HSMC DB3 Datasheet

HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. :Preliminary Data Issued Date : 1998.02.01 Revised Date : 1999.08.01 Page No. : 1/2
DB3
Description
High reliability glass passivation insuring parameter stability and against contamination.
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature............................................................................................ -40 ~ +125 °C
Junction Temperature........................................................................................... -40 ~ +110 °C
Maximum Power Dissipation
Total Power Dissipation (Ta=25°C)............................................................................... 150 mW
Maximum Voltages and Currents
Breakover Voltage .............................................................................................................. 32 V
Breakover Voltage symmetry.............................................................................................. ±3 V
Repetitive peak on-state Current.......................................................................................... 2 A
Characteristics
Symbol Min. Typ. Max. Unit Test Conditions
VBO 28 32 36 V C=22nF
[ |+VBO| ]-[ |-VBO| ] - -
IV±I 5 - - V I=[ IBO to IF=10mA ]
VO 5 - - V
IBO - - 50 uA C=22nF
tr - 1.5 - uS
IB - - 10 uA VB=0.5 VBO max
(Ta=25°C)
(Ta=25°C)
3
±
V C=22nF
*Pulse Test : Pulse Width ≤380us, Duty Cycle≤2%
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
DO-35(Glass) Dimension
A
Spec. No. :Preliminary Data Issued Date : 1998.02.01 Revised Date : 1999.08.01 Page No. : 2/2
E
B
DO-35 Glasses Package, HSMC Package Code : L
DIM
A
φ
Inches Millimeters Inches M illimeters
Min. Max. Min. Max.
0.0181φ0.0220
0.46
φ
B 0.9646 1.2811 24.50 32.54 E
0.56
φ
C
DIM
D
Min. Max. Min. Max.
D 0.9646 1.2811 24.50 32.54
0.0602φ0.0787
φ
1.53
φ
C 0.1200 0.1700 3.05 4.20
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringem ent of pat ents, or applic ati on assistance.
Head Office And Factory :
Head Office
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 :
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 :
Tel : 886-3-5977061 Fax : 886-3-5979220
(Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
*:Typical
2.00
φ
HSMC Product Specification
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