HP AT-41411-TR1, AT-41411-BLK Datasheet
Surface Mount Low Noise
Silicon␣ Bipolar Transistor Chip
Technical Data
AT-41411
Features
• Low Noise Figure:
1.4 dB Typical at 1.0␣ GHz
1.8 dB Typical at 2.0␣ GHz
• High Associated Gain:
18.0 dB Typical at 1.0␣ GHz
13.0 dB Typical at 2.0␣ GHz
• High Gain-Bandwidth
Product: 7.0 GHz Typical f
• Low Cost Surface Mount
Plastic Package
• Tape-and-Reel Packaging
Option Available
[1]
T
Description
Hewlett-Packard’s AT-41411 is a
general purpose NPN bipolar
transistor that offers excellent
high frequency performance. The
AT-41411 is housed in a low cost
low parasitic 4 lead SOT-143
surface mount package. The
SOT-143 is an industry standard
and is compatible with high
volume surface mount assembly
techniques. The 4 micron emitter-
to-emitter pitch enables this
transistor to be used in many
different functions. The 14 emitter
finger interdigitated geometry
yields an intermediate sized
transistor with impedances that
are easy to match for low noise
and moderate power applications.
This device is designed for use in
low noise, wideband amplifier,
mixer and oscillator applications
in the VHF, UHF, and microwave
frequencies. An optimum noise
match near 50 Ω in the 1 to 2 GHz
frequency range, makes this
device easy to use as a low noise
amplifier.
The AT-41411 bipolar transistor is
fabricated using Hewlett-Packard’s
10 GHz fT Self-Aligned-Transistor
(SAT) process. The die is nitride
passivated for surface protection.
Excellent device uniformity,
performance and reliability are
produced by the use of ionimplantation, self-alignment
techniques, and gold metalization
in the fabrication of this device.
SOT-143 Plastic
Pin Connections
INPUT
V
414
CC
GND
OUTPUT
Note:
1. Refer to “Tape-and-Reel Packaging for
Semiconductor Devices”.
4-109
5965-8924E
AT-41411 Absolute Maximum Ratings
Absolute
Symbol Parameter Units Maximum
V
V
V
T
EBO
CBO
CEO
I
C
P
T
STG
T
j
Emitter-Base Voltage V 1.5
Collector-Base Voltage V 20
Collector-Emitter Voltage V 12
Collector Current mA 50
Power Dissipation
[2,3]
m W 225
Junction Temperature °C 150
Storage Temperature °C -65 to 150
[1]
Part Number Ordering Information
Part Number Increment Comments
AT-41411-TR1 3000 Reel
AT-41411-BLK 100 Bulk
Note: For more information, see “Tape and Reel Packaging for Semiconductor Devices”.
Thermal Resistance
[2,4]
θjc = 550°C/W
Notes:
1. Permanent damage may occur if
any of these limits are exceeded.
2. T
3. Derate at 1.8 mW/° C for T
4. See MEASUREMENTS section
= 25° C.
CASE
> 26° C.
C
“Thermal Resistance” for more
information.
:
Electrical Specifications, T
Symbol Parameters and Test Conditions
|S
|2Insertion Power Gain; VCE = 8 V, IC = 20 mA f = 1.0 GHz dB 14.5 16.5
21E
= 25° C
A
[1]
Units Min. Typ. Max.
f = 2.0 GHz 11.0
P
1 dB
Power Output @ 1 dB Gain Compression f = 2.0 GHz dBm 17.0
VCE = 8 V, IC = 20 mA
G
NF
1 dB
1 dB Compressed Gain; VCE = 8 V, IC = 20 mA f = 2.0 GHz dB 13.0
Optimum Noise Figure: VCE = 8 V, IC = 10 mA f = 1.0 GHz dB 1.4
O
f = 2.0 GHz 1.8
f = 4.0 GHz 3.5
G
A
Gain @ NFO; VCE = 8 V, IC = 10 mA f = 1.0 GHz dB 18.0
f = 2.0 GHz 13.0
f = 4.0 GHz 9.0
f
T
h
FE
I
CBO
I
EBO
Notes:
1.
Refer to PACKAGING Section, “Tape-and-Reel Packaging for Semiconductor Devices.”
Gain Bandwidth Product: VCE = 8 V, IC = 20 mA GHz 7.0
Forward Current Transfer Ratio; VCE = 8 V, IC = 10 mA — 30 150 270
Collector Cutoff Current; V
Emitter Cutoff Current; V
= 8 V µA 0.2
CB
= 1 V µA 1.0
EB
4-110
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