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HP ProLiant ML350 Generation 4 Server
Aug
Maintenance and Service Guide
ust 2005 (Third Edition)
Part Number 356698-003
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© Copyright 2004, 2005 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP
shall not be liable for technical or editorial errors or omissions contained herein.
Microsoft, and Windows are U.S. registered trademarks of Microsoft Corporation. Intel and Xeon are trademarks or registered trademarks of
Intel Corporation or its subsidiaries in the United States and other countries. Linux is a U.S. registered trademark of Linus Torvalds.
August 2005 (Third Edition)
Part Number 356698-003
Audience assumptions
This guide is for an experienced service technician. HP assumes you are qualified in the servicing of
computer equipment and trained in recognizing hazards in products with hazardous energy levels and
are familiar with weight and stability precautions for rack installations.
Page 3
Contents
Illustrated parts catalog ................................................................................................................. 5
Mechanical Components............................................................................................................................ 5
System Components................................................................................................................................... 6
Removal and replacement procedures............................................................................................. 8
Required Tools .......................................................................................................................................... 8
Safety considerations................................................................................................................................. 8
Preventing electrostatic discharge ...................................................................................................... 9
Symbols on equipment ..................................................................................................................... 9
Rack warnings and cautions ........................................................................................................... 10
Preparation procedures............................................................................................................................ 10
Powering down the server ..............................................................................................................11
Extending the server from the rack ................................................................................................... 11
Access Panel................................................................................................................................. 12
Removing the server from the rack ...................................................................................................12
Removing tower feet ................................................................................................................................ 13
Removing the front bezel (tower model)...................................................................................................... 13
Rack rails ............................................................................................................................................... 13
Removing the power supply blank ............................................................................................................. 14
Hot-plug power supply............................................................................................................................. 14
Non-hot-plug power supply....................................................................................................................... 15
Hot-Plug Power Supply Backplane .............................................................................................................16
Removing a hard drive blank.................................................................................................................... 17
Hot-Plug SCSI Hard Drive......................................................................................................................... 17
Non-hot-plug SCSI hard drive ................................................................................................................... 18
Redundant system fan .............................................................................................................................. 19
Expansion Slot Cover...............................................................................................................................20
Expansion board..................................................................................................................................... 20
CD-ROM drive........................................................................................................................................ 21
Tape drive.............................................................................................................................................. 22
Internal two-bay hot-plug SCSI drive cage................................................................................................... 23
Processor and Heatsink............................................................................................................................ 24
PPM ...................................................................................................................................................... 27
Second serial port ................................................................................................................................... 28
Duplex SCSI backplane............................................................................................................................ 29
Battery................................................................................................................................................... 29
System Board ......................................................................................................................................... 30
Re-entering the server serial number and product ID..................................................................................... 31
Diagnostic tools.......................................................................................................................... 32
Automatic Server Recovery ....................................................................................................................... 32
HP Systems Insight Manager..................................................................................................................... 32
Integrated Management Log ..................................................................................................................... 32
HP Instant Support Enterprise Edition.......................................................................................................... 33
Option ROM Configuration for Arrays ....................................................................................................... 33
HP ProLiant Essentials Rapid Deployment Pack ............................................................................................33
ROM-Based Setup Utility .......................................................................................................................... 34
ROMPaq utility........................................................................................................................................ 34
System online ROM flash component utility ................................................................................................. 34
SmartStart software ................................................................................................................................. 34
HP Insight Diagnostics.................................................................................................................... 35
Contents 3
Page 4
SmartStart software........................................................................................................................ 35
Server component identification.................................................................................................... 36
Front Panel Components........................................................................................................................... 36
Front Panel LEDs and Buttons ....................................................................................................................37
Rear Panel Components ........................................................................................................................... 38
Rear Panel LEDs ...................................................................................................................................... 39
System Board Components ....................................................................................................................... 40
NMI jumper.................................................................................................................................. 41
System Maintenance Switch............................................................................................................ 41
System LEDs and internal health LED combinations....................................................................................... 41
System Board LEDs .................................................................................................................................. 43
Hot-Plug SCSI IDs .................................................................................................................................... 44
Hot-plug SCSI hard drive LEDs ..................................................................................................................45
Specifications............................................................................................................................. 46
Server Specifications ............................................................................................................................... 46
Environmental specifications ..................................................................................................................... 47
Rack server specifications......................................................................................................................... 47
Hot-plug power supply calculations............................................................................................................ 48
DDR SDRAM DIMM specifications ............................................................................................................. 48
1.44-MB diskette drive specifications ......................................................................................................... 48
CD-ROM drive specifications .................................................................................................................... 49
Acronyms and abbreviations........................................................................................................ 51
Index......................................................................................................................................... 54
Contents 4
Page 5
Illustrated parts catalog
In this section
Mechanical Components........................................................................................................................... 5
System Components ................................................................................................................................. 6
Mechanical Components
Item Description Spare Part Number
1 Access panel, tower 365058-001
2 Access panel, rack* 371714-001
3 Tower bezel 365064-001
4 Rack bezel* 371752-001
5 Removable media blank 231212-001
6 SCSI Hard drive blank 319602-001
7 Hot-plug power supply blank 365059-001
8 Return kit (tower model)* 365060-001
9 Return kit (rack model)* 250189-001
*Not shown
Illustrated parts catalog 5
Page 6
System Components
Item Description Spare Part Number
10 Fan assembly, 120 mm 367637-001
11 3.0-V lithium battery 234556-001
12 Heatsink 366866-001
13 Processor
13a Intel® Xeon™ 3.00-GHz with 800-MHz system bus* 366864-001
13b Intel® Xeon™ 3.20-GHz with 800-MHz system bus* 373521-001
13c Intel® Xeon™ 3.40-GHz with 800-MHz system bus* 376069-001
14 Processor power module (PPM) 347884-001
15 Hot-plug power supply, 725-watt, 12-V 365063-001
16 Non hot-plug power supply with tray* 365220-001
17 System board with processor cage 365062-001
18 Hard drive cage with SCSI simplex backplane 366862-001
19 Non-hot-plug hard drive cage* 370782-001
20 Power supply backplane 365065-001
System Components
Boards
Mass Storage Devices
21 Diskette drive, 3-mode, 1.44-MB with USB 372058-001
22 CD-ROM drive, IDE, 48X 288894-001
Miscellaneous
Illustrated parts catalog 6
Page 7
Item Description Spare Part Number
23 Power switch 292236-001
24 Plastics kit* 250843-001
25 Country kit* 366859-001
Cables
26 Miscellaneous signal cable kit* 163353-001
27 AC power cable, 12 ft, 120-V* 187335-001
28 SCSI cable* 367168-001
29 SCSI point-to-point cable* 292232-001
Memory
30 512-MB DDR DIMM PC2700 370780-001
31 1-GB DDR DIMM PC2700* 367167-001
32 2-GB DDR DIMM PC2700* 367553-001
Options
33 Two-bay, hot-plug drive cage* 253761-001
34 Tower-to-rack conversion kit* 366861-001
35 Redundant system fan assembly 372213-001
36 Duplex SCSI backplane* 371722-001
37 Second Serial Port* 372657-001
38 Keyboard* 355630-001
39 Mouse* 344704-001
*Not shown
Illustrated parts catalog 7
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Removal and replacement procedures
In this section
Required Tools ......................................................................................................................................... 8
Safety considerations................................................................................................................................ 8
Preparation procedures........................................................................................................................... 10
Removing tower feet ............................................................................................................................... 13
Removing the front bezel (tower model) .................................................................................................... 13
Rack rails .............................................................................................................................................. 13
Removing the power supply blank............................................................................................................ 14
Hot-plug power supply............................................................................................................................ 14
Non-hot-plug power supply...................................................................................................................... 15
Hot-Plug Power Supply Backplane ............................................................................................................ 16
Removing a hard drive blank................................................................................................................... 17
Hot-Plug SCSI Hard Drive........................................................................................................................ 17
Non-hot-plug SCSI hard drive .................................................................................................................. 18
Redundant system fan ............................................................................................................................. 19
Expansion Slot Cover.............................................................................................................................. 20
Expansion board.................................................................................................................................... 20
CD-ROM drive ....................................................................................................................................... 21
Tape drive............................................................................................................................................. 22
Internal two-bay hot-plug SCSI drive cage ................................................................................................. 23
Processor and Heatsink........................................................................................................................... 24
PPM...................................................................................................................................................... 27
Second serial port .................................................................................................................................. 28
Duplex SCSI backplane .......................................................................................................................... 29
Battery .................................................................................................................................................. 29
System Board......................................................................................................................................... 30
Re-entering the server serial number and product ID ................................................................................... 31
Required Tools
You need the following items for some procedures:
• Torx T-15 screwdriver
• Diagnostics Utility
Safety considerations
Before performing service procedures, review all the safety information.
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Preventing electrostatic discharge
To prevent damaging the system, be aware of the precautions you need to follow when setting up the
system or handling parts. A discharge of static electricity from a finger or other conductor may damage
system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the
device.
To prevent electrostatic damage:
• Avoid hand contact by transporting and storing products in static-safe containers.
• Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.
• Place parts on a grounded surface before removing them from their containers.
• Avoid touching pins, leads, or circuitry.
• Always be properly grounded when touching a static-sensitive component or assembly.
Symbols on equipment
The following symbols may be placed on equipment to indicate the presence of potentially hazardous
conditions.
This symbol indicates the presence of hazardous energy circuits or electric shock
27.22 kg
60 lb
hazards. Refer all servicing to qualified personnel.
WARNING: To reduce the risk of injury from electric shock hazards, do not open
this enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.
This symbol indicates the presence of electric shock hazards. The area contains no
user or field serviceable parts. Do not open for any reason.
WARNING: To reduce the risk of injury from electric shock hazards, do not open
this enclosure.
This symbol on an RJ-45 receptacle indicates a network interface connection.
WARNING: To reduce the risk of electric shock, fire, or damage to the equipment,
do not plug telephone or telecommunications connectors into this receptacle.
This symbol indicates the presence of a hot surface or hot component. If this surface is
contacted, the potential for injury exists.
WARNING: To reduce the risk of injury from a hot component, allow the surface to
cool before touching.
This symbol indicates that the component exceeds the recommended weight for one
individual to handle safely.
WARNING: To reduce the risk of personal injury or damage to the equipment,
observe local occupational health and safety requirements and guidelines for manual
material handling.
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These symbols, on power supplies or systems, indicate that the equipment is supplied
by multiple sources of power.
WARNING: To reduce the risk of injury from electric shock, remove all power
cords to completely disconnect power from the system.
Rack warnings and cautions
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure
that:
• The leveling jacks are extended to the floor.
• The full weight of the rack rests on the leveling jacks.
• The stabilizing feet are attached to the rack if it is a single-rack installation.
• The racks are coupled together in multiple-rack installations.
• Only one component is extended at a time. A rack may become unstable if more than
one component is extended for any reason.
WARNING: To reduce the risk of personal injury or equipment damage when unloading
a rack:
• At least two people are needed to safely unload the rack from the pallet. An empty
42U rack can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft)
tall, and may become unstable when being moved on its casters.
• Never stand in front of the rack when it is rolling down the ramp from the pallet.
Always handle the rack from both sides.
WARNING: To reduce the risk of personal injury or damage to the equipment,
adequately stabilize the rack before extending a component outside the rack. Extend
only one component at a time. A rack may become unstable if more than one component
is extended.
WARNING: When installing a server in a telco rack, be sure that the rack frame is
adequately secured to the top and bottom of the building structure.
Preparation procedures
To access some components and perform certain service procedures, you must perform one or more of the
following procedures:
• Extend the server from the rack ("Extending the server from the rack" on page 11).
If you are performing service procedures in a Compaq branded rack, telco rack, or third-party rack
cabinet, you can use the locking feature of the rack rails to support the server and gain access to
internal components.
For more information about telco rack solutions, refer to the RackSolutions.com website
(http://www.racksolutions.com/hp
• Power down the server ("Powering down the server" on page 11).
If you must remove a server from a rack or a non-hot-plug component from a server, power down the
server.
• Remove the server from the rack ("Removing the server from the rack" on page 12).
If the rack environment, cabling configuration, or the server location in the rack creates awkward
conditions, remove the server from the rack.
).
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Powering down the server
WARNING: To reduce the risk of personal injury, electric shock, or damage to the
equipment, remove the power cord to remove power from the server. The front panel
Power On/Standby button does not completely shut off system power. Portions of the
power supply and some internal circuitry remain active until AC power is removed.
IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.
1. Shut down the operating system as directed by the operating system documentation.
2. Press the Power On/Standby button to place the server in standby mode. When the server activates
standby power mode, the system power LED changes to amber.
3. Disconnect the power cords.
The system is now without power.
CAUTION: Due to the high capacitance in the power supply, please wait 30 seconds after removing the
power cable before opening the access panel.
Extending the server from the rack
1. Loosen the thumbscrews that secure the server faceplate to the front of the rack.
IMPORTANT: If the server is installed in a telco rack, remove the server from the rack to access internal
components.
2. Extend the server on the rack rails until the server rail-release latches engage.
WARNING: To reduce the risk of personal injury or equipment damage, be sure that the
rack is adequately stabilized before extending a component from the rack.
WARNING: To reduce the risk of personal injury, be careful when pressing the server
rail-release latches and sliding the server into the rack. The sliding rails could pinch your
fingers.
3. After performing the installation or maintenance procedure, slide the server back into the rack:
a. Press the server rail-release latches and slide the server fully into rack.
b. Secure the server by tightening the thumbscrews.
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Access Panel
To remove the component from a rack server:
1. Power down the server ("Powering down the server" on page 11).
2. Remove the server from the rack ("Removing the server from the rack" on page 12).
3. Loosen the two thumbscrews on the front panel of the server near the access panel.
4. Slide the access panel back about 1.5 cm (0.5 in).
5. Lift and remove the access panel.
To remove the component from a tower server:
1. Power down the server ("Powering down the server" on page 11).
2. Remove the front bezel, if necessary ("Removing the front bezel (tower model)" on page 13).
3. Loosen the two thumbscrews on the front panel of the server near the access panel.
4. Slide the access panel back about 1.5 cm (0.5 in).
5. Lift and remove the access panel.
NOTE: Turn the access panel over to locate the System Configuration and Options hood labels. These
labels will provide information on installing various options, flexible memory configurations, LED status
indicators, and switch settings.
To replace the component, reverse the removal procedure.
Removing the server from the rack
To remove the server from an HP, telco, or third-party rack:
1. Power down the server ("Powering down the server" on page 11).
2. Loosen the front panel thumbscrews that secure the server faceplate to the front of the rack.
3. Disconnect the cabling and remove the server from the rack. Reverse the server installation steps in
the documentation that ships with the rack-mounting option.
4. Place the server on a sturdy, level surface.
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Removing tower feet
Remove the feet.
Removing the front bezel (tower model)
This server has a removable front bezel that must be unlocked and opened before accessing the hard
drive cage or removing the access panel. The door should be kept closed during normal server
operations.
Use the key provided with the server to unlock the bezel with a clockwise turn.
If necessary, remove the front bezel.
Rack rails
NOTE: This procedure applies to rack servers only.
To remove the component:
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1.
Use a flat-head screwdriver to lift the spring tab.
2. Slide the rail forward and remove it from the server.
3. Repeat steps 1 and 2 to remove other rail.
To replace the component, reverse the removal procedure.
Removing the power supply blank
Remove the thumbscrew that secures the redundant power supply blank, and then pull the blank from the
back of the server.
Hot-plug power supply
WARNING: To reduce the risk of electric shock, do not disassemble the power supply or
attempt to repair it. Replace it only with the specified spare part.
CAUTION: Do not attempt to remove and replace a power supply as a hot-plug procedure unless both
bays are populated with power supplies.
To remove the component:
1. Remove the power cord from the unit to be removed.
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2.
Push down on the power supply release latch, and remove the power supply from the server.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays
are populated with either a component or a blank.
To replace the component, reverse the removal procedure.
Non-hot-plug power supply
WARNING: To reduce the risk of personal injury or damage to the equipment, the
installation of power supplies should be performed only by individuals who are qualified
in servicing server equipment and trained to deal with products capable of producing
hazardous energy levels.
WARNING: To reduce the risk of electric shock, do not disassemble the power supply or
attempt to repair it. Replace it only with the specified spare part.
WARNING: To reduce the risk of personal injury from hot surfaces, observe the thermal
labels on each power supply or module.
WARNING: To reduce the risk of injury from electric shock hazards, do not open power
supplies. Refer all maintenance, upgrades, and servicing to qualified personnel.
CAUTION: Electrostatic discharge (ESD) can damage electronic components. Be sure that you are properly
grounded (earthed) before beginning any installation procedure.
To remove the component:
1. Remove the access panel ("Access Panel" on page 12).
2. Remove the power cord from the unit to be removed.
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3.
Remove the four screws from the chassis, and remove the power supply from the server.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays
are populated with either a component or a blank.
To replace the component, reverse the removal procedure.
Hot-Plug Power Supply Backplane
To remove the component:
1. Remove the power supplies from the server.
2. Remove the access panel ("Access Panel" on page 12).
3. Remove cables from the components connected to the power supply backplane.
4. Remove the power supply backplane.
To replace the component, reverse the removal procedure.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays
are populated with either a component or a blank.
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Removing a hard drive blank
To remove a hard drive blank, push the lever to release the blank and pull out.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays
are populated with either a component or a blank.
NOTE: Depending on model purchased, the server may look slightly different than shown.
Hot-Plug SCSI Hard Drive
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays
are populated with either a component or a blank.
To remove the component:
1. Back up all server data on the hard drive.
2. Open the front bezel ("Removing the front bezel (tower model)" on page 13).
3. Remove the hard drive.
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To replace the component, reverse the procedure.
Non-hot-plug SCSI hard drive
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays
are populated with either a component or a blank.
To remove the component:
1. Back up all server data on the hard drive.
2. Remove the access panel ("Access Panel" on page 12).
3. Disconnect the power cable and the four-device SCSI cable from the hard drive.
4. Remove screws from the hard drive bay, and remove the hard drive.
To replace the component:
1. Set the SCSI ID for the non-hot-plug SCSI hard drive. Refer to the documentation that ships with the
hard drive.
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2.
Install two screws on the side of the hard drive to ensure proper alignment inside the bay.
3. Replace the hard drive into the hard drive bay, and reinstall the screws.
4. Reconnect the power cable and the four-device SCSI cable to the hard drive.
5. Replace the access panel ("Access Panel" on page 12).
Redundant system fan
CAUTION: The redundant system fan is not hot-pluggable.
To remove the redundant system fan:
1. Remove the access panel ("Access Panel" on page 12).
2. Remove the redundant system fan cable from the redundant system fan header on the system board.
3. Remove the fan.
To replace the component, reverse the removal procedure.
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Expansion Slot Cover
To remove the component:
1. Remove the access panel ("Access Panel" on page 12).
2. Remove the expansion slot cover.
CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all PCI slots
have either an expansion slot cover or an expansion board installed.
To replace the component, reverse the removal procedure.
Expansion board
CAUTION: To prevent damage to the server or expansion boards, power down the server and remove all
AC power cords before removing or installing the expansion boards.
To remove the component:
1. Remove the access panel ("Access Panel" on page 12).
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2.
Remove the expansion board retainer.
3. Disconnect any internal or external cables from the expansion board.
4. Remove the expansion board.
5. Reinstall the expansion board retainer, then tighten the thumbscrew.
To replace the component, reverse the removal procedure.
CD-ROM drive
To remove the component:
1. Remove the access panel ("Access Panel" on page 12).
2. Disconnect the cables from the rear of the CD-ROM drive.
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3.
Push up on the release lever and push the drive partially out through the front of the server.
4. Remove the CD-ROM drive.
To replace the component, reverse the removal procedure.
Tape drive
To remove the component:
1. Remove the access panel ("Access Panel" on page 12).
2. Disconnect the data and power cables from the rear of the tape drive.
3. Push up on the release lever and push the drive partially out through the front of the server.
4. Remove the tape drive.
To replace the component, reverse the removal procedure.
IMPORTANT: HP recommends installing the tape drive on a separate SCSI cable to avoid a decrease in
performance on other SCSI devices.
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Internal two-bay hot-plug SCSI drive cage
To remove the component:
1. Remove the access panel ("Access Panel" on page 12).
2. Access the removable media cage.
3. Disconnect the SCSI and power cables.
4. Remove the drive cage from the chassis.
To replace the component, reverse the removal procedure.
IMPORTANT: Be sure that the unit identification numbers (0 and 1) appear on the right side of the drive
cage front panel.
Refer to the HP Internal Two-Bay Hot-Plug SCSI Drive Cage Installation Instructions for additional
information.
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Processor and Heatsink
IMPORTANT: If upgrading processor speed, update the system ROM before installing the processor.
IMPORTANT: PPM 2 must be installed when processor 2 is installed. The system fails to boot if the PPM is
missing.
To remove a processor and heatsink:
1. Remove the access panel ("Access Panel" on page 12).
2. Disconnect the heatsink connectors from the headers on the system board ("System Board
Components" on page 40).
3. Open the heatsink retaining levers.
4. Remove the heatsink.
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5.
Open the processor locking lever and remove the processor.
To replace the processor and heatsink:
1. Open the processor locking lever, if necessary.
2. Install the processor and close the processor locking lever.
CAUTION: Forcing the processor locking lever could lead to hardware damage.
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IMPORTANT: Do not remove the thermal tape from the bottom of the heatsink. Removing the tape will
affect the thermal solution and prevent the system from working properly.
3. Install the heatsink.
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4.
Close the processor retaining brackets.
5. Connect the heatsink connector to the correct header on the system board.
PPM
Item Description
1 CPU 1 heatsink header
2 CPU 2 heatsink header
6. Replace the access panel ("Access Panel" on page 12).
To remove the component:
1. Remove the access panel ("Access Panel" on page 12).
2. Open the latches on the PPM slot.
3. Install the PPM for processor 2 (if installing a second processor).
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NOTE: PPM 1 is embedded onto the system board.
NOTE: The appearance of compatible PPMs may vary.
To replace the component, reverse the removal procedure.
Second serial port
To remove the component:
1. Remove the access panel ("Access Panel" on page 12).
2. Open the retention clip securing the second serial port.
3. Remove the serial port cable from the serial port header on the system board.
4. Remove the second serial port option.
To replace the component, reverse the removal procedure.
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Duplex SCSI backplane
To remove the component:
1. Remove the access panel ("Access Panel" on page 12).
2. Remove the SCSI cable from the duplex SCSI backplane and from either the array controller or the
system board.
3. Remove the duplex SCSI backplane.
To replace the component, reverse the removal procedure.
Battery
If the server no longer automatically displays the correct date and time, you may need to replace the
battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years.
WARNING: The computer contains an internal lithium manganese dioxide, a vanadium
pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack
is not properly handled. To reduce the risk of personal injury:
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• Do not attempt to recharge the battery.
• Do not expose the battery to temperatures higher than 60°C (140°F).
• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or
water.
• Replace only with the spare designated for this product.
To remove the component:
1. Remove the access panel ("Access Panel" on page 12).
2. Remove the battery.
IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After
replacing the battery, reconfigure the system through RBSU.
To replace the component, reverse the removal procedure.
For more information about battery replacement or proper disposal, contact an authorized reseller or an
authorized service provider.
System Board
To remove the component:
1. Remove the access panel ("Access Panel" on page 12).
2. Remove the system fans ("Redundant system fan" on page 19).
3. Remove the processors and heatsinks ("Processor and Heatsink" on page 24).
4. Disconnect all cables connected to the system board.
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5.
Remove the four system board screws, and remove the system board.
To replace the component, reverse the removal procedure.
Re-entering the server serial number and product ID
After you replace the system board, you must re-enter the server serial number and the product ID.
1. During the server startup sequence, press the F9 key to access RBSU.
2. Select the Advanced Options menu.
3. Select Serial Number. The following warning is displayed:
Warning: The serial number should ONLY be modified by qualified service
personnel. This value should always match the serial number located on the
chassis.
4. Press the Enter key to clear the warning.
5. Enter the serial number.
6. Select Product ID. The following warning is displayed.
Warning: The Product ID should ONLY be modified by qualified service
personnel. This value should always match the Product ID located on the
chassis.
7. Enter the product ID and press the Enter key.
8. Press the Escape key to close the menu.
9. Press the Escape key to exit RBSU.
10. Press the F10 key to confirm exiting RBSU. The server will automatically reboot.
Removal and replacement procedures 31
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Diagnostic tools
In this section
Automatic Server Recovery...................................................................................................................... 32
HP Systems Insight Manager.................................................................................................................... 32
Integrated Management Log.................................................................................................................... 32
HP Instant Support Enterprise Edition ........................................................................................................ 33
Option ROM Configuration for Arrays...................................................................................................... 33
HP ProLiant Essentials Rapid Deployment Pack........................................................................................... 33
ROM-Based Setup Utility ......................................................................................................................... 34
ROMPaq utility....................................................................................................................................... 34
System online ROM flash component utility................................................................................................ 34
SmartStart software ................................................................................................................................ 34
Automatic Server Recovery
ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such
as a blue screen, ABEND, or panic. A system fail-safe timer, the ASR timer, starts when the System
Management driver, also known as the Health Driver, is loaded. When the operating system is
functioning properly, the system periodically resets the timer. However, when the operating system fails,
the timer expires and restarts the server.
ASR increases server availability by restarting the server within a specified time after a system hang or
shutdown. At the same time, the HP SIM console notifies you by sending a message to a designated
pager number that ASR has restarted the system. You can disable ASR from the HP SIM console or
through RBSU.
HP Systems Insight Manager
HP SIM is a web-based application that allows system administrators to accomplish normal administrative
tasks from any remote location, using a web browser. HP SIM provides device management capabilities
that consolidate and integrate management data from HP and third-party devices.
IMPORTANT: You must install and use HP SIM to benefit from the Pre-Failure Warranty for processors,
SCSI hard drives, and memory modules.
For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack or
the HP SIM website (http://www.hp.com/go/hpsim
).
Integrated Management Log
The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each
event with 1-minute granularity.
You can view recorded events in the IML in several ways, including the following:
• From within HP SIM ("HP Systems Insight Manager" on page 32)
Diagnostic tools 32
Page 33
•
From within Survey Utility
• From within operating system-specific IML viewers
• For NetWare: IML Viewer
• For Windows®: IML Viewer
• For Linux: IML Viewer Application
• From within HP Insight Diagnostics (on page 35)
For more information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack.
HP Instant Support Enterprise Edition
ISEE is a proactive remote monitoring and diagnostic tool to help manage your systems and devices, a
feature of HP support. ISEE provides continuous hardware event monitoring and automated notification to
identify and prevent potential critical problems. Through remote diagnostic scripts and vital system
configuration information collected about your systems, ISEE enables fast restoration of your systems.
Install ISEE on your systems to help mitigate risk and prevent potential critical problems.
For more information on ISEE, refer to the HP website
(http://www.hp.com/hps/hardware/hw_enterprise.html
).
To download HP ISEE, visit the HP website (http://www.hp.com/hps/hardware/hw_downloads.html
For installation information, refer to the HP ISEE Client Installation and Upgrade Guide
(ftp://ftp.hp.com/pub/services/hardware/info/isee_client.pdf
).
Option ROM Configuration for Arrays
Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign
RAID levels, and establish online spare configurations.
The utility also provides support for the following functions:
• Reconfiguring one or more logical drives
• Viewing the current logical drive configuration
• Deleting a logical drive configuration
• Setting the controller to be the boot controller
).
If you do not use the utility, ORCA will default to the standard configuration.
For more information regarding array controller configuration, refer to the controller user guide.
For more information regarding the default configurations that ORCA uses, refer to the HP ROM-Based
Setup Utility User Guide on the Documentation CD.
HP ProLiant Essentials Rapid Deployment Pack
The RDP software is the preferred method for rapid, high-volume server deployments. The RDP software
integrates two powerful products: Altiris Deployment Solution and the HP ProLiant Integration Module.
The intuitive graphical user interface of the Altiris Deployment Solution console provides simplified pointand-click and drag-and-drop operations that enable you to deploy target servers, including server blades,
remotely. It enables you to perform imaging or scripting functions and maintain software images.
For more information about the RDP, refer to the HP ProLiant Essentials Rapid Deployment Pack CD or
refer to the HP website (http://www.hp.com/servers/rdp
).
Diagnostic tools 33
Page 34
ROM-Based Setup Utility
RBSU, an embedded configuration utility, performs a wide range of configuration activities that may
include:
• Configuring system devices and installed options
• Displaying system information
• Selecting the primary boot controller
For more information on RBSU, refer to the HP ROM-Based Setup Utility User Guide on the Documentation
CD or the HP website (http://www.hp.com/servers/smartstart
ROMPaq utility
Flash ROM enables you to upgrade the firmware (BIOS) with system or option ROMPaq utilities. To
upgrade the BIOS, insert a ROMPaq diskette into the diskette drive and boot the system.
The ROMPaq utility checks the system and provides a choice (if more than one exists) of available ROM
revisions. This procedure is the same for both system and option ROMPaq utilities.
For more information about the ROMPaq utility, refer to the HP website
(http://www.hp.com/servers/manage
).
).
System online ROM flash component utility
The Online ROM Flash Component Utility enables system administrators to efficiently upgrade system or
controller ROM images across a wide range of servers and array controllers. This tool has the following
features:
• Works offline and online
• Supports Microsoft®, Windows® 2000, Windows® Server 2003, Novell Netware, and Linux
operating systems
IMPORTANT: This utility supports operating systems that may not be supported by the server. For
operating systems supported by the server, refer to the HP website (http://www.hp.com/go/supportos
• Integrates with other software maintenance, deployment, and operating system tools
• Automatically checks for hardware, firmware, and operating system dependencies, and installs only
the correct ROM upgrades required by each target server
To download the tool and for more information, refer to the HP website
(http://h18000.www1.hp.com/support/files/index.html
).
SmartStart software
SmartStart is a collection of software that optimizes single-server setup, providing a simple and consistent
way to deploy server configuration. SmartStart has been tested on many ProLiant server products,
resulting in proven, reliable configurations.
).
SmartStart assists the deployment process by performing a wide range of configuration activities,
including:
• Configuring hardware using embedded configuration utilities, such as RBSU and ORCA
• Preparing the system for installing "off-the-shelf" versions of leading operating system software
Diagnostic tools 34
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•
Installing optimized server drivers, management agents, and utilities automatically with every
assisted installation
• Testing server hardware using the Insight Diagnostics Utility ("HP Insight Diagnostics" on page 35)
• Installing software drivers directly from the CD. With systems that have internet connection, the
SmartStart Autorun Menu provides access to a complete list of ProLiant system software.
• Enabling access to the Array Configuration Utility, Array Diagnostic Utility, and Erase Utility
SmartStart is included in the HP ProLiant Essentials Foundation Pack. For more information about
SmartStart software, refer to the HP ProLiant Essentials Foundation Pack or the HP website
(http://www.hp.com/servers/smartstart
HP Insight Diagnostics
HP Insight Diagnostics is a proactive server management tool, available in both offline and online
versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify
server installations, troubleshoot problems, and perform repair validation.
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the
OS is not running. To run this utility, launch the SmartStart CD.
HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and
other related data needed for effective server management. Available in Microsoft® Windows® and
Linux versions, the utility helps to ensure proper system operation.
).
For more information or to download the utility, refer to the HP website
(http://www.hp.com/servers/diags
SmartStart software
SmartStart is a collection of software that optimizes single-server setup, providing a simple and consistent
way to deploy server configuration. SmartStart has been tested on many ProLiant server products,
resulting in proven, reliable configurations.
SmartStart assists the deployment process by performing a wide range of configuration activities,
including:
• Configuring hardware using embedded configuration utilities, such as RBSU and ORCA
• Preparing the system for installing "off-the-shelf" versions of leading operating system software
• Installing optimized server drivers, management agents, and utilities automatically with every
assisted installation
• Testing server hardware using the Insight Diagnostics Utility ("HP Insight Diagnostics" on page 35)
• Installing software drivers directly from the CD. With systems that have internet connection, the
SmartStart Autorun Menu provides access to a complete list of ProLiant system software.
• Enabling access to the Array Configuration Utility, Array Diagnostic Utility, and Erase Utility
SmartStart is included in the HP ProLiant Essentials Foundation Pack. For more information about
SmartStart software, refer to the HP ProLiant Essentials Foundation Pack or the HP website
(http://www.hp.com/servers/smartstart
).
).
Diagnostic tools 35
Page 36
Server component identification
In this section
Front Panel Components.......................................................................................................................... 36
Front Panel LEDs and Buttons ................................................................................................................... 37
Rear Panel Components .......................................................................................................................... 38
Rear Panel LEDs ..................................................................................................................................... 39
System Board Components...................................................................................................................... 40
System LEDs and internal health LED combinations ..................................................................................... 41
System Board LEDs................................................................................................................................. 43
Hot-Plug SCSI IDs ................................................................................................................................... 44
Hot-plug SCSI hard drive LEDs ................................................................................................................. 45
Front Panel Components
Item Description
1 Removable media bays (4)
2 Non-hot-plug SCSI hard drive bays (4)
3 Hot-plug SCSI hard drive bays (6)
4 System power button
5 UID button
6 Diskette drive
7 CD-ROM drive
Server component identification 36
Page 37
Front Panel LEDs and Buttons
Item Description Status
1 UID LED Blue = Activated
Flashing = System remotely managed
Off = Deactivated
2 Internal health LED Green = Normal
Amber = System degraded. Refer to system board LEDs to identify
component in degraded state.
Red = System critical. Refer to system board LEDs to identify
component in critical state.
Off = Normal (when in standby mode)
3
External health LED
(power supply)
Green = Normal
Red = Power redundancy failure
4 NIC activity LED Green = Network link
Flashing = Network link and activity
Off = No link to network. If power is off, view the rear panel RJ-45
LEDs for status.
5 Power LED On = Power
Amber = System off and power available
Off = No power
6 System power button
7 UID button
Server component identification 37
Page 38
Rear Panel Components
NOTE: Hot-plug power supply model shown. For non-hot-plug models, the power supply will look different.
Item Description
1 Power cord connector
2 Optional hot-plug redundant power supply bay
3 SCSI connector knockouts
4 PCI Express 4x (half length card), slot 1
5 PCI Express 8x (full length card), slot 2
6 64-bit 100-MHz PCI-X slot, bus 9, slot 3
7 64-bit 100-MHz PCI-X slot, bus 9, slot 4
8 64-bit 133-MHz PCI-X slot, bus 6, slot 5
9 64-bit 66-MHz PCI-X slot, bus 2, slot 6
10 RJ-45 Ethernet connector
11 USB 2.0 connectors (2)
12 Video connector
13 Parallel connector
14 Serial connector
15 Keyboard connector
16 Mouse connector
Server component identification 38
Page 39
Rear Panel LEDs
Location LED Status
1 Power supply LED Off = No power or inadequate power supply
Green = Power supply is on and functioning
2 UID LED Blue = Activated
Off = Deactivated
Flashing = Remote inquiry
3 10/100/1000
NIC link LED
4 10/100/1000
NIC standby LED
On = Link
Off = No Link
On = Standby
Off = Activity
Server component identification 39
Page 40
System Board Components
NOTE: PPM 1 is embedded onto the system board.
Item Description Item Description
1 Power supply connectors 15 64-bit 133-MHz PCI-X slot, bus 6
2 CPU 1 heatsink header 16 64-bit 100-MHz PCI-X slot, bus 9
3 Processor socket 1 17 64-bit 100-MHz PCI-X slot, bus 9
4 Processor socket 2 18 NMI jumper
5 Diskette drive connector 19 PCI Express x8 slot (full length card)
6
Primary IDE connector (ATAPI
20 PCI Express x4 slot (half length card)
devices)
7 CPU 2 heatsink header 21 System battery
8 Power button/LED connector 22 Redundant system fan header
9 Primary SCSI connector* 23 Rear fan connector
10 Secondary SCSI connector* 24 Serial port header
11 PPM 2 socket 25 DIMM slot 4
12 RILOE II connector (30-pin) 26 DIMM slot 3
13 System maintenance switch 27 DIMM slot 2
14 64-bit 66-MHz PCI-X slot, bus 2 28 DIMM slot 1
*For SCSI models only
Server component identification 40
Page 41
NMI jumper
The NMI jumper allows administrators to perform a memory dump before performing a hard reset. Crash
dump analysis is an essential part of eliminating reliability problems, such as hangs or crashes in
operating systems, device drivers, and applications. Many crashes freeze a system, requiring you to do a
hard reset. Resetting the system erases any information that would support root cause analysis.
Systems running Microsoft® Windows® operating systems experience a blue screen trap when the
operating system crashes. When this happens, Microsoft® recommends that system administrators
perform an NMI event by pressing a dump switch. The NMI event enables a hung system to become
responsive again.
System Maintenance Switch
Position Default Function
S1 Off Reserved
S2 Off
S3 Off Reserved
S4 Off Reserved
S5 Off Off = Power-on password is enabled.
S6 Off Off = No function
S7
S8
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase
all system configuration settings from both CMOS and NVRAM.
Off = System configuration can be
changed.
On = System configuration is locked.
On = Power-on password is disabled.
On = Clear NVRAM
Reserved
Reserved
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to properly
configure the server or data loss could occur.
System LEDs and internal health LED combinations
When the internal health LED on the front panel illuminates either amber or red, the server is experiencing
a health event. Combinations of illuminated system LEDs and the internal health LED indicate system
status.
The front panel health LEDs indicate only the current hardware status. In some situations, HP SIM may
report server status differently than the health LEDs because the software tracks more system attributes.
Server component identification 41
Page 42
System LED and Color
Internal Health
Status
LED Color
Processor failure,
socket X (Amber)
Red One or more of the following conditions may exist:
• Processor in socket X has failed.
• Processor in socket X failed over to the second processor.
• Processor X is not installed in the socket.
• Processor X is not supported.
• Processor heatsink is not attached properly.
Amber Processor in socket X is in a pre-failure condition.
Processor failure, both
Red Processor types are mismatched.
sockets (Amber)
PPM failure (Amber) Red • PPM has failed.
• PPM is not installed, but the corresponding processor is
installed.
DIMM failure, slot X
(Amber)
Red • DIMM in slot X has failed.
• DIMM in slot X is an unsupported type, and no valid
memory exists in another bank.
Amber
• DIMM in slot X has reached single-bit correctable error
threshold.
• DIMM in slot X is in a pre-failure condition.
• DIMM in slot X is an unsupported type, but valid memory
exists in another bank.
Overtemperature
(Amber)
Red
• The Health Driver has detected a cautionary temperature
level.
• The server has detected a hardware critical temperature
level.
Fan (Amber) Red
The minimum fan requirements are not being met. Fan has
failed.
Amber
A fan has failed but still meets the minimum fan requirements
(with redundant system fan option only).
Server component identification 42
Page 43
System Board LEDs
Item LED Description Status
1 AC power Off = No AC power or failed power supply
Green = Power supply is on and functioning
2
3 Processor 1 status Off = Processor 1 functioning
4
5
6 Processor 2 status Off = Processor 1 functioning
7 PPM 2 status Off = PPM 2 functioning
8
9
10 Rear fan status Off = Processor fan is functioning
11 DIMM 4 status Off = DIMM 4 functioning
12 DIMM 3 status Off = DIMM 3 functioning
13 DIMM 2 status Off = DIMM 2 functioning
Processor 1 fan
status
PPM 1 (embedded)
status
Processor 2 fan
status
Temperature
threshold
Redundant system
fan status
Off = Processor fan is functioning
Amber = Fan is not installed or has failed
Amber = Processor 1 failed
Off = PPM 1 functioning
Amber = PPM 1 failed
Off = Processor fan is functioning
Amber = Fan is not installed or has failed
Amber = Processor 1 failed
Amber = PPM 2 failed
Off = Normal
Amber = System temperature threshold
exceeded
Off = Fan is functioning
Amber = Redundant system fan has failed
Amber = Fan is not installed or has failed
Amber = DIMM 4 failed
Amber = DIMM 3 failed
Amber = DIMM 2 failed
Server component identification 43
Page 44
Item LED Description Status
14 DIMM 1 status Off = DIMM 1 functioning
Hot-Plug SCSI IDs
The server supports single- or dual-channel SCSI hard drive configurations. The single-channel
configuration (simplex) supports up to six SCSI hard drives on one channel. The dual-channel
configuration (duplex) supports two SCSI hard drives on one channel (SCSI IDs 4 and 5) and up to four
SCSI hard drives on the other channel (SCSI IDs 0 through 3) with the duplex option.
The SCSI IDs for both simplex and duplex configurations are illustrated. Always populate hard drive bays
starting with the lowest SCSI ID.
Amber = DIMM 1 failed
Item Description
1 Hot-plug SCSI hard drive cage
2 Non-hot-plug SCSI hard drive cage
Server component identification 44
Page 45
Hot-plug SCSI hard drive LEDs
Item LED description Status
1 Activity status On = Drive activity
Flashing = High activity on the drive or drive
is being configured as part of an array.
Off = No drive activity
2 Online status
3 Fault status On = Drive failure
On = Drive is part of an array and is
currently working.
Flashing = Drive is actively online.
Off = Drive is offline.
Flashing = Fault-process activity
Off = No fault-process activity
Server component identification 45
Page 46
Specifications
In this section
Server Specifications .............................................................................................................................. 46
Environmental specifications.................................................................................................................... 47
Rack server specifications........................................................................................................................ 47
Hot-plug power supply calculations .......................................................................................................... 48
DDR SDRAM DIMM specifications............................................................................................................ 48
1.44-MB diskette drive specifications........................................................................................................ 48
CD-ROM drive specifications ................................................................................................................... 49
Server Specifications
Specification Value
Dimensions
Height (with feet) 46.8 cm (18.43 in)
Depth (with bezel) 64 cm (25.2in)
Width 22 cm (8.66 in)
Weight (no drives installed) 27.22 kg (60 lb)
Models with a redundant
power supply
Input requirements
Rated input voltage 100 VAC to 240 VAC
Rated input frequency 47 Hz to 63 Hz
Rated input current 10 A (110 V) to 5 A (220 V)
Rated input power 893 W
BTUs per hour 3049
Power supply output
Rated steady-state power 725 W
Maximum peak power 725 W
Models with a Nonredundant power supply
Input requirements
Rated input voltage 100 VAC to 240 VAC
Rated input frequency 47 Hz to 63 Hz
Rated input current 7.8 A (110 V) to 3.9 A (220 V)
Rated input power 710 W
BTUs per hour 2425
Power supply output
Specifications 46
Page 47
Specification Value
Rated steady-state power 460 W
Maximum peak power 484 W
Acoustic Noise
Idle <6.5 and 48
Operating <6.5 and 48
Environmental specifications
Specification Value
Temperature range*
Operating 10°C to 35°C (50°F to 95°F)
Shipping -40°C to 70°C (-40°F to 158°F)
Maximum wet bulb temperature 28°C (82.4°F)
Relative humidity
(noncondensing)**
Operating 10% to 90%
Non-operating 5% to 95%
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to
3048 m (10,000 ft) is applicable. No direct sunlight allowed.
** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for
storage corresponds to a pressure minimum of 70 KPa.
Rack server specifications
Specification Value
Height 21.87 cm (8.61 in)
Depth (with bezel) 60.96 cm (24 in)
Width 48.26 cm (19 in)
Weight (no drives installed) 27.24 kg (60 lb)
Models with a redundant
power supply
Input requirements
Rated input voltage 100 VAC to 240 VAC
Rated input frequency 47 Hz to 63 Hz
Rated input current 10 A (110 V) to 5 A (220 V)
Rated input power 893 W
BTUs per hour 3049
Power supply output
Rated steady-state power 725 W
Maximum peak power 725 W
Models with a Nonredundant power supply
Specifications 47
Page 48
Specification Value
Input requirements
Rated input voltage 100 VAC to 240 VAC
Rated input frequency 47 Hz to 63 Hz
Rated input current 7.8 A (110 V) to 3.9 A (220 V)
Rated input power 710 W
BTUs per hour 2425
Power supply output Specification
Rated steady-state power 460 W
Maximum peak power 484 W
Hot-plug power supply calculations
For hot-plug power supply specifications and calculators to determine electrical and heat loading for the
server, refer to the HP Enterprise Configurator website (http://h30099.www3.hp.com/configurator/
DDR SDRAM DIMM specifications
).
NOTE: Use only 256-MB, 512-MB, 1-GB, 72-bit wide, 2.5-B, PC2100 Registered ECC DDR SDRAM. Use
Compaq branded or HP DDR SDRAM only.
Item Description
Size 256 MB, 512 MB, 1 GB, 2 GB
Width 72 bits
Upgrade requirement
Any combination of like-paired DDR SDRAM DIMMs
that provide a minimum of 512 MB
1.44-MB diskette drive specifications
Specification Value
Dimensions
Height 12.7 mm (0.5 in)
Width 96 mm (3.8 in)
Depth 130 mm (5.1 in)
LEDs (front panel) Green = On
Read/write capacity per
diskette
High density 1.44 MB
Low density 720 KB
Drives supported 1
Drive height One-third height
Drive rotation 300 rpm
Transfer rate
Specifications 48
Page 49
Specification Value
High 500 Kb/s
Low 250 Kb/s
Bytes/sector 512
Sectors per track (high/low) 18/9
Tracks per side (high/low) 80/80
Access times
Track-to-track (high/low) 3 ms/6 ms
Average (high/low) 169 ms/94 ms
Setting time 15 ms
Latency average 100 ms
Cylinders (high/low) 80/80
Read/write heads 2
CD-ROM drive specifications
Specification Value
Disk formats
Capacity 550 MB (mode 1, 12 cm)
Block size 2368, 2352 bytes (mode 0)
Dimensions
Height 12.7 mm (0.50 in)
Depth 132.08 mm (5.20 in)
Width 132.08 mm (5.20 in)
Weight 0.34 kg (0.75 lb)
Data transfer rate
Sustained 150 KB/s (sustained 1X), 1500/3600 KB/s (10X to 24X)
Burst 16.6 MB/s
Access times
(typical)
Full stroke 300 ms
Random 140 ms
Diameter 12 cm, 8 cm (4.70 in, 3.15 in)
Thickness 1.2 mm (0.05 in)
Track pitch 1.6 µm (6.3 × 10-7 in)
Cache/buffer 128 KB
Startup time < 10 s
Stop time < 5 s (single); < 30 s (multisession)
CD-ROM (modes 1 and 2); mixed mode (audio and data combined); CD-DA;
Photo CD (single/multiple-session), CD-XA ready; CDi ready
640 MB (mode 2, 12 cm)
2352, 2340, 2336, 2048 bytes (mode 1)
2352, 2340, 2336, 2048 bytes (mode 2)
Specifications 49
Page 50
Specification Value
Laser parameters
Type Semiconductor laser GaAs
Wave length 700 ± 25 nm
Divergence angle 53.5° ± 1.5°
Output power 0.14 mW
Operating
conditions
Temperature 5°C to 45°C (41°F to 118°F)
Humidity 5% to 90%
Specifications 50
Page 51
Acronyms and abbreviations
ABEND
abnormal end
ACU
Array Configuration Utility
ADU
Array Diagnostics Utility
ASR
Automatic Server Recovery
DDR
double data rate
DIMM
dual inline memory module
HD68
high density 68
IEC
International Electrotechnical Commission
iLO
Integrated Lights-Out
IML
Integrated Management Log
IPL
initial program load
IRQ
interrupt request
Acronyms and abbreviations 51
Page 52
ISEE
Instant Support Enterprise Edition
MPS
multi-processor specification
NEMA
National Electrical Manufacturers Association
NFPA
National Fire Protection Association
NIC
network interface controller
NMI
non-maskable interrupt
NVRAM
non-volatile memory
ORCA
Option ROM Configuration for Arrays
PCI Express
peripheral component interconnect express
PCI-X
peripheral component interconnect extended
PDU
power distribution unit
POST
Power-On Self Test
PPM
Processor Power Module
PSP
ProLiant Support Pack
Acronyms and abbreviations 52
Page 53
PXE
preboot eXecution environment
RBSU
ROM-Based Setup Utility
RILOE II
Remote Insight Lights-Out Edition II
SCSI
small computer system interface
SDRAM
synchronous dynamic RAM
SIM
Systems Insight Manager
TMRA
recommended ambient operating temperature
UID
unit identification
VHDCI
very high density cable interconnect
WOL
Wake-on LAN
Acronyms and abbreviations 53
Page 54
Index
A
access panel 12
Altiris Deployment Solution 33
Altiris eXpress Deployment Server 33
ASR (Automatic Server Recovery) 32, 51
Automatic Server Recovery (ASR) 32, 51
Autorun menu 34
B
battery 29
BIOS upgrade 34
buttons 36
C
cautions 10
CD-ROM drive 21, 36, 49
components 36
configuration of system 34
connectors 36
D
deployment software 33
diagnostic tools 32, 33, 34, 35
DIMM slot LEDs 45
DIMMs 48
diskette drive 36, 48
drive bays 36
drive LEDs 45
E
flash ROM 34
front bezel 13
front panel components 36
front panel LEDs 37
H
hard drive LEDs 45
hard drive, replacing 18
hard drives 18, 38, 45
health driver 32, 45
health LEDs 37, 45
hot-plug power supply 14
HP Insight Diagnostics 35
HP ProLiant Essentials Foundation Pack 32
HP ProLiant Essentials Rapid Deployment Pack 33
HP Systems Insight Manager, overview 32
I
illustrated parts catalog 5
IML (Integrated Management Log) 32
Insight Diagnostics 35
Integrated Management Log (IML) 32
internal health LED 36, 37
L
LEDs 36, 45
LEDs, hard drive 45
M
management tools 32
mechanical components 5
electrostatic discharge 9
environmental specifications 47
expansion boards 20
expansion slot covers 20
external health LED 36, 37
F
fan LED 45
fans 19
features 36
N
NIC (network interface controller) 52
NIC LEDs 36, 37
O
Online ROM Flash Component Utility 34
Option ROM Configuration for Arrays (ORCA) 33
ORCA (Option ROM Configuration for Arrays) 33
Index 54
Page 55
P
PCI Express 38
power LEDs, system 37
Power On/Standby button 11, 36, 37
power requirements 48
power supplies 15, 48
power supply blank 14
power supply output 48
powering down 11
PPM (Processor Power Module) 27
preparation procedures 10
processors 24
R
RBSU (ROM-Based Setup Utility) 34
redundant system fan 19
removal and replacement procedures 8
removing server from rack 12
removing the system board 30
ROM-Based Setup Utility (RBSU) 34
ROMPaq utility 34
S
safety considerations 8
server asset text 31
SmartStart autorun menu 34
SmartStart, overview 34
spare part numbers 5, 6
specifications 46, 48
specifications, server 46, 48
static electricity 9
support packs 34
symbols on equipment 9, 10
system board 30
system board battery 29
system components 6
system power LED 37
Systems Insight Manager 32
T
telco racks 10
tools 8, 32
U
UID LEDs 11, 36, 37, 38, 39
utilities 32, 33, 34, 35
Index 55
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