HSMC H6850NF, H6850P, H6850S Schematics
HI-SINCERITY
MICROELECTRONICS CORP.
H6850 Series
Novel Low Cost Green-Power PWM Controller
With Low EMI Technique
Feature
z Low Cost, PWM&PFM&CRM (Cycle
Reset Mode)
z Low Start-up Current (about 3μA)
z Low Operating Current (about 1.2mA)
z Current Mode Operation
z Under Voltage Lockout (UVLO)
z Built-in Synchronized Slope
Compensation
z Built-in Low EMI Technique
z Programmable PWM Frequency
z Audio Noise Free Operation
z Leading edge Blanking on Sense input
z Constant output power limiting for
universal AC input Range
z SOT-23-6L 、SOP8 and DIP-8 Pb-Free
Applications
z Switching AC/DC Adaptor
z Battery Charger
z Open Frame Switching Power Supply
General Description
The H6850 is a highly integrated low cost
current mode PWM controller, which is ideal
for small power current mode of offline
AC-DC fly-back converter applications.
Making use of external resistors, the IC
changes the operating frequency and
automatically enters the PFM/CRM (Cycle
Reset Mode) under light-load/zero-load
conditions. This can minimize standby
power consumption and achieve powersaving functions. With a very low start-up
current, the H6850 could use a large value
start-up resistor (2MΩ).
Built-in synchronized slope compensation
enhances the stability of the system and
avoids sub-harmonic oscillation. Dynamic
peak current limiting circuit minimizes output
power change caused by delay time of the
system over a universal AC input range.
Packaging
z Good Protection Coverage With Auto
Self-Recovery
z Compatible with SG6848 (6849) /
SG5701/SG5848/LD7535 (7550) /
OB2262 (2263)/OB2278（2279）
z Complete Protection with
¾ Soft Clamped GATE output voltage
18.0V
¾ VDD over voltage protect 34.0V
¾ Cycle-by-cycle current limiting
¾ Output SCP (Short circuit Protection)
¾ Output OLP (Over Load Protection)
¾ High-Voltage CMOS Process with ESD
z Standby Power Supplies
z Set-Top Box Power Supplies
z 384X Replacement
Leading edge blanking circuit on current
sense input could remove the signal glitch
due to snubber circuit diode reverse
recovery and thus greatly reduces the
external component count and system cost
in the design. Cycle-by-Cycle current
limiting ensures safe operation even during
short-circuit.
Excellent EMI performance is achieved
built-in soft driver and low EMI technique.
The H6850 offers perfect protection like
OVP(Over Voltage Protection)、OLP(Over
Load Protection) 、 SCP(Short circuit
protection)、OTP、Sense Fault Protection
and OCP(Over current protection). The
H6850’s output driver is soft clamped to
maximum 18.0V to protect the power
MOSFET. H6850 is offered in SOT-23-6L,
SOT-8 and DIP-8 packages.
Spec. No. : IC200912
Issued Date : 2009.07.15
Revised Date :
Page No. : 1/13
H6850P, H6850S,H6850NF HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Pin Assignment
Part Number
H6850NF SOT26, Pb-free,in T/R
H6850S SOP-8, Pb-free in T/R
H6850P DIP-8, Pb-free in Tube
Pin Descriptions
Package
SOT-26
SOT-26
1234
DIP -8(SOP-8)
Description
Function Description
DIP-8
Pin6: GATE Pin1: GATE Totem-pole output to drive the external power MOSFET
46 5
Pin5: VDD Pin2: VDD
Pin3: NC NC Pin.
31 2
Pin4:
SENSE
5678
Pin3: RI Pin5: RI
Pin6: NC NC Pin
Pin2: FB Pin7:FB
Pin1: GND Pin8: GND GND Pin
Pin4:
SENSE
Spec. No. : IC200804
Issued Date : 2008.09.19
Revised Date :
Page No. : 2/13
Supply voltage pin.
Current sense pin, a resistor connects to sense the
MOSFET current.
This pin is to program the switching frequency. By
connecting a resistor to ground to set the switching
frequency.
Voltage feedback pin. Output current of this pin could
controls the PWM duty cycle、OLP and SCP.
TYPICAL APPLICATION
H6850
H6850P, H6850S,H6850NF HSMC Product Specification
Block Diagram
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : IC200804
Issued Date : 2008.09.19
Revised Date :
Page No. : 3/13
Simplified Internal Circuit Architecture
Absolute Maximum Ratings
Symbol Parameter Rating Unit
V
I
V
V
T
DD
OVP
FB
SEN
P
D
T
L
STG
Supply voltage Pin Voltage 40 V
VDD OVP maximal enter current 20 mA
Input Voltage to FB Pin -0.3 to 6V V
Input Voltage to SEN Pin -0.3 to 6V V
Power Dissipation 300 mW
ESD Capability, HBM Model 2500 V
ESD Capability, Machine Model 250 V
Lead Temperature
(Soldering)
SOT-23-6L (20S) 220
DIP-8 (10S) 260
SOP-8 (10S) 230
Storage Temperature Range -55 to + 150
℃
℃
℃
℃
RECOMMENDED OPERATION CONDITION
Symbol Parameter Min ~ Max Unit
VDD VDD Supply Voltage 10~30 V
RI RI PIN Resistor Value 100 K ohm
TOA Operation Ambient Temperature -20~85
P
Maximal Output Power 0~80 W
OMAX
F
PWM
Frequency of PWM 30~150 kHz
℃
H6850P, H6850S,H6850NF HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : IC200804
Issued Date : 2008.09.19
Revised Date :
Page No. : 4/13
Electrical Characteristics (Ta=25°C unless otherwise noted, V
= 16V)
DD
Symbol Parameter Conditions Min. Typ. Max. Unit
Supply Voltage (VDD Pin)
I
ST
Startup Current 3.0 20.0
VFB=0V 3.0 mA
VDD
VDD
VDD
VDD
I
SS
ON
OFF
CLAMP
AIS
Operating Current
VFB=3V 1.2 mA
=Open 0.8 mA
V
FB
Turn-on Threshold Voltage 13.0 14.0 15.0 V
Turn-off Threshold Voltage 7.8 8.8 9.8 V
VDD Clamp Voltage I
Anti Intermission Surge
=10mA 34.0 V
VDD
9.4 V
VDD Voltage
μA
Voltage Feedback (FB Pin)
IFB Short Circuit Current VFB=0V 0.7 mA
VFB Open Loop Voltage VFB=Open 4.8 V
I
Zero Duty Cycle FB current 0.59 mA
FB_0D
I
PFM
I
CRM
V
PFM
V
CRM
I
OLP&SCP
V
OLP&SCP
T
OLP&SCP
Enter PFM FB current 0.50 mA
Enter CRM FB current 0.55 mA
Enter PFM Threshold V
FB
1.80 V
Enter CRM Threshold VFB 1.40 V
Enter OLP&SCP FB current 170 uA
Enter OLP&SCP FB voltage 3.7 V
OLP&SCP min. delay Time RI=100K 33 35 50 mS
Current Sensing (SEN Pin)
V
TH_L
SEN Maximum Voltage Level
（Dmin=0%）
RI=100K,
0.80 V
FB=3.3V
V
SEN Maximum Voltage
TH_H
Level(Dmax=78%)
RI=100K,
1.05 V
FB=3.3V
TPD Delay to Output FB=3.3V 75 ns
H6850P, H6850S,H6850NF HSMC Product Specification
RCS Input Impedance
Leading edge blanking time
T
LEB
( LEB )
Oscillator (RI Pin)
F
Normal Frequency RI=100Kohm 60 65 70 KHz
OSC
F
PFM Frequency RI=100Kohm 22 KHZ
PFM
DC
DC
ΔF
T
F
Maximum Duty Cycle PWM RI=100Kohm 78 %
MAX_W
MAX_F
TEMP
BLANK
JITTER
Maximum Duty Cycle PFM RI=100Kohm 78 %
Frequency Temp. Stability
Leading-Edge Blanking Time 300 nS
Frequency jitter RI=100Kohm -4 4 %
HI-SINCERITY
MICROELECTRONICS CORP.
40 KΩ
RI=100K 300 nS
-30-100
℃
Spec. No. : IC200804
Issued Date : 2008.09.19
Revised Date :
Page No. : 5/13
5 %
GATE Drive Output (GATE Pin)
Output Low Level VDD=16V,
V
OL
Output High Level VDD=16V,
V
OH
VG
T
R1
T
F1
T
R2
T
F2
T
R3
T
F3
T
R4
T
F4
CLAMP
Rising Time
Falling Time CL=500pF 71 ns
Rising Time
Falling Time CL=1000pF 116 ns
Rising Time
Falling Time CL=1500pF 153 ns
Rising Time
Falling Time CL=2000pF 209 ns
Output Clamp Voltage VDD=20V 18.0 V
Low EMI technique
I
=20mA
O
10 V
0.8 V
I
=20mA
O
CL=500pF 123 ns
CL=1000pF 248 ns
CL=1500pF 343 ns
CL=2000pF 508 ns
f
EMI
Low EMI frequency RI=100Kohm 65 KHz
Frequency modulation range
∆f_osc
RI=100Kohm -3 3 %
/Base frequency
H6850P, H6850S,H6850NF HSMC Product Specification
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