HP ProLiant ML330 Generation 3 Maintenance and Service Guide

HP ProLiant ML330 Generation 3 Server
Maintenance and Service Guide
April 2003 (First Edition)
Part Number 322375-001
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Microsoft®, Windows®, and Windows NT® are U.S. registered trademarks of Microsoft Corporation.
Intel® is a U.S. registered trademark of Intel Corporation.
Hewlett-Packard Company shall not be liable for technical or editorial errors or omissions contained herein. The information in this document is provided “as is” without warranty of any kind and is subject to change without notice. The warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty.
HP ProLiant ML330 Generation 3 Server Maintenance and Service Guide
April 2003 (First Edition) Part Number 322375-001
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Contents

About This Guide
Audience Assumptions............................................................................................................................... vii
Technician Notes........................................................................................................................................ vii
Where to Go for Additional Help.............................................................................................................. viii
Telephone Numbers............................................................................................................................ viii
Chapter 1
Illustrated Parts Catalog
Mechanical Components........................................................................................................................... 1-1
System Components.................................................................................................................................. 1-3
Chapter 2
Removal and Replacement Procedures
Safety Considerations................................................................................................................................ 2-1
Electrostatic Discharge Information ................................................................................................... 2-1
Rack Warnings and Cautions.............................................................................................................. 2-2
Server Warnings and Cautions............................................................................................................ 2-2
System Power Down ................................................................................................................................. 2-4
Front Bezel ................................................................................................................................................ 2-5
Bezel Blanks.............................................................................................................................................. 2-6
Access Panel.............................................................................................................................................. 2-7
Air Baffle................................................................................................................................................... 2-8
DIMMs ...................................................................................................................................................... 2-9
Processor and Heatsink/Fan Assembly ................................................................................................... 2-10
Processor Retention Brackets .................................................................................................................. 2-12
System Fan .............................................................................................................................................. 2-13
Power Supply .......................................................................................................................................... 2-15
Media Devices......................................................................................................................................... 2-16
Cable Routing Diagrams................................................................................................................... 2-16
CD-ROM Drive ................................................................................................................................ 2-19
Media Bay Drive Tray ...................................................................................................................... 2-20
Hard Drive Compartment ................................................................................................................. 2-21
Diskette Drive................................................................................................................................... 2-22
Hard Drives....................................................................................................................................... 2-23
Removable Media Bay Devices........................................................................................................ 2-28
Power Button/LED Assembly................................................................................................................. 2-29
SCSI Controller ....................................................................................................................................... 2-32
Expansion Slot Retainer.......................................................................................................................... 2-33
Battery ..................................................................................................................................................... 2-34
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Contents
System Board...........................................................................................................................................2-35
Chapter 3
Diagnostic Tools
Automatic Server Recovery-2....................................................................................................................3-1
Insight Manager 7 ......................................................................................................................................3-1
Integrated ATA RAID Configuration Utility (ATA models only)............................................................3-1
Integrated Management Log ......................................................................................................................3-2
Management Agents ..................................................................................................................................3-3
Option ROM Configuration for Arrays .....................................................................................................3-3
Power-On Self-Test ...................................................................................................................................3-3
ROM-Based Setup Utility..........................................................................................................................3-3
ROMPaq ....................................................................................................................................................3-4
SmartStart Software...................................................................................................................................3-4
SmartStart Autorun Menu ...................................................................................................................3-5
SmartStart Scripting Toolkit................................................................................................................3-5
Enterprise Diagnostics LX32 Utility................................................................................................... 3-5
Survey Utility.............................................................................................................................................3-6
System Online ROM Flash Utility.............................................................................................................3-6
Additional Information ..............................................................................................................................3-6
Chapter 4
Component Identification
Front Panel Components............................................................................................................................4-1
Front Panel LEDs.......................................................................................................................................4-2
Media Components....................................................................................................................................4-3
Rear Panel Components............................................................................................................................. 4-4
Rear Panel LEDs........................................................................................................................................4-5
System Board Components........................................................................................................................4-6
System Configuration Switch..............................................................................................................4-7
System ID Switch................................................................................................................................4-8
Jumper Settings ...................................................................................................................................4-8
System Board LEDs...................................................................................................................................4-9
SCSI Controller Components ..................................................................................................................4-10
SCSI Cable Components..........................................................................................................................4-11
ATA Cable Components.......................................................................................................................... 4-12
Chapter 5
Specifications
Server Unit.................................................................................................................................................5-1
Environmental Specifications ....................................................................................................................5-2
DIMMs.......................................................................................................................................................5-2
Diskette Drive............................................................................................................................................5-3
IDE CD-ROM Drive.................................................................................................................................. 5-3
ATA Hard Drives.......................................................................................................................................5-5
Wide Ultra3 SCSI Hard Drives..................................................................................................................5-6
NC7760 PCI Gigabit Server Adapter (Integrated/Embedded)...................................................................5-7
Integrated Single Channel Ultra3 SCSI Adapter ....................................................................................... 5-7
Integrated Dual Channel Ultra ATA/100 Adapter with Integrated ATA RAID 0, 1, and
1+0 (ATA Models) ....................................................................................................................................5-8
iv HP ProLiant ML330 Generation 3 Server Maintenance and Service Guide
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Index
Contents
HP ProLiant ML330 Generation 3 Server Maintenance and Service Guide v
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This maintenance and service guide can be used for reference when servicing the HP ProLiant ML330 Generation 3 server.
WARNING: To reduce the risk of personal injury from electric shock and hazardous energy levels, only authorized service technicians should attempt to repair this equipment. Improper repairs can create conditions that are hazardous.

Audience Assumptions

This guide is for service technicians. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazard in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations.

Technician Notes

WARNING: Only authorized technicians trained by HP should attempt to repair this equipment. All troubleshooting and repair procedures are detailed to allow only subassembly/module-level repair. Because of the complexity of the individual boards and subassemblies, no one should attempt to make repairs at the component level or to make modifications to any printed wiring board. Improper repairs can create a safety hazard.
WARNING: To reduce the risk of personal injury from electric shock and hazardous energy levels, do not exceed the level of repairs specified in these procedures. Because of the complexity of the individual boards and subassemblies, do not attempt to make repairs at the component level or to make modifications to any printed wiring board. Improper repairs can create conditions that are hazardous.
WARNING: To reduce the risk of electric shock or damage to the equipment:
Disconnect power from the system by unplugging all power cords from the power supplies.
Do not disable the power cord grounding plug. The grounding plug is an important safety feature.

About This Guide

Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all times.
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About This Guide
CAUTION: To properly ventilate the system, you must provide at least 7.6 cm (3.0 in) of clearance at the front and back of the server.
CAUTION: The computer is designed to be electrically grounded (earthed). To ensure proper operation, plug the AC power cord into a properly grounded AC outlet only.
NOTE: Any indications of component replacement or printed wiring board modifications may void any warranty.

Where to Go for Additional Help

In addition to this guide, the following information sources are available:
User documentation
Service Quick Reference Guide
Service training guides
Service advisories and bulletins
QuickFind information services
Insight Manager software

Telephone Numbers

For the name of the nearest HP authorized reseller:
In the United States, call 1-800-345-1518.
In Canada, call 1-800-263-5868.
For HP technical support:
In the United States and Canada, call 1-800-652-6672.
Outside the United States and Canada, refer to the HP website (
www.hp.com).
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Mechanical Components

1
Illustrated Parts Catalog
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Illustrated Parts Catalog
Table 1-1: Mechanical Components
Item Description Spare Part Number
1 Front bezel 324713-001
2 Access panel 307549-001
a) Hood panel (right)
b) Access panel (left)
3 Hardware kit 325036-001
a) Hard drive compartment
b) Media bay drive tray
c) Expansion board knockout
d) Hard drive screws
e) Processor retention brackets*
4 Miscellaneous plastics kit 176617-001
a) Air baffle
b) Expansion slot retainer*
c) Rubber bumpers*
d) Removable media bezel blank*
e) Cable clips*
f) Miscellaneous clamps*
g) LED shield*
Chassis
Miscellaneous
*Not shown
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System Components

Illustrated Parts Catalog
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Illustrated Parts Catalog
Table 1-2: System Components
Item Description Spare Part Number
5 IDE CD-ROM drive, 48X 288894-001
6 Diskette drive 233409-001
7 Hard drive
a) 36-GB Wide Ultra3 hard drive, 10K RPM (SCSI model) 177986-001
b) 40-GB ATA hard drive (ATA model)* 232008-001
c) 18-GB Wide Ultra3 hard drive, 10K RPM (SCSI model)* 152191-001
d) 80-GB ATA hard drive (ATA model)* 287685-001
e) 160-GB ATA hard drive (ATA model)* 326510-001
8 PC2100 ECC Registered DDR SDRAM DIMM
a) 128-MB* 301691-001
b) 256-MB 300699-001
c) 512-MB* 300700-001
d) 1-GB* 300701-001
9 System board, 533-MHz front side bus 324709-001
10 Integrated Single Channel Ultra3 SCSI adapter 324710-001
11 Intel Xeon processor
12 Heatsink/fan assembly 325035-001
13 System fan 324711-001
14 Power supply, 300 W, CE Mark-compliant 324714-001
15 CR2032 lithium battery 234556-001
16 Power cable kit 287181-001
a) Power button/LED assembly
b) Power shield cable*
c) Power extension cable*
Mass Storage Devices
Boards
a) 2.4-GHz*
b) 2.8-GHz
Fans and Power
325034-001
324708-001
*Not shown
continued
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Illustrated Parts Catalog
Table 1-2: System Components continued
Item Description Spare Part Number
17 Enhanced keyboard* 244000-001
a) European keyboard—UK* 244000-031
b) European keyboard—GR* 244000-041
c) European keyboard—FR* 244000-051
d) Spacesaver keyboard—JP* 244000-291
18 Signal cable kit* 253826-001
a) ATA ribbon cable assembly
b) Diskette drive cable assembly
c) CD cable assembly
19 Ultra3 SCSI cable* 289229-001
20 Rack enabling kit* 302569-001
21 Country kit* 308250-001
22 Return kit* 176621-001
*Not shown
Miscellaneous
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Removal and Replacement Procedures
To service the server, you might need the following:
Torx T-15 screwdriver ·
·
Flat-blade screwdriver
·
Phillips screwdriver
·
Diagnostics software from the SmartStart CD

Safety Considerations

Before performing service procedures, review all the safety information.

Electrostatic Discharge Information

2
An electrostatic discharge (ESD) can damage static-sensitive devices or microcircuitry. Proper packaging and grounding techniques are necessary precautions to prevent damage. To prevent electrostatic damage, observe the following precautions:
·
Transport products in static-safe containers such as conductive tubes, bags, or boxes.
·
Keep electrostatic-sensitive parts in their containers until they arrive at static-free stations.
·
Cover workstations with approved static-dissipating material. Use a wrist strap connected to the work surface, and properly grounded (earthed) tools and equipment.
·
Keep work area free of nonconductive materials, such as ordinary plastic assembly aids and foam packing.
·
Be sure that you are always properly grounded when touching a static-sensitive component or assembly.
·
Avoid touching pins, leads, or circuitry.
·
Always place drives with the Printed Circuit Board (PCB) assembly-side down.
·
Use conductive field service tools.
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Removal and Replacement Procedures

Rack Warnings and Cautions

WARNING: Because the rack allows stacking of computer components on a vertical rather than horizontal plane, be sure that precautions have been taken to provide for rack stability and safety. It is important to follow these precautions providing for rack stability and safety, and to protect both personnel and property. Heed all cautions and warnings throughout the installation instructions provided with the device.
WARNING: To reduce the risk of personal injury or damage to the equipment:
· Observe local occupational safety requirements and guidelines for heavy
equipment handling.
· Obtain adequate assistance to lift and stabilize the product during installation or
removal.
· Always load the heaviest item first, and load the rack from the bottom up. This
makes the rack bottom-heavy and helps prevent the rack from becoming unstable.
· Extend the leveling jacks to the floor.
· Rest the full weight of the rack on the leveling jacks.
· Attach the stabilizing feet to the rack if it is a single-rack installation.
· Couple the racks together in multiple-rack installations.
· Fully extend the bottom stabilizers on the equipment. Be sure that the equipment is
properly supported/braced when installing options and boards.
· Be sure that the rack is adequately stabilized before extending a component
outside the rack. Extend only one component at a time. A rack may become unstable if more than one component is extended for any reason.
· Do not attempt to move a fully loaded equipment rack. Remove equipment from the
rack before moving the rack.
· At least two people are needed to safely unload the rack from the pallet. An empty
42U rack weighs 115 kg (253 lb), is over 2.1m (7 ft) tall, and may become unstable when being moved on its casters. Do not stand in front of the rack as it rolls down the ramp from the pallet; handle it from the sides. Stabilize the device by keeping the unit on the rails.

Server Warnings and Cautions

Before installing a system, be sure that you understand the following warnings and cautions.
WARNING: To reduce the risk of personal injury or damage to the equipment, observe all warnings and cautions throughout this chapter.
WARNING: Do not exceed the level of repair specified in the procedures in the product documentation. All troubleshooting and repair procedures are detailed to allow only subassembly or module-level repair. Because of the complexity of the individual boards and subassemblies, do not attempt to make repairs at the component level or to make modifications to any printed wiring board. Improper repairs can create a safety hazard.
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Removal and Replacement Procedures
WARNING: Be sure that the AC power supply branch circuit that provides power to the rack is not overloaded. Not overloading AC power to the rack power supply circuit reduces the risk of personal injury, fire, or damage to the equipment. The total rack load should not exceed 80 percent of the branch circuit rating. Consult the electrical authority having jurisdiction over your facility wiring and installation requirements.
WARNING: To reduce the risk of personal injury or damage to the equipment, the installation of options other than hot-plug power devices should be performed only by individuals who are qualified in servicing computer equipment and trained to deal with products capable of producing hazardous energy levels.
WARNING: To reduce the risk of electric shock or damage to the equipment:
· Do not disable the power cord grounding plug. The grounding plug is an important
safety feature.
· Plug the power cord into a grounded (earthed) electrical outlet that is easily
accessible at all times.
· Unplug the power cord from the power supply to disconnect power to the
equipment.
· Do not route the power cord where it can be walked on or pinched by items placed
against it. Pay particular attention to the plug, electrical outlet, and the point where the cord extends from the system.
· Do not use conductive tools that could bridge live parts.
· Remove all watches, rings, or loose jewelry when working in hot-plug areas of an
energized device.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
CAUTION: Protect the device from power fluctuations and temporary interruptions with a
regulating uninterruptible power supply (UPS). This device protects the hardware from damage caused by power surges and voltage spikes, and keeps the system in operation during a power failure.
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Removal and Replacement Procedures

System Power Down

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the system. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.
CAUTION: Failure to follow these directions could result in damage to equipment or loss of
data.
IMPORTANT: If installing a hot-plug device, it is not necessary to power down the system.
To power down the server:
1. Back up the server data and record configuration information.
2. Shut down the operating system as directed in the operating system instructions.
3. Press the Power On/Standby button to place the server in standby mode. When the server acquires standby mode, the system power LED goes from green to amber.
4. After the system power LED is amber, disconnect the power cord.
5. Disconnect any other external equipment from the server.
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Front Bezel

To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Pull up on the bezel locking latch until it disengages.
3. Rotate the bezel upward and slide it away from the chassis. A small amount of force may
Removal and Replacement Procedures
CAUTION: To prevent equipment damage or data loss, be sure that the server is powered down, all cables are disconnected from the back of the server, and the power cord is disconnected from the grounded (earthed) AC outlet before removing the front bezel.
be necessary to detach the bezel.
To replace the component, reverse the removal procedure.
IMPORTANT: When replacing the front bezel, be sure to place the top hinge points in the chassis before rotating the front bezel downward to its original position.
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Removal and Replacement Procedures

Bezel Blanks

WARNING: To reduce the risk of personal injury and to prevent damage to the equipment, before removing the front bezel, be sure that the server is powered down, all cables are disconnected from the back of the server, and the power cord is disconnected from the grounded AC outlet.
NOTE: It is not necessary to remove a bezel blank when installing a hard drive into a removable media
bay.
To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the bezel blank:
a. On the back of the front bezel, press the tabs on each end of the bezel blank toward
each other.
b. Push the bezel blank through the front bezel.
To replace the component, reverse the removal procedure.
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Access Panel

NOTE: The interior of the access panel contains labels with information about the server system board.
To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel:
a. Remove the thumbscrew from the front left side of the chassis.
b. Slide the access panel forward.
Removal and Replacement Procedures
WARNING: To reduce the risk of injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
CAUTION: Do not operate the server for long periods without the access panel. Operating
the server without the access panel results in improper airflow and improper cooling that can lead to thermal damage.
c. Pull from the top of the access panel to remove it from the chassis.
To replace the component, reverse the removal procedure.
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Removal and Replacement Procedures

Air Baffle

To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Remove the air baffle.
To replace the component, reverse the removal procedure.
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DIMMs

Removal and Replacement Procedures
To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Remove the air baffle. Refer to “Air Baffle” in this chapter.
5. Remove the DIMM:
a. Press outward on both latches of the memory module socket at the same time to
release the DIMM and push it partially out of the socket.
b. Lift the memory module from the socket.
CAUTION: When handling a memory module, be careful not to touch any of the contacts. Doing so may damage the module.
CAUTION: Do not mix ECC and non-ECC SDRAM DIMMs. If different types of memory modules are mixed, the server does not properly function.
IMPORTANT: DIMMs must be industry-standard, ECC Registered PC2100 DDR SDRAM DIMMs and support CAS Latency 2.5 (CL=2.5).
NOTE: HP recommends that the DIMMs be installed sequentially in slots 1, 2, 3, and then 4.
To replace the component, reverse the removal procedure.
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Removal and Replacement Procedures

Processor and Heatsink/Fan Assembly

CAUTION: To reduce the risk of personal injury from hot surfaces, allow the internal server
components to cool before touching them.
To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Remove the air baffle. Refer to “Air Baffle” in this chapter.
5. Lay the server on the right side, so the open side faces up.
6. Disconnect the processor fan cable from the system board. For system board connectors, refer to Chapter 4, “Component Identification.”
7. Open the processor retaining clips.
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Removal and Replacement Procedures
8. Remove the heatsink/fan assembly.
9. Open the processor socket locking lever and remove the processor.
To replace the component, reverse the removal procedure.
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Removal and Replacement Procedures

Processor Retention Brackets

To remove the components:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Remove the air baffle. Refer to “Air Baffle” in this chapter.
5. Remove the processor and heatsink/fan assembly. Refer to “Processor and Heatsink/Fan Assembly” in this chapter.
6. Remove the processor retention brackets:
a. Remove the screws securing the bracket to the system board.
b. Lift the bracket off the system board.
To replace the component, reverse the removal procedure.
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System Fan

To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Remove the air baffle. Refer to “Air Baffle” in this chapter.
5. Disconnect the fan power cable from the system board fan connector.
Removal and Replacement Procedures
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Removal and Replacement Procedures
6. Remove the system fan:
a. Use a Torx T-15 screwdriver to remove the four mounting screws from the rear of the
server.
b. Pull the fan out and away from the chassis.
To replace the component, reverse the removal procedure.
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Power Supply

To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Remove the air baffle, as needed to access power supply connectors. Refer to “Air
Baffle” in this chapter.
5. Disconnect all power cables from the devices and system board.
Removal and Replacement Procedures
WARNING: To reduce the risk of electric shock or damage to the equipment:
· Unplug the power cord before removing the power supply from the server.
· Install the power supply before connecting the power cord to the power supply.
CAUTION: When sliding the power supply out of the chassis, use one hand to support the weight of the power supply.
6. Remove the power supply:
a. Remove the four screws securing the power supply to the rear of the chassis.
b. Slide the power supply forward.
c. Lift the power supply from the chassis.
To replace the component, reverse the removal procedure.
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Removal and Replacement Procedures

Media Devices

Cable Routing Diagrams

SCSI Device Cabling
NOTE: Air baffle removed for clarity.
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ATA Device Cabling
NOTE: Air baffle removed for clarity.
Removal and Replacement Procedures
Table 2-1: ATA Cabling Routing
Item Channel/Cable Cable Connector Drive Location
1 ATA/100 RAID primary
controller
2 ATA/100 RAID secondary
controller
3 ATA/100 RAID primary
controller
4 ATA/100 RAID secondary
controller
Device 0 Hard drive bay 2
Device 0 Media bay 3
Device 1 Hard drive bay 3
Device 1 Media bay 4
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Removal and Replacement Procedures
ATAPI Tape Drive Cabling
NOTE: Air baffle removed for clarity.
Table 2-2: ATAPI Tape Drive Cable Routing
Item Connector
1 Integrated IDE channel
2 Device 1
3 Device 0
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CD-ROM Drive

To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Remove the CD-ROM drive:
Removal and Replacement Procedures
a. Disconnect the cables from the rear of the drive. Refer to “Cable Routing Diagrams”
in this chapter.
b. Press the release latches.
c. Slide the drive out of the bay.
To replace the component, reverse the removal procedure.
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Removal and Replacement Procedures

Media Bay Drive Tray

NOTE: The drive trays in the removable media bays can be used to mount internal 3.5-inch devices.
The rails mounted inside the drive trays can be removed and used to mount other devices in the removable media bays.
To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Remove the drive tray:
a. Remove the screws that secure the drive tray on each side.
b. Gently slide the drive tray out of the chassis.
To replace the component, reverse the removal procedure.
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Hard Drive Compartment

To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Disconnect any cabling attached to the drives in the compartment. Refer to “Cable
Routing Diagrams” in this chapter.
5. Remove the drive compartment:
a. Remove the three shipping screws.
b. Press the tabs on each side of the drive compartment.
c. Pull the drive compartment out of the chassis.
Removal and Replacement Procedures
To replace the component, reverse the removal procedure.
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Removal and Replacement Procedures

Diskette Drive

To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Remove the hard drive compartment. Refer to “Hard Drive Compartment” in this chapter.
5. Remove the diskette drive:
a. Disconnect the cables from the rear of the drive. Refer to “Cable Routing Diagrams”
in this chapter.
b. Remove the four screws that secure the drive to the compartment.
c. Slide the drive out of the bay.
To replace the component, reverse the removal procedure.
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Hard Drives

Removal and Replacement Procedures
To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Disconnect any cabling attached to the drives in the compartment. Refer to “Cable
Routing Diagrams” in this chapter.
5. Remove the hard drive compartment. Refer to “Hard Drive Compartment” in this chapter.
6. Remove the hard drive:
a. Using a Phillips screwdriver, loosen the screws that secure the diskette drive.
b. Remove the two screws on each side of the hard drive to be removed.
c. Gently pull the hard drive out of the drive bay.
To replace the component, reverse the removal procedure.
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Removal and Replacement Procedures
ATA Drive Failure Scenarios
IMPORTANT: This section applies only to ATA models of the server.
When a drive fails:
Insight Manager notifies you of the drive failure. ·
· · If applicable to the operating system, the RAID status icon changes from green to red to
indicate that a problem exists. The icon is represented as a round figure wearing sunglasses and is located in the tray bar at the lower right of the screen.
Some operating systems also write to the console and/or a log file.
IMPORTANT: Some operating systems do not display the RAID status icon or the icon may display differently.
The following sections provide instructions for rebuilding an array when a drive fails.
RAID 0 Configurations
A drive failure in a RAID 0 configuration causes data loss across the entire array. To recover from a drive failure, the array must be rebuilt from scratch. To rebuild the array:
1. Determine the failed drive by viewing the information provided at Power-On Self Test (POST) and in the Integrated ATA RAID Configuration Utility by pressing the F8 key.
2. Replace the failed drive. Refer to “Hard Drives” in this chapter.
3. Reboot the server and configure the array using the menu options in the Integrated ATA RAID Configuration Utility by pressing the F8 key.
Refer to “Integrated ATA RAID Configuration Utility” in this chapter for information on the utility menu options.
RAID 1 Configurations
NOTE: This configuration is the only one where a spare pool configuration has any value. A spare provides a means by which a failed drive in a RAID 1 configuration can be rebuilt online.
In a RAID 1 configuration, use the following scenarios depending on whether an online spare is configured.
When an online spare is configured, the auto-rebuild process occurs without user intervention, removing the failed drive from the array and adding the spare to the array.
To reconfigure the online spare:
1. Replace the failed drive. Refer to “Hard Drives” in this chapter.
2. Run the Integrated ATA RAID Configuration Utility by pressing the F8 key.
3. Configure the drive as a spare.
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Removal and Replacement Procedures
When an online spare is not configured, you must rebuild the array.
To rebuild the array:
1. Replace the failed drive. Refer to “Hard Drives” in this chapter.
2. Reboot the server.
3. Use one of the following methods to rebuild the array:
— Run the Integrated ATA RAID Configuration Utility by pressing the F8 key, and
then run Rebuild.
— Let the auto-rebuild take place when the operating system is up and running.
Refer to “Integrated ATA RAID Configuration Utility” in this chapter for information on the utility menu options.
RAID 1+0 Configurations
NOTE: RAID 1+0, RAID 0+1, and RAID 10 are used synonymously. Four ATA hard drives are required to support a RAID 1+0 configuration.
In a RAID 1+0 situation, multiple drive failures can be handled as long as both elements of a mirror have not failed.
To rebuild the array:
1. Replace the failed drive. Refer to “Hard Drives” in this chapter.
2. Reboot the server.
3. Use one of the following methods to rebuild the array:
— Run the Integrated ATA RAID Configuration Utility by pressing the F8 key, and
then run Rebuild.
— Let the auto-rebuild take place when the operating system is up and running.
Refer to “Integrated ATA RAID Configuration Utility” in this chapter for information on the utility menu options.
Integrated ATA RAID Configuration Utility
The setup screen of the Integrated ATA RAID Configuration Utility has three menu windows:
Array Information ·
· · Physical Drive Information
Help Information
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Removal and Replacement Procedures
Array Information
The Array Information window of the setup screen displays all configured drive arrays. Use this section to create, delete, or edit the existing configurations. The window displays the drive arrays as a node in a tree, like Microsoft® Windows® Explorer. Open the node to display the properties of the array. Press the up arrow and down arrow keys to navigate the properties, and then press the Enter key to edit your selection.
CAUTION: Adding or removing drives from a configured array results in data loss.
Physical Drive Information
The Physical Drive Information window displays all the physical drives connected to the ATA/100 controller channels and the drive properties. Press the up arrow and down arrow keys to navigate this section. You cannot edit information in this window.
Help
The Help window displays hints on available options and provides a list of keys that you can use to perform tasks, such as:
Switch Windows (the Tab key)—toggles control back and forth between the Array
·
Information and the Physical Drive Information windows.
·
Auto Configure RAID 0 (the F1 key)—automatically creates and configures a striped array based on the available physical drives installed.
·
Auto Configure RAID 1 (the F2 key)—automatically creates and configures a mirrored array based on the available physical drives installed. You must have a minimum of two free hard drives in the array.
·
Auto Configure RAID 0+1 (the F3 key)—automatically creates and configures a RAID 0+1 array based on the available physical drives installed. You must have four hard drives in the array.
IMPORTANT: All previous settings are lost when the Auto Configure option is run for striped, mirrored, and RAID 0+1 arrays.
·
Create Array (the F4 key)—creates a drive array. When this option is selected, a default array template is created. You must edit the array properties to complete the array creation. Use the arrow keys to highlight a property field, and then press the Enter key to edit that property. The array properties are as follows:
Array Type—selects the intended RAID mode including RAID 0, RAID 1,
RAID 0+1, and Spare. The default for the Array Type option is RAID 0.
Drive(s)—selects the drives for the array. This term refers to the drive number listed
in the Physical Drives Information box, not the number of drives attached. Use the arrow keys, and then press the spacebar to select or deselect the drive or drives. Press the Enter key when done. No default exists for this setting.
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Removal and Replacement Procedures
Stripe Size—changes the stripe size. This field applies only to RAID 0 arrays. The
default stripe size is 64 KB.
IMPORTANT: RAID configurations do not support a stripe size less than 32 KB. You cannot change the stripe size of an array that has been configured already.
Drive Size—displays the size of the array and cannot be edited. If the array type is
stripe, then the drive size is the total of all the drives selected. When mirrored, the drive size is shown by an individual drive.
Build Array—rebuilds the array using a spare drive. When Build Array starts, the
utility prompts the user to select the target drive before rebuilding the array. This option applies only to RAID 1 and RAID 0+1 arrays.
Initialize Array—clears the configuration information from drives attached to the
integrated ATA controller.
Delete Array (the F5 key)—deletes a currently configured array. ·
· · Restore Old Configuration (the F6 key)—restores the configuration that existed before
you entered the utility.
Edit Options (the F7 key)—edits the physical drive option status boxes located in the top right corner of the Physical Drive Information window. The options are as follows:
WC-OFF—enables or disables write cache.
CAUTION: Enabling write cache may cause data loss or corruption during an unexpected loss of power.
DMA-ON—enables or disables Direct Memory Access (DMA) transfers, in which
data is transferred directly from the memory to the hard drive without microproccesor intervention.
Pressing the F7 key enables or disables these options. Press the F7 key, move the cursor to the desired box, and then press the spacebar to select the option. When enabled, the option status boxes change from red to green.
Save and Exit (the F10 key)—saves the configuration and exits the utility. ·
To exit the utility without saving the configuration or any changes, press the Esc key. Respond appropriately to the subsequent message boxes requiring confirmation.
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Removal and Replacement Procedures

Removable Media Bay Devices

To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Remove the air baffle, as needed to access cabling. Refer to “Air Baffle” in this chapter.
5. Disconnect any cabling attached to the drives in the compartment. Refer to “Cable Routing Diagrams” in this chapter.
6. Remove the media bay drive tray. Refer to “Media Bay Drive Tray” in this chapter.
7. Remove the device from the tray:
a. Remove the screws from the bottom of the device.
b. Lift the device from the tray.
To replace the component, reverse the removal procedure.
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Power Button/LED Assembly

To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Disconnect the power button cable from the system board.
NOTE: Air baffle removed for clarity.
Removal and Replacement Procedures
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Removal and Replacement Procedures
5. Remove the LED shield:
a. Press the locking levers.
b. Pull the shield away from the chassis.
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Removal and Replacement Procedures
6. Disengage the power button:
a. From the front of the chassis, squeeze the sides of the power button to disengage the
two retainer clips from the chassis.
b. Gently remove the power button from the chassis.
7. Disengage the LEDs:
a. Squeeze the sides of the LED to disengage the two retainer clips from the chassis.
b. Gently remove the LED from the chassis.
c. Repeat for the other LEDs.
To replace the component, reverse the removal procedure.
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Removal and Replacement Procedures

SCSI Controller

To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Remove the SCSI controller:
a. Disconnect the SCSI cable attached to the SCSI controller.
b. Remove the screw that secures the SCSI controller to the slot.
c. Slide the SCSI controller out of the slot.
IMPORTANT: Always install the SCSI controller in slot 1.
To replace the component, reverse the removal procedure.
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Expansion Slot Retainer

To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Disconnect any cabling attached to the drives in the compartment. Refer to “Cable
Routing Diagrams” in this chapter.
5. Remove the expansion slot retainer:
a. Loosen the screw.
b. Pivoting the retainer back towards the front of the chassis.
Removal and Replacement Procedures
To replace the component, reverse the removal procedure.
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Removal and Replacement Procedures

Battery

If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. Always use a battery from the approved spare parts list in Chapter 1, “Illustrated Parts Catalog.”
WARNING: The system board contains a lithium battery. A risk of fire and chemical burn exists if the battery is improperly handled. Do not disassemble, crush, puncture, or short external contacts, dispose of in water or fire, or expose the battery to temperatures higher than 60°C (140°F).
To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Locate the battery on the system board. Refer to Chapter 4, “Component Identification.”
NOTE: If you have expansion boards installed, it may be necessary to remove them to gain access to the battery.
5. Remove the battery:
a. Press outward on the latch at the top of the battery holder to release the battery.
b. Lift the battery away from the holder.
For more information about battery replacement or proper disposal, contact an authorized reseller or authorized service provider.
To replace the component, reverse the removal procedure.
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IMPORTANT: Positive (+) polarity must be positioned up.
IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration.
After replacing the battery, reconfigure the system through RBSU. Refer to the setup and installation guide.

System Board

To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Remove the air baffle. Refer to “Air Baffle” in this chapter.
5. Remove all DIMMs. Refer to “DIMMs” in this chapter.
6. Remove all processors. Refer to “Processor and Heatsink/Fan Assembly” in this chapter.
Removal and Replacement Procedures
7. Remove the SCSI controller (SCSI models). Refer to “SCSI Controller” in this chapter.
8. Remove all expansion boards.
9. Disconnect all cables from the system board.
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Removal and Replacement Procedures
10. Remove the system board:
a. Remove the seven screws securing the system board to the chassis.
b. Slide the system board toward the front of the server to clear the four alignment
standoffs.
c. Gently pull the system board out of the chassis.
To replace the component, reverse the removal procedure.
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Automatic Server Recovery-2

ASR-2 is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND (abnormal end), or panic. A system fail-safe timer, the ASR-2 timer, starts when the System Management driver, also known as the Health Driver, is loaded. When the operating system is functioning properly, the system periodically resets the timer. However, when the operating system fails, the timer expires and restarts the server.
ASR-2 increases server availability by restarting the server within a specified time after a system hang or shutdown. At the same time, the Insight Manager 7 console notifies you by sending a message to a designated pager number that ASR-2 has restarted the system. You can disable ASR-2 from the Insight Manager 7 console or through RBSU.

Insight Manager 7

3
Diagnostic Tools
Insight Manager 7 is a Web-based application that allows system administrators to accomplish normal administrative tasks from any remote location, using a Web browser. Insight Manager 7 provides device management capabilities that consolidate and integrate management data from HP and third-party devices.
For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack.

Integrated ATA RAID Configuration Utility (ATA models only)

Supports and configures RAID arrays. The features include:
Optimized drive access
RAID support before operating system loads
Automatic detection and configuration
Ability to handle configuration changes
Support for PIO modes 0-4, MDMA modes 0-2, and Ultra DMA modes 0-5 (0-5 for ATA/100)
Support for RAID levels 0, 1, and 1+0
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Diagnostic Tools
Multiple drive rebuilding
Special handling of error log, spare drive, and rebuilding
After all hard drives have been installed and connected, press the F8 key during startup to run the Integrated ATA RAID Configuration Utility and view the setup screen. ROM will automatically configure drives to RAID 0 if you do not run the F8 utility.
To turn off the Integrated ATA RAID Management:
In Microsoft operating systems, right-click on the tray icon and select Quit Spy.
In Novell operating systems, enter
In Linux operating systems, enter
Turning off this utility turns off the ability for online spares to be rebuilt if a drive failure occurs. You need to power up the server and rebuild the spare in the RAID Configuration Utility by pressing the F8 key.
To turn on the Integrated ATA RAID Configuration Utility:
In Microsoft operating systems, power up the server or log off the server and then log back on.
In Novell operating systems, enter
In Linux operating systems, enter

Integrated Management Log

The IML records hundreds of events and stores them in an easy-to-view form. The IML time stamps each event with 1-minute granularity.
You can view recorded events in the IML in several ways, including the following:
From within Insight Manager 7
Unload Spy at the console.
Spy-Stop at the prompt.
Load Spy at the console.
Spy-Start at the prompt.
From within Survey Utility
From within operating system-specific IML viewers
— For NetWare: IML Viewer
— For Windows: Event Viewer or IML Viewer
— For Linux: IML Viewer Application
From within Enterprise Diagnostics LX32 Utility
For more information, refer to the Servers Troubleshooting Guide on the Documentation CD, or the Management CD in the HP ProLiant Essentials Foundation Pack.
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Management Agents

The server is equipped with the latest Management Agents, allowing easy manageability of the server through Insight Manager 7 software, and third-party SNMP management platforms. Management agents monitor key subsystems that are instrumental in making health, configuration, and performance data available to the agent software. The agents act upon that data by initiating alarms in the event of faults. The agents also provide updated management information, such as network interface or subsystem performance statistics, to the management systems.
For additional information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack or refer to the HP website (
www.hp.com/servers/manage).

Option ROM Configuration for Arrays

Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign RAID levels, and establish online spare configurations.
The utility provides support for the following functions:
Diagnostic Tools
Configuring one or more logical drives using physical drives on one or more SCSI buses
Viewing the current logical drive configuration
Deleting a logical drive configuration
If you do not use the utility, ORCA will default to the standard configuration.
For more information about array controller configuration, refer to the HP ROM-Based Setup Utility User Guide on the Documentation CD.

Power-On Self-Test

POST is a series of diagnostic tests that checks firmware and assemblies to ensure that the server is functioning properly. This utility runs automatically every time the server is powered up.
For the normal power-up sequence and diagnosis of problems encountered during POST, refer to the setup and installation guide.

ROM-Based Setup Utility

RBSU performs a wide range of configuration activities, including the following:
Configuring server devices and installed options
Viewing server information
Selecting the operating system
Selecting the primary boot controller
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Diagnostic Tools

ROMPaq

To make selections within RBSU, use the following keys:
Access RBSU by pressing the F9 key when prompted during startup.
Use the arrow keys navigate through the menu system.
Make selections by pressing the Enter key.
Cancel selections by pressing the Esc key.
Save selections and changes by pressing the F10 key.
For information on RBSU not found in this guide, refer to the HP ROM-Based Setup Utility User Guide on the Documentation CD.
Flash ROM enables you to upgrade the firmware (BIOS) with system or option ROMPaq utilities. To upgrade the BIOS, insert a ROMPaq diskette into the diskette drive and boot the system.
The ROMPaq utility checks the system and provides a choice (if more than one exists) of available ROM revisions. This procedure is the same for both system and option ROMPaq utilities.
CAUTION: Do not power down during a firmware upgrade. A loss of power during upgrade may corrupt the firmware and prevent the server from starting.
For more information about the ROMPaq utility, refer to the HP website
www.hp.com/servers/manage).
(

SmartStart Software

The SmartStart CD is used to load the server software, thereby achieving a well-integrated server and ensuring maximum dependability and supportability. The SmartStart CD contains diagnostic utilities and ROMPaq tools.
SmartStart software enables you to:
Install selected server operating systems using packaged product CDs.
Install the latest optimized drivers.
Test server hardware using the new Enterprise Diagnostics LX32 Utility.
Update the latest system or option ROM using the ROM Update Utility.
Install software drivers directly from the CD. With systems that have internet connection, the SmartStart Autorun Menu provides access to the complete list of ProLiant System Software on the website.
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To install the SmartStart software:
1. Press the F9 key to run RBSU and configure the primary operating system.
2. Locate the SmartStart CD in the HP ProLiant Essentials Foundation Pack.
3. After you power up the server, press the CD-ROM drive eject button.
4. Insert the SmartStart CD into the CD-ROM drive with the labeled side up. Handle the CD
by its edges, not by the flat surfaces of the disc.
5. When the busy indicator turns green, the SmartStart sequence begins.
Refer to the SmartStart documentation included with the server to install the operating system, create updated driver diskettes, and run upgrade utilities.
For more information about SmartStart software, refer to the HP website
www.hp.com/servers/smartstart).
(

SmartStart Autorun Menu

The SmartStart Autorun Menu enables you to access the latest system software directly from the operating system environment, simply by inserting the SmartStart CD into a configured system. The Autorun Menu enables you to install the latest HP ProLiant Support Packs.
Diagnostic Tools

SmartStart Scripting Toolkit

The SmartStart Scripting Toolkit is a set of Microsoft MS-DOS®-based utilities that enables you to configure and deploy servers in a customized, predictable, and unattended manner. These utilities provide scripted server and array replication for mass server deployment and duplicate the configuration of a source server onto target systems with minimum user interaction.
For more information, and to download the SmartStart Scripting Toolkit, refer to the HP website (
www.hp.com/servers/sstoolkit).

Enterprise Diagnostics LX32 Utility

The Enterprise Diagnostics LX32 Utility displays information about the server hardware and tests the system to be sure that it is operating properly. To access the Enterprise Diagnostics LX32 Utility, refer to the SmartStart CD or refer to the HP website
www.hp.com/servers/manage).
(
For more information, refer to the Management CD in the HP ProLiant Essentials Foundation Pack.
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Diagnostic Tools

Survey Utility

Survey Utility gathers critical hardware and software information on servers running Microsoft Windows NT®, Novell NetWare, SCO OpenServer, or SCO UnixWare operating systems.
IMPORTANT: This utility supports operating systems that may not be supported by the server. For operating systems supported by the server, refer to the HP FTP site (ftp://ftp.compaq.com/pub/products/servers/os-support-matrix-310.pdf).
If a significant change occurs between data-gathering intervals, the Survey Utility marks the previous information and overwrites the Survey text files to reflect the latest changes in the configuration.
To install the Survey Utility, use the Management CD in the HP ProLiant Essentials Foundation Pack or refer to the HP website (

System Online ROM Flash Utility

The Online ROM Flash Utility enables system administrators to efficiently upgrade system or controller ROM images across a wide range of servers and array controllers. This tool has the following features:
www.hp.com/servers/manage).
Works offline and online
Supports Microsoft Windows NT, Windows 2000, Windows Server 2003, Novell
NetWare, and Linux operating systems
IMPORTANT: This utility supports operating systems that may not be supported by the server. For operating systems supported by the server, refer to the HP FTP site (ftp://ftp.compaq.com/pub/products/servers/os-support-matrix-310.pdf).
Integrates with other software maintenance, deployment, and operating system tools
Automatically checks for hardware, firmware, and operating system dependencies, and installs only the correct ROM upgrades required by each target server
To download the tool and for more information, refer to the HP website
www.compaq.com/support/ files/server/us/webdoc/rom/RemoteROMUser-001.pdf).
(

Additional Information

For detailed information about each of these diagnostic tools, refer to the Servers Troubleshooting Guide on the Documentation CD. For the most recent version of the guide,
refer to the HP website (
www.hp.com).
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Front Panel Components

4
Component Identification
Table 4-1: Front Panel Components
Item Description
1 CD-ROM drive eject button
2 Diskette drive eject button
3 Power On/Standby button
IMPORTANT: The Power On/Standby button does not remove all power from the system. The Standby mode removes power from most of the electronics and the drives, but portions of the power supply and some internal circuitry remain active. To remove power completely, refer to “System Power Down” in Chapter 2, “Removal and Replacement Procedures.”
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Component Identification

Front Panel LEDs

Table 4-2: Front Panel LEDs
Item LED Description Status
1 CD-ROM drive activity
2 Diskette drive activity
3 System power Green = Server is on.
4 Hard drive activity Green or flashing green = Hard drive
5 NIC link/activity Green = Network link exists.
6 Internal health Green = Server is powered up and server
On = Drive activity exists.
Off = No drive activity exists.
Amber = Server is in standby mode.
Off = Server is off; power cord is disconnected.
activity exists.
Off = No hard drive activity exists.
Flashing green = Network activity exists.
Off = No network link exists or server in standby.
health is good.
Amber = Server health is degraded; a pre-failure warning exists.
Red = Server health is critical; attention is required.
Off = Server is off; power cord is disconnected.
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Media Components

Component Identification
Table 4-3: Media Components
Item Description Location Dimensions
1 IDE CD-ROM drive Media bay 1
2 Available removable
media bay
3 Available removable
media bay
4 Available removable
media bay
5 Diskette drive Hard drive bay 1
6 Hard drive bay Hard drive bay 2
7 Hard drive bay Hard drive bay 3
Media bay 2
Media bay 3
Media bay 4
13.34 × 4.06 cm
(5.25 × 1.60 in)
8.90 × 2.54 cm
(3.5 × 1.0 in)
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Component Identification

Rear Panel Components

Table 4-4: Rear Panel Components
Item Description
1 Power connector
2 Mouse connector
3 Keyboard connector
4 Serial connector
5 Video connector
6 USB connectors
7 RJ-45 connector
8 Parallel connector
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Rear Panel LEDs

Component Identification
Table 4-5: Rear Panel LEDs
Item LED Description Status
1 Network activity Flashing green = Network activity exists.
Off = No network activity exists.
2 Network link Green = Network link exists.
Off = No network link exists.
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Component Identification

System Board Components

Table 4-6: System Board Components
Item Description Item Description
1 Power supply connectors 12 Remote Insight connector (30-pin)
2 DIMM slot 4 13 System configuration switch
3 DIMM slot 3 14 Expansion slot 4
4 DIMM slot 2 15 Expansion slot 3
5 DIMM slot 1 16 Expansion slot 2
6 Diskette drive connector 17 Expansion slot 1
7 IDE connector (ATAPI devices) 18 Processor fan connector 2
8 ATA/100 RAID primary connector 19 Processor socket 2
9 ATA/100 RAID secondary connector 20 Processor socket 1 (populated)
10 Power button assembly connector 21 System fan connector
11 System battery 22 Processor fan connector 1
Note: In SCSI model servers, the SCSI controller populates expansion slot 1.
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System Configuration Switch

CAUTION: Clearing nonvolatile RAM (NVRAM) deletes the system configuration. For
instructions on configuring the server, refer to the setup and installation guide.
Table 4-7: System Configuration Switch Settings
Position Default Description Status
1 Off Reserved
2 Off Lock configuration Off = Configuration can be changed
3 Off Tower/rack configuration Off = Tower configuration
4 Off Diskette boot Off = Server uses RBSU diskette boot
5 Off Password override Off = Password protection is active
6 Off Clear CMOS and NVRAM Off = No function
7 Off Reserved
8 Off Reserved
Component Identification
On = Configuration is locked
On = Rack configuration
selection
On = User can override RBSU diskette boot selection and boot from diskette
On = User can override password
On = Server configuration is erased at power-up
Note: Switch positions 1, 7, and 8 are reserved for authorized service providers only.
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Component Identification

System ID Switch

The system ID switch is reserved for use by authorized service providers only. Do not change the indicated default settings.

Jumper Settings

SCSI Device Jumper Settings
No two SCSI devices connected to the same SCSI controller can have the same SCSI ID. If another SCSI device is connected to the controller, check its SCSI ID before beginning the installation procedure for the additional device. Jumpers located on each device set the SCSI ID. For more information, refer to the SCSI device option documentation.
IDE Device Jumper Settings
When installing any IDE devices (ATA hard drives, ATAPI CD-ROM drives, or ATAPI tape drives), be sure that the jumper on the device is set to Cable Select (CS). This setting allows the cable to automatically assign the device ID of an IDE drive attached to the cable. For information on installing and cabling IDE devices, refer to the setup and installation guide.
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System Board LEDs

Component Identification
Table 4-8: System Board LEDs
Item LED Description Status
1 System fan failure Amber = The system fan has failed or is not installed.
Off = The system fan is functioning.
2 Processor 1 failure Amber = Processor 1 has failed or is not installed.
Off = Processor 1 is functioning.
3 Processor fan 1 failure Amber = Processor fan 1 has failed or is not installed.
Off = Processor fan 1 is functioning.
4 Processor power connector
not installed
5 Integrated PPM failure Amber = The PPM has failed.
6 DIMM 1 failure
7 DIMM 2 failure
8 DIMM 3 failure
9 DIMM 4 failure
10 Processor 2 failure Amber = Processor 2 has failed or is missing.
11 System overtemperature Amber = The temperature threshold has been exceeded.
Amber = Power connector is not installed.
Off = Power connector is installed.
Off = The PPM is functioning.
Amber = The DIMM is failed.
Off = The DIMM is functioning.
Off = Processor 2 is functioning.
Off = The temperature is normal.
continued
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Component Identification
Table 4-8: System Board LEDs continued
Item LED Description Status
12 Processor fan 2 failure Amber = Processor fan 2 has failed or is not installed.
Off = Processor fan 2 is functioning.
13 AC power Green = The power supply is attached to AC power.
Off = The AC power cord is not connected to the power supply, the power supply connector is not attached to the system board, or the power supply has failed.

SCSI Controller Components

The SCSI controller has a single SCSI connector to support the internal SCSI bus.
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SCSI Cable Components

Before performing SCSI cabling procedures, identify the SCSI cable components.
The SCSI cable supports up to five SCSI devices and comes with a terminator on the end. One cable is included with SCSI models of the server.
Component Identification
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Component Identification

ATA Cable Components

Before performing ATA cabling procedures, identify the ATA cable components.
The type of ATA cable that ships with the server supports up to two ATA devices. Two cables are included with ATA models of the server.
Table 4-9: ATA Cable Components
Item Description
1 Device 0 (primary)
2 Device 1 (secondary)
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Server Unit

Table 5-1: Server Unit Specifications
Specification Value
Dimensions
Approximate weight (depending on options) 18.18 kg (40 lb)
Input specifications
Output specifications
BTUs for tower model 935 BTU/hr (based on 274 W input)
Acoustic noise
5
Specifications
Height 42.7 cm (16.8 in)
Width 19.1 cm (7.5 in)
Depth 48.5 cm (19.1 in)
Rated input voltage 100 VAC to 199 VAC (U.S.)
200 VAC to 240 VAC (International)
Rated input frequency 50 Hz to 60 Hz
Rated input current 6 A (100 VAC to 199 VAC)
3 A (200 VAC to 240 VAC)
Input power (rated) 462 W
Rated steady-state power 300 W
Maximum peak power 400 W
Idle (hard drives spinning) 5.5 NPEL (Bels)/45 AVERAGE SPL (dba)
Operating (random seeks to hard drives) 6.0 NPEL (Bels)/45 AVERAGE SPL (dba)
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Specifications

Environmental Specifications

Table 5-2: Environmental Specifications
Specification Value
Temperature range*
Operating 50°F to 95°F (10°C to 35°C)
Shipping -40°F to 158°F (-40°C to 70°C)
Maximum wet bulb temperature 82.4°F (28°C)
Relative humidity (noncondensing)
Operating 10% to 90%
Non-operating 5% to 95%
* All temperature ratings shown are for sea level. The specification uses an altitude derating of 1°C per 300 m to 3,000 m (1.8°F per 1,000 ft to 10,000 ft).

DIMMs

Table 5-3: DIMM Specifications
Specification Value
Size 128 MB, 256 MB, and 512 MB, and 1 GB
Speed DDR 266 MHz
Type ECC Registered PC2100 DDR SDRAM DIMMs
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Diskette Drive

Table 5-4: 1.44-MB Diskette Drive Specifications
Specification Value
Size 8.89 cm (3.5 in)
LEDs (front panel) Green
Read/write capacity per diskette (high/low density)
Drives supported 1
Drive height Third, 1 inch
Drive rotation 300 rpm
Transfer rate bits/sec (high/low) 500 Kbps/250 Kbps
Bytes/sector 512
Sectors per rack (high/low) 18/9
Tracks per side (high/low) 80/80
Access times
Track-to-track (high/low) 3 ms/6 ms
Average (high/low) 94 ms/169 ms
Settling time 15 ms
Latency average 100 ms
Cylinders (high/low) 80/80
Read/write heads 2
Specifications
1.44 MB/720 KB

IDE CD-ROM Drive

Table 5-5: IDE CD-ROM Specifications
Specification Value
Applicable disk CD-ROM (modes 1 and 2); mixed mode (audio and data
combined); CD-DA; Photo CD (single- and multiple-session), CD-XA (mode 2, forms 1 and 2); CDI ready; CD-WO
Capacity 650 MB
Rotational speed 5,200 rpm
Block size 2,328 bytes (CD-XA)
2,340 bytes, 2,336 bytes, 1,024 bytes (mode 2)
2,048 bytes, 1,024 bytes (mode 1)
2,352 bytes (CD-DA)
continued
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Specifications
Table 5-5: IDE CD-ROM Specifications continued
Specification Value
Dimensions
Height 42.9 mm (1.69 in)
Width 208.0 mm (8.2 in)
Depth 150.1 mm (5.91 in)
Weight 0.950 kg (2.09 lb)
Data transfer rate
Sustained 150 KBps (single), 1,500 to 4,800 KBps (10X to 32X)
Burst 150 KBps to 4,800 KBps
Interface IDE (ATAPI)
Access times (typical)
Full stroke <150 ms
Random <100 ms
Diameter 12 cm, 8 cm (4.7 in, 3.15 in)
Center hole 15 mm (0.6 in)
Thickness 1.2 mm (0.05 in)
Track pitch
Cache/buffer 128 KB
Startup time <7 seconds
Stop time <4 seconds
Laser parameters
Type Semiconductor Laser GaA1As
Wave length
Divergence angle
Output power 0.14 mW
Operating conditions
Temperature
Humidity 5% to 90% (10% to 80%)
1.6 µm
780 ± 25 nm
53.5° ± 1.5°
5°C to 45°C (41°F to 113°F)
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Specifications

ATA Hard Drives

Table 5-6: ATA Hard Drive Specifications
Specification 40 GB 7.2K rpm 80 GB 7.2K rpm 160 GB 7.2K rpm
Capacity 40,020.0 MB 80,020.0 MB 160,040.0 MB
Height 26.1 mm (1.028 in) 26.1 mm (1.028 in) 26.1 mm (1.028 in)
Width 101.6 mm (4 in) 101.6 mm (4 in) 101.6 mm (4 in)
Interface Ultra ATA/100 Ultra ATA/100 Ultra ATA/100
Transfer rate synchronous (max) 100 MBps 100 MBps 100 MBps
Seek time (typical, including setting)
Single track 1.2 ms 3.0 ms 3.0 ms
Average
Full stroke
Rotational speed 7,200 rpm 7,200 rpm 7,200 rpm
Physical configuration
Logical blocks 78,165,360 156,301,488 312,581,808
Bytes/sector 512 512 512
Operating temperature
Celsius 5° to 55° 5° to 55° 5° to 55°
Fahrenheit 41° to 131° 41° to 131° 41° to 131°
<9.00 ms <9.00 ms <9.00 ms
<30.0 ms <30.0 ms <30.0 ms
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Specifications

Wide Ultra3 SCSI Hard Drives

Table 5-7: Wide Ultra3 SCSI Hard Drive Specifications
Specification 18.2 GB 10 K rpm 36.4 GB 10 K rpm
Capacity 18,209.3 MB 36,419.2 MB
Height 25.4 mm (1 in) 25.4 mm (1 in)
Width 101.6 mm (4.0 in) 101.6 mm (4.0 in)
Interface Wide Ultra3 SCSI Wide Ultra3 SCSI
Transfer rate synchronous (max) 160 MBps 160 MBps
Seek time (typical, including setting)
Single track 0.7 ms 0.7 ms
Average 5.4 ms 5.4 ms
Full stroke 11.0 ms 11.0 ms
Rotational speed 10,000 rpm 10,000 rpm
Physical configuration
Bytes/sector 512 512
Logical blocks 35,565,080 71,132,000
Operating temperature
Celsius 10° to 35° 10° to 35°
Fahrenheit 50° to 95° 50° to 95°
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Specifications

NC7760 PCI Gigabit Server Adapter (Integrated/Embedded)

Table 5-8: NC7760 PCI Gigabit Server Adapter (Integrated/Embedded) Specifications
Specification Value
Network interface 1000Base-T/100Base-TX/10Base-T
Compatibility IEEE 802.3am, 802.3u, 802.3
Data transfer method 32-bit, 33-MHz PCI bus master
Network transfer rate 10/100/1000 MBps
Connector RJ-45
Compliance PCI 2.2
OS support For specific OS support, refer to
www.hp.com/products/servers/platforms
Management support Wake-on-LAN (WOL), Pre-Boot eXecution
Environment (PXE)

Integrated Single Channel Ultra3 SCSI Adapter

Table 5-9: Integrated Single Channel Ultra3 SCSI Adapter Specifications
Specification Value
SCSI protocol Wide Ultra3 SCSI, Wide Ultra2 SCSI,
Wide Ultra SCSI-3, Fast-Wide SCSI-2, and Fast SCSI-2
Electrical protocol Low Voltage Differential (LVD)
Drives supported Up to 14 SCSI devices per channel
Data transfer method 64-bit/33-MHz PCI bus master
Maximum host bus transfer rate 267 MBps per channel
Maximum SCSI transfer rate 160 MBps per channel
Storage capacity Up to 1019.2 GB
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Specifications
Integrated Dual Channel Ultra ATA/100 Adapter with Integrated ATA RAID 0, 1, and 1+0 (ATA Models)
Table 5-10: Integrated Dual Channel Ultra ATA/100 Adapter Specifications
Specification Value
Protocol UDMA Mode (0-5)
PIO Mode (0-4)
Drives supported Up to 4 ATA (2 devices per channel)
Data transfer method 32-bit/33-MHz PCI bus-master
Maximum transfer rate per PCI Bus (peak) 133 MBps per channel
ATA 100 Cable 80-conductor cable
ATA channel transfer rate 100 MBps per channel
ATA connectors Two 40-pin connectors (primary and secondary)
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A
AC power LEDs 4-10 access panels
airflow caution 2-7 part number 1-2 removing and replacing 2-7
air baffle
part number 1-2 removing and replacing 2-8
ATA cable
assembly, part number 1-5
components 4-12 ATA cable routing 2-17 ATA devices
ID, setting 4-8
jumper settings 4-8 ATA drive failure scenarios 2-24 ATA ribbon cable assembly, part number 1-5 ATA/100 RAID connectors 4-6 ATAPI tape drive cabling 2-18 Automatic Server Recovery-2 (ASR-2) 3-1 Autorun Menu 3-5
B
baffle See air baffle battery
configuring system with RBSU 2-35
location 4-6
part number 1-4
removing and replacing 2-34 bays 4-3 bezel blank
part number 1-2
removing and replacing 2-6 buttons, locations 4-1

Index

cable routing diagrams
ATA cable routing 2-17 ATAPI tape drive cabling 2-18 SCSI cable routing 2-16
cables and cabling
ATA components 4-12 SCSI components 4-11
CD-ROM drive
bay dimensions 4-3 bay, locating 4-3 eject button 4-1 LED 4-2 part number 1-4
specifications 5-3 CE Mark-compliant power supply See power supply clamps, part number 1-2 compartment, hard drive
part number 1-2
removing and replacing 2-21, 2-22 component-level repairs vii components
ATA cable 4-12
front panel 4-1
mechanical 1-1
media 4-3
rear panel 4-4
SCSI cable 4-11
SCSI controller 4-10
system 1-3
system board 4-6 connectors
rear panel 4-4
system board 4-6 controllers, specifications
ATA 5-8
NIC 5-7
SCSI 5-7 country kit, part number 1-5
C
cable clips, part number 1-2
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D
devices, jumper settings 4-8
Index
diagnostic tools 3-1 diagnostics utility 2-1, 3-5 DIMM slots, location 4-6 DIMMs
part numbers 1-4 removing and replacing 2-9 specifications 5-2 types supported 2-9
diskette drive
cable assembly, part number 1-5 connector, system board 4-6 dimensions 4-3 eject button 4-1 LED 4-2 locating 4-3 part number 1-4
specifications 5-3 drive failure scenarios, ATA 2-24 drive tray See media bay drive tray
E
electrostatic discharge (ESD) 2-1 enhanced keyboard See keyboard Enterprise Diagnostics LX32 Utility 3-5 expansion board knockout, part number 1-2 expansion slot retainer
part number 1-2
removing and replacing 2-33 expansion slots, location 4-6
F
fan failure LEDs 4-9 fan, processor See heatsink/fan assembly fan, system
connector 4-6
part number 1-4
removing and replacing 2-12, 2-13 firmware, upgrading 3-4 flash ROM 3-4 floppy drive See diskette drive front bezel
part number 1-2
removing and replacing 2-5 front panel
components 4-1
LEDs 4-2
G
grounding viii grounding plug vii
H
hard drive
ATA, specifications 5-5 bays 4-3 LEDs 4-2 part number 1-4 removing and replacing 2-23 SCSI, specifications 5-6
hard drive compartment
part number 1-2
removing and replacing 2-21, 2-22 hardware kit, part number 1-2 heatsink/fan assembly
part number 1-4
removing and replacing 2-10 help viii HP authorized reseller viii humidity, specifications 5-2
I
IDE CD-ROM drive See CD-ROM drive IDE connector 4-6 IML 3-2 Insight Manager 7 3-1 Integrated ATA RAID Configuration Utility
Array Information window 2-26
exiting 2-27
features 3-1
Help window 2-26
overview 2-25
Physical Drive Information window 2-26 Integrated Management Log (IML) 3-2 internal health LED 4-2
J
jumpers
ATA devices 4-8
SCSI devices 4-8
K
keyboard
connector 4-4
part numbers 1-5 kits
country 1-5
hardware 1-2
plastics, miscellaneous 1-2
power cable 1-4
return 1-5
signal cable 1-5
tower-to-rack option 1-5
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Index
L
LED shield
part number 1-2 removing and replacing 2-30
LEDs
front panel 4-2 rear panel 4-5 system board 4-9
M
management agents 3-3 mechanical components 1-1 media bay drive tray
part number 1-2
removing and replacing 2-20 media bays See removable media bays media components 4-3 memory module See DIMMs miscellaneous plastics kit, part number 1-2 mouse connector 4-4
N
NIC
LEDs 4-2, 4-5
specifications 5-7
O
Online ROM Flash Component Utility 3-6 Option ROM Configuration for Arrays (ORCA) 3-3 overtemperature LEDs 4-9
P
parallel connector 4-4 part numbers
mechanical components 1-2
system components 1-4 plastics kit, miscellaneous 1-2 power button/LED assembly
connector 4-6
part number 1-4
removing and replacing 2-29 power cable kit, part number 1-4 power connector 4-4 power extension cable, part number 1-4 Power On/Standby button 4-1 power shield cable, part number 1-4 power supply
part number 1-4
removing and replacing 2-15
weight caution 2-15 power supply connectors, system board 4-6
power switch See power button/LED assembly;
Power On/Standby button powering down the server 2-4 Power-On Self-Test 3-3 processor
part number 1-4
removing and replacing 2-10 processor failure LEDs 4-9 processor fan See heatsink/fan assembly processor fan connectors 4-6 processor power connector LEDs 4-9 processor retention brackets
part number 1-2
removing and replacing 2-12 processor sockets, location 4-6
R
rack warnings 2-2 rear panel
components 4-4
LEDs 4-5 Remote Insight connector 4-6 removable media bay devices, removing and
replacing 2-28
removable media bays
dimensions 4-3
locating 4-3 removable media bezel blank, part number 1-2 removing and replacing
access panel 2-7
air baffle 2-8
battery 2-34
bezel blank 2-6
DIMMs 2-9
expansion slot retainer 2-33
fan, system 2-13
front bezel 2-5
hard drive compartment 2-21, 2-22
hard drives 2-23
heatsink/fan assembly 2-10
LED shield 2-30
media bay drive tray 2-20
power button/LED assembly 2-29
power supply 2-15
processor 2-10
processor retention brackets 2-12
removable media bay devices 2-28
system board 2-35
system fan 2-13 resources viii, 3-6 return kit, part number 1-5 RJ-45 connector 4-4 ROM flashing 3-4 ROM-Based Setup Utility (RBSU) 3-3
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Index
ROMPaq Utility 3-4 rubber bumpers, part number 1-2
S
safety considerations 2-1 SCSI cable components 4-11 SCSI controller
components 4-10 part number 1-4 specifications 5-7
SCSI devices
jumper settings 4-8
setting the ID 4-8 SCSI ID, setting 4-8 serial connector 4-4 server warnings 2-2 shipping temperatures 5-2 signal cable kit, part number 1-5 slots, locations 4-6 SmartStart
installing 3-5
overview 3-4 SmartStart Autorun Menu 3-5 SmartStart Scripting Toolkit 3-5 specifications
CD-ROM drive 5-3
DIMMs 5-2
diskette drive 5-3
hard drives 5-5
NIC 5-7
server unit 5-1
Ultra ATA/100 controller 5-8
Ultra3 SCSI controller 5-7
Wide Ultra3 SCSI hard drive 5-6 support packs 3-5 Survey Utility 3-6 switches
system configuration 4-7
system ID 4-8 system battery See battery system board
components 4-6
LEDs 4-9
part number 1-4
removing and replacing 2-35 system components 1-3
system configuration switch
location 4-6 settings 4-7
system fan
connector 4-6 part number 1-4
removing and replacing 2-13 system ID switch 4-8 system power down 2-4 system power LED 4-2
T
technician notes vii telephone numbers viii temperature, specifications 5-2 tools, required for service procedures 2-1 tower-to-rack option kit, part number 1-5 troubleshooting, hard drive failure 2-24
U
Ultra ATA/100 controller, specifications 5-8 Ultra3 SCSI cable, part number 1-5 Ultra3 SCSI controller, specifications 5-7 USB connectors 4-4 utilities
Enterprise Diagnostics LX32 3-5
Integrated ATA RAID Configuration 3-1
RBSU 3-3
ROMPaq 3-4
SmartStart 3-4
SmartStart Scripting Toolkit 3-5
Survey 3-6
V
ventilation clearances viii video connector 4-4
W
warranty viii Wide Ultra3 SCSI hard drive, specifications 5-6
Index-4 HP ProLiant ML330 Generation 3 Server Maintenance and Service Guide
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