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Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP ProDesk 480 G3 MT Business PC
1.0 Items Requiring Selective Treatment
Quantity
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB /PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
6
External electrical cables and cords
Power cord
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
already listed as a separate item above)
Cooler fan 81g,system fan 99g,PSU fan 67g
247g
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Product End-of-Life Disassembly Instructions
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within t he product which require selective treatment in the right column, as
applicable.
Item Description Notes
weighing > 25 grams (not including PCBs or PCAs
of items
included
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Page 2
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point whe re components
Tool Description
Tool Size (if
applicable)
Screw driver
T-15
Micro shear
YN-3
Screw driver
PH2
Description #4
Description #5
3.0 Product Disassembly Process
and materials requiring selective treatment can be removed.
3.1 List the basic steps that should typically be f oll owed to remove components and materials requiring selective treatment:
1. Remove access panel. (see Figure 1-2)
2. Remove front bezel. (see Fi gure 3)
3. Disconnect cooler cable then remove the cooler from board. (see Figure4-5)
4. Remove the HDD (see Figure 6-8)
5. Remove the Slim ODD (see Figure 9-10)
6. Unplug all cable conn. from PCA. (see Figure 11)
7. Remove the PCA(see Figure 12-13)
8. Remove the DIMM. (see Figure 14)
9. Remove the CPU. (see Figure 15-16)
10. Remove the Battery. (see Figure 17)
11. Remove the FIO module from chassis. (see Figure 18-19)
12. Remove the PWR_LED switch cable from cha ssis. (see Figure 20-21)
13. Remove the SD card reader from chassis. (see Figure 22-23)
14. Remove the speaker from chassis. (see Figure 24-25)
15. Remove Sys fan from chassis. (see Figure 26-27)
16. Remove the PSU from chassis. (see Figure 28-29)
17. Remove the PSU chassis and remove the PSU board. (see Figure 30-39)
18. Remove the Electrolytic Capacitors from PSU board. (see Figure 40-54)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the item s
contained in the product that require selective t reatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Page 3
Figure1 Release Thumb screw on the access panel.
Figure2 Griping the tab at the end of access panel, pull
Figure3 Pull 3 pcs bezel hooks and remove the front bezel
Figure4 Unplug the cooler cable from PCA
Figure5 Release 4 screws from cooler and remove i t
Figure6 Disconnect the SATA and power cables from
towards the rear and remove from unit.
from chassis.
HDD
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Page 4
Figure7 Release the HDD screws
Figure8 Remove the HDD form chassis
Figure9 Push the latch and release the Slim ODD.
Figure10 Remove the Slim ODD form chassis.
Figure11 Unplug all cable conn. from PCA.
Figure12 Release 8 pcs screws from PCA
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Page 5
Figure13 Remove PCA from chassis
Figure14 Push the hooks on both sides and then pick up
the memory
Figure15 Rotate the handle and open it up
Figure16 Remove the CPU from board
Figure17 Remove the battery from the PCA
Figure18 Release the screw of the FIO cable
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Page 6
Figure19 Rotation and Remove the FIO module from
chassis
Figure20 Push the plastic hook.
Figure21 Remove the PWR_LED switch from chassis
Figure22 Release 1 pcs screw of speaker
Figure23 Remove the speaker form chassis
Figure24 Release the SD card reader screw
EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Page 7
Figure25 Remove the SD Card reader from chassis
Figure26 Release 2 pcs screws from system fan.
Figure27 Remove the system fan from chassis
Figure28 Release 4 pcs screws of PSU and remove it
Figure29 Pull up the PSU and remove it
Figure30 Cut the cable tie
EL-MF877-00 Page 7
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Page 8
Figure31 Remove screw for bottom
Figure32 Remove screw for top
Figure33 Remove FG screw
Figure34 Disconnect fan connector
Figure35 Remove LED holder
Figure36 Remove plastic cover
EL-MF877-00 Page 8
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Page 9
Figure37 Remove PCB screw
Figure38 Remove AC inlet screw
Figure 39 Cut output cable, AC inlet wire, LED wire
Figure40 Remove capacitors use solder iron
Figure41 Heat the solder of Electrolytic Capacitors
Figure42 Heat the solder of Electrolytic Capacitors greater
C801
C151
C303
C951
greater than 2.5cm in diameter or height and remove i t.
(C801,C151,C303,C951) (Gamay-S 300W APFC-Delta)
than 2.5cm in diameter or height and remove it.
(C801 ,C951) (Crasto-S 180W E-Star6-Delta)
EL-MF877-00 Page 9
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Page 10
Figure43 Heat the solder of Electrolytic Capacitors
greater than 2.5cm in diameter or height and remove i t.
Figure44 Heat the solder of Electrolytic Capacitors greater
Figure45 Heat the solder of Electrolytic Capacitors
Figure46 Heat the solder of Electrolytic Capacitors greater
Figure47 Heat the solder of Electrolytic Capacitors
Figure48 Heat the solder of Electrolytic Capacit ors greater
(C801) (Ortega 180W ATX bronze-Delta)
than 2.5cm in diameter or height and remove it.
(C1,C6) (Gamay-S 300W APFC_AcBel)
greater than 2.5cm in diameter or height and remove it
(C1,C6,C19) (Gamay-S 300W Bronze_AcBel)
greater than 2.5cm in diameter or height and remove it.
(C6,C19) (Crasto-S 180W Bronze_AcBel)
than 2.5cm in diameter or height and remove it.
(C6,C19) (Crasto-S 180W APFC_AcBel)
than 2.5cm in diameter or height and remove it.
(C6,C19,C57,C13) (Ortega 180W Bronze_AcBel)
EL-MF877-00 Page 10
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Page 11
Figure49 Heat the solder of Electrolytic Capacit ors
greater than 2.5cm in diameter or height and remove it.
Figure50 Heat the solder of Electrolytic Capacitors greater
Figure51 Heat the solder of Electrolytic Capacit ors
Figure52 Heat the solder of Electrolytic Capacit ors greater
Figure53 Heat the solder of Electrolytic Capacit ors
Figure54 Heat the solder of Electrolytic Capacit ors greater
C75
C74
C72
C33
(C223, C224, C225, C406, C105) (Gamay-S 300W
Bronze_Lite-On)
than 2.5cm in diameter or height and remove it.
(C72 C74 C75 C33) (Crasto-S 180W APFC_Huntkey)
greater than 2.5cm in diameter or height and remove it.
(C1) (Gamay-S 300W APFC_Chicony)
greater than 2.5cm in diameter or height and remove it.
(C1) (Crasto-S 180W APFC_Chicony)
than 2.5cm in diameter or height and remove it.
(C1) (Gamay-S 300W Bronze_Chicony)
than 2.5cm in diameter or height and remove it.
(C1) (Ortega 180W Bronze_Chicony)
EL-MF877-00 Page 11
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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