :

• Lead : 42 Alloy ; solder plati ng

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0

1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.

2.Controlling dimension : millimeters.

3.Maximum lead thicknes s includes lead finish thickness, and minimum lead thickness i s the minimum thickness of base m aterial.

4.If there is any question with packing specification or packing method, please contac t your local HSMC sales office.

*:Typical

Important Notice:

• All rights are reserved. Reproduc tion in whole or in part is prohibited without the prior written approval of HSMC.

• HSMC reserves the right to m ake changes to its products without notice.

•

HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or applic ation assistance.

Head Office And Factory :

•

Head Office

Tel : [phone] Fax : [phone]

•

Factory 1 :

Tel : [phone]~5 Fax : [phone]

HAD825SP HSMC Product Specific at i on

(Hi-Sincerity Microelect ronics Corp.) : 10F.,No. 61, Sec . 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.

No. 38, Kuang Fu S. Rd., Fu-Kou Hs i n-Chu Industrial Park Hsin-Chu Taiwan. R.O.C