Hp zx2000 technical reference guide
technical reference guide
hp workstation zx2000
Document Part Number: 5969-3154
April 2003
This manual contains an overview of system specifications, instructions
for removing and replacing system components, information on
configuring your system using the included tools and interfaces, and
detailed troubleshooting information.
© 2003 Hewlett-Packard Development Company, L.P.
®
Microsoft
Corporation in the U.S. and other countries.
Intel
under license.
LINUX® is a registered trademark of Linus Torvalds in the U.S. and other countries.
NVIDIA and NVIDIA Quadro are registered trademarks or trademarks of NVIDIA Corporation in the United
States and/or other countries.
All other product names mentioned herein may be trademarks of their respective companies.
Hewlett-Packard Company shall not be liable for technical or editorial errors or omissions contained herein or for
incidental or consequential damages in connection with the furnishing, performance, or use of this material. The
information in this document is provided “as is” without warranty of any kind, including, but not limited to, the
implied warranties of merchantability and fitness for a particular purpose, and is subject to change without notice.
The warranties for HP products are set forth in the express limited warranty statements accompanying such
products. Nothing herein should be construed as constituting an additional warranty.
This document contains proprietary information that is protected by copyright. No part of this document may be
photocopied, reproduced, or translated to another language without the prior written consent of Hewlett-Packard
Company.
WARNING: Text set off in this manner indicates that failure to follow directions could result in bodily
Å
harm or loss of life.
CAUTION: Text set off in this manner indicates that failure to follow directions could result in
Ä
damage to equipment or loss of information.
, Windows®, Windows 2000®, and Windows XP® are registered trademarks of Microsoft
®
and Itanium® are registered trademarks of Intel Corporation in the U.S. and other countries and are used
technical reference guide
hp workstation zx2000
First Edition (April 2003)
Document Part Number: 5969-3154
important safety warnings
WARNING: Avoid Electrical Shocks. To avoid electrical shock, do not open the power supplies. There
Å
are no user-serviceable parts inside.
To avoid electrical shock and harm to your eyes by laser light, do not open the DVD laser module. The
laser module should be serviced by service personnel only. Do not attempt to make any adjustment to the
laser unit. Refer to the label on the DVD for power requirements and wavelength. This product is a class I
laser product.
WARNING: Removing and Replacing the Cover. For your safety, never remove the system side cover
Å
without first disconnecting the power cord from the power outlet and removing any connection to a
telecommunications network. If a Power Protection Device is fitted to your system, you must shut down
your computer using its on/off switch, then remove the power cord before removing the system’s side
cover. Remove the Power Protection Device cables before any servicing operation. Always replace the
side cover before switching the system on again.
WARNING: Battery Safety Information. There is a danger of explosion if the battery is incorrectly
Å
installed. For your safety, never attempt to recharge, disassemble, or burn an old battery. Replace the
battery with the same or equivalent type, as recommended by the manufacturer.
The battery in this system is a lithium battery that does not contain any heavy metals. However, to protect
the environment, do not dispose of batteries in household waste. Return used batteries either to the shop
from which you bought them, to the dealer from whom you purchased your system, or to HP so that they
can either be recycled or disposed of in the correct way. Returned batteries will be accepted free of
charge.
WARNING: Avoid Burn Injuries. Some parts inside the computer will be hot. Wait approximately three
Å
to five minutes for them to cool down before touching them.
CAUTION: Avoid Static Electricity. Static electricity can damage electronic components. Turn OFF all
Ä
equipment before installing an accessory card. Don’t let your clothes touch any accessory card. To
equalize the static electricity when replacing an accessory card, rest the accessory card bag on top of the
system unit while you are removing the card from the bag. Handle the card as little as possible and with
care.
CAUTION: Information on Ergonomic Issues. It is strongly recommended that you read the ergonomics
Ä
information, available in the “Working In Comfort” section of this manual, before using your system. You
can access more extensive ergonomics information at: www.hp.com/ergo
NOTE: Recycling Your System. HP has a strong commitment toward the environment. Your HP
system has been designed to respect the environment as much as possible. HP can also take back
your old system for recycling when it reaches the end of its useful life. HP has a product
take-back program in several countries. The collected equipment is sent to an HP recycling
facilities in Europe or the U.S.A. As many parts as possible are reused. The remainder is
recycled. Special care is taken for batteries and other potential toxic substances, these are
reduced into non-harmful components through special chemical processes. If you require more
details about the HP product take-back program, contact your local dealer or your nearest HP
Sales Office.
Contents
1 Product Information
System features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1
Physical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3
Power specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4
Power consumption and cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5
Environmental specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5
Front panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6
Rear panel. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–8
2 Installing or Replacing Parts and Accessories
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1
Internal components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2
Removal and replacement prerequisites. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
Read the power and EMI warning and note . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
Gather your tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
Follow electrostatic discharge (ESD) precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4
Removing and replacing covers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–5
Removing the plastic and metal covers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–5
Replacing the covers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–8
Removing and replacing the front bezel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–10
Removing and replacing internal components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–11
Memory modules. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–11
Accessory and graphics cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–13
Optical drives (CD or DVD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–17
Hard drives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–20
Power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–23
System fans . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–24
Airflow guide. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–26
LED status panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–27
Processor assembly and power module. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–28
System board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–33
System battery . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–36
3 System Configuration
Extensible Firmware Interface (EFI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1
Accessing and navigating the EFI shell. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2
Using the Boot Option Maintenance menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–11
Using the Security/Password menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–21
Baseboard Management Controller (BMC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–23
Using the BMC command line interface (CLI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–23
technical reference guide v
Contents
3 System Configuration
Extensible Firmware Interface (EFI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1
Accessing and navigating the EFI shell. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2
Using the Boot Option Maintenance menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–11
Using the Security/Password menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–21
Baseboard Management Controller (BMC). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–23
Using the BMC command line interface (CLI). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–23
BMC commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–24
IPMI commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–26
Firmware upgrades. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–31
4 Troubleshooting
Troubleshooting overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1
Identifying and diagnosing hardware problems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2
System e-buzzer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–3
LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–5
Monitor troubleshooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–14
Running Diagnostic Software Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–15
HP e-DiagTools hardware diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–15
Additional diagnostics tools for HP-UX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–18
A System Accessories
Graphics cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–1
Supported graphics cards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–1
Selecting a monitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–2
Mass storage devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–6
Hard disk drives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–6
CD-RW drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–7
DVD-ROM drive. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A–8
B System Board
System board overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–1
System board components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–3
Intel® Itanium® 2 processor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–3
Processor bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–3
ZX1 I/O and memory controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–4
I/O bus interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–4
Processor dependent hardware controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–5
Dual serial controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–5
Field programmable gate array controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–6
Baseboard management controller (BMC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–6
IDE interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–6
10/100/1000 BT LAN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B–7
vi technical reference guide
C Part Numbers
Exploded view . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C–1
D Event, Error and Warning Messages
EFI error and warning messages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D–1
SEL and FPL log entries . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D–4
Accessing the logs with BMC CLI commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D–4
System specific events. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D–5
Events without sensors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D–8
Index
Contents
technical reference guide vii
Contents
viii technical reference guide
This chapter provides an overview of the hp workstation zx2000, including:
■
System features
■
Physical characteristics
■
Power specifications
■
Environmental specifications
■
Front panel features
■
Rear panel connectors
system features
Feature Description
Processor Intel® Itanium® 2
1
product information
•900 MHz
• 1.5 MB cache on chip
Firmware 8 MB flash EEPROM
• Configured using Extensible Firmware Interface (EFI)
Operating system Models include one of the following:
•HP-UX
•Linux®
• Microsoft® Windows® XP 64-Bit Edition Version 2003
Main memory Capacity:
• 512 MB min. (2 x 256 MB)
• 8 GB max. (4 x 2 GB)
Type: PC2100 ECC registered DDR266 SDRAM
Sockets: Four DIMM sockets
Bus Bandwidth: 4.25 GB/sec
For memory loading order and detailed memory installation
instructions, see “Loading Order” on page 2-12.
Hard drive(s) Models include one or two of the following:
• Ultra ATA-100 IDE: 40 GB, 80 GB or 120 GB
• Ultra 160 SCSI: 36 GB, 73 GB or 146 GB
technical reference guide 1–1
Product Information
Feature Description
Optical drive(s) Models include one of the following IDE drives:
• 48X CD-RW
•16X DVD-ROM
SCSI controller
(optional)
IDE controller Ultra ATA-100 capable controller supporting a total of two IDE buses
Graphics controllers Models available with a range of AGP graphics cards (Appendix A).
Accessory card sockets Six sockets total:
I/O connectors • 10/100/1000 LAN connector
Models may include one Ultra 160 SCSI adapter
and four IDE devices:
•Two internal hard drives
• Two front-access optical drives
• One AGP Pro 50 1.5V-only 4
• Three full-length and one half-length 3.3V 64-bit 66 MHz PCI-X
sockets
• One full-length 3.3V 64-bit 133 MHz PCI-X socket.
• Four USB 2.0 480 Mb/s connectors:
•Two front-access
•Two rear-access
•Two 9-pin serial ports:
•UART 16550 buffered
• RS-232-C
32-bit socket
×
Input devices USB keyboard and mouse:
• HP 104/105 key keyboard, available in 13 localized layouts
• HP three-button mouse, standard or scroll-wheel
IEEE-1394 FireWire
(optional)
Audio Integrated audio features:
1–2 technical reference guide
Models may include IEEE-1394 interface cards:
• IEEE-1394A, OHCI
• Three ports (two rear, one internal)
• 16-bit stereo
• Internal CD audio connector
• Full duplex
• Three rear-connect audio jacks:
•Microphone
•Line in
•Line out
physical characteristics
Characteristic hp workstation zx2000
Product Information
Weight
1
Tower system Minimum: 21.98 kg (48.45 lb.)
Maximum: 24.80 kg (54.68 lb.)
Rack system Minimum: 17.77 kg (39.18 lb.)
Maximum: 20.60 kg (45.41 lb.)
Dimensions
Tower system Height: 502.6 mm (19.79 in.)
Depth: 512.4 mm (20.17 in.)
Width: 268.0 mm (10.55 in.)
Rack system Height: 175.3 mm (6.90 in.)
Depth: 510.9 mm (20.11 in.)
Width: 482.5 mm (18.99 in.)
Footprint, tower system
Space requirement, rack system
1. Excludes keyboard, mouse and display.
0.09 m2 (0.98 sq. ft.)
4 units
technical reference guide 1–3
Product Information
power specifications
Available power (output) is the maximum DC power that the power supply can supply to the
system.
Maximum input power is what the power supply requires from the AC line to deliver that
maximum DC output (given worst case efficiency and max loading).
Maximum input current is the worst case/highest current given the lowest input voltage and the
maximum input power.
Parameter Total Rating PCI Sockets AGP Sockets
Input voltage (wide-range) 100-127VAC
200-240VAC
Max input current 6.4A at 100VAC
3.2A at 200VAC
Input frequency 50 – 60 Hz
Max input power required 643W
Max available output power 450W
Max current at +12V 14A
Max current at +12V-CPU 16A
Max current at +3.3V 34A
Max current at +5V 20A
Max current at –12V 0.55A
Max current at +5Vsb 2A
5 sockets
available at
15W/socket
Total of 75W
1 socket
available at
50W/socket
The power supply has Active Power Factor Correction (APFC) that meets EN61000-3-2 over the
range of 88-255 VAC rms.
1–4 technical reference guide
power consumption and cooling
The power consumptions listed in the following table are valid for a standard configuration as
shipped (4 GB of memory, 450W power supply, two hard disk drives, and one graphics card).
All information in this section is based on primary power consumptions.
Additional Component
Processor 130W 443.6 Btu/h
IDE hard disk drive with I/O access 23W 78.4 Btu/h
IDE hard disk without I/O access (idle) 16W 54.5 Btu/h
PCI card 10W to 25W 34.12 Btu/h to 85.30 Btu/h
AGP card 50W (maximum) 170.6 Btu/h
environmental specifications
Environmental Specifications (System Processing Unit with Hard Disk)
Product Information
Operating temperature +5° C to +35° C (+41° F to +95° F)
Storage temperature -40° C to +70 C (-40° F to +158° F)
Over-temperature shutdown +40° C (+104° F)
Operating humidity 15% to 85% relative (non-condensing)
Storage humidity 8% to 85% relative (non-condensing)
Operating altitude 0-3000 m (0-10,000 ft.)
Storage altitude (long-term) 0-4600 m (0-15,000 ft.)
Operating temperature and humidity ranges may vary depending on the installed mass storage
devices. High humidity levels can cause improper disk operation. Low humidity levels can
aggravate static electricity problems and cause excessive wear of the disk surface.
technical reference guide 1–5
Product Information
front panel
The hp workstation zx2000 front panel has the following features:
■
Two front-access USB connectors.
■
Two front-access optical drive bays.
Power Button turns the system power on or off.
■
Power LED is green when the power is on or the power button is pushed in. If the power is
■
on and the button is pushed in, the light will stay on even after the system is powered down.
When the button is released, the green light turns off.
Activity LED indicates whether the system is accessing any of the hard drives or optical
■
drives (IDE or SCSI). If the LED is:
off, the system is off, or the system is not accessing internal drives
❏
blinking green, the system is accessing an internal drive
❏
NOTE: The Activity LED automatically communicates with IDE hard drives or optical drives.
To communicate with SCSI drives, a SCSI LED activity cable must connect the SCSI card and
the system board. The Activity LED is active only on systems purchased after March 2003.
System and Diagnostic LEDs provide information about system errors.
■
Locator Button and LED (rack-mount configuration only) identifies the rack position of
■
the workstation.
1–6 technical reference guide
Product Information
1
2
3
4
5
6
7
Front Panel, Tower Configuration
12345687
Front Panel, Rack Configuration
1 Optical drive bays 5 Activity LED
2 Power LED 6 Diagnostic LEDs 1-4
3 Power button 7 Front-access USB connectors
(behind door)
4 System LED 8 Locator LED and button
(rack-mounted system only)
technical reference guide 1–7
Product Information
rear panel
The connectors are shaped to go in one way only. Refer to the label on the back of the
workstation.
1
2
3
4
5
6
7
Rear Panel Connectors, Tower Configuration
124
Rear Panel Connectors, Rack-mounted Configuration
1 Power 5 LAN LEDs
2 Serial ports 6 Built-in LAN and optional 2nd LAN ports
3 Audio
4 USB
(headphone, microphone)
37
5
7 Monitor port(s) on graphics card
6
1–8 technical reference guide
installing or replacing parts and accessories
overview
This chapter contains the following sections:
■
“Internal components” on page 2-2 shows photos of the internal components and system
board. These will help you locate components.
■
“Removal and replacement prerequisites” on page 2-4 provides information you must know
before you remove components.
■
“Removing and replacing covers” on page 2-5 and “Removing and replacing the front bezel”
on page 2-10 explain two tasks you perform for many remove/replace procedures.
■
The remaining sections explain how to remove and replace components:
❏
Memory modules, page 2-11
❏
Accessory and graphics cards, page 2-13
❏
Optical drives (CD or DVD), page 2-17
2
❏
Hard drives, page 2-20
❏
Power supply, page 2-23
❏
System fans, page 2-24
❏
Airflow guide, page 2-26
❏
LED status panel, page 2-27
❏
Processor assembly and power module, page 2-28
❏
System board, page 2-33
❏
System battery, page 2-36
technical reference guide 2–1
Installing or Replacing Parts and Accessories
6
internal components
7
5
4
3
2
1
14
zx2000 Main Components
1 PCI sockets 8 Optical drive(s)
2 AGP video card (behind arm) 9 System fans (behind front bezel)
13
8
9
10
11
12
3 AGP retainer arm 10 LED status panel
4 Memory DIMMs 11 Serial number label (behind door)
5 Power supply 12 Front-access USB ports (behind door)
6 Processor/fan assembly
(behind hard-drive cage)
7 Hard-drive cage 14 Pedestal (tower system)
2–2 technical reference guide
13 Internal speaker
Installing or Replacing Parts and Accessories
543
6
7
2
8
1
11
10
9
zx2000 System Board
1 CD Audio connector 7 Internal speaker connector
2 Memory DIMM sockets (4) 8 AGP-Pro 50 socket
3 CPU Power Module 9 PCI sockets (5)
4 CPU Assembly 10 SCSI LED activity connectors
5 Battery 11 Rear panel connectors
6 USB front cable connector
For additional information on the system board, see Appendix B.
technical reference guide 2–3
Installing or Replacing Parts and Accessories
removal and replacement prerequisites
Before you remove or replace parts, you must:
■
Read the power and EMI warning and note below. (Your safety is important!)
■
Gather your tools.
■
Follow electrostatic discharge (ESD) precautions.
read the power and EMI warning and note
WARNING: For the installation and removal procedures in this chapter, you must:
Å
gather your tools
power off the workstation, and
■
unplug the workstation power cord from the AC power outlet.
■
NOTE: To maintain FCC Electromagnetic Interference (EMI) compliance, verify that all covers
are replaced and that all screws are properly seated.
You ne e d:
■
Flat blade screwdriver
■
T-15 Torx driver
■
Special processor tool (provided with replacement CPU)
■
Static-free mat
■
Static strap
follow electrostatic discharge (ESD) precautions
To prevent damage to this system, observe all of the following ESD precautions while
performing the system parts removal/replacement procedures:
■
Work on a static-free mat.
■
Wear a static strap to ensure that any accumulated electrostatic charge is discharged from
your body to ground.
■
Create a common ground for the equipment you are working on by connecting the static-free
mat, static strap and peripheral units to that piece of equipment.
■
Keep uninstalled printed circuit boards in their protective antistatic bags.
■
Handle printed circuit boards by their edges, once you have removed them from their
protective antistatic bags.
2–4 technical reference guide
removing and replacing covers
To upgrade, remove or replace system components, you must first remove the covers from the
system chassis. This section explains how to remove and replace the covers for both tower and
rackmount configurations.
WARNING: Never remove the system cover(s) without first turning the system off and unplugging the
Å
power cord from the outlet or Power Protection Device. Always replace the cover(s) before turning the
workstation on.
removing the plastic and metal covers
1. Turn off the system and disconnect the power cable and all other cables from the back of the
system.
2. Access the metal cover.
Rackmount system: Release the glide-rail retainers and slide the system outward as far as you
can so that you have access to the system cover.
Tower system: remove the plastic cover. With the front panel of the tower case facing right:
a. Grasp both indentations at the top of the side panel and pull outward.
Installing or Replacing Parts and Accessories
b. Lift the plastic cover off of the system chassis.
Removing the Plastic Cover (Tower System Only)
technical reference guide 2–5
Installing or Replacing Parts and Accessories
3. Loosen the two blue screws on the cover near the back panel of the chassis.
Unscrewing the Metal Side Cover
4. Slide the cover about 60 mm (1.5 in.) toward the back of the chassis, then lift it off.
A
B
Removing the Metal Side Cover
2–6 technical reference guide
removing the shipping screws
The first time you open the case to work on the system, remove the screws that hold the hard
drive cage and AGP retainer arm in place for shipping. Replacing these screws is not necessary.
Installing or Replacing Parts and Accessories
Shipping Screws
technical reference guide 2–7
Installing or Replacing Parts and Accessories
replacing the covers
1. Align the right edge of the metal cover with the blue line on the system chassis.
Align the Metal Cover
2. Place the metal cover on the chassis and slide it toward the system front panel.
Replace the Metal Cover
3. Tighten the two blue screws on the cover near the rear panel of the chassis.
4. Rackmount system: Slide the system inward until the glide-rail retainers latch.
2–8 technical reference guide
Installing or Replacing Parts and Accessories
5. Tower system: Replace the plastic cover.
a. Align the cover mounting holes with the matching tabs on the system chassis.
b. Close the cover until it snaps onto the system chassis.
B
A
Replacing the Plastic Cover (tower system only)
technical reference guide 2–9
Installing or Replacing Parts and Accessories
removing and replacing the front bezel
You must remove the front bezel from the chassis to upgrade, remove or replace an optical drive.
removing the front bezel
1. To remove the front bezel:
❏
Tower system: Firmly grasp the finger grip at the top of the bezel and pull forward until
the bezel snaps open.
❏
Rack-mounted system: Remove the metal cover, then depress the blue release tabs inside
the chassis and rotate the bezel away from the chassis.
Removing the Front Bezel
2. Lift the bezel off of the chassis.
replacing the front bezel
1. Insert the bezel latches into the matching slots on the system chassis.
Replacing the Front Bezel
2. Close the bezel and push toward the front of the system until it snaps into place.
3. Rack-mounted system only: Replace the metal cover.
2–10 technical reference guide
Installing or Replacing Parts and Accessories
removing and replacing internal components
memory modules
The hp workstation zx2000 has four memory sockets for memory modules. These modules can
be 256 MB, 512 MB, 1 GB or 2 GB. DIMMs must be installed in ordered pairs of equal size. You
can install between 512 MB and 8 GB of memory in the system. For a list of approved memory
modules, see Appendix C.
removing memory modules
1. Turn off the system, disconnect all cables, and remove the system covers.
WARNING: To ensure that memory modules are not damaged during removal or installation, power off
Å
the workstation and unplug the power cord from the AC power outlet. Wait until the LED on the back of
the power supply turns off before removing memory.
2. Press down on the memory module retainer clips and lift the module by its edges out of its
memory socket.
Memory Module Retainer Clips
3. If the removed memory is functional, store it in a static-free container for future use.
4. Replace the system covers, reconnect all cables, and turn on the system.
5. Execute the EFI shell info mem command to verify the new memory configuration.
For more information on EFI, see Chapter 3
installing memory modules
1. Turn off the system, disconnect all cables, and remove the system covers.
WARNING: To ensure that memory modules are not damaged during removal or installation, power off
Å
the workstation and unplug the power cord from the AC power outlet. Wait until the LED on the back of
the power supply turns off before removing or installing memory.
technical reference guide 2–11
Installing or Replacing Parts and Accessories
2. Holding the memory module by its left and right edges, insert the module into the socket.
❏
DDR SDRAM must be loaded as matched pairs. For example, if you place a memory
module of 1 GB in DIMM 0A, you must insert a 1 GB module in DIMM 0B. Matched
pairs should be loaded in sockets 0A and 0B first, and then in sockets 1A and 1B.
❏
To verify that DIMMs are matched pairs, make sure the HP part numbers are identical.
❏
It is not necessary for DIMMs in the two pairs to match. For example, you may install a
pair of 256 MB DIMMs in sockets 0A and 0B and a pair of 1 GB DIMMs in sockets 1A
and 1B.
Location of power supply (reference point)
Loading Order Memory DIMM Sockets
1st DIMM 0A
2nd DIMM 1A
1st DIMM 0B
2nd DIMM 1B
NOTE: The memory modules are keyed and can only be inserted in one direction. When the
module is correctly seated, the retainer clips will return to their fully upright position. Snap the
clips firmly into place to ensure that the DIMMs are seated properly.
3. Replace the system covers, reconnect all cables, and turn on the system.
4. Execute the EFI shell info mem command to verify the new memory configuration.
For more information on EFI, see Chapter 3.
2–12 technical reference guide
accessory and graphics cards
The zx2000 has the following accessory card sockets:
■
One half-length 64-bit 66 MHz PCI-X socket
■
One AGP-Pro 50 4X video card socket
■
Three full-length 64-bit 66 MHz PCI-X sockets
■
One full-length 64-bit 133 MHz PCI-X socket
1
2
3
4
Installing or Replacing Parts and Accessories
PCI and AGP Sockets
1 Half-length PCI socket
2 AGP-Pro 50 socket
3 66 MHz full-length PCI sockets (3)
4 133 MHz full-length PCI sockets
This section explains how to:
■
access the sockets, and
■
remove and replace AGP video and PCI accessory cards.
technical reference guide 2–13
Installing or Replacing Parts and Accessories
removing an accessory or video card
1. Turn off the system, disconnect all cables, and remove the system covers.
2. Disconnect the hard drive power connection and IDE or SCSI cable.
3. Raise the hard drive cage:
a. Depress the blue latch on the hard drive cage.
b. Lift up the hard drive cage until it snaps into the upright position.
B
Lifting the Hard Drive Cage
A
4. Remove the AGP retainer arm:
a. Unscrew the blue AGP retainer arm screw.
b. Lift the arm, sliding it slightly toward the front of the system to release the latches from
the slots in the chassis.
B
A
Removing the AGP Retainer Arm
2–14 technical reference guide
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