HP dx7300 User Manual

Technical Reference Guide

HP Compaq dx7300 and dc7700 Series Business Desktop Computers

Document Part Number: 433473-001

September 2006

This document provides information on the design, architecture, function, and capabilities of the HP Compaq dx7300 and dc7700 Series Business Desktop Computers. This information may be used by engineers, technicians, administrators, or anyone needing detailed information on the products covered.

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The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

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WARNING: Text set off in this manner indicates that failure to follow directions could result in bodily

harm or loss of life.

CAUTION: Text set off in this manner indicates that failure to follow directions could result in damage to equipment or loss of information.

Text set off in this manner provides infomation that may be helpful.

✎

Technical Reference Guide

HP Compaq dx7300 and dc7700 Series Business Desktop Computers

First Edition (September 2006) Document Part Number: 433473-001

1Introduction

1.1 About this Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.1.1 Online Viewing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.1.2 Hardcopy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.2 Additional Information Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.3 Model Numbering Convention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2

1.4 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.5 Notational Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.5.1 Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.5.2 Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.5.3 Register Notation and Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.5.4 Bit Notation and Byte Values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.6 Common Acronyms and Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4

2 System Overview

2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–1

2.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–2

2.3 Mechanical Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–4

2.3.1 Cabinet Layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–5

2.3.2 Chassis Layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–10

2.3.3 Board Layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–14

2.4 System Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–17

2.4.1 Intel Processor Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–19

2.4.2 Chipset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–20

2.4.3 Support Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–21

2.4.4 System Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–21

2.4.5 Mass Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–22

2.4.6 Serial and Parallel Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–22

2.4.7 Universal Serial Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–22

2.4.8 Network Interface Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–22

2.4.9 Graphics Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–23

2.4.10Audio Subsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–23

2.5 Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2–24

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Contents

3 Processor/Memory Subsystem

3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–1

3.2 Pentium 4 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2

3.2.1 Processor Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–2

3.2.2 Processor Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–3

3.3 Memory Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3–4

4 System Support

4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1

4.2 PCI Bus Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–1

4.2.1 PCI 2.3 Bus Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–2

4.2.2 PCI Express Bus Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–6

4.2.3 Option ROM Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–8

4.2.4 PCI Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–8

4.2.5 PCI Power Management Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–8

4.2.6 PCI Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–9

4.3 System Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–11

4.3.1 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–11

4.3.2 Direct Memory Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–16

4.4 Real-Time Clock and Configuration Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–19

4.4.1 Clearing CMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–19

4.4.2 Standard CMOS Locations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–20

4.5 System Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–20

4.5.1 Security Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–20

4.5.2 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–22

4.5.3 System Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–23

4.5.4 Thermal Sensing and Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–23

4.6 Register Map and Miscellaneous Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–24

4.6.1 System I/O Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–24

4.6.2 SCH5317 I/O Controller Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4–25

5 Input/Output Interfaces

5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1

5.2 SATA Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1

5.2.1 SATA Programming. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–1

5.2.2 SATA Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–3

5.2.3 RAID Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–3

5.3 Diskette Drive Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–4

5.3.1 Diskette Drive Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–4

5.3.2 Diskette Drive Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–8

5.4 Serial Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9

5.4.1 Serial Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9

5.4.2 Serial Interface Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–9

5.5 Parallel Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–11

5.5.1 Standard Parallel Port Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–11

5.5.2 Enhanced Parallel Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–11

5.5.3 Extended Capabilities Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–12

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5.5.4 Parallel Interface Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–12

5.5.5 Parallel Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–14

5.6 Keyboard/Pointing Device Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–15

5.6.1 Keyboard Interface Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–15

5.6.2 Pointing Device Interface Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–17

5.6.3 Keyboard/Pointing Device Interface Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–17

5.6.4 Keyboard/Pointing Device Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–21

5.7 Universal Serial Bus Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–22

5.7.1 USB Data Formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–23

5.7.2 USB Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–24

5.7.3 USB Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–25

5.7.4 USB Cable Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–26

5.8 Audio Subsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–27

5.8.1 HD Audio Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–28

5.8.2 HD Audio Link Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–28

5.8.3 Audio Codec. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–29

5.8.4 Audio Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–30

5.8.5 Audio Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–32

5.9 Network Interface Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–33

5.9.1 Wake-On-LAN Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–34

5.9.2 Alert Standard Format Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–34

5.9.3 Power Management Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–34

5.9.4 NIC Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–35

5.9.5 NIC Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–35

5.9.6 NIC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5–36

6 Integrated Graphics Subsystem

6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–1

6.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–2

6.3 Display Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–4

6.4 Upgrading 845G-Based Graphics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–5

6.5 VGA Monitor Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6–6

7 Power and Signal Distribution

7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1

7.2 Power Supply Assembly/Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–1

7.2.1 Power Supply Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–2

7.2.2 Power Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–4

7.2.3 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–7

7.3 Power Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–8

7.4 Signal Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7–10

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Contents

8BIOS ROM

8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–1

8.2 ROM Flashing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2

8.2.1 Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–2

8.2.2 Changeable Splash Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3

8.3 Boot Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3

8.3.1 Boot Device Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–3

8.3.2 Network Boot (F12) Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–4

8.3.3 Memory Detection and Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–4

8.3.4 Boot Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–5

8.4 Setup Utility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–6

8.5 Client Management Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–15

8.5.1 System ID and ROM Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–15

8.5.2 Temperature Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–15

8.5.3 Drive Fault Prediction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–15

8.6 SMBIOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–17

8.7 USB Legacy Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8–17

A Error Messages and Codes

B ASCII Character Set

C Keyboard

Index

8 www.hp.com Technical Reference Guide

1.1 A bo u t t h i s G u i d e

This guide provides technical information about HP Compaq dx7300 and dc7700 series personal computers that feature Intel Pentium processors and the Intel Q965 chipset. This document describes in detail the system's design and operation for programmers, engineers, technicians, and system administrators, as well as end-users wanting detailed information.

The chapters of this guide primarily describe the hardware and firmware elements and primarily deal with the system board and the power supply assembly. The appendices contain general data such as error codes and information about standard peripheral devices such as keyboards, graphics cards, and communications adapters.

This guide can be used either as an online document or in hardcopy form.

1.1.1 O n li ne V i ew in g

Online viewing allows for quick navigating and convenient searching through the document. A color monitor will also allow the user to view the color shading used to highlight differential data. A softcopy of the latest edition of this guide is available for downloading in .pdf file format at the URL listed below:

www.hp.com

Introduction

Viewing the file requires a copy of Adobe Acrobat Reader available at no charge from Adobe Systems, Inc. at the following URL:

www.adobe.com

1.1. 2 H ar d co p y

A hardcopy of this guide may be obtained by printing from the .pdf file. The document is designed for printing in an 8 ½ x 11-inch format. Note that printing in black and white will lose color shading properties.

1.2 Additional Information Sources

For more information on components mentioned in this guide refer to the indicated manufacturers' documentation, which may be available at the following online sources:

■ HP Corporation: www.hp.com

■

Intel Corporation: www.intel.com

■

Standard Microsystems Corporation: www.smsc.com

■

Serial ATA International Organization (SATA-IO) : www.serialATA.org.

■

USB user group: www.usb.org

1. 3 M o de l N u m b e ri n g C on ve n ti o n

The model numbering convention for HP systems is as follows:

Technical Reference Guide www.hp.com 1-1

Introduction

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1. 4 S e ri a l N um b er

The unit's serial number is located on a sticker placed on the exterior cabinet. The serial number is also written into firmware and may be read with HP Diagnostics or Insight Manager utilities.

1.5 Notational Conventions

The notational guidelines used in this guide are described in the following subsections.

1. 5 .1 Va l u e s

Hexadecimal values are indicated by a numerical or alpha-numerical value followed by the letter “h.” Binary values are indicated by a value of ones and zeros followed by the letter “b.” Numerical values that have no succeeding letter can be assumed to be decimal unless otherwise stated.

1. 5 .2 R an ge s

Ranges or limits for a parameter are shown using the following methods:

Example A: Bits <7..4> = bits 7, 6, 5, and 4.

Introduction

Example B: IRQ3-7, 9 = IRQ signals 3 through 7, and IRQ signal 9

1.5.3 Register Notation and Usage

This guide uses standard Intel naming conventions in discussing the microprocessor's (CPU) internal registers. Registers that are accessed through programmable I/O using an indexing scheme are indicated using the following format:

03C5.17h

In the example above, register 03C5.17h is accessed by writing the index port value 17h to the index address (03C4h), followed by a write to or a read from port 03C5h.

1.5.4 Bit Notation and Byte Values

Bit designations are labeled between brackets (i.e., “bit <0 >”). Binary values are shown with the most significant bit (MSb) on the far left, least significant bit (LSb) at the far right. Byte values in hexadecimal are also shown with the MSB on the left, LSB on the right.

Index port Data port

Technical Reference Guide www.hp.com 1-3

Introduction

1.6 Common Acronyms and Abbreviations

Table 1-1 lists the acronyms and abbreviations used in this guide.

Table 1-1

Acronyms and Abbreviations

Acronym or Abbreviation Description

Aampere AC alternating current ACPI Advanced Configuration and Power Interface A/D analog-to-digital ADC Analog-to-digital converter ADD or ADD2 Advanced digital display (card) AGP Accelerated graphics port API application programming interface APIC Advanced Programmable Interrupt Controller APM advanced power management AOL Alert-On-LAN™ ASIC application-specific integrated circuit ASF Alert Standard Format AT 1. attention (modem commands) 2. 286-based PC architecture ATA AT attachment (IDE protocol) ATAPI ATA w/packet interface extensions AVI audio-video interleaved AVGA Advanced VGA AWG American Wire Gauge (specification) BAT Basic assurance test BCD binary-coded decimal BIOS basic input/output system bis second/new revision BNC Bayonet Neill-Concelman (connector type) bps or b/s bits per second BSP Bootstrap processor BTO Built to order CAS column address strobe CD compact disk CD-ROM compact disk read-only memory CDS compact disk system CGA color graphics adapter

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Table 1-1

Acronyms and Abbreviations

Acronym or Abbreviation Description

Ch Channel, chapter cm centimeter CMC cache/memory controller CMOS complimentary metal-oxide semiconductor (configuration memory) Cntlr controller Cntrl control codec 1. coder/decoder 2. compressor/decompressor CPQ Compaq CPU central processing unit CRIMM Continuity (blank) RIMM CRT cathode ray tube CSM 1. Compaq system management 2. Compaq server management

Introduction

DAC digital-to-analog converter DC direct current DCH DOS compatibility hole DDC Display Data Channel DDR Double data rate (memory) DIMM dual inline memory module DIN Deutche IndustriNorm (connector type) DIP dual inline package DMA direct memory access DMI Desktop management interface dpi dots per inch DRAM dynamic random access memory DRQ data request DVI Digital video interface dword Double word (32 bits) EDID extended display identification data EDO extended data out (RAM type) EEPROM electrically eraseable PROM EGA enhanced graphics adapter EIA Electronic Industry Association EISA extended ISA EPP enhanced parallel port EIDE enhanced IDE

Technical Reference Guide www.hp.com 1-5

Introduction

Table 1-1

Acronyms and Abbreviations

Acronym or Abbreviation Description

ESCD Extended System Configuration Data (format) EV Environmental Variable (data) ExCA Exchangeable Card Architecture FIFO first in/first out FL flag (register) FM frequency modulation FPM fast page mode (RAM type) FPU Floating point unit (numeric or math coprocessor) FPS Frames per second ft Foot/feet GB gigabyte GMCH Graphics/memory controller hub GND ground GPIO general purpose I/O GPOC general purpose open-collector GART Graphics address re-mapping table GUI graphic user interface hhexadecimal HW hardware hex hexadecimal Hz Hertz (cycles-per-second) ICH I/O controller hub IDE integrated drive element IEEE Institute of Electrical and Electronic Engineers IF interrupt flag I/F interface IGC integrated graphics controller in inch INT interrupt I/O input/output IPL initial program loader IrDA Infrared Data Association IRQ interrupt request ISA industry standard architecture

1-6 www.hp.com Technical Reference Guide

Table 1-1

Acronyms and Abbreviations

Acronym or Abbreviation Description

Kb/KB kilobits/kilobytes (x 1024 bits/x 1024 bytes) Kb/s kilobits per second kg kilogram KHz kilohertz kV kilovolt lb pound LAN local area network LCD liquid crystal display LED light-emitting diode LPC Low pin count LSI large scale integration LSb/LSB least significant bit/least significant byte

Introduction

LUN logical unit (SCSI) m Meter MCH Memory controller hub MMX multimedia extensions MPEG Motion Picture Experts Group ms millisecond MSb/MSB most significant bit/most significant byte mux multiplex MVA motion video acceleration MVW motion video window n variable parameter/value NIC network interface card/controller NiMH nickel-metal hydride NMI non-maskable interrupt NRZI Non-return-to-zero inverted ns nanosecond NT nested task flag NTSC National Television Standards Committee NVRAM non-volatile random access memory OS operating system PAL 1. programmable array logic 2. phase alternating line PATA Parallel ATA

Technical Reference Guide www.hp.com 1-7

Introduction

Table 1-1

Acronyms and Abbreviations

Acronym or Abbreviation Description

PC Personal computer PCA Printed circuit assembly PCI peripheral component interconnect PCI-E PCI Express PCM pulse code modulation PCMCIA Personal Computer Memory Card International Association PEG PCI express graphics PFC Power factor correction PIN personal identification number PIO Programmed I/O PN Part number POST power-on self test PROM programmable read-only memory PTR pointer RAID Redundant array of inexpensive disks (drives) RAM random access memory RAS row address strobe rcvr receiver RDRAM (Direct) Rambus DRAM RGB red/green/blue (monitor input) RH Relative humidity RMS root mean square ROM read-only memory RPM revolutions per minute RTC real time clock R/W Read/Write SATA Serial ATA SCSI small computer system interface SDR Singles data rate (memory) SDRAM Synchronous Dynamic RAM SDVO Serial digital video output SEC Single Edge-Connector SECAM sequential colour avec memoire (sequential color with memory) SF sign flag

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Table 1-1

Acronyms and Abbreviations

Acronym or Abbreviation Description

SGRAM Synchronous Graphics RAM SIMD Single instruction multiple data SIMM single in-line memory module SMART Self Monitor Analysis Report Technology SMI system management interrupt SMM system management mode SMRAM system management RAM SPD serial presence detect SPDIF Sony/Philips Digital Interface (IEC-958 specification) SPN Spare part number SPP standard parallel port SRAM static RAM

Introduction

SSE Streaming SIMD extensions STN super twist pneumatic SVGA super VGA SW software TAD telephone answering device TAFI Temperature-sensing And Fan control Integrated circuit TCP tape carrier package, transmission control protocol TF trap flag TFT thin-film transistor TIA Telecommunications Information Administration TPE twisted pair ethernet TPI track per inch TTL transistor-transistor logic TV television TX transmit UART universal asynchronous receiver/transmitter UDMA Ultra DMA URL Uniform resource locator us/µs microsecond USB Universal Serial Bus UTP unshielded twisted pair Vvolt

Technical Reference Guide www.hp.com 1-9

Introduction

Table 1-1

Acronyms and Abbreviations

Acronym or Abbreviation Description

VAC Volts alternating current VDC Volts direct current VESA Video Electronic Standards Association VGA video graphics adapter VLSI very large scale integration VRAM Video RAM Wwatt WOL Wake-On-LAN WRAM Windows RAM ZF zero flag ZIF zero insertion force (socket)

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2.1 Introduction

The HP Compaq dx7300 and dc7700 Series Business Desktop Computers (Figure 2-1) deliver an outstanding combination of manageability, serviceability, and compatibility for enterprise environments. Based on the Intel Pentium 4 processor with the Intel Q965 Express chipset, these systems emphasize performance along with industry compatibility. These models feature a similar architecture incorporating both PCI 2.3 and PCIe buses. All models are easily upgradeable and expandable to keep pace with the needs of the office enterprise.

System Overview

HP Compaq dx7300 ST

HP Compaq dc7700 USDT

Figure 2-1. HP Compaq dx7300and dc7700 Series Business Desktop Computers

This chapter includes the following topics:

■ Features (2.2)

■ Mechanical design (2.3)

■ System architecture (2.4)

■ Specifications (2.5)

HP Compaq dx7300 MT

HP Compaq dc7700 SFF

HP Compaq dc7700 CMT

Technical Reference Guide www.hp.com 2-1

System Overview

2.2 Features

The following standard features are included on all series unless otherwise indicated:

■ Intel Pentium processor in LGA775 (Socket T) package

■ Integrated graphics controller

■ PC2-6400 and PC2-5300 DIMM support on all models

■ Serial ATA (SATA) interfaces supporting transfer rates up to 3.0 Gbps and RAID operation

for dual drive arrays

■ PCI 2.3 and PCI Express interfaces

■ Hard drive fault prediction

■ Eight USB 2.0-compliant ports

■ High definition (HD) audio processor with one headphone output, at least one microphone

input, one line output, and one line input

■ Network interface controller providing 10/100/1000Base T support

■ Plug 'n Play compatible (with ESCD support)

■ Intelligent Manageability support

■ Energy Star compliant

■ Security features including:

❏ Flash ROM Boot Block

❏ Diskette drive disable, boot disable, write protect

❏ Power-on password

❏ Administrator password

❏ Serial/parallel port disable

❏ hood (cover) sense

❏ USB port disable

■ PS/2 enhanced keyboard

■ PS/2 scroll mouse

2-2 www.hp.com Technical Reference Guide

System Overview

Table 2-1 shows the differences in features between the different PC series based on form factor:

Table 2-1

Difference Matrix by Form Factor

USDT SFF ST MT CMT

Series dc7700 dc7700 dx7300 dx7300 dc7700

System Board Type custom custom custom µATX µATX

Serial and parallel ports Optional [1] Standard Standard Standard Standard

Memory:

# of sockets Maximum memory Memory type

Drive bays:

Externally accessible Internal

PCI Express slots:

x16 graphics x1

3 GB

DDR2

1 1

1 [2a]

4 GB

DDR2

2 1

1 [3] [4]

1 [4]

4 GB

DDR2

2 1

1 [3] [4]

1 [4]

4 GB

DDR2

4 2

1 [5]

4 GB

DDR2

4 2

1 [5]

PCI 2.3 32-bit 5-V slots 1full-height

[2b]

Smart Cover Sensor / Smart Cover Lock

Power Supply:

Power rating PFC type Auto-ranging

NOTES:

[1] Supported on system board. Requires optional cable/bracket assembly. [2] Configuration choice of:

a) 1 low-profile PCIe x16 graphics card support: height = 3.99 in., lenght = 6.60 in. when optional PCI Express riser card is installed. Or

b) 1 full height PCI card support when optional PCI riser is installed. [3] Accepts low-profile, reversed-layout ADD2/SDVO PCI-E card: height = 2.5 in., length = 6.6 in. [4] Slot not accessible in configuration using PCI riser card. [5] Accepts standard height, normal (non-reversed) layout ADD2/SDVO card: height = 4.2 in.,

length = 10.5 in. [6] Full-height PCI slots require installation of PCI riser card field option.

Half-height dimensions: height = 2.5 in., length = 6.6 in.

Full-hieght dimensions: height = 4.2 in., length = 6.875 in [7] PCI expansion board required for 4-slot support.

Full-height dimensions: height = 4.2 in., length = 6.875 in

Sensor only Both Both Both Both

200-watt

Active

Yes

2 half-height

2 full-height [6]

240-watt

Active

Yes

2 half-height

2 full-height [6]

240 -watt

Active

Yes

full-height

365-watt

Active

Yes

2 or 4

full-height [7]

365-watt

Active

Yes

Technical Reference Guide www.hp.com 2-3

System Overview

2.3 Mechanical Design

This guide covers five form factors:

■ Ultra-slim Desktop (USDT)—Very slim design that can be used in a tradition desktop

(horizontal) orientation or as a small tower mounted in the supplied tower stand.

■ Small Form Factor (SFF)—A small footprint design that can be used in a desktop

configuration (default) or as a small tower mounted in a tower stand.

■ Slim Tower (ST)—Slim design that can be used in a tradition desktop (horizontal)

orientation or as a small tower (default) mounted in the supplied tower stand.

■ MicroTower (MT)—Compact tower design that is easily placed on a desktop or floor

■ Convertible Minitower (CMT) —an ATX-type unit providing the most expandability and

being adaptable to desktop (horizontal) or floor-standing (vertical) placement.

The following subsections describe the mechanical (physical) aspects of models.

CAUTION: Voltages are present within the system unit whenever the unit is plugged into a live AC outlet, regardless of the system's “Power On” condition. Always disconnect the power cable from the power outlet and/or from the system unit before handling the system unit in any way.

The following information is intended primarily for identification purposes only. Before servicing these systems, refer to the applicable Service Reference Guide. Service personnel should review training materials also

✎

available on these products.

2-4 www.hp.com Technical Reference Guide

2.3.1 Cabinet Layouts

Front Views

Figure 2-2 shows the front panel components of the Ultra Slim Desktop (USDT) format factor.

System Overview

Item Description Item Decription

1 Slimline drive bay 5 USB ports 7, 8 2 CD-ROM eject button 6 HD activity LED 3 Microphone audio In jack 7 Power LED 4 Headphone audio Out jack 8 Power button

Figure 2-2. HP Compaq dc7700 USDT Front View

Technical Reference Guide www.hp.com 2-5

System Overview

Figure 2-3 shows the front panel components of the Small Form Factor (SFF). and Slim Tower (ST)

Item Description Item Decription

1 Diskette drive activity LED 7 Microphone audio In jack 2 Diskette drive media door 8 Headphone audio Out jack 3 CD-ROM drive acitvity LED 9 USB ports 7, 8 4 Diskette drive eject button 10 Hard drive activity LED 5CD-ROM media tray 11Power LED 6 CD-ROM drive open/close button 12 Power button

Figure 2-3. HP Compaq dc7700 SFF (left)/dx7300 ST (right) Front View

2-6 www.hp.com Technical Reference Guide

Figure 2-4 shows the front panel components of the microtower (uT) form factor.

Item Description Item Decription

1 CD-ROM drive 7 CD-ROM drive open/close button 2 CD-ROM drive activity LED 8 Power button

System Overview

3 Diskette drive media door 9 Power LED 4 Diskette drive activity LED 10 Hard drive activity LED 5 Diskette drive eject button 11 Headphone audio Out jack 6 USB ports 7, 8 12 Microphone audio In jack

Figure 2-4. HP Compaq dx7300 MT Front View

Technical Reference Guide www.hp.com 2-7

System Overview

Figure 2-5 shows the front panel components of the Convertable Minitower (CMT) form factor.

Item Description Item Decription

1 CD-ROM drive 7 CD-ROM drive open/close button 2 CD-ROM drive activity LED 8 Power button 3 Diskette drive media door 9 Power LED 4 Diskette drive activity LED 10 USB ports 7, 8 5 Diskette drive eject button 11 Headphone audio Out jack 6 Hard drive activity LED 12 Microphone audio In jack

Figure 2-5. HP Compaq dc7700 CMT Front View

2-8 www.hp.com Technical Reference Guide

System Overview

Rear Chassis Connections

Table 2-2 describes the signal connections available on the rear panels of the dx7300 and dc7700 models. Note that not all connectors listed are provided on all form factors.

Table 2-2

Rear Panel Signal Connections

Connector & Icon Description

AC input connector.

(no icon)

PS/2 female connector (color-coded purple) for keyboard interface.

PS/2 female connector (color-coded green) for mouse interface

Universal serial bus (USB) connector for USB interface

DB-9 male connector for RS-232 serial (COM1 or COM2) interface.

RJ-45 jack for Local Area Network (LAN) interface.

DB-25 female connetor for parallel (LPT1) interface.

DB-15 female connector for video monitor.

1/8 inch, 3-conductor phone jack (color-coded blue) for stereo audio line input.

1/8-inch, 3-conductor phone jack (color-coded green) for stereo audio line output.

1/8-inch, 3-conductor phone jack (color-coded pink) for stereo audio microphone input.

Technical Reference Guide www.hp.com 2-9

System Overview

2.3.2 Chassis Layouts

This section describes the internal layouts of the chassis. For detailed information on servicing the chassis refer to the multimedia training and/or the maintenance and service guide for these systems.

UIltra Slim Desktop Chassis

The Ultra Slim Desktop (USDT) chassis used for the HP Compaq dc7700 models uses a compact, space-saving form factor.

Item Description Item Description

1 Power supply assembly 5 Chassis fan 2 DIMM sockets (3) 6 Slimline Optical Drive bay

3 PCI or PCIe riser card cage 7 Hard drive (under item 6) 4 Processor socket -- --

Figure 2-6. USDT Chassis Layout, TopView

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System Overview

Small Form Factor / Slim Tower Chassis

The chassis layouts for the Small Form Factor (SFF) used for the HP Compaq dc7700 models and the Slim Tower (ST) used for the HP Comapq dx7300 models are shown in Figure 2-8. Features include:

■ Tilting drive cage assembly for easy access to processor and memory sockets

■ Two configurations available:

❏ Without card cage:

◆ Two half-height, full length PCI 2.3 slots

◆ One PCI Express x16 graphics/SDVO reverse-layout slot

◆ One PCI Express x1 slot

❏ With card cage:

◆ Two full-height, full-length PCI 2.3 slots

Chassis with card cage

Chassis without card cage

Item Description Item Description

1 Power supply assembly 6 Card cage 2 DIMM sockets (4) 7 Processor socket

3 PCI Express x1 slot 8 Chassis fan 4PCI Express x16

graphics/reverse-layout slot [1]

5 PCI 2.3 slots (2) 10 Diskette drive bay (under item 9)

NOTE:

[1] Accepts PCI-E graphics or reversed-layout ADD2 card.

Figure 2-7. SFF / ST Chassis Layout, Top / Right Side Views

Technical Reference Guide www.hp.com 2-11

9 Optical drive bay

System Overview

Microtower Chassis

Figure 2-8 shows the layout for the Microtower (MT) chassis used for the HP Compaq dx7300 models. Features include:

■ Externally accessible drive bay assembly.

■ Easy access to expansion slots and all socketed system board components.

9 8

Item Description Item Description

1 Power supply assembly 7 Speaker 2 Processor socket 8 PCI 2.3 slots 3 DIMM sockets (4) 9 PCI Express x1 slot 4 DriveLock 10 PCI Express x16 graphics/normal-layout

SDVO slot [1]

5 Externally accessible

drive bays

6 Internally accessible

drive bays

NOTE:

[1] Accepts PCI-E graphics or normal-layout ADD2 card.

Figure 2-8. MT Chassis Layout, Left Side View

2-12 www.hp.com Technical Reference Guide

11 Chassis fan

-- --

System Overview

Convertible Minitower

Figure 2-9 shows the layout for the Convertible Minitower (CMT) chassis in the minitower configuration used for HP Compaq dc7700 models. Features include:

■ Externally accessible drive bay assembly may be configured for minitower (vertical) or

desktop (horizontal) position.

■ Easy access to expansion slots and all socketed system board components.

9 8

Item Description Item Description

1 Power supply assembly 7 Speaker (inside optional card guide

assembly, if installed) 2 Processor socket 8 Expansion board area 3 DIMM sockets (4) 9 PCI 2.3 slots 4 DriveLock 10 PCI Express x1 slot 5 Externally accessible drive bays 11 PCI Express x16 graphics/normal-layout

SDVO slot [1] 6 Internally accessible drive bays 12 Chassis fan

NOTE:

[1] Accepts PCI-E graphics or normal-layout ADD2 card.

Figure 2-9. CMT Chassis Layout, Left Side View (Minitower configuration)

Technical Reference Guide www.hp.com 2-13

System Overview

2.3.3 Board Layouts

Figures 2-10 through 2-12 show the system and expansion board layouts. Figure 2-9 shows the layout for the USDT system board.

y t

Item Description Item Description

1 Serial port option header 11 Power button, power LED, HD LED, temp

2 Hood sense header 12 Chassis speaker connector 3 Parallel port option header 13 Front panel audio connector 4 CMOS clear button 14 Front panel USB port connector 5 SATA #0 (blue), 1 (white), 2 (white)

connectors 6 Password clear jumper/header 16 Processor fan connctor 7 PCI Express x16 slot 17 DIMM sockets (3) 8 PCI 2.3 slot 18 IDE (PATA) connector 9 Power supply (VccP) connector 19 Battery 10 Processor socket 20 Power supply connector

sensor header

15 Chassis fan connector

Figure 2-10. USDT System Board

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