HP ProDesk 480 G3 Disassembly Instructions Manual

Product Category: Personal Computers

Marketing Name / Model
[List multiple models if applicable.]

HP ProDesk 480 G3 MT Business PC

1.0 Items Requiring Selective Treatment

Quantity

in product

Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)

With a surface greater than 10 sq cm

2

Batteries

All types including standard alkaline and lithium coin
or button style batteries

1

Mercury-containing components

For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm

Includes background illuminated displays with gas
discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB /PCT)

Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height

6
External electrical cables and cords

Power cord

1

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants
already listed as a separate item above)

Cooler fan 81g,system fan 99g,PSU fan 67g

247g
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent
chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing
refractory ceramic fibers

Product End-of-Life Disassembly Instructions

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within t he product which require selective treatment in the right column, as
applicable.

Item Description Notes

weighing > 25 grams (not including PCBs or PCAs

of items
included

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PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing
radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point whe re components

Tool Description

Tool Size (if
applicable)

Screw driver

T-15

Micro shear

YN-3

Screw driver

PH2

Description #4

Description #5

3.0 Product Disassembly Process

and materials requiring selective treatment can be removed.

3.1 List the basic steps that should typically be f oll owed to remove components and materials requiring selective treatment:

1. Remove access panel. (see Figure 1-2)

2. Remove front bezel. (see Fi gure 3)

3. Disconnect cooler cable then remove the cooler from board. (see Figure4-5)

4. Remove the HDD (see Figure 6-8)

5. Remove the Slim ODD (see Figure 9-10)

6. Unplug all cable conn. from PCA. (see Figure 11)

7. Remove the PCA(see Figure 12-13)

8. Remove the DIMM. (see Figure 14)

9. Remove the CPU. (see Figure 15-16)

10. Remove the Battery. (see Figure 17)

11. Remove the FIO module from chassis. (see Figure 18-19)

12. Remove the PWR_LED switch cable from cha ssis. (see Figure 20-21)

13. Remove the SD card reader from chassis. (see Figure 22-23)

14. Remove the speaker from chassis. (see Figure 24-25)

15. Remove Sys fan from chassis. (see Figure 26-27)

16. Remove the PSU from chassis. (see Figure 28-29)

17. Remove the PSU chassis and remove the PSU board. (see Figure 30-39)

18. Remove the Electrolytic Capacitors from PSU board. (see Figure 40-54)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the item s
contained in the product that require selective t reatment (with descriptions and arrows identifying locations).

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PSG instructions for this template are available at EL-MF877-01

Figure1 Release Thumb screw on the access panel.

Figure2 Griping the tab at the end of access panel, pull

Figure3 Pull 3 pcs bezel hooks and remove the front bezel

Figure4 Unplug the cooler cable from PCA

Figure5 Release 4 screws from cooler and remove i t

Figure6 Disconnect the SATA and power cables from

towards the rear and remove from unit.

from chassis.

HDD

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Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure7 Release the HDD screws

Figure8 Remove the HDD form chassis

Figure9 Push the latch and release the Slim ODD.

Figure10 Remove the Slim ODD form chassis.

Figure11 Unplug all cable conn. from PCA.

Figure12 Release 8 pcs screws from PCA

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Template Revision B

PSG instructions for this template are available at EL-MF877-01