HP HFBR-2115T, HFBR-1115T Datasheet

Fiber Optic Transmitter
and Receiver Data Links
for 125 MBd

Technical Data

HFBR-1115T Transmitter
HFBR-2115T Receiver

Features

• Full Compliance with the
Optical Performance
Requirements of the FDDI
PMD Standard

• Full Compliance with the
Optical Performance
Requirements of the ATM
100 Mbps Physical Layer

• Full Compliance with the
Optical Performance
Requirements of the
100 Mbps Fast Ethernet
Physical Layer

• Other Versions Available for:

- ATM

- Fibre Channel

• Compact 16-pin DIP Package
with Plastic ST* Connector

• Wave Solder and Aqueous
Wash Process Compatible
Package

• Manufactured in an ISO
9001 Certified Facility

Applications

• FDDI Concentrators,
Bridges, Routers, and
Network Interface Cards

• 100 Mbps ATM Interfaces

• Fast Ethernet Interfaces

• General Purpose, Point-to­Point Data Communications

• Replaces DLT/R1040-ST1
Model Transmitters and
Receivers

*ST is a registered trademark of AT&T Lightguide Cable Connectors.

5965-3481E (8/96)

Description

The HFBR-1115/-2115 series of
data links are high-performance,
cost-efficient, transmitter and
receiver modules for serial
optical data communication
applications specified at 100
Mbps for FDDI PMD or 100 Base­FX Fast Ethernet applications.

These modules are designed for
50 or 62.5 µm core multi-mode
optical fiber and operate at a
nominal wavelength of 1300 nm.
They incorporate our high­performance, reliable, long­wavelength, optical devices and
proven circuit technology to give
long life and consistent
performance.

Transmitter

The transmitter utilizes a
1300 nm surface-emitting
InGaAsP LED, packaged in an
optical subassembly. The LED is
dc-coupled to a custom IC which
converts differential-input, PECL
logic signals, ECL-referenced
(shifted) to a +5 V power supply,
into an analog LED drive current.

Receiver

The receiver utilizes an InGaAs
PIN photodiode coupled to a
custom silicon transimpedance

preamplifier IC. The PIN­preamplifier combination is ac­coupled to a custom quantizer IC
which provides the final pulse
shaping for the logic output and
the Signal Detect function. Both
the Data and Signal Detect
Outputs are differential. Also,
both Data and Signal Detect
Outputs are PECL compatible,
ECL-referenced (shifted) to a
+5 V power supply.

Package

The overall package concept for
the Data Links consists of the
following basic elements: two
optical subassemblies, two
electrical subassemblies, and the
outer housings as illustrated in
Figure 1.

177

DIFFERENTIAL
DATA IN
DIFFERENTIAL
SIGNAL

DETECT OUT

DIFFERENTIAL
DATA IN
V

BB

RECEIVER

QUANTIZER

IC

ELECTRICAL
SUBASSEMBLIES

TRANSMITTER

DRIVER IC

TOP VIEW

PREAMP IC

PIN PHOTODIODE

OPTICAL
SUBASSEMBLIES

LED

Figure 1. Transmitter and Receiver Block Diagram.

SIMPLEX ST
RECEPTACLE

THREADS
3/8 – 32 UNEF-2A

HFBR-111X/211XT
DATE CODE (YYWW)
SINGAPORE

The package outline drawing and
pinout are shown in Figures 2
and 3. The details of this package
outline and pinout are compatible
with other data-link modules from

®

other vendors.

8.31

5.0

NOTES:

1. MATERIAL ALLOY 194 1/2H – 0.38 THK
FINISH MATTE TIN PLATE 7.6 µm MIN.

2. MATERIAL PHOSPHOR BRONZE WITH
120 MICROINCHES TIN LEAD (90/10)
OVER 50 MICROINCHES NICKEL.

3. UNITS = mm

7.01

Figure 2. Package Outline Drawing.

5.05

2.45

19.72

12

41 MAX.

17.78

(7 x 2.54)

12.19
MAX.

0.9

9.8 MAX.

8 x 7.62

HOUSING PINS 0.38 x 0.5 mm
NOTE 1

PCB PINS
DIA. 0.46 mm
NOTE 2

3

178

NC

GND

V

CC

V

CC

GND
DATA
DATA

NC

OPTICAL PORT

9NC

8

10 NO PIN

7

11 GND

6

12 GND

5

13 GND

4

14 GND

3

15 V

2

BB

16 NC

1

NC

NO PIN

GND
GND
GND

SD
SD

NO PIN

OPTICAL PORT

9NC

8

10 GND

7

11 V

6

CC

12 V

5

CC

13 V

4

CC

14 DATA

3

15 DATA

2

16 NC

1

Figure 4 illustrates the predicted
OPB associated with the trans­mitter and receiver specified in this
data sheet at the Beginning of Life
(BOL). This curve represents the
attenuation and chromatic plus
modal dispersion losses associated
with 62.5/125 µm and 50/125 µm
fiber cables only. The area under
the curve represents the remaining
OPB at any link length, which is
available for overcoming non-fiber
cable related losses.

TRANSMITTER

Figure 3. Pinout Drawing.

The optical subassemblies consist
of a transmitter subassembly in
which the LED resides and a
receiver subassembly housing the
PIN-preamplifier combination.

The electrical subassemblies con­sist of a multi-layer printed circuit
board on which the IC chips and
various sufrace-mounted, passive
circuit elements are attached.

Each transmitter and receiver
package includes an internal shield
for the electrical subassembly to
ensure low EMI emissions and high
immunity to external EMI fields.

The outer housing, including the
ST* port, is molded of filled, non­conductive plastic to provide
mechanical strength and electrical
isolation. For other port styles,
please contact your Hewlett­Packard Sales Representative.

Each data-link module is attached
to a printed circuit board via the
16-pin DIP interface. Pins 8 and 9
provide mechanical strength for
these plastic-port devices and will
provide port-ground for forthcom­ing metal-port modules.

RECEIVER

Application Information

The Applications Engineering
group of the Optical Communi­cation Division is available to assist
you with the technical understand­ing and design tradeoffs associated
with these transmitter and receiver
modules. You can contact them
through your Hewlett-Packard
sales representative.

The following information is
provided to answer some of the
most common questions about the
use of these parts.

Transmitter and Receiver Optical Power Budget versus Link Length

The Optical Power Budget (OPB)
is the available optical power for a
fiber-optic link to accommodate
fiber cable losses plus losses due to
in-line connectors, splices, optical
switches, and to provide margin for
link aging and unplanned losses
due to cable plant reconfiguration
or repair.

14

12

10

8

6

4

2

0

OPB – OPTICAL POWER BUDGET – dB

0 4.0

FIBER OPTIC CABLE LENGTH – km

Figure 4. Optical Power Budget at
BOL vs. Fiber Optic Cable Length.

62.5/125 µm

50/125 µm

0.5 1.5 2.0 2.5

1.0 3.0

3.5

Hewlett-Packard LED technology
has produced 1300 nm LED
devices with lower aging
characteristics than normally asso­ciated with these technologies in
the industry. The industry
convention is 1.5 dB aging for
1300 nm LEDs; however, HP 1300
nm LEDs will experience less than
1 dB of aging over normal
commercial equipment mission-life
periods. Contact your Hewlett­Packard sales representative for
additional details.

Figure 4 was generated with a
Hewlett-Packard fiber-optic link
model containing the current
industry conventions for fiber

179

cable specifications and the FDDI
PMD optical parameters. These
parameters are reflected in the
guaranteed performance of the
transmitter and receiver specifica­tions in this data sheet. This same
model has been used extensively in
the ANSI and IEEE committees,
including the ANSI X3T9.5
committee, to establish the optical
performance requirements for
various fiber-optic interface
standards. The cable parameters
used come from the ISO/IEC JTC1/
SC 25/WG3 Generic Cabling for
Customer Premises per DIS 11801
document and the EIA/TIA-568-A
Commercial Building Telecom­munications Cabling Standard per
SP-2840.

Transmitter and Receiver Signaling Rate Range and BER Performance

For purposes of definition, the
symbol rate (Baud), also called
signaling rate, is the reciprocal of
the symbol time. Data rate (bits/
sec) is the symbol rate divided by
the encoding factor used to encode
the data (symbols/bit).

When used in FDDI, ATM 100
Mbps, and Fast Ethernet
applications, the performance of
Hewlett-Packard’s 1300 nm HFBR­1115/-2115 data link modules is
guaranteed over the signaling rate
of 10 MBd to 125 MBd to the full
conditions listed in the individual
product specification tables.

The data link modules can be used
for other applications at signaling
rates outside of the 10 MBd to 125
MBd range with some penalty in
the link optical power budget
primarily caused by a reduction of
receiver sensitivity. Figure 5 gives
an indication of the typical
performance of these 1300 nm
products at different rates.

3.0

2.5

2.0

1.5

1.0

0.5

0

POWER BUDGET AT CONSTANT BER (dB)

TRANSMITTER/RECEIVER RELATIVE OPTICAL

CONDITIONS:

1. PRBS 2

2. DATA SAMPLED AT CENTER OF DATA SYMBOL.

3. BER = 10

4. TA = 25° C
= 5 Vdc

5. V

CC

6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.

Figure 5. Transmitter/Receiver
Relative Optical Power Budget at
Constant BER vs. Signaling Rate.

50 150

0 200

25 75 100 125

SIGNAL RATE (MBd)

7

-1

-6

175

These data link modules can also
be used for applications which
require different bit-error-ratio
(BER) performance. Figure 6
illustrates the typical trade-off
between link BER and the receiver
input optical power level.

-2

1 x 10

-3

1 x 10

-4

1 x 10

-5

1 x 10

-6

1 x 10

-7

1 x 10

-8

1 x 10

BIT ERROR RATIO

-10

2.5 x 10

-11

1 x 10

-12

1 x 10

-6 4

RELATIVE INPUT OPTICAL POWER – dB

CONDITIONS:

1. 125 MBd

2. PRBS 2
= 25° C

3. T

A

= 5 Vdc

4. V

CC

5. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.

Figure 6. Bit-Error-Ratio vs. Relative
Receiver Input Optical Power.

-4 2-2

7

-1

CENTER OF
SYMBOL

0

Data Link Jitter Performance

The Hewlett-Packard 1300 nm data
link modules are designed to
operate per the system jitter
allocations stated in Table E1 of
Annex E of the FDDI PMD
standard.

The 1300 nm transmitter will
tolerate the worst-case input
electrical jitter allowed in the table
without violating the worst-case
output jitter requirements of
Section 8.1 Active Output Interface
of the FDDI PMD standard.

The 1300 nm receiver will tolerate
the worst-case input optical jitter
allowed in Section 8.2 Active Input
Interface of the FDDI PMD
standard without violating the
worst-case output electrical jitter
allowed in the Table E1 of the
Annex E.

The jitter specifications stated in
the following transmitter and
receiver specification table are
derived from the values in Table
E1 of Annex E. They represent the
worst-case jitter contribution that
the transmitter and receiver are
allowed to make to the overall
system jitter without violating the
Annex E allocation example. In
practice, the typical jitter
contribution of the Hewlett­Packard data link modules is well
below the maximum amounts.

Recommended Handling Precautions

It is advised that normal static
precautions be taken in the
handling and assembly of these
data link modules to prevent
damage which may be induced by
electrostatic discharge (ESD). The
HFBR-1115/-2115 series meets
MIL-STD-883C Method 3015.4
Class 2.

180