HP HFBR-2116T, HFBR-1116T Datasheet
Fiber Optic Transmitter
and Receiver Data Links
for 155 MBd
Technical Data
HFBR-1116T Transmitter
HFBR-2116T Receiver
Features
• Full Compliance with the
Optical Performance
Requirements of the ATM
Forum UNI SONET OC-3
Multimode Physical Layer
Specification
• Other Versions Available for:
- FDDI
- Fibre Channel
• Compact 16-pin DIP Package
with Plastic ST* Connector
• Wave Solder and Aqueous
Wash Process Compatible
Package
• Manufactured in an ISO
9001 Certified Facility
Applications
• ATM Switches, Hubs, and
Network Interface Cards
• Multimode Fiber ATM
Wiring Closet-to-Desktop
Links
• Point-to-Point Data
Communications
• Replaces DLT/R1040-ST1
Model Transmitters and
Receivers
Description
The HFBR-1116/-2116 series of
data links are high-performance,
cost-efficient, transmitter and
receiver modules for serial
optical data communication
applications specified at 155 MBd
for ATM UNI applications.
These modules are designed for
50 or 62.5 µm core multimode
optical fiber and operate at a
nominal wavelength of 1300 nm.
They incorporate our highperformance, reliable, longwavelength, optical devices and
proven circuit technology to give
long life and consistent
performance.
Transmitter
The transmitter utilizes a 1300 nm
surface-emitting InGaAsP LED,
packaged in an optical subassembly. The LED is dc-coupled to a
custom IC which converts
differential-input, PECL logic
signals, ECL-referenced (shifted)
to a +5 V power supply, into an
analog LED drive current.
Receiver
The receiver utilizes an InGaAs
PIN photodiode coupled to a
custom silicon transimpedance
preamplifier IC. The PINpreamplifier combination is accoupled to a custom quantizer IC
which provides the final pulse
shaping for the logic output and
the Signal Detect function. Both
the Data and Signal Detect
Outputs are differential. Also,
both Data and Signal Detect
Outputs are PECL compatible,
ECL-referenced (shifted) to a
+5 V power supply.
Package
The overall package concept for
the Data Links consists of the
following basic elements: two
optical subassemblies, two
electrical subassemblies, and the
outer housings as illustrated in
Figure 1.
*ST is a registered trademark of AT&T Lightguide Cable Connectors.
5965-3482E (8/96)
189
DIFFERENTIAL
DATA IN
DIFFERENTIAL
SIGNAL
DETECT OUT
DIFFERENTIAL
DATA IN
V
BB
RECEIVER
QUANTIZER
IC
ELECTRICAL
SUBASSEMBLIES
TRANSMITTER
DRIVER IC
PREAMP IC
PIN PHOTODIODE
OPTICAL
SUBASSEMBLIES
LED
SIMPLEX ST
RECEPTACLE
The package outline drawing and
pinout are shown in Figures 2
and 3. The details of this package
outline and pinout are compatible
with other data-link modules from
®
other vendors.
The optical subassemblies consist
of a transmitter subassembly in
which the LED resides and a
receiver subassembly housing the
PIN-preamplifier combination.
TOP VIEW
Figure 1. Transmitter and Receiver Block Diagram.
8.31
41 MAX.
5.05
5.0
7.01
2.45
19.72
THREADS
3/8 – 32 UNEF-2A
HFBR-111X/211XT
DATE CODE (YYWW)
SINGAPORE
12.19
MAX.
0.9
The electrical subassemblies consist of a multi-layer printed circuit
board on which the IC chips and
various surface-mounted, passive
circuit elements are attached.
9.8 MAX.
3
NOTES:
1. MATERIAL ALLOY 194 1/2H – 0.38 THK
FINISH MATTE TIN PLATE 7.6 µm MIN.
2. MATERIAL PHOSPHOR BRONZE WITH
120 MICROINCHES TIN LEAD (90/10)
OVER 50 MICROINCHES NICKEL.
3. UNITS = mm
Figure 2. Package Outline Drawing.
190
12
17.78
(7 x 2.54)
8 x 7.62
HOUSING PINS 0.38 x 0.5 mm
NOTE 1
PCB PINS
DIA. 0.46 mm
NOTE 2
NC
GND
V
CC
V
CC
GND
DATA
DATA
NC
OPTICAL PORT
9NC
8
10 NO PIN
7
11 GND
6
12 GND
5
13 GND
4
14 GND
3
15 V
2
BB
16 NC
1
NC
NO PIN
GND
GND
GND
SD
SD
NO PIN
OPTICAL PORT
9NC
8
10 GND
7
11 V
6
CC
12 V
5
CC
13 V
4
CC
14 DATA
3
15 DATA
2
16 NC
1
12
10
8
6
4
2
OPTICAL POWER BUDGET (dB)
0
Figure 4. Optical Power Budget at
BOL vs. Fiber Optic Cable Length.
62.5/125 µm
50/125 µm
0.5
0 1.0 1.5
0.3 2.0
FIBER OPTIC CABLE LENGTH (km)
2.5
TRANSMITTER
Figure 3. Pinout Drawing.
Each transmitter and receiver
package includes an internal shield
for the electrical subassembly to
ensure low EMI emissions and high
immunity to external EMI fields.
The outer housing, including the
ST* port, is molded of filled, nonconductive plastic to provide
mechanical strength and electrical
isolation. For other port styles,
please contact your HewlettPackard Sales Representative.
Each data-link module is attached
to a printed circuit board via the
16-pin DIP interface. Pins 8 and 9
provide mechanical strength for
these plastic-port devices and will
provide port-ground for forthcoming metal-port modules.
Application Information
The Applications Engineering
group of the Optical Communication Division is available to assist
you with the technical understanding and design tradeoffs associated
with these transmitter and receiver
modules. You can contact them
through your Hewlett-Packard
sales representative.
RECEIVER
The following information is
provided to answer some of the
most common questions about the
use of these parts.
Transmitter and Receiver Optical Power Budget versus Link Length
The Optical Power Budget (OPB)
is the available optical power for a
fiber-optic link to accommodate
fiber cable losses plus losses due to
in-line connectors, splices, optical
switches, and to provide margin for
link aging and unplanned losses
due to cable plant reconfiguration
or repair.
Figure 4 illustrates the predicted
OPB associated with the transmitter and receiver specified in this
data sheet at the Beginning of Life
(BOL). This curve represents the
attenuation and chromatic plus
modal dispersion losses associated
with 62.5/125 µm and 50/125 µm
fiber cables only. The area under
the curve represents the remaining
OPB at any link length, which is
available for overcoming non-fiber
cable related losses.
*ST is a registered trademark of AT&T Lightguide Cable Connectors.
191
Transmitter and Receiver Signaling Rate Range and BER Performance
For purposes of definition, the
symbol rate (Baud), also called
signaling rate, is the reciprocal of
the symbol time. Data rate (bits/
sec) is the symbol rate divided by
the encoding factor used to encode
the data (symbols/bit).
When used in 115 Mbps SONET
OC-3 applications, the performance of Hewlett-Packard’s
1300 nm data link modules, HFBR1116/-2116, is guaranteed to the
full conditions listed in the individual product specification tables.
The data link modules may be used
for other applications at signaling
rates different than the 155 Mbps
with some variation in the link
optical power budget. Figure 5
gives an indication of the typical
performance of these 1300 nm
products at different rates.
2.5
2.0
1.5
1.0
0.5
0
0.5
0 200
25 75 100 125
POWER BUDGET AT CONSTANT BER (dB)
TRANSMITTER/RECEIVER RELATIVE OPTICAL
CONDITIONS:
1. PRBS 2
2. DATA SAMPLED AT CENTER OF DATA SYMBOL.
3. BER = 10
4. TA = 25° C
5. V
= 5 Vdc
CC
6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
Figure 5. Transmitter/Receiver
Relative Optical Power Budget at
Constant BER vs. Signaling Rate.
50 150
SIGNAL RATE (MBd)
7
-1
-6
175
These data link modules can also
be used for applications which
require different bit-error-ratio
(BER) performance. Figure 6
illustrates the typical trade-off
between link BER and the receiver
input optical power level.
-2
1 x 10
-3
1 x 10
-4
1 x 10
-5
1 x 10
-6
1 x 10
-7
1 x 10
-8
1 x 10
BIT ERROR RATIO
-9
1 x 10
-10
1 x 10
-11
1 x 10
-12
1 x 10
-6 4
RELATIVE INPUT OPTICAL POWER – dB
CONDITIONS:
1. 155 MBd
2. PRBS 2
= 25° C
3. T
A
4. V
CC
5. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
Figure 6. Bit Error Ratio vs. Relative
Receiver Input Optical Power.
CENTER OF SYMBOL
-4 2-2
7
-1
= 5 Vdc
0
Data Link Jitter Performance
The Hewlett-Packard 1300 nm data
link modules are designed to
operate per the system jitter
allocations stated in Table B1 of
Annex B of the ANSI T1E1.2
Revision 3 standard.
The 1300 nm transmitter will
tolerate the worst-case input
electrical jitter allowed in Annex B
without violating the worst-case
output jitter requirements.
The 1300 nm receiver will tolerate
the worst-case input optical jitter
allowed in Annex B without
violating the worst-case output
electrical jitter allowed.
The jitter specifications stated in
the following transmitter and
receiver specification table are
derived from the values in Table
B1 of Annex B. They represent the
worst-case jitter contribution that
the transmitter and receiver are
allowed to make to the overall
system jitter without violating the
Annex B allocation example. In
practice, the typical jitter
contribution of the HewlettPackard data link modules is well
below the maximum allowed
amounts.
Recommended Handling Precautions
It is advised that normal static precautions be taken in the handling
and assembly of these data link
modules to prevent damage which
may be induced by electrostatic
discharge (ESD). The HFBR-1116/2116 series meets MIL-STD-883C
Method 3015.4 Class 2.
Care should be taken to avoid
shorting the receiver Data or
Signal Detect Outputs directly to
ground without proper currentlimiting impedance.
Solder and Wash Process Compatibility
The transmitter and receiver are
delivered with protective process
caps covering the individual ST*
ports. These process caps protect
the optical subassemblies during
wave solder and aqueous wash
processing and act as dust covers
during shipping.
These data link modules are
compatible with either industry
standard wave- or hand-solder
processes.
192
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