HP ProDesk 485 G1 Disassembly Instructions Manual
Product End-of-Life Disassembly Instructions
Product Category:
Personal Computers
Marketing Name / Model
1.0 Items Requiring Selective Treatment
Quantity
Printed Circuit Boards (PCB) or Printed Circuit
With a surface greater than 10 sq
cm 2
Batteries
All types including standard alkaline and lithium coin
1 Mercury
-
containing components
For example, mercury in lamps, display backlights,
Liquid Crystal Displays (LCD) with a surface greater
Includes background
illuminated displays with gas
Cathode Ray Tubes (CRT)
Capacito
rs / condensers (Containing PCB
/PCT)
Electrolytic Capacitors / Condensers measuring
5 External electrical cables and cords
Power cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
Components and parts containing toner and ink,
Include the cartridges, print heads, tubes, vent
Components and waste containing asbestos
[List multiple models if applicable.]
HP ProDesk 485 G1 Microtower Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Assemblies (PCA)
or button style batteries
scanner lamps, switches, batteries
than 100 sq cm
greater than 2.5 cm in diameter or height
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
including liquids, semi-liquids (gel/paste) and toner
discharge lamps
chambers, and service stations.
of items
included
in product
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Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
Tool Description
Tool Size (if
Screw driver
T-15 M
icro shear
YN-3
Screw driver
PH1
Description #4
Description #5
3.0 Product Disassembly Process
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
applicable)
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel. (see Figure 1-3)
2. Remove front bezel. (see Figure 4)
3. Disconnect cooler cable then remove the cooler from board. (see Figure5-7)
4. Disconnect 24 pin power cable、SATA cable、SATA power cable、CPU power cable. (see Figure 8-11)
5. Remove the ODD and HDD from chassis (see Figure 12-16)
6. Disconnect the MCR cable from board then remove the MCR. (see Figure 17-19)
7. Disconnect system fan cable then remove the system fan from chassis (see Figure 20-22)
8. Disconnect FIO cables and open the cable clip. (see Figure 23-24)
9. Remove the FIO module from chassis. (see Figure 25-26)
10. Disconnect PWR cable then remove it from chassis. (see Figure 27-28)
11. Disconnect speaker cable then remove it from chassis. (see Figure 29-31)
12. Remove the Memory from chassis. (see Figure 32)
13. Remove the battery from the board. (see Figure 33)
14. Remove Mother board from chassis. (see Figure 34-36)
15. Remove the I/O shielding from chassis. (see Figure 37)
16. Remove the PSU from chassis. (see Figure 38&39)
17. Remove the PSU chassis and remove the PSU board.. (see Figure 40-43)
18. Remove the Electrolytic Capacitors from PSU board. (see Figure 44-50)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure1 Loose
the two screws
from access panel
Figure2
Slide the access panel back
Figure3 R
otate the top of the panel
away
to remove it
Figure4 Pull the 3 hooks and r
otate
to remove the front
bezel
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure5 Disconnect the cooler cable from MB
Figure6 Loose 4 screws from cooler and remove it
Figure7 Remove the cooler from board
Figure8 Disconnect the SATA cables form board
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Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure1
1 Disconnect
the SATA and power cables from
Figure9 Disconnect the CPU power cable from board
ODD
Figure10 Disconnect the 24pin power cable from MB
Figure12 Loose the ODD screws
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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