HP HFBR-2119T, HFBR-1119T Datasheet

Fiber Optic Transmitter
and Receiver Data Links
for 266 MBd

Technical Data

HFBR-1119T Transmitter
HFBR-2119T Receiver

Features

• Full Compliance with the
Optical Performance
Requirements of the Fibre
Channel Physical Layer

• Other Versions Available for:

- FDDI

- ATM

• Compact 16-pin DIP Package
with Plastic ST* Connector

• Wave Solder and Aqueous
Wash Process Compatible
Package

• Manufactured in an ISO
9001 Certified Facility

Applications

• Fibre Channel Interfaces

• Multimode Fiber Optic Links
up to 266 MBd at 1500 m

• General Purpose, Point-to­Point Data Communications

• Replaces DLT/R1040-ST2
Model Transmitters and
Receivers

Description

The HFBR-1119/-2119 series of
data links are high-performance,
cost-efficient, transmitter and
receiver modules for serial
optical data communication

applications specified at 266 MBd
for Fibre Channel applications or
for general-purpose fiber optic
data link transmission.

These modules are designed for
50 or 62.5 µm core multimode
optical fiber and operate at a
nominal wavelength of 1300 nm.
They incorporate our high­performance, reliable, long­wavelength, optical devices and
proven circuit technology to give
long life and consistent
performance.

Transmitter

The transmitter utilizes a 1300 nm
surface-emitting InGaAsP LED,
packaged in an optical subassem­bly. The LED is dc-coupled to a
custom IC which converts
differential-input, PECL logic
signals, ECL-referenced (shifted)
to a +5 V power supply, into an
analog LED drive current.

Receiver

The receiver utilizes an InGaAs
PIN photodiode coupled to a
custom silicon transimpedance
preamplifier IC. The PIN­preamplifier combination is ac-

coupled to a custom quantizer IC
which provides the final pulse
shaping for the logic output and
the Signal Detect function. Both
the Data and Signal Detect
Outputs are differential. Also,
both Data and Signal Detect
Outputs are PECL compatible,
ECL-referenced (shifted) to a
+5 V power supply.

Package

The overall package concept for
the Data Links consists of the
following basic elements: two
optical subassemblies, two
electrical subassemblies, and the
outer housings as illustrated in
Figure 1.

*ST is a registered trademark of AT&T Lightguide Cable Connectors.

200

5965-3483E (8/96)

DIFFERENTIAL
DATA IN
DIFFERENTIAL
SIGNAL

DETECT OUT

DIFFERENTIAL
DATA IN
V

BB

RECEIVER

QUANTIZER

IC

ELECTRICAL
SUBASSEMBLIES

TRANSMITTER

DRIVER IC

PREAMP IC

PIN PHOTODIODE

OPTICAL
SUBASSEMBLIES

LED

SIMPLEX ST
RECEPTACLE

The package outline drawing and
pinout are shown in Figures 2
and 3. The details of this package
outline and pinout are compatible
with other data-link modules from

®

other vendors.

The optical subassemblies consist
of a transmitter subassembly in
which the LED resides and a
receiver subassembly housing the
PIN-preamplifier combination.

TOP VIEW

Figure 1. Transmitter and Receiver Block Diagram.

8.31

41 MAX.

5.05

5.0

7.01

2.45

19.72

THREADS
3/8 – 32 UNEF-2A

HFBR-111X/211XT
DATE CODE (YYWW)
SINGAPORE

12.19
MAX.

0.9

The electrical subassemblies con­sist of a multi-layer printed circuit
board on which the IC chips and
various surface-mounted, passive
circuit elements are attached.

9.8 MAX.

3

NOTES:

1. MATERIAL ALLOY 194 1/2H – 0.38 THK
FINISH MATTE TIN PLATE 7.6 µm MIN.

2. MATERIAL PHOSPHOR BRONZE WITH
120 MICROINCHES TIN LEAD (90/10)
OVER 50 MICROINCHES NICKEL.

3. UNITS = mm

Figure 2. Package Outline Drawing.

12

17.78

(7 x 2.54)

8 x 7.62

HOUSING PINS 0.38 x 0.5 mm
NOTE 1

PCB PINS
DIA. 0.46 mm
NOTE 2

201

OPTICAL PORT

NC

GND

V
V

GND
DATA
DATA

NC

Figure 3. Pinout Drawing.

9NC

8

10 NO PIN

7

11 GND

CC
CC

TRANSMITTER

6

12 GND

5

13 GND

4

14 GND

3

15 V

2

16 NC

1

BB

NC

NO PIN

GND
GND
GND

SD
SD

NO PIN

OPTICAL PORT

9NC

8

10 GND

7

11 V

6

CC

12 V

5

CC

13 V

4

CC

14 DATA

3

15 DATA

2

16 NC

1

RECEIVER

8

7
6

5

62.5/125 µm

4
3
2

50/125 µm

1

OPTICAL POWER BUDGET – dB

0

Figure 4. Optical Power Budget at
BOL vs. Fiber Optic Cable Length.

0.5

021.5
FIBER OPTIC CABLE LENGTH – km

1

Each transmitter and receiver
package includes an internal shield
for the electrical subassembly to
ensure low EMI emissions and high

The following information is
provided to answer some of the
most common questions about the
use of these parts.

immunity to external EMI fields.

Transmitter and Receiver

The outer housing, including the
ST* port, is molded of filled, non­conductive plastic to provide
mechanical strength and electrical
isolation. For other port styles,
please contact your Hewlett­Packard Sales Representative.

Each data-link module is attached
to a printed circuit board via the
16-pin DIP interface. Pins 8 and 9
provide mechanical strength for
these plastic-port devices and will
provide port-ground for forthcom­ing metal-port modules.

Application Information

The Applications Engineering
group of the Optical Communi­cation Division is available to assist
you with the technical understand­ing and design tradeoffs associated
with these transmitter and receiver
modules. You can contact them
through your Hewlett-Packard
sales representative.

*ST is a registered trademark of AT&T Lightguide Cable Connectors.

Optical Power Budget
versus Link Length

The Optical Power Budget (OPB)
is the available optical power for a
fiber-optic link to accommodate
fiber cable losses plus losses due to
in-line connectors, splices, optical
switches, and to provide margin for
link aging and unplanned losses
due to cable plant reconfiguration
or repair.

Figure 4 illustrates the predicted
OPB associated with the trans­mitter and receiver specified in this
data sheet at the Beginning of Life
(BOL). This curve represents the
attenuation and chromatic plus
modal dispersion losses associated
with 62.5/125 µm and 50/125 µm
fiber cables only. The area under
the curve represents the remaining
OPB at any link length, which is
available for overcoming non-fiber
cable related losses.

Hewlett-Packard LED technology
has produced 1300 nm LED
devices with lower aging character­istics than normally associated with
these technologies in the industry.
The industry convention is 1.5 dB
aging for 1300 nm LEDs; however,
HP 1300 nm LEDs will experience
less than 1 dB of aging over
normal commercial equipment
mission-life periods. Contact your
Hewlett-Packard sales represen­tative for additional details.

Figure 4 was generated with a
Hewlett-Packard fiber-optic link
model containing the current
industry conventions for fiber
cable specifications and Fibre
Channel optical parameters. These
parameters are reflected in the
guaranteed performance of the
transmitter and receiver specifica­tions in this data sheet. This same
model has been used extensively in
the ANSI and IEEE committees,
including the ANSI X3T9.5
committee, to establish the optical
performance requirements for
various fiber-optic interface
standards. The cable parameters
used come from the ISO/IEC JTC1/

202

SC 25/WG3 Generic Cabling for
Customer Premises per DIS 11801
document and the EIA/TIA-568-A
Commercial Building Telecom­munications Cabling Standard per
SP-2840.

Transmitter and Receiver Signaling Rate Range and BER Performance

For purposes of definition, the
symbol rate (Baud), also called
signaling rate, is the reciprocal of
the symbol time. Data rate (bits/
sec) is the symbol rate divided by
the encoding factor used to encode
the data (symbols/bit).

The specifications in this data
sheet have all been measured using
the standard Fibre Channel symbol
rate of 266 MBd.

The data link modules can be used
for other applications at signaling
rates different than specified in this
data sheet. Depending on the
actual signaling rate, there may be
some differences in optical power
budget. This is primarily caused by
a change in receiver sensitivity.

These data link modules can also
be used for applications which
require different bit-error-ratio
(BER) performance. Figure 5
illustrates the typical trade-off
between link BER and the receiver
input optical power level.

Data Link Jitter Performance

The Hewlett-Packard 1300 nm data
link modules are designed to
operate per the system jitter
allocations stated in FC-PH Annex
A.4.3 and A.4.4.

The 1300 nm transmitter will
tolerate the worst-case input
electrical jitter allowed, without
violating the worst-case output
optical jitter requirements.

-2

1 x 10

-3

1 x 10

-4

1 x 10

-5

1 x 10

-6

1 x 10

-7

1 x 10

-8

BIT ERROR RATIO

1 x 10

-9

1 x 10

-10

1 x 10

-11

1 x 10

-12

1 x 10

-6 20

RELATIVE INPUT OPTICAL POWER – dB

CONDITIONS:

1. 266 MBd

2. PRBS 2
= 25 °C

3. T

A

4. V

CC

5. INPUT OPTICAL RISE/FALL TIMES =

1.0/1.9 ns

Figure 5. HFBR-1119T/2119T Bit­Error-Ratio vs. Relative Receiver
Input Optical Power.

CENTER OF SYMBOL

-4

7

-1

= 5 Vdc

-2

The 1300 nm receiver will tolerate
the worst-case input optical jitter
allowed without violating the
worst-case output electrical jitter
allowed.

The jitter specifications stated in
the following transmitter and
receiver specification tables are
derived from the values in FC-PH
Annex A.4.3 and A.4.4. They
represent the worst-case jitter
contribution that the transmitter
and receiver are allowed to make
to the overall system jitter without
violating the allowed allocation. In
practice, the typical jitter contribu­tion of the Hewlett-Packard data
link modules is well below the
maximum allowed amounts.

Recommended Handling Precautions

It is advised that normal static pre­cautions be taken in the handling
and assembly of these data link
modules to prevent damage which
may be induced by electrostatic
discharge (ESD). The HFBR-1119/

-2119 series meets MIL-STD-883C
Method 3015.4 Class 2.

Care should be taken to avoid
shorting the receiver Data or
Signal Detect Outputs directly to
ground without proper current­limiting impedance.

Solder and Wash Process Compatibility

The transmitter and receiver are
delivered with protective process
caps covering the individual ST*
ports. These process caps protect
the optical subassemblies during
wave solder and aqueous wash
processing and act as dust covers
during shipping.

These data link modules are
compatible with either industry
standard wave- or hand-solder
processes.

Shipping Container

The data link modules are
packaged in a shipping container
designed to protect it from
mechanical and ESD damage
during shipment or storage.

Board Layout–Interface Circuit and Layout Guidelines

It is important to take care in the
layout of your circuit board to
achieve optimum performance
from these data link modules.
Figure 6 provides a good example
of a power supply filter circuit that
works well with these parts. Also,
suggested signal terminations for
the Data, Data-bar, Signal Detect
and Signal Detect-bar lines are
shown. Use of a multilayer,
ground-plane printed circuit board
will provide good high-frequency
circuit performance with a low
inductance ground return path. See
additional recommendations noted
in the interface schematic shown in
Figure 6.

203