HP j6700 User Manual
largest memory, smallest pack age av ailable
The HP W or kst ati on j6700 and HP Wor kstati on j67 50 are flexible, hi gh memory capac ity, dual PA-8700 750-MHZ or dual PA-8700+ 875-MHz
processor UNIX w or ks tati ons providing incredible performance for handling very large design files, reduc ing the total com pute time required, and
enabling quicker time to mar ket. Whether used as a deskside configurati on optimized for your offi ce en vironment or a racked soluti on , the HP j6700's
and HP’s j6 750’s performance and re lia bility w ill s atisfy the most demanding u ser. When you need the capacity fo r toda y’s tough es t desi gns and
simulations with room to s pare for tomorrow’s ev en b igger workloads, look to the HP Workstati on j6700 and HP Wor kst ati on j6750.
hp wor kstations
j6700 and j6750
data sheet
flexible, hi gh memory capac ity, dual processing
performance
features
dual 750-MHz PA-8700 or
dual 875-MHz PA-8700+ proces sor s
16-GB SDRAM capacity
2.25-MB on-chip cache
four-wa y s et as sociative cache
64-bit x 64-bit – operating system
and micropr oce ss or
1.9-GB/s I/O peak performance
efficient rack mountable design
hp fxe graphics card
hp fx
10
pro graphics card
hp Fire GL-UX graphics card
binary compatibility with future
PA-RISC and Intel
®
Itanium
®
processors
benefits
puts more compute and visuali zation power behind EDA
and CAE applications and pro vides higher application
performance at a lowe r pr i ce
supports analysis of larger models and delivers higher
application performance w ith les s disk acces s; largest
memory available
minimize s s ystem latency and enhances system
performance delivering greater application speed and
throughput
decreases the miss r ate o f direct mapped cache requiring
less disk-to-cache access for instruc ti ons and data yielding
higher performance
furnishes large addr e ss s paces f o r improved large
processing performance suc h as f ull-c hip simulati on, logic
synthesis and design r ule c hec king
provi des f a st data transfer to I/O for excellent file server
performance
increase s y s tem v e rs atility and r edeplo yability with flexible
configurations , sa ve space – up to 20 systems per 2 m
rack
prov ide s f ull-f eatur ed, 3D capability for universal access to
all types of data acro ss diverse, cros s-f unc tional teams
delivers high-end 3D graphics performance for mechanical
design and analysis fo r gr eater u ser productivity and
performance
delivers fas te st 3D UNI X graphics performance f o r
mechanical design and analy sis with greatest user
productiv ity and perfor mance
ensures smooth transition to hp’s next-generation highperformance sys tems , protects your investment in
applications, data and systems
rack up to 20 HP j6700 or HP j6750 workstations in
a 2 m rack – gain the value of redeployability
hp workstation j6700 and j6750 technical specifications
processor hp j6700 hp j6750
type PA-8700 PA-8700+
clock frequency 750-MHz 875-MHz
number of processors 2 2
cache (on-chip)
total cache 2.25-MB
instruction 0.75-MB
data 1.50-MB
main memory
bus bandwidth 1.9-GB/s
RAM type 120-MHz ECC SDRAM
capacity 1-MB to 16-GB
memory slots 16 DIMMs
storage bays 1 slim line optical, 2 Ultra 2 SCSI LVD
internal storage (2 bays) up to 2 devices, 146-GB maximum
Ultra 2 SCSI LVD, hot pluggable,
80 pin SCA connector
18-GB (10K RPM)
36-GB (10K RPM)
73-GB (10K RPM)
36-GB (15K RPM)
external storage
NSE SCSI (HD50) 1 shared port - up to 7 devices
Ultra2 SCSI LVD 1 shared port - up to 13 devices
removable media
optical drive 1 slim line, ATAPI interface,
DVD or DVD/CD-RW combo drive
expansion slots (3 total)
PCI 4X (full size) 3 slots, 64-bit 3.3-volt 66-MHz,
20 watts per slot
integrated networking
LAN data rate 10/100-Mb/s
built-in I/O
serial interface 9-pin DIN 2 ports
USB (Universal Serial Bus) Series A 2 ports (keyboard and mouse only)
audio
type integrated, CD-quality stereo
inputs stereo line-in, MIC-in
outputs stereo line-out, internal speaker with
frequency range of 25-20,000-Hz,
internal CD-ROM audio, headphone
environmental specifications
altitude
– operating 0-3000 m (0-10,000 ft)
– non-operating 0-4500 m (0-15,000 ft)
temperature
– operating 5 to +35 degrees C
– non-operating -40 to +70 degrees C
humidity
– operating 15 to 80% (non condensing)
vibration
– operating random 0.21 G rms, 5-500-Hz
– swept sine survival 0.5 G peak, 5-500-Hz
– random survival 2.09 G rms, 5-500-Hz
safety UL1950, CUL to CSA C22.2#950,
and TUV GS, Mark to
EN60950/IEC950
emissions FCC and CISPR Class A
and VCCI Class A
physical dimensions deskside configuration
height 49.5 cm (19.5 inches)
width 13.7 cm (5.4 inches)
depth 65.5 cm (25.8 inches)
racked configuration
height 2-EIA units
width 48.3 cm (19.0 inches)
depth 62.2 cm (24.5 inches)
rack orientation horizontal
net weight
minimum configuration 18.2 kg (40 lbs.)
fully loaded 21.8 kg (48 lbs.)
power requirements
input current 6 amps RMS max @ 100-120 V
3 amps RMS max @ 220-240 V
line frequency 50-60-Hz
maximum power input 600 watts (maximum power
configuration will vary)
supported operating systems
hp-ux 11i TCOE (Technical Computing Operating Environment)
hp-ux 11i MTOE (Minimal Technical Operating Environment)
hp-ux 11.0
monitors
hp L2025 20 inch LCD, flat-panel
hp L1325 18 inch LCD, flat-panel
hp wide-aspect 24 inch CRT, flat-screen, wide aspect
hp p1130 21 inch CRT, flat-screen
hp p920 19 inch CRT, flat-screen
leadership graphics—entry 3D
hp fxe 3 maximum, 24-MB FB memory,
9.5-MB maximum texture memory at
1280 x 1024 resolution
leadership graphics—high-end 3D
hp fx
10
pro 2 maximum, 128-MB FB memory,
110-MB maximum texture memory at
1280 x 1024 resolution
leadership graphics—extreme 3D
hp Fire GL-UX 2 maximum, 128-MB FB memory,
110-MB maximum texture memory at
1280 x 1024 resolution
For more information about the HP leadership graphics program:
www.hp.com/go/leadershipgraphics
Screen image courtesy of EDS PLM Solutions and Ducati Motor Holding S.p.A., and Mentor
Graphics. UNIX is a registered trademark of The Open Group in the United States and other
countries. All other product names mentioned herein may be trademarks of their respective
companies.
Information in the document is subject to change without notice.
© 2002 Hewlett-Packard Company
11/18/02
5981-3992EN
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