HP Apollo 2000 System Maintenance And Service Manual

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HPE Apollo 2000 System Maintenance and Service Guide

Abstract

This guide describes identification and maintenance procedures, diagnostic tools, specifications and requirements for hardware components and software. This guide is for an experienced service technician. Hewlett Packard Enterprise assumes that you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.

Part Number: 798329-009 Published: May 2017 Edition: 10

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2014, 2017 Hewlett Packard Enterprise Development LP

The information contained herein is subject to change without notice. The only warranties for Hewlett Packard Enterprise products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. Hewlett Packard Enterprise shall not be liable for technical or editorial errors or omissions contained herein.

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HPE Apollo 2000 System............................................................................ 7

Customer self repair....................................................................................8

Illustrated parts catalog............................................................................ 18

Removal and replacement procedures....................................................29

Introduction..........................................................................................................................................7

System components..........................................................................................................................18

Chassis system components..................................................................................................18

Node system components...................................................................................................... 22

Required tools................................................................................................................................... 29

Safety considerations........................................................................................................................ 29

Preventing electrostatic discharge..........................................................................................29

Symbols on equipment........................................................................................................... 29

Server warnings and cautions................................................................................................ 30

Rack warnings........................................................................................................................ 31

Preparation procedures.....................................................................................................................31

Power down the system..........................................................................................................32

Power down the node.............................................................................................................32

Remove the node from the chassis........................................................................................ 32

Remove the node blank from the chassis...............................................................................34

Remove the power supply...................................................................................................... 35

Remove the chassis from the rack......................................................................................... 36

Remove the security bezel..................................................................................................... 37

Remove the PDB cover.......................................................................................................... 38

Remove the chassis access panel......................................................................................... 39

Remove the fan cages............................................................................................................39

Remove the chassis PDB assembly.......................................................................................40

Remove the rear I/O blank......................................................................................................42

Remove the air baffle..............................................................................................................44

Remove the bayonet board assembly.................................................................................... 45

Remove the PCI riser cage assembly.................................................................................... 47

Single-slot left PCI riser cage assembly...................................................................... 47

Single-slot 1U node right PCI riser cage assemblies...................................................48

FlexibleLOM 1U node riser cage assembly................................................................. 49

Single-slot 2U node PCI riser cage assembly..............................................................50

FlexibleLOM 2U node riser cage assembly................................................................. 51

Three-slot riser cage assemblies................................................................................. 51

Remove the riser cage bracket from the three-slot riser cage assembly................................52

Remove Accelerator 1 from the FlexibleLOM 2U node riser cage assembly......................... 53

Remove Accelerator 1 from the three-slot riser cage assembly............................................. 55

Remove Accelerator 2 from the three-slot riser cage assembly............................................. 58

Chassis assembly..............................................................................................................................61

Power distribution board (PDB).........................................................................................................63

Drive bay mapping for the HPE Apollo r2800 Chassis...................................................................... 64

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Factory default configuration.................................................................................................. 65

Mapping drive bays.................................................................................................................65

PDB pass-through board...................................................................................................................66

RPS link board...................................................................................................................................67

RCM 2.0 cable...................................................................................................................................69

Drive backplane.................................................................................................................................70

Storage expander card (HPE Apollo r2800 Chassis only).................................................................72

Fan module........................................................................................................................................73

HPE Smart Storage Battery...............................................................................................................75

RCM module......................................................................................................................................76

RCM 2.0 to 1.0 adapter cable............................................................................................................77

Hot-plug drive.................................................................................................................................... 77

Bezel ear........................................................................................................................................... 78

FBWC module................................................................................................................................... 80

Dedicated iLO management port module..........................................................................................82

Enabling the dedicated iLO management module..................................................................82

Riser boards...................................................................................................................................... 83

PCIe transfer board........................................................................................................................... 87

M.2 SATA SSD enablement board.................................................................................................... 88

Heatsink.............................................................................................................................................90

Processor.......................................................................................................................................... 93

Accelerators.......................................................................................................................................97

Accelerator population rules................................................................................................... 97

Supported riser cage assemblies and accelerator power cables........................................... 98

Replacing Accelerator 1 in the FlexibleLOM 2U node riser cage assembly........................... 99

Replacing Accelerator 1 in a three-slot riser cage assembly................................................100

Replacing Accelerator 2 in a three-slot riser cage assembly................................................103

Expansion board..............................................................................................................................108

DIMMs..............................................................................................................................................111

Memory and processor information.......................................................................................111

Removing the DIMMs........................................................................................................... 113

System battery.................................................................................................................................114

System board...................................................................................................................................115

Re-entering the server serial number and product ID...........................................................120

HP Trusted Platform Module........................................................................................................... 120

4 Contents

Troubleshooting.......................................................................................121

Troubleshooting resources..............................................................................................................121

Diagnostic tools.......................................................................................122

UEFI System Utilities.......................................................................................................................122

Using UEFI System Utilities..................................................................................................122

Flexible boot control..............................................................................................................122

Restoring and customizing configuration settings................................................................ 123

Secure Boot configuration.................................................................................................... 123

Embedded UEFI shell...........................................................................................................124

Embedded Diagnostics option..............................................................................................124

iLO RESTful API support for UEFI........................................................................................124

Re-entering the server serial number and product ID...........................................................124

HPE ProLiant Pre-boot Health Summary............................................................................. 125

Insight Diagnostics.......................................................................................................................... 125

Insight Diagnostics survey functionality................................................................................ 125

Active Health System...................................................................................................................... 125

Integrated Management Log........................................................................................................... 126

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USB support.................................................................................................................................... 126

External USB functionality.................................................................................................... 127

Internal USB functionality..................................................................................................... 127

Component identification....................................................................... 128

Chassis front panel components..................................................................................................... 128

Chassis front panel LEDs and buttons............................................................................................ 129

Chassis rear panel components......................................................................................................131

Chassis rear panel LEDs.................................................................................................................132

Node rear panel components.......................................................................................................... 132

Node rear panel LEDs and buttons................................................................................................. 133

Power fault LEDs.............................................................................................................................136

System board components..............................................................................................................137

System maintenance switch................................................................................................. 138

NMI functionality................................................................................................................... 139

DIMM slot locations.............................................................................................................. 139

Fan locations................................................................................................................................... 140

Drive bay numbering....................................................................................................................... 140

HPE Apollo r2200 Chassis drive bay numbering..................................................................140

HPE Apollo r2600 Chassis drive bay numbering..................................................................141

HPE Apollo r2800 Chassis drive bay numbering..................................................................142

M.2 SATA SSD bay numbering.............................................................................................142

Hot-plug drive LED definitions.........................................................................................................143

SmartDrive hot-plug drive definitions....................................................................................143

Low-profile LFF hot-plug drive LED definitions.....................................................................144

Accelerator numbering.................................................................................................................... 146

RCM module components...............................................................................................................147

RCM module LEDs..........................................................................................................................148

PCIe riser board slot definitions.......................................................................................................148

Cabling......................................................................................................155

Chassis cabling............................................................................................................................... 155

Front I/O cabling................................................................................................................... 155

Drive backplane power cabling.............................................................................................155

RCM 2.0 cabling................................................................................................................... 157

Fan power cabling................................................................................................................ 157

Fan module cabling.............................................................................................................. 159

HPE Smart Storage Battery cabling..................................................................................... 159

Node cabling....................................................................................................................................160

SATA and Mini-SAS cabling..................................................................................................160

FBWC module cabling..........................................................................................................162

Accelerator cabling..........................................................................................................................164

Accelerator cabling in the FlexibleLOM 2U node riser cage assembly.................................164

Accelerator cabling in a three-slot riser cage assembly....................................................... 165

2-pin adapter cables............................................................................................................. 168

Specifications.......................................................................................... 169

Environmental specifications...........................................................................................................169

Mechanical specifications................................................................................................................169

Power supply specifications............................................................................................................ 171

Hot-plug power supply calculations.................................................................................................171

Thermal limitations.......................................................................................................................... 171

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Websites...................................................................................................174

Documentation feedback........................................................................ 175

Acronyms and abbreviations................................................................. 176

Acronyms and abbreviations........................................................................................................... 176

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HPE Apollo 2000 System

Introduction

The HPE Apollo 2000 System consists of a chassis and nodes. There are three chassis options with different storage configurations. To ensure proper thermal cooling, the four server tray slots on the chassis must be populated with server nodes or node blanks.

Chassis

• HPE Apollo r2200 Chassis (12 low-profile LFF model)

• HPE Apollo r2600 Chassis (24 SFF model)

• HPE Apollo r2800 Chassis (24 SFF model with storage expander backplane)

Nodes

• HPE ProLiant XL170r Gen9 Server Node (1U)

• HPE ProLiant XL190r Gen9 Server Node (2U)

The chassis supports the combination of 1U and 2U nodes. One chassis can support a maximum of the following:

• Four 1U nodes

• Two 1U nodes and one 2U node

• Two 2U nodes

For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the

Hewlett Packard Enterprise website .

HPE Apollo 2000 System 7

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Customer self repair

Hewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period Hewlett Packard Enterprise (or Hewlett Packard Enterprise service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, Hewlett Packard Enterprise will ship that part directly to you for replacement. There are two categories of CSR parts:

• Mandatory—Parts for which customer self repair is mandatory. If you request Hewlett Packard Enterprise

to replace these parts, you will be charged for the travel and labor costs of this service.

• Optional—Parts for which customer self repair is optional. These parts are also designed for customer

self repair. If, however, you require that Hewlett Packard Enterprise replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

NOTE: Some Hewlett Packard Enterprise parts are not designed for customer self repair. In order to satisfy the customer warranty, Hewlett Packard Enterprise requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

Based on availability and where geography permits, CSR parts will be shipped for next business day delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits. If assistance is required, you can call the Hewlett Packard Enterprise Support Center and a technician will help you over the telephone. Hewlett Packard Enterprise specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to Hewlett Packard Enterprise. In cases where it is required to return the defective part to Hewlett Packard Enterprise, you must ship the defective part back to Hewlett Packard Enterprise within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material. Failure to return the defective part may result in Hewlett Packard Enterprise billing you for the replacement. With a customer self repair, Hewlett Packard Enterprise will pay all shipping and part return costs and determine the courier/carrier to be used.

For more information about the Hewlett Packard Enterprise CSR program, contact your local service provider. For the North American program, go to the Hewlett Packard Enterprise CSR website.

Parts only warranty service

Your Hewlett Packard Enterprise Limited Warranty may include a parts only warranty service. Under the terms of parts only warranty service, Hewlett Packard Enterprise will provide replacement parts free of charge.

For parts only warranty service, CSR part replacement is mandatory. If you request Hewlett Packard Enterprise to replace these parts, you will be charged for the travel and labor costs of this service.

Réparation par le client (CSR)

Les produits Hewlett Packard Enterprise comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la période de diagnostic, Hewlett Packard Enterprise (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être effectuée à l'aide d'une pièce CSR, Hewlett Packard Enterprise vous l'envoie directement. Il existe deux catégories de pièces CSR :

• Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à

Hewlett Packard Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

• Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également

conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à Hewlett Packard Enterprise de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.

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REMARQUE: Certaines pièces Hewlett Packard Enterprise ne sont pas conçues pour permettre au client

d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, Hewlett Packard Enterprise exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.

Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour toute assistance, appelez le Centre d’assistance Hewlett Packard Enterprise pour qu’un technicien vous aide au téléphone Dans les documents envoyés avec la pièce de rechange CSR, Hewlett Packard Enterprise précise s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, Hewlett Packard Enterprise se réserve le droit de vous facturer les coûts de remplacement. Dans le cas d'une pièce CSR, Hewlett Packard Enterprise supporte l'ensemble des frais d'expédition et de retour, et détermine la société de courses ou le transporteur à utiliser.

Pour plus d'informations sur le programme CSR de Hewlett Packard Enterprise, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web Hewlett

Packard Enterprise.

Service de garantie "pièces seules"

Votre garantie limitée Hewlett Packard Enterprise peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de rechange fournies par Hewlett Packard Enterprise ne sont pas facturées.

Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez à Hewlett Packard Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

Riparazione da parte del cliente

Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti Hewlett Packard Enterprise sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica Hewlett Packard Enterprise (o un centro di servizi o di assistenza Hewlett Packard Enterprise) identifica il guasto come riparabile mediante un ricambio CSR, Hewlett Packard Enterprise lo spedirà direttamente al cliente per la sostituzione. Vi sono due categorie di parti CSR:

• Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la

riparazione ad Hewlett Packard Enterprise, deve sostenere le spese di spedizione e di manodopera per il servizio.

• Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti

progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad Hewlett Packard Enterprise, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.

NOTA: alcuni componenti Hewlett Packard Enterprise non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, Hewlett Packard Enterprise richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.

In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico Hewlett Packard Enterprise. Nel materiale fornito con una parte di ricambio CSR, Hewlett Packard Enterprise specifica se il cliente deve restituire dei component. Qualora sia richiesta la resa ad Hewlett Packard Enterprise del componente difettoso, lo si deve spedire ad Hewlett Packard Enterprise entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di Hewlett Packard Enterprise. Nel caso di riparazione da parte del cliente, Hewlett Packard Enterprise sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.

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Per ulteriori informazioni sul programma CSR di Hewlett Packard Enterprise, contattare il centro di assistenza di zona. Per il programma in Nord America fare riferimento al sito Web.

Servizio di garanzia per i soli componenti

La garanzia limitata Hewlett Packard Enterprise può includere un servizio di garanzia per i soli componenti. Nei termini di garanzia del servizio per i soli componenti, Hewlett Packard Enterprise fornirà gratuitamente le parti di ricambio.

Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione da parte del cliente. Se il cliente invece richiede la sostituzione ad Hewlett Packard Enterprise dovrà sostenere le spese di spedizione e di manodopera per il servizio.

Customer Self Repair

Hewlett Packard Enterprise Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn Hewlett Packard Enterprise (oder ein Hewlett Packard Enterprise Servicepartner) bei der Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen Hewlett Packard Enterprise dieses Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:

• Zwingend—Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den

Austausch dieser Teile von Hewlett Packard Enterprise vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet.

• Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für

Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von Hewlett Packard Enterprise vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.

HINWEIS: Einige Hewlett Packard Enterprise Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem Hewlett Packard Enterprise Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.

CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das Hewlett Packard Enterprise Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien von Hewlett Packard Enterprise, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an Hewlett Packard Enterprise zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an Hewlett Packard Enterprise zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das defekte Teil nicht zurückschicken, kann Hewlett Packard Enterprise Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt Hewlett Packard Enterprise für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst.

Weitere Informationen über das Hewlett Packard Enterprise Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der

Hewlett Packard Enterprise Website unter.

Parts-only Warranty Service (Garantieservice ausschließlich für Teile)

Ihre Hewlett Packard Enterprise Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice ausschließlich für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt Hewlett Packard Enterprise Ersatzteile kostenlos zur Verfügung.

Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den Austausch dieser Teile von Hewlett Packard Enterprise vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet.

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Reparaciones del propio cliente

Los productos de Hewlett Packard Enterprise incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, Hewlett Packard Enterprise (o los proveedores o socios de servicio de Hewlett Packard Enterprise) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR, Hewlett Packard Enterprise le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:

• Obligatorio—Componentes cuya reparación por parte del usuario es obligatoria. Si solicita a Hewlett

Packard Enterprise que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

• Opcional—Componentes cuya reparación por parte del usuario es opcional. Estos componentes también

están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que Hewlett Packard Enterprise realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto.

NOTA: Algunos componentes de Hewlett Packard Enterprise no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, Hewlett Packard Enterprise pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el catálogo ilustrado de componentes.

Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de asistencia técnica de Hewlett Packard Enterprise y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, Hewlett Packard Enterprise especificará si los componentes defectuosos deberán devolverse a Hewlett Packard Enterprise. En aquellos casos en los que sea necesario devolver algún componente a Hewlett Packard Enterprise, deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no enviara el componente defectuoso requerido, Hewlett Packard Enterprise podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, Hewlett Packard Enterprise se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.

Para obtener más información acerca del programa de Reparaciones del propio cliente de Hewlett Packard Enterprise, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de Hewlett Packard Enterprise CSR.

Servicio de garantía exclusivo de componentes

La garantía limitada de Hewlett Packard Enterprise puede que incluya un servicio de garantía exclusivo de componentes. Según las condiciones de este servicio exclusivo de componentes, Hewlett Packard Enterprise le facilitará los componentes de repuesto sin cargo adicional alguno.

Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes por parte del usuario (CSR). Si solicita a Hewlett Packard Enterprise que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

Customer Self Repair

Veel onderdelen in Hewlett Packard Enterprise producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als Hewlett Packard Enterprise (of een Hewlett Packard Enterprise Service Partner) bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt Hewlett Packard Enterprise dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee categorieën CSR-onderdelen:

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• Verplicht—Onderdelen waarvoor reparatie door de klant verplicht is. Als u Hewlett Packard Enterprise

verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.

• Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn

ontworpen voor reparatie door de klant. Als u echter Hewlett Packard Enterprise verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.

OPMERKING: Sommige Hewlett Packard Enterprise onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".

Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie is gewenst, belt u het Hewlett Packard Enterprise Support Center om via de telefoon ondersteuning van een technicus te ontvangen. Hewlett Packard Enterprise vermeldt in de documentatie bij het vervangende CSR-onderdeel of het defecte onderdeel aan Hewlett Packard Enterprise moet worden geretourneerd. Als het defecte onderdeel aan Hewlett Packard Enterprise moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde periode, gewoonlijk vijf (5) werkdagen, retourneren aan Hewlett Packard Enterprise. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan Hewlett Packard Enterprise u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt Hewlett Packard Enterprise alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest Hewlett Packard Enterprise zelf welke koerier/ transportonderneming hiervoor wordt gebruikt.

Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van Hewlett Packard Enterprise. Informatie over Service Partners vindt u op de Hewlett Packard Enterprise

website.

Garantieservice "Parts Only"

Het is mogelijk dat de Hewlett Packard Enterprise garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal Hewlett Packard Enterprise kosteloos vervangende onderdelen ter beschikking stellen.

Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u Hewlett Packard Enterprise verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht

Reparo feito pelo cliente

Os produtos da Hewlett Packard Enterprise são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se, durante o período de diagnóstico, a Hewlett Packard Enterprise (ou fornecedores/parceiros da Hewlett Packard Enterprise) concluir que o reparo pode ser efetuado pelo uso de uma peça CSR, a Hewlett Packard Enterprise enviará a peça diretamente ao cliente. Há duas categorias de peças CSR:

• Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a Hewlett Packard

Enterprise substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

• Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o

reparo feito pelo cliente. No entanto, se desejar que a Hewlett Packard Enterprise as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

OBSERVAÇÃO: Algumas peças da Hewlett Packard Enterprise não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a Hewlett Packard Enterprise exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca "No" (Não), no catálogo de peças ilustrado.

12 Customer self repair

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Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico da Hewlett Packard Enterprise para que um técnico o ajude por telefone. A Hewlett Packard Enterprise especifica nos materiais fornecidos com a peça CSR de reposição se a peça com defeito deve ser devolvida à Hewlett Packard Enterprise. Nos casos em que isso for necessário, é preciso enviar a peça com defeito à Hewlett Packard Enterprise, você deverá enviar a peça com defeito de volta para a Hewlett Packard Enterprise dentro do período de tempo definido, normalmente em 5 (cinco) dias úteis. A peça com defeito deve ser enviada com a documentação correspondente no material de transporte fornecido. Caso não o faça, a Hewlett Packard Enterprise poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a Hewlett Packard Enterprise paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço postal a ser utilizado.

Para obter mais informações sobre o programa de reparo feito pelo cliente da Hewlett Packard Enterprise, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da

Hewlett Packard Enterprise.

Serviço de garantia apenas para peças

A garantia limitada da Hewlett Packard Enterprise pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a Hewlett Packard Enterprise fornece as peças de reposição sem cobrar nenhuma taxa.

No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a Hewlett Packard Enterprise substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

Customer self repair 13

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14 Customer self repair

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Customer self repair 15

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16 Customer self repair

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Customer self repair 17

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Illustrated parts catalog

System components

Hewlett Packard Enterprise continually improves and changes product parts. For complete and current supported parts information, see the

Chassis system components

Hewlett Packard Enterprise PartSurfer website.

Item Description Spare part

1 12 low-profile LFF drive cage — —

2 12 low-profile LFF drive backplane for Apollo r2200 Chassis 800357-001 No

3 HPE Smart Storage Battery 871264-001 Mandatory

4 Fan module 808849-001 Optional

5 Power supplies — —

a) HPE 1400W Flex Slot Platinum Plus Hot Plug Power Supply

Kit – 94% efficiency*

b) HPE 800W Flex Slot Platinum Hot Plug Power Supply Kit –

94% efficiency*

18 Illustrated parts catalog

Customer self

number

754383-001 Mandatory

754381-001 Mandatory

repair

Table Continued

Page 19

Item Description Spare part

number

c) HPE 800W Flex Slot Universal Hot Plug Power Supply Kit –

754379-001 Mandatory

Customer self repair

94% efficiency*

d) HPE 800W Flex Slot Titanium Hot Plug Power Supply Kit –

754378-001 Mandatory

96% efficiency*

e) HPE 800W Flex Slot -48VDC Hot Plug Power Supply Kit –

754382-001 Mandatory

94% efficiency*

6 RCM module 800361-001 Mandatory

7 Right bezel ear — —

8 PDB pass-through board assembly — —

9 PDB pass-through board* 800356-001 No

10 Power distribution board 800355-001 No

11 RPS link board assembly — —

12 RPS link board* 800375-001 Optional

13 24 SFF backplane for Apollo r2600 Chassis 800358-001 No

14 Storage expander backplane (Apollo r2800 Chassis drive

800359-001 No

backplane)

15 Storage expander card (for Apollo r2800 Chassis only) 800360-001 No

16 24 SFF drive cage — —

17 Left bezel ear 808850-001 Optional

18 Fan power cable assembly* 808848-001 Mandatory

19 Chassis cable kit 811569-001 —

a) RCM 2.0 cable* — No

b) PDB pass-through cable* — Mandatory

c) Left front I/O cable* for HPE Apollo r2600/r2800 Chassis — Mandatory

d) Front I/O cables * — Mandatory

e) RCM 2.0 to 1.0 adapter cable* — Mandatory

20 12 LFF Apollo r2200 Chassis* 841639-001 Optional

21 24 SFF Apollo r2600 Chassis* 841640-001 Optional

22 24 SFF Apollo r2800 Chassis* 841641-001 Optional

*Not shown

Mandatory—Parts for which customer self repair is mandatory. If you request Hewlett Packard Enterprise to

replace these parts, you will be charged for the travel and labor costs of this service.

Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that Hewlett Packard Enterprise replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

Illustrated parts catalog 19

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No—Some Hewlett Packard Enterprise parts are not designed for customer self repair. In order to satisfy the customer warranty, Hewlett Packard Enterprise requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

Obligatoire—Pièces pour lesquelles le client doit procéder lui-même aux réparations. Si vous demandez à Hewlett Packard Enterprise de procéder au remplacement de ces pièces, les frais de transport et de main d’œuvre pour ce service vous seront facturés.

Facultatif—Pièces pour lesquelles une réparation par le client est facultative. Ces pièces sont également conçues pour que le client puisse procéder lui-même aux réparations. Cependant, les frais supplémentaires engendrés par le remplacement de ces pièces par Hewlett Packard Enterprise dépendent du type de service de garantie désigné pour votre produit.

Non—Certaines pièces Hewlett Packard Enterprise ne sont pas conçues pour être remplacées par le client. Afin de se conformer aux exigences de la garantie la garantie du client, Hewlett Packard Enterprise demande à un fournisseur de services agréé de procéder au remplacement de la pièce. Ces pièces sont signaléespar le mot « Non » dans le Catalogue de pièces illustré.

Obbligatorio—Parti per le quali il cliente è tenuto a effettuare autonomamente la riparazione. Se si richiede l'intervento di Hewlett Packard Enterprise per la sostituzione di queste parti, al cliente verranno addebitate le spese di viaggio e manodopera dell'operazione.

Facoltativo—Parti per le quali la riparazione in autonomia da parte del cliente è facoltativa. Queste parti sono progettate per consentire anche la riparazione da parte del cliente. Tuttavia, se il cliente richiedel'intervento di Hewlett Packard Enterprise per la sostituzione, potrebbero essere addebitate spese aggiuntive a seconda del tipo di garanzia in assistenza previsto per il prodotto.

No—Alcune parti Hewlett Packard Enterprise non sono progettate la riparazione in autonomia da parte del cliente. In base a quanto previsto dalla garanzia per il cliente, Hewlett Packard Enterprise richiede l'intervento di un tecnico autorizzato per la sostituzione della parte. Queste parti sono contrassegnate con"No"nel catalogo parti illustrato.

Zwingend—Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den Austausch dieser Teile von Hewlett Packard Enterprisevornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet.

Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von Hewlett Packard Enterprisevornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.

Nein—Einige Hewlett Packard Enterprise Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem Hewlett Packard Enterprise Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.

Obligatorio—Componentes cuya reparación por parte del usuario es obligatoria. Si solicita a Hewlett Packard Enterprise que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

Opcional—Componentes cuya reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que Hewlett Packard Enterprise realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto.

No—Algunos componentes de Hewlett Packard Enterprise no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, Hewlett Packard Enterprise pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el catálogo ilustrado de componentes.

Verplicht—Onderdelen die de klant zelf moet vervangen. Als u Hewlett Packard Enterprise vraagt deze onderdelen te vervangen, worden er reis- en arbeidskosten voor deze service in rekening gebracht.

20 Illustrated parts catalog

Page 21

Optioneel—Onderdelen die de klant zelf kan vervangen. Deze onderdelen zijn ook ontworpen om door de klant zelf te worden vervangen. Als u Hewlett Packard Enterprise verzoekt om deze te vervangen, kan het zijn dat hiervoor extra kosten in rekening worden gebracht, afhankelijk van het soort garantie dat op uw product van toepassing is.

Geen—Sommige onderdelen van Hewlett Packard Enterprise zijn niet ontworpen om door de klant zelf te worden vervangen. Om te voldoen aan de garantievoorwaarden eist Hewlett Packard Enterprise dat een geautoriseerde serviceverlener het onderdeel vervangt. Deze onderdelen worden aangeduid met 'Geen' in de geïllustreerde onderdelencatalogus.

Obrigatório—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a Hewlett Packard Enterprise substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a Hewlett Packard Enterprise as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

Não—Algumas peças da Hewlett Packard Enterprise não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a Hewlett Packard Enterprise exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca "No" (Não), no catálogo de peças ilustrado.

Illustrated parts catalog 21

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Node system components

Item Description Spare part

number

Customer selfrepair

23 Air baffle kit (includes 1U baffle and 2U baffle)* 811223-001 Mandatory

24 1U air baffle — —

25 2U air baffle — —

26 Dedicated iLO management port 800369-001 Optional

27 System board assemblies (include alcohol pad and thermal

— —

compound)

a) System board assembly for Intel Xeon E5-2600 v3

800362-001 No

processors only

b) System board assembly for both Intel Xeon E5-2600 v4

842587-001 No

processors and Intel Xeon E5-2600 v3 processors

28 Processor — —

Intel Xeon E5-2600 v3 processors

a) 1.6-GHz Intel Xeon E5-2603 v3, 6C, 85W 762441-001 Optional

b) 1.8-GHz Intel Xeon E5-2650L v3, 12C, 65W* 762461-001 Optional

c) 1.8-GHz Intel Xeon E5-2630L v3, 8C, 55W* 762459-001 Optional

d) 1.9-GHz Intel Xeon E5-2609 v3, 6C, 85W* 762443-001 Optional

e) 2.0-GHz Intel Xeon E5-2683 v3, 14C, 120W* 762453-001 Optional

f) 2.3-GHz Intel Xeon E5-2698 v3, 16C, 135W* 780760-001 Optional

g) 2.3-GHz Intel Xeon E5-2670 v3, 12C, 120W* 762450-001 Optional

22 Node system components

Table Continued

Page 23

Item Description Spare part

number

Customer selfrepair

h) 2.3-GHz Intel Xeon E5-2650 v3, 10C, 105W* 762448-001 Optional

i) 2.3-GHz Intel Xeon E5-2699 v3, 18C, 145W* 780761-001 Optional

j) 2.3-GHz Intel Xeon E5-2695 v3, 14C, 120W* 762454-001 Optional

k) 2.4-GHz Intel Xeon E5-2630 v3, 8C, 85W* 762446-001 Optional

l) 2.4-GHz Intel Xeon E5-2620 v3, 6C, 85W* 762445-001 Optional

m) 2.5-GHz Intel Xeon E5-2680 v3, 12C, 120W* 762451-001 Optional

n) 2.6-GHz Intel Xeon E5-2640 v3, 8C, 90W* 762447-001 Optional

o) 2.6-GHz Intel Xeon E5-2660 v3, 10C, 105W* 762449-001 Optional

p) 2.6 GHz Intel Xeon E5-2697 v3, 14C, 145W* 765154-001 Optional

q) 2.6-GHz Intel Xeon E5-2690 v3, 12C, 135W* 762452-001 Optional

r) 3.2-GHz Intel Xeon E5-2667 v3, 8C, 135W* 762457-001 Optional

s) 3.2-GHz Intel Xeon E5-1680 v3, 8C, 140W* 846824-001 Optional

t) 3.4-GHz Intel Xeon E5-2643 v3, 6C, 135W* 762456-001 Optional

u) 3.5-GHz Intel Xeon E5-2637 v3, 4C, 135W* 762455-001 Optional

v) 3.5-GHz Intel Xeon E5-1650 v3, 6C, 140W* 801578-001 Optional

w) 3.7-GHz Intel Xeon E5-1630 v3, 4C, 140W* 846823-001 Optional

Intel Xeon E5-2600 v4 processors

a) 1.7-GHz Intel Xeon E5-2650L v4, 14C, 65W* 835609-001 Optional

b) 1.7-GHz Intel Xeon E5-2603 v4, 6C, 85W* 835599-001 Optional

c) 1.7-GHz Intel Xeon E5-2609 v4, 8C, 85W* 835600-001 Optional

d) 1.8-GHz Intel Xeon E5-2630L v4, 10C, 55W* 835608-001 Optional

e) 2.0-GHz Intel Xeon E5-2660 v4, 14C, 105W* 835605-001 Optional

f) 2.1-GHz Intel Xeon E5-2620 v4, 8C, 85W* 835601-001 Optional

g) 2.1-GHz Intel Xeon E5-2683 v4, 16C, 120W* 835614-001 Optional

h) 2.1-GHz Intel Xeon E5-2695 v4, 18C, 120W* 835615-001 Optional

i) 2.2-GHz Intel Xeon E5-2630 v4, 10C, 85W* 835602-001 Optional

j) 2.2-GHz Intel Xeon E5-2650 v4, 12C, 105W* 835604-001 Optional

k) 2.2-GHz Intel Xeon E5-2698 v4, 20C, 135W* 835617-001 Optional

l) 2.2-GHz Intel Xeon E5-2699 v4, 22C, 145W* 835618-001 Optional

m) 2.3-GHz Intel Xeon E5-2697 v4, 18C 145W* 835616-001 Optional

n) 2.4-GHz Intel Xeon E5-2640 v4, 10C, 90W* 835603-001 Optional

o) 2.4-GHz Intel Xeon E5-2680 v4, 14C, 120W* 835606-001 Optional

p) 2.6-GHz Intel Xeon E5-2623 v4, 4C, 85W* 835610-001 Optional

Table Continued

Illustrated parts catalog 23

Page 24

Item Description Spare part

number

q) 2.6-GHz Intel Xeon E5-2690 v4, 14C, 135W* 835607-001 Optional

r) 2.6-GHz Intel Xeon E5-2697A v4, 16C, 145W* 841035-001 Optional

s) 3.2-GHz Intel Xeon E5-2667 v4, 8C, 135W* 835613-001 Optional

t) 3.4-GHz Intel Xeon E5-2643 v4, 6C, 135W* 835612-001 Optional

29 DIMM Optional

Customer selfrepair

DIMMs designed for Intel Xeon E5-2600 v3 processors

a) 4 GB, single-rank x8 PC4-2133R-15 774169-001 Mandatory

b) 8 GB, single-rank x4 PC4-2133R-15* 774170-001 Mandatory

c) 8 GB, dual-rank x8 PC4-2133R-15* 774171-001 Mandatory

d) 16 GB, dual-rank x4 PC4-2133R-15* 774172-001 Mandatory

e) 16 GB, dual-rank x4 PC4-2133L-15* 774173-001 Mandatory

f) 32 GB, quad-rank x4 PC4-2133L-15* 774174-001 Mandatory

g) 32 GB, dual-rank x4 PC4-2133R-15* 774175-001 Mandatory

DIMMs designed for Intel Xeon E5-2600 v4 processors

a) 8 GB, single-rank x8 PC4-2400T-R* 819410-001 Mandatory

b) 16 GB, single-rank x4 PC4-2400T-R* 819411-001 Mandatory

c) 16 GB, dual-rank x4 PC4-2400T-R* 846740-001 Mandatory

d) 32 GB, dual-rank x4 PC4-2400T-R* 819412-001 Mandatory

e) 32 GB, dual-rank x4 PC4-2400T-L* 852545-001 Mandatory

f) 64 GB, quad-rank x4 PC4-2400T-L* 819413-001 Mandatory

g) 128 GB, octal-rank x8 PC4-2400U-L* 819415-001 Mandatory

30 Heatsink —

a) Heatsink for Processor 1 (49 fins) 800377-001 Optional

b) Heatsink for Processor 2* (18 fins) 800376-001 Optional

31 Node tray —

32 1U bayonet board 811224-001 Optional

33 2U bayonet board 811225-001 Optional

34 PCIe x16 right 1U node riser board for Processor 1* 828928-001 Optional

35 PCIe x16 right 1U node riser board for Processor 2* 800366-001 Optional

36 FlexibleLOM x8 1U node riser board* 800367-001 Optional

37 FlexibleLOM x16x8 2U node riser board* 800368-001 Optional

38 Low-profile PCIe x16 left 1U/2U node riser board (for the

single-slot left PCI riser cage assembly and single-slot 2U node PCI riser cage assembly)*

24 Illustrated parts catalog

800370-001 Optional

Table Continued

Page 25

Item Description Spare part

number

Customer selfrepair

39 M.2 SATA SSD enablement board* 800371-001 Optional

40 PCIe transfer board* 800372-001 Optional

41 Three-slot PCIe x16 11OS 2U node riser board* 800373-001 Optional

42 Three-slot GPU-direct PCIe x16 2U node riser board* 800374-001 Optional

43 Three-slot GPU-direct with re-timer PCIe x16 2U node riser

828927-001 Optional

board*

44 Storage cable kit * 808851-001 Optional

a) Apollo r2200 Chassis power cable for Node 1 and Node 2* — —

b) HPE Apollo r2600/r2800 Chassis power cable for Node 1

— —

and Node 2*

c) HPE Apollo r2200/r2600/r2800 Chassis power cable for

— —

Node 3 and Node 4*

d) HPE Apollo r2200/r2600 Chassis power cable for hot-plug

— —

drives*

e) Apollo r2800 Chassis power cable for hot-plug drives* — —

f) PDB to Storage expander card fan power cable (Apollo r2800

— —

Chassis only)*

g) Storage expander card to right fan cage power cable (Apollo

— —

r2800 Chassis only)*

h) RCM 2.0 to RCM 1.0 adapter cable* — —

i) Mini-SAS P440 2U node cable* — —

j) Mini-SAS H240 2U node cable* — —

n) Mini-SAS P440/P840 cable* — —

o) Mini-SAS H240 1U node cable* — —

p) B140i 1U node SATA cable* — —

q) B140i 2U node SATA cable* — —

45 Accelerator cable kit* 808852-001 Mandatory

a) Dual accelerator power cable for a three-slot riser cage

assembly (this cable supports NVIDIA Tesla K40 GPUs, NVIDIA GRID K2 RAF GPUs, AMD FirePro S9150 GPUs, AMD FirePro S7150 GPUs, and Intel Xeon Phi 5110P Coprocessors)*

b) Single accelerator power cable for a FlexibleLOM 2U node

riser cage assembly (this cable supports NVIDIA Quadro K4200 GPUs, NVIDIA Quadro M4000 GPUs, NVIDIA Tesla K40 GPUs, AMD FirePro S9150 GPUs, and Intel Xeon Phi 5110P Coprocessors)*

— —

Table Continued

Illustrated parts catalog 25

Page 26

Item Description Spare part

number

Customer selfrepair

c) 2-pin accelerator adapter cable (for NVIDIA GRID K2 RAF

— —

GPUs only)*

46 Accelerator 1 power cable for a three-slot riser cage assembly

867336-001 Mandatory (this cable supports NVIDIA Tesla K40 GPUs, NVIDIA GRID K2 RAF GPUs, AMD FirePro S9150 GPUs, AMD FirePro S7150 GPUs, and Intel Xeon Phi 5110P Coprocessors)*

47 Accelerator 2 power cable for a three-slot riser cage assembly

867337-001 Mandatory (this cable supports NVIDIA Tesla K40 GPUs, NVIDIA GRID K2 RAF GPUs, AMD FirePro S9150 GPUs, AMD FirePro S7150 GPUs, and Intel Xeon Phi 5110P Coprocessors)*

48 Dual NVIDIA Tesla K80/M60/M40/P40/P100 GPU power cable

811571-001 Mandatory kit*

a) Accelerator 1 power cable for a three-slot riser cage

— — assembly*

b) Accelerator 2 power cable for a three-slot riser cage

— — assembly*

49 GPU accelerators*

a) NVIDIA Quadro K4200 GPU Module 783875-001 —

b) NVIDIA Quadro M4000 GPU Module 841576-001 —

c) NVIDIA GRID K2 RAF GPU Module 756822-001 —

d) NVIDIA Tesla K40 12 GB Module 747401-001 —

e) NVIDIA Tesla P40 GPU Module 872323-001 —

f) NVIDIA Tesla P100 GPU Module 868585-001 —

g) NVIDIA Tesla K80 GPU Module 797637-001 —

h) NVIDIA Tesla M60 RAF GPU Module 820178-001 —

i) NVIDIA Tesla M40 24GB GPU Module 855178-001 —

j) AMD FirePro S7150 Accelerator 820179-001 —

k) AMD FirePro S9150 Accelerator 797639-001 —

l) Intel Xeon Phi 5110P Coprocessor 708360-001 —

*Not shown

Mandatory—Parts for which customer self repair is mandatory. If you request Hewlett Packard Enterprise to

replace these parts, you will be charged for the travel and labor costs of this service.

26 Illustrated parts catalog

Page 27

Verplicht—Onderdelen die de klant zelf moet vervangen. Als u Hewlett Packard Enterprise vraagt deze onderdelen te vervangen, worden er reis- en arbeidskosten voor deze service in rekening gebracht.

Illustrated parts catalog 27

Page 28

28 Illustrated parts catalog

Page 29

Removal and replacement procedures

Required tools

You need the following items for some procedures:

• T-10/T-15/T-20 Torx screwdriver

• Flathead screwdriver (for replacing the system battery)

HPE Insight Diagnostics

•

• Thin-nose pliers (for replacing the chassis power distribution board)

Safety considerations

Before performing service procedures, review all the safety information.

Preventing electrostatic discharge

About this task

To prevent damaging the system, be aware of the precautions you must follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.

Procedure

• Avoid hand contact by transporting and storing products in static-safe containers.

• Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.

• Place parts on a grounded surface before removing them from their containers.

• Avoid touching pins, leads, or circuitry.

• Always be properly grounded when touching a static-sensitive component or assembly.

Symbols on equipment

The following symbols might be found on the equipment to indicate the presence of potentially hazardous conditions.

This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel.

WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.

This symbol indicates the presence of electric shock hazards. The area contains no user or field serviceable parts. Do not open for any reason.

WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure.

This symbol on an RJ-45 receptacle indicates a network interface connection.

WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do not plug telephone or telecommunications connectors into this receptacle.

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This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists.

WARNING: To reduce the risk of injury from a hot component, allow the surface to cool before touching.

This symbol indicates that the component exceeds the recommended weight for one individual to handle safely.

WARNING: To reduce the risk of personal injury or damage to the equipment, observe local occupational health and safety requirements and guidelines for manual material handling.

These symbols, on power supplies or systems, indicate that the equipment is supplied by multiple sources of power.

WARNING: To reduce the risk of injury from electric shock, remove all power cords to disconnect power from the system completely.

Server warnings and cautions

WARNING:

The chassis is very heavy. To reduce the risk of personal injury or damage to the equipment:

• Observe local occupational health and safety requirements and guidelines for manual material handling.

• Remove all installed components from the chassis before installing or moving the chassis.

• Use caution and get help to lift and stabilize the chassis during installation or removal, especially when the chassis is not fastened to the rack.

WARNING:

To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

WARNING:

To reduce the risk of personal injury, electric shock, or damage to the equipment, remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal circuitry remain active until AC power is removed.

CAUTION:

Protect the server from power fluctuations and temporary interruptions with a regulating uninterruptible power supply. This device protects the hardware from damage caused by power surges and voltage spikes and keeps the system in operation during a power failure.

CAUTION:

Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.

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CAUTION:

To ensure proper thermal cooling, the four server tray slots must be populated with server nodes or node blanks.

Rack warnings

WARNING:

To reduce the risk of personal injury or damage to the equipment, be sure that:

• The leveling jacks are extended to the floor.

• The full weight of the rack rests on the leveling jacks.

• The stabilizing feet are attached to the rack if it is a single-rack installation.

• The racks are coupled together in multiple-rack installations.

• Only one component is extended at a time. A rack may become unstable if more than one component is extended for any reason.

WARNING:

To reduce the risk of personal injury or equipment damage when unloading a rack:

• At least two people are needed to safely unload the rack from the pallet. An empty 42U rack can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and might become unstable when being moved on its casters.

• Never stand in front of the rack when it is rolling down the ramp from the pallet. Always handle the rack from both sides.

WARNING:

To reduce the risk of personal injury or damage to the equipment, adequately stabilize the rack before extending a component outside the rack. Extend only one component at a time. A rack may become unstable if more than one component is extended.

WARNING:

When installing a server in a telco rack, be sure that the rack frame is adequately secured at the top and bottom to the building structure.

Preparation procedures

To access some components and perform certain service procedures, you must perform one or more of the following procedures:

• Power down the system.

• Power down the node .

• Remove the node from the chassis.

• Remove the node blank from the chassis.

• Remove the power supply.

• Remove the chassis from the rack.

• Remove the security bezel.

• Remove the PDB cover.

• Remove the access panel.

• Remove the fan cages.

• Remove the chassis PDB assembly.

• Remove the rear I/O blank.

• Remove the air baffle.

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• Remove the bayonet board assembly.

• Remove the PCI riser cage assembly.

• Remove Accelerator 1 from the FlexibleLOM 2U node riser cage assembly.

• Remove Accelerator 1 from the three-slot riser cage assembly.

• Remove Accelerator 2 from the three-slot riser cage assembly.

Power down the system

IMPORTANT:

When the nodes are in standby mode, auxiliary power is still being provided to the system.

1. Power down the nodes.

2. Disconnect the power cords from the power supplies.

Power down the node

About this task

CAUTION:

Before powering down the node, perform a backup of critical server data and programs. Removing the node while the Do not remove LED is on may result in data loss or corruption. The node can be safely removed from the chassis only after the Do not remove LED is off.

IMPORTANT:

When the node is in standby mode, auxiliary power is still being provided to the system.

To power down the node , use one of the following methods:

• Press and release the Power On/Standby button.

This method initiates a controlled shutdown of applications and the OS before the node enters standby mode.

• Press and hold the Power On/Standby button for more than 4 seconds to force the node to enter standby mode.

This method forces the node to enter standby mode without properly exiting applications and the OS. If an application stops responding, you can use this method to force a shutdown.

• Use a virtual power button selection through iLO .

This method initiates a controlled remote shutdown of applications and the OS before the node enters standby mode.

Before proceeding, verify that the node is in standby mode by observing that the system power LED is amber.

Remove the node from the chassis

About this task

CAUTION:

32 Power down the system

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Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis:

CAUTION:

To avoid damage to the node , always support the bottom of the node when removing it from the chassis .

CAUTION:

To ensure proper thermal cooling, the four server tray slots must be populated with server nodes or node blanks.

a. Loosen the thumbscrew. b. Pull back the handle and remove the node.

• 1U node

• 2U node

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CAUTION:

To avoid damage to the device, do not use the removal handle to carry it.

4. Place the node on a flat, level surface.

Remove the node blank from the chassis

About this task

CAUTION:

To ensure proper thermal cooling, the four server tray slots must be populated with server nodes or node blanks.

Procedure

1. Loosen the thumbscrew.

2. Pull back the handle.

3. Slide the node blank out of the chassis.

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Remove the power supply

CAUTION:

Do not mix power supplies with different efficiency and wattage in the chassis. Install only one type of power supply. Verify that all power supplies have the same part number and label color. The system becomes unstable and may shut down when it detects mismatched power supplies.

Before removing the power supply, note the configuration and possible impact to the system.

• If two power supplies are installed, removal or failure of one of the power supplies might result in throttling or shut down of the server nodes.

• The bottom power is power supply 1, and the top power supply is power supply 2. For power supply numbering, see "Chassis rear panel components."

• Power supply 2 is hot-swappable only if power supply 1 is installed.

• If a RCM module is installed, power down all nodes before removing the RCM module and power supply

• Power supply 1 is hot-swappable only if:

◦ A RCM module is not installed. ◦ Power supply 2 is installed.

To remove the component:

1. If only one power supply is operational and it must be removed, or if the RCM module and power supply 1 must be removed, do the following:

a. Power down all nodes. b. Access the product rear panel. c. If installed, remove the RCM module.

2. Release the power cord from the strain relief strap.

3. Remove all power:

a. Disconnect the power cord from the power source. b. Disconnect the power cord from the chassis.

4. Remove the power supply.

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Remove the chassis from the rack

About this task

WARNING:

The chassis is very heavy. To reduce the risk of personal injury or damage to the equipment:

• Observe local occupational health and safety requirements and guidelines for manual material handling.

• Remove all installed components from the chassis before installing or moving the chassis.

• Use caution and get help to lift and stabilize the chassis during installation or removal, especially when the chassis is not fastened to the rack.

WARNING:

To reduce the risk of personal injury or damage to the equipment, you must adequately support the chassis during installation and removal.

WARNING:

Always use at least two people to lift the chassis into the rack. If the chassis is being loaded into the rack above chest level, a third person must assist with aligning the chassis with the rails while the other two people support the weight of the chassis.

CAUTION:

Before installing the chassis into the rack or removing the chassis from the rack, Hewlett Packard Enterprise recommends removing the nodes, the drives, and the power supplies. Because a fully populated chassis is heavy, removing these components facilitates moving the chassis.

Procedure

1. Power down all nodes.

2. Disconnect all peripheral cables from the nodes and chassis.

IMPORTANT:

Label the drives before removing them. The drives must be returned to their original locations.

3. Remove all nodes from the chassis.

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4. If installed, remove the security bezel.

5. Remove all drives.

6. If installed, remove the RCM module.

7. Remove all power supplies.

8. Loosen the thumbscrews and extend the chassis from the rack.

9. Remove the chassis from the rack.

For more information, see the documentation that ships with the rack mounting option.

10. Place the chassis on a flat surface.

Remove the security bezel

About this task

To access the front panel components, unlock and then remove the security bezel.

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Remove the PDB cover

1. Power down the system.

2. Disconnect all peripheral cables from the nodes and chassis.

3. Remove all nodes from the chassis.

4. If installed, remove the security bezel.

5. Remove all drives.

6. If installed, remove the RCM module.

7. Remove all power supplies.

8. Remove the chassis from the rack.

9. Remove the access panel.

10. If Smart Storage Battery is installed, slightly pull up the battery holder from the chassis to access the

battery cable connection underneath it, and then disconnect the Smart Storage Battery cable.

11. Remove the PDB cover.

a. Remove the screw. b. Slide back the PDB cover and remove it from the chassis.

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Remove the chassis access panel

Procedure

1. Power down all nodes.

2. Disconnect all peripheral cables from the nodes and chassis.

WARNING:

The chassis is very heavy. To reduce the risk of personal injury or damage to the equipment:

• Observe local occupational health and safety requirements and guidelines for manual material handling.

• Remove all installed components from the chassis before installing or moving the chassis.

• Use caution and get help to lift and stabilize the chassis during installation or removal, especially when the chassis is not fastened to the rack.

CAUTION:

3. Remove all nodes from the chassis.

4. If installed, remove the security bezel.

5. Remove all drives.

6. If installed, remove the RCM module.

7. Remove all power supplies.

8. Remove the chassis from the rack.

9. Unlock the access panel latch using the T-15 Torx screwdriver and release the access panel latch.

10. Slide the access panel back about 1.5 cm (0.5 in).

11. Lift and remove the access panel.

Remove the fan cages

1. Power down the system.

2. Disconnect all peripheral cables from the nodes and chassis.

3. Remove all nodes from the chassis.

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4. If installed, remove the security bezel.

5. Remove all drives.

6. If installed, remove the RCM module.

7. Remove all power supplies.

8. Remove the chassis from the rack.

9. Remove the access panel.

10. Remove all fan modules.

11. Disconnect the fan power cable assemblies from the fan cages.

12. Remove the fan cages.

• Right fan cage

• Left fan cage

Remove the chassis PDB assembly

To remove the component:

1. Power down the system.

2. Disconnect all peripheral cables from the nodes and chassis.

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3. Remove all nodes from the chassis.

4. If installed, remove the security bezel.

5. Remove all drives.

6. If installed, remove the RCM module.

7. Remove all power supplies.

8. Remove the chassis from the rack.

9. Remove the access panel.

10. If Smart Storage Battery is installed, slightly pull up the battery holder from the chassis to access the

battery cable connection underneath it, and then disconnect the Smart Storage Battery cable.

11. Remove the PDB cover.

12. Disconnect all cables from the PDB.

13. Disconnect the PDB pass-through cable from the pass-through board.

14. Remove the chassis PDB assembly.

a. Remove the screws. b. Slide the chassis PDB assembly toward to the rear of the server to disconnect the RPS link board

from drive backplane.

c. Slightly lift the chassis PDB assembly from the chassis.

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d. Disconnect the RCM 2.0 cable from the power distribution board and remove the chassis PDB

assembly.

Remove the rear I/O blank

Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis.

4. Place the node on a flat, level surface.

5. Remove the rear I/O blanks:

• 1U left rear I/O blank

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• 1U right rear I/O blank

• 2U rear I/O blank

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CAUTION:

To prevent improper cooling and thermal damage, do not operate the node unless all PCI riser cages or rear I/O blanks are installed, and do not operate the node unless all PCI slots have either an expansion slot cover or an expansion board installed.

Remove the air baffle

Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis.

4. Place the node on a flat, level surface.

5. If installed in a 2U node, remove the FlexibleLOM 2U node PCI riser cage assembly.

6. If installed in a 2U node, remove the three-slot PCI riser cage assembly.

7. Remove the air baffle:

• 1U air baffle

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• 2U air baffle

Remove the bayonet board assembly

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis.

4. Place the node on a flat, level surface.

5. If installed in a 2U node, remove the FlexibleLOM 2U node riser cage assembly.

6. If installed in a 2U node, remove the three-slot PCI riser cage assembly.

7. If an accelerator power cable is installed, disconnect it from the bayonet board.

8. If a B140i SATA cable is installed, disconnect it from the system board.

9. Remove the bayonet board assembly from the node.

• 1U bayonet board assembly

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• 2U bayonet board assembly

10. If installing a SATA or Mini-SAS cable, remove the bayonet board bracket from the bayonet board.

• 1U bayonet board bracket

• 2U bayonet board bracket

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Remove the PCI riser cage assembly

WARNING:

To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION:

To prevent damage to the server or expansion boards, power down the server, and disconnect all power cords before removing or installing the PCI riser cage.

Single-slot left PCI riser cage assembly

Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis .

4. Place the node on a flat, level surface.

5. In a 2U node, remove the three-slot riser cage assembly.

6. Remove the single-slot left PCI riser cage assembly:

• 1U node

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• 2U node

CAUTION:

Single-slot 1U node right PCI riser cage assemblies

About this task

NOTE:

Single-slot 1U node right PCI riser cage assemblies feature different riser boards. For more information on the riser board slot specifications, see "PCIe riser board slot definitions."

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Procedure

1. Power down the node.

2. Disconnect all peripheral cables from the node.

3. Remove the node from the chassis.

4. Do one of the following:

5. Remove the single-slot 1U node right PCI riser cage assembly.

• Remove the 1U left rear I/O blank.

• Remove the single-slot left PCI riser cage assembly.

CAUTION:

FlexibleLOM 1U node riser cage assembly

Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis .

4. Do one of the following:

• Remove the 1U left rear I/O blank.

• Remove the single-slot left PCI riser cage assembly.

5. Remove the FlexibleLOM 1U node riser cage assembly.

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CAUTION:

Single-slot 2U node PCI riser cage assembly

Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis.

4. Place the node on a flat, level surface.

5. Remove the FlexibleLOM 2U node riser cage assembly.

6. Remove the single-slot 2U node PCI riser cage assembly.

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CAUTION:

FlexibleLOM 2U node riser cage assembly

Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis .

4. Place the node on a flat, level surface.

5. Remove the FlexibleLOM 2U node riser cage assembly.

Three-slot riser cage assemblies

About this task

NOTE: Three-slot riser cage assemblies feature different riser boards. For more information on the riser board slot specifications, see "PCIe riser board slot definitions."

Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis.

4. Place the node on a flat, level surface.

5. Remove the three-slot riser cage assembly.

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CAUTION:

Remove the riser cage bracket from the three-slot riser cage assembly

About this task

To remove the component:

Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis .

4. Place the node on a flat, level surface.

5. Remove the three-slot PCI riser cage assembly.

6. Remove the riser cage bracket from the three-slot riser cage assembly.

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Remove Accelerator 1 from the FlexibleLOM 2U node riser cage assembly

About this task

To remove the component:

Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis .

4. Place the node on a flat, level surface.

5. Remove the FlexibleLOM 2U node riser cage assembly.

6. Disconnect the accelerator power cable from the bayonet board.

7. Disconnect the accelerator power cable from Accelerator 1.

8. Remove Accelerator 1 from the FlexibleLOM 2U node riser cage assembly:

• NVIDIA Tesla K40 GPU

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• Intel Xeon Phi Coprocessor 5110P

• AMD FirePro S9150 GPU

54 Removal and replacement procedures

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• NVIDIA Quadro K4200 GPU or NVIDIA Quadro M4000 GPU

Remove Accelerator 1 from the three-slot riser cage assembly

About this task

To remove the component:

Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis .

4. Place the node on a flat, level surface.

5. Remove the three-slot PCI riser cage assembly.

6. Disconnect the accelerator power cable from the bayonet board.

7. Remove the riser cage bracket from the three-slot riser cage assembly.

8. Disconnect all cables from the accelerators.

9. Remove Accelerator 2 from the three-slot riser cage assembly.

10. Remove Accelerator 1 from the three-slot riser cage assembly.

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• NVIDIA K40, K80, M60, M40, P40, or P100 GPU

• NVIDIA GRID K2 GPU

• Intel Xeon Phi Coprocessor 5110P

56 Removal and replacement procedures

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• AMD FirePro S9150 GPU

• AMD FirePro S7150 GPU

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Remove Accelerator 2 from the three-slot riser cage assembly

About this task

To remove the component:

Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis .

4. Place the node on a flat, level surface.

5. Remove the three-slot PCI riser cage assembly.

6. Disconnect the accelerator power cable from the bayonet board.

7. Remove the riser cage bracket from the three-slot riser cage assembly.

8. Disconnect all cables from the accelerators.

9. Remove Accelerator 2 from the three-slot riser cage assembly:

• NVIDIA K40, K80, M60, M40, P40, or P100 GPU

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• NVIDIA GRID K2 GPU

• Intel Xeon Phi Coprocessor 5110P

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• AMD FirePro S9150 GPU

• AMD FirePro S7150 GPU

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Chassis assembly

About this task

CAUTION:

If replacing the HPE Apollo r2800 Chassis, verify the original drive bay mapping configuration to prevent possible data loss. For more information, see "Drive bay mapping for the HPE Apollo r2800 Chassis."

To remove the component:

Procedure

1. Power down the system.

2. Disconnect all peripheral cables from the nodes and chassis.

3. Remove all nodes from the chassis.

4. If installed, remove the security bezel.

5. Remove all drives.

6. If installed, remove the RCM module.

7. Remove all power supplies.

8. Remove the chassis from the rack.

To replace the component:

1. Remove the Smart Storage Battery and fan modules from the failed chassis:

a. Remove the access panel. b. If installed, remove the HPE Smart Storage Battery. c. Remove all fan modules.

2. Install the Smart Storage Battery and fan modules into the new chassis:

a. Remove the access panel. b. Install the HPE Smart Storage Battery into the chassis.

IMPORTANT:

Ensure that the battery cable is connected to the correct connector. For detailed cabling information, see "HPE Smart Storage Battery cabling."

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c. Install all fan modules and connect the fan cables to the power connectors.

3. Install the access panel.

WARNING:

The chassis is very heavy. To reduce the risk of personal injury or damage to the equipment:

• Observe local occupational health and safety requirements and guidelines for manual material handling.

• Remove all installed components from the chassis before installing or moving the chassis.

• Use caution and get help to lift and stabilize the chassis during installation or removal, especially when the chassis is not fastened to the rack.

WARNING:

To avoid risk of personal injury or damage to the equipment, do not stack anything on top of railmounted equipment or use it as a work surface when extended from the rack.

CAUTION:

Always plan the rack installation so that the heaviest item is on the bottom of the rack. Install the heaviest item first, and continue to populate the rack from the bottom to the top.

4. Install the chassis into the rack and tighten the thumbscrews.

5. Install all power supplies.

6. If removed, install the RCM module.

7. Install all drives.

8. If removed, install the security bezel.

9. Install all nodes into the chassis.

10. Connect all peripheral cables to the nodes.

11. Power up the nodes.

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Power distribution board (PDB)

CAUTION:

If replacing the power distribution board in the Apollo r2800 Chassis, verify the original drive bay mapping configuration to prevent possible data loss. For more information, see "Drive bay mapping for the HPE Apollo r2800 Chassis."

To remove the component:

1. Power down the system.

2. Disconnect all peripheral cables from the nodes and chassis.

3. Remove all nodes from the chassis.

4. If installed, remove the security bezel.

5. Remove all drives.

6. If installed, remove the RCM module.

7. Remove all power supplies.

8. Remove the chassis from the rack.

9. Remove the access panel.

10. If Smart Storage Battery is installed, slightly pull up the battery holder from the chassis to access the

battery cable connection underneath it, and then disconnect the Smart Storage Battery cable.

11. Remove the PDB cover.

12. Disconnect all cables from the PDB.

13. Disconnect the PDB pass-through cable from the pass-through board.

14. Remove the chassis PDB assembly.

15. Remove the PDB pass-through board assembly.

a. Use a pair of thin-nose pliers to firmly grasp the cap nuts on the bottom of the PDB. b. Remove the screws with a T-20 Torx screwdriver. c. Remove the PDB pass-through board assembly from the PDB.

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16. Using a T-15 Torx screwdriver, remove the RPS link board assembly.

To replace the component, reverse the removal procedure.

Drive bay mapping for the HPE Apollo r2800 Chassis

The HPE Apollo r2800 Chassis, featuring the storage expander backplane, supports the flexibility to assign drive bays to specific server nodes. System administrators with the Integrated Lights Out (iLO) administrator login credentials may provide and execute iLO XML commands or scripts to change the association of drive bays to server node numbers.

Drive bay mapping configuration changes may be made from any server node and take effect after all server nodes in the HPE Apollo r2800 Chassis are turned off and the Chassis firmware is able to reset the storage expander backplane. All nodes must remain powered off for at least 5 seconds after executing the configuration changes. The server nodes may be remotely restarted through the iLO remote interface, or may be locally restarted by pressing the power button for each node.

This feature requires the following minimum firmware versions:

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• Apollo 2000 System Chassis firmware version 1.4.0 or later

• Storage Expander firmware version 1.0 or later

• iLO firmware version 2.10 or later

Factory default configuration

The factory default configuration evenly distributes the 24 SFF drive bays in the HPE Apollo r2800 Chassis.

Six drive bays are allocated to each 1U node.

• Node 1: drive bays 1 through 6

• Node 2: drive bays 7 through 12

• Node 3: drive bays 13 through 18

• Node 4: drive bays 19 through 24

Twelve drive bays are allocated to each 2U node.

• Node 1: drive bays 1 through 12

• Node 3: drive bays 13 through 24

For node numbering, see "Chassis rear panel components."

For drive bay numbering, see "HPE Apollo r2800 Chassis drive bay numbering."

Mapping drive bays

CAUTION:

Before mapping any drive bays, note the current configuration. Any changes to the drive bay mapping configuration where there are any drives set up in a Smart Array RAID configuration could cause data loss.

IMPORTANT:

The HPE Apollo r2800 Chassis does not support nodes using the HPE Dynamic Smart Array B140i Controller or the HPE P840 Smart Array Controller. Hewlett Packard Enterprise recommends installing an HPE H240 Host Bus Adapter or HPE P440 Smart Array Controller.

For detailed information and examples on drive bay mapping configuration changes in the HPE Apollo r2800 Chassis, see the HPE iLO 4 Scripting and Command Line Guide on the Hewlett Packard Enterprise website.

To map drives in the HPE Apollo r2800 Chassis:

1. Determine which drive bays to map to each node.

2. Using Integrated Lights Out (iLO) administrator login credentials, use a script that includes the

READ_BACKPLANE_INFO command to get the current mapping information from the HPE Apollo r2800 Chassis.

3. Build an XML script to map the drive bays.

4. Using a script that includes the READ_ZONE_TABLE command, verify the changes to the zone table. The

drives can also be labeled to clearly show the drive bay mapping configuration.

5. Power down the nodes.

IMPORTANT:

All nodes must remain powered off for at least 5 seconds after executing the configuration changes.

6. Power up the nodes.

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PDB pass-through board

To remove the component:

1. Power down the system.

2. Disconnect all peripheral cables from the nodes and chassis.

3. Remove all nodes from the chassis.

4. If installed, remove the security bezel.

5. Remove all drives.

6. If installed, remove the RCM module.

7. Remove all power supplies.

8. Remove the chassis from the rack.

9. Remove the access panel.

10. If Smart Storage Battery is installed, slightly pull up the battery holder from the chassis to access the

battery cable connection underneath it, and then disconnect the Smart Storage Battery cable.

11. Remove the PDB cover.

12. Disconnect all cables from the PDB.

13. Disconnect the PDB pass-through cable from the pass-through board.

14. Remove the chassis PDB assembly.

15. Using a T-20 Torx screwdriver, remove the PDB pass-through board assembly from the bus bars.

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16. Using a T-15 Torx screwdriver, remove the support bracket from the PDB pass-through board.

To replace the component, reverse the removal procedure.

RPS link board

1. Power down the system.

2. Disconnect all peripheral cables from the nodes and chassis.

3. Remove all nodes from the chassis.

4. If installed, remove the security bezel.

5. Remove all drives.

6. If installed, remove the RCM module.

7. Remove all power supplies.

8. Remove the chassis from the rack.

9. Remove the access panel.

10. If Smart Storage Battery is installed, slightly pull up the battery holder from the chassis to access the

battery cable connection underneath it, and then disconnect the Smart Storage Battery cable.

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11. Remove the PDB cover.

12. Disconnect all cables from the PDB.

13. Disconnect the PDB pass-through cable from the pass-through board.

14. Remove the chassis PDB assembly.

15. Using a T-15 Torx screwdriver, remove the RPS link board assembly.

16. Remove the support bracket from the RPS link board.

68 Removal and replacement procedures

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To replace the component, reverse the removal procedure.

RCM 2.0 cable

To remove the component:

1. Power down the system.

2. Disconnect all peripheral cables from the nodes and chassis.

3. Remove all nodes from the chassis.

4. If installed, remove the security bezel.

5. Remove all drives.

6. If installed, remove the RCM module.

7. Remove all power supplies.

8. Remove the chassis from the rack.

9. Remove the access panel.

10. If Smart Storage Battery is installed, slightly pull up the battery holder from the chassis to access the

battery cable connection underneath it, and then disconnect the Smart Storage Battery cable.

11. Remove the PDB cover.

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12. Disconnect all cables from the PDB.

13. Disconnect the PDB pass-through cable from the pass-through board.

14. Remove the chassis PDB assembly.

15. Remove the two screws from the bottom of the chassis.

16. Remove the RCM 2.0 cable.

To replace the component, reverse the removal procedure.

Drive backplane

To remove the component:

1. Power down the system.

2. Disconnect all peripheral cables from the nodes and chassis.

3. Remove all nodes from the chassis.

4. If installed, remove the security bezel.

5. Remove all drives.

6. If installed, remove the RCM module.

7. Remove all power supplies.

8. Remove the chassis from the rack.

9. Remove the access panel.

10. If Smart Storage Battery is installed, slightly pull up the battery holder from the chassis to access the

battery cable connection underneath it, and then disconnect the Smart Storage Battery cable.

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11. Remove the PDB cover.

12. Disconnect all cables from the PDB.

13. Disconnect the PDB pass-through cable from the pass-through board.

14. Remove the chassis PDB assembly.

15. Remove all fan modules.

16. Remove the fan cages.

17. If replacing the storage expander backplane in the Apollo r2800 Chassis, remove the storage expander card.

18. Disconnect all the cables from the drive backplane.

19. Remove the drive backplane.

• 12 low-profile LFF drive backplane for Apollo r2200 Chassis

• 24 SFF drive backplane for Apollo r2600 Chassis

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• Storage expander backplane (24 SFF drive backplane for Apollo r2800 Chassis)

To replace the component, reverse the removal procedure.

Storage expander card (HPE Apollo r2800 Chassis only)

To remove the component:

1. Power down the system.

2. Disconnect all peripheral cables from the nodes and chassis.

3. Remove all nodes from the chassis.

4. If installed, remove the security bezel.

5. Remove all drives.

6. If installed, remove the RCM module.

7. Remove all power supplies.

8. Remove the chassis from the rack.

9. Remove the access panel.

10. If Smart Storage Battery is installed, slightly pull up the battery holder from the chassis to access the

battery cable connection underneath it, and then disconnect the Smart Storage Battery cable.

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11. Remove the PDB cover.

12. Disconnect all cables from the PDB.

13. Disconnect the PDB pass-through cable from the pass-through board.

14. Remove the chassis PDB assembly.

15. Remove all fan modules.

16. Remove the fan cages.

17. Disconnect all cables from the storage expander card.

18. Remove the r2800 storage expander card.

To replace the component, reverse the removal procedure.

Fan module

About this task

To remove the component:

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Procedure

1. Power down the system.

2. Disconnect all peripheral cables from the nodes and chassis.

3. Remove all nodes from the chassis.

4. If installed, remove the security bezel.

5. Remove all drives.

6. If installed, remove the RCM module.

7. Remove all power supplies.

8. Remove the chassis from the rack.

9. Remove the access panel.

10. Disconnect the cable from the fan cage.

11. Remove the fan module.

To replace the component, reverse the removal procedure.

74 Removal and replacement procedures

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HPE Smart Storage Battery

WARNING:

To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION:

To prevent damage to electrical components, take the appropriate anti-static precautions before beginning any installation, removal, or replacement procedure. Improper grounding can cause electrostatic discharge.

To remove the component:

1. Power down the system.

2. Disconnect all peripheral cables from the nodes and chassis.

3. Remove all nodes from the chassis.

4. If installed, remove the security bezel.

5. Remove all drives.

6. If installed, remove the RCM module.

7. Remove all power supplies.

8. Loosen the thumbscrews and extend the chassis from the rack.

9. Remove the chassis from the rack.

10. Remove the access panel.

11. Slightly pull up the battery holder from the chassis to access the battery cable connection underneath it,

and then disconnect the HPE Smart Storage Battery cable.

12. Remove the Smart Storage Battery from its holder.

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To replace the component, reverse the removal procedure.

RCM module

Observe the following rules and limitations when installing an RCM module:

• If a dedicated iLO management port module is installed in a node, the node cannot be accessed through the RCM module.

• If a dedicated iLO management port module is installed in a node, the node can only connect to a network through the dedicated iLO management port module.

• If using the RCM module iLO ports or the dedicated iLO management port module to connect to a network, the network must operate at a speed of 1 Gb/s. The server cannot connect to the network if the network is operating at a speed of 10/100 Mb/s or 10 Gb/s.

• Use either the HPE APM port or an iLO port to connect to a network. Having both ports connected at the same time results in a loopback condition.

• Do not connect both iLO ports to the network at the same time. Only one iLO port can be connected to the network, while the other iLO port can be used only as a connection to a second enclosure. Having both ports connected at the same time results in a loopback condition.

To remove the component:

1. Power down all nodes.

2. Access the product rear panel.

3. Disconnect all cables from the RCM module.

4. Remove the RCM module.

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RCM 2.0 to 1.0 adapter cable

To remove the component:

Power down the system.

2. Disconnect the RCM 2.0 to 1.0 adapter cable from APM.

3. Disconnect the RCM 2.0 to 1.0 adapter cable from the RCM module.

To replace the component, reverse the removal procedure.

Hot-plug drive

CAUTION:

To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank.

To remove the component:

RCM 2.0 to 1.0 adapter cable 77

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1. Back up all node data on the drive.

2. Determine the status of the drive from the hot-plug drive LED definitions.

3. Remove the hot-plug drive.

• SFF HPE SmartDrive

• Low-profile LFF hot-plug drive

To replace the component, reverse the removal procedure.

Bezel ear

To remove the component:

1. Power down the system.

2. Disconnect all peripheral cables from the nodes and chassis.

3. Remove all nodes from the chassis.

4. If installed, remove the security bezel.

5. Remove all drives.

6. If installed, remove the RCM module.

7. Remove all power supplies.

8. Remove the chassis from the rack.

9. Remove the access panel.

10. Remove all fan modules.

11. Remove the fan cages.

12. Remove the front I/O cable cover.

• Right front I/O cable cover

78 Bezel ear

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• Left front I/O cable cover

13. Disconnect the front I/O cable from the drive backplane.

14. Remove the bezel ear.

• Right bezel ear

Removal and replacement procedures 79

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• Left bezel ear

15. Disconnect the front I/O cable from the bezel ear.

To replace the component, reverse the removal procedure.

FBWC module

About this task

WARNING:

To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION:

In systems that use external data storage, be sure that the server is the first unit to be powered down and the last to be powered back up. Taking this precaution ensures that the system does not erroneously mark the drives as failed when the server is powered up.

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To remove the component:

Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis .

4. Remove the PCI riser cage assembly.

5. If necessary for easier access to the cache module connector and/or removal of an air scoop, remove the

6. If the cache module is covered by an air scoop, remove the air scoop.

7. Disconnect the cache module backup power cable from the cache module.

CAUTION:

storage controller from the PCI riser cage or from the system board.

8. Remove the cache module.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 81

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Dedicated iLO management port module

Observe the following rules and limitations when installing an dedicated iLO management port module:

• If a dedicated iLO management port module is installed in a node, the node can only connect to a network through the dedicated iLO management port module.

• If a dedicated iLO management port module is installed in a node, the node cannot be accessed through the RCM module.

To remove the component:

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the server node from the chassis.

4. Place the node on a flat, level surface.

5. Remove any installed PCI riser cage assemblies.

6. Remove all rear I/O blanks.

7. Remove the failed dedicated iLO management port card.

To replace the component, reverse the removal procedure.

Enabling the dedicated iLO management module

To enable the dedicated iLO management module:

1. During the server startup sequence after installing the module, press F9 in the POST screen.

The System Utilities screen appears.

2. Select System Configuration | iLO 4 Configuration Utility.

The iLO 4 Configuration Utility screen appears.

3. Select Network Options, and then press Enter.

The Network Options screen appears.

4. Set the Network Interface Adapter field to ON, and then press Enter.

5. Press F10 to save your changes.

82 Dedicated iLO management port module

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A message prompt to confirm the iLO settings reset appears.

6. Press Enter to reboot the iLO settings.

7. Press Esc until the main menu is displayed.

8. Select Reboot the System to exit the utility and resume the boot process.

The IP address of the enabled dedicated iLO connector appears on the POST screen on the subsequent boot-up. Access the Network Options screen again to view this IP address for later reference.

Riser boards

About this task

To remove the component:

CAUTION:

To prevent damage to the server or expansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser board assembly.

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis .

4. Remove the PCI riser cage assembly.

5. In a three-slot riser cage assembly, remove the riser cage bracket from the three-slot riser cage assembly.

6. Remove all expansion boards from the riser cage assembly.

• Remove Accelerator 1 from the FlexibleLOM 2U node riser cage assembly

• Remove Accelerator 2 from the three-slot riser cage assembly

• Remove Accelerator 1 from the three-slot riser cage assembly

7. Disconnect all cables from the riser board.

8. If replacing a riser board in a three-slot riser cage assembly, remove the PCIe transfer board.

9. Remove the failed riser board.

• PCIe x16 left riser board (Single-slot left PCI riser cage assembly)

• PCIe x16 left riser board (Single-slot 2U node PCI riser cage assembly)

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• PCIe x16 right 1U node riser board

• FlexibleLOM x8 1U node riser board

84 Removal and replacement procedures

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• FlexibleLOM x16x8 2U node riser board

• Three-slot PCIe x16 11OS 2U node riser board

Removal and replacement procedures 85

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• Three-slot PCIe x16 GPU-direct 2U node riser board

• Three-slot GPU-direct with re-timer PCIe x16 2U node riser board

86 Removal and replacement procedures

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To replace the component, reverse the removal procedure.

PCIe transfer board

About this task

To remove the component:

Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis .

4. Remove the three-slot PCI riser cage assembly.

5. In a three-slot riser cage assembly, remove the riser cage bracket from the three-slot riser cage assembly.

6. Remove all expansion boards from the riser cage assembly.

• Remove Accelerator 1 from the FlexibleLOM 2U node riser cage assembly

• Remove Accelerator 2 from the three-slot riser cage assembly

• Remove Accelerator 1 from the three-slot riser cage assembly

7. Disconnect all cables from the riser board.

8. Remove the PCIe transfer board.

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To replace the component, reverse the removal procedure.

M.2 SATA SSD enablement board

To remove the component:

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis .

4. In a 2U node, do one of the following:

• Remove the three-slot PCI riser cage assembly.

• Remove the FlexibleLOM 2U node PCI riser cage assembly.

5. Do one of the following:

• Remove the single-slot left PCI riser cage assembly.

• Remove the single-slot 2U node PCI riser cage assembly.

6. If installed, remove the storage controller.

7. Disconnect all cables from the riser board.

8. Loosen the T-15 screw and remove the enablement board from the PCI riser cage assembly.

• Single-slot left PCI riser cage assembly

88 M.2 SATA SSD enablement board

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• Single-slot 2U node PCI riser cage assembly

9. Loosen the T-10 screw and remove the M.2 SATA SSD cards from the failed enablement board.

• Remove the first M.2 SATA SSD card

Removal and replacement procedures 89

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• Remove the second M.2 SATA SSD card

To replace the component, reverse the removal procedure.

Heatsink

90 Heatsink

WARNING:

To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION:

To avoid damage to the processor and system board, only authorized personnel should attempt to replace or install the processor in this node .

CAUTION:

To prevent possible node malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number.

Page 91

CAUTION:

The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed.

IMPORTANT:

Processor socket 1 must be populated at all times or the node does not function.

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis .

4. Place the node on a flat, level surface.

5. In a 2U node, do one of the following:

• Remove the three-slot PCI riser cage assembly.

• Remove the FlexibleLOM 2U node PCI riser cage assembly.

6. Remove the air baffle.

7. Remove the heatsink.

To replace the component:

1. Clean the old thermal grease from the processor with the alcohol swab. Allow the alcohol to evaporate before continuing.

2. Remove the thermal interface protective cover from the heatsink.

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CAUTION:

Heatsink retaining screws should be tightened in diagonally opposite pairs (in an "X" pattern).

3. Install the heatsink:

a. Position the heatsink on the processor backplate. b. Tighten one pair of diagonally opposite screws halfway, and then tighten the other pair of screws. c. Finish the installation by completely tightening the screws in the same sequence.

4. Install the air baffle.

5. Install any removed PCI riser cage assemblies.

6. Install the node into the chassis.

7. Connect all peripheral cables to the node .

8. Power up the node .

92 Removal and replacement procedures

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Processor

About this task

WARNING:

To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.

CAUTION:

To avoid damage to the processor and system board, only authorized personnel should attempt to replace or install the processor in this node .

CAUTION:

To prevent possible node malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number.

CAUTION:

To prevent possible node overheating, always populate processor socket 2 with a processor and a heatsink or a processor socket cover and a heatsink blank.

CAUTION:

To remove the component:

Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis .

4. Place the node on a flat, level surface.

5. In a 2U node, do one of the following:

6. Remove the air baffle.

7. Remove the heatsink.

8. Open each of the processor locking levers in the order indicated, and then open the processor retaining

IMPORTANT:

If installing a processor with a faster speed, update the system ROM before installing the processor.

IMPORTANT:

Processor socket 1 must be populated at all times or the node does not function.

Remove the three-slot PCI riser cage assembly.

•

• Remove the FlexibleLOM 2U node PCI riser cage assembly.

bracket.

Processor 93

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CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid

damage to the system board, do not touch the processor or the processor socket contacts.

9. Remove the processor from the processor retaining bracket.

To replace the component:

1. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE

SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.

94 Removal and replacement procedures

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CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid

damage to the system board, do not touch the processor or the processor socket contacts.

CAUTION:

Do not press down on the processor. Pressing down on the processor might damage the processor socket and the system board. Press only in the area indicated on the processor retaining bracket.

2. Close the processor retaining bracket. When the processor is installed properly inside the processor

retaining bracket, the processor retaining bracket clears the flange on the front of the socket.

3. Press and hold the processor retaining bracket in place, and then close each processor locking lever.

Press only in the area indicated on the processor retaining bracket.

4. Remove the thermal interface protective cover from the heatsink.

Removal and replacement procedures 95

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5. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate before continuing.

6. Apply all the grease to the top of the processor in one of the following patterns to ensure even distribution.

7. Install the heatsink:

96 Removal and replacement procedures

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8. Install the air baffle.

9. Install any removed PCI riser cage assemblies.

10. Install the node into the chassis.

11. Connect all peripheral cables to the node .

12. Power up the node .

Accelerators

Accelerator population rules

Observe the following population rules when installing an accelerator in the node:

• The FlexibleLOM 2U node riser cage assembly supports one accelerator option. Install the accelerator into slot 2.

• A three-slot riser cage assembly supports a maximum of two accelerators.

◦ If installing a single NVIDIA GRID K2 RAF GPU, NVIDIA Tesla K80 GPU, NVIDIA Tesla M60 GPU,

NVIDIA Tesla M40 GPU, NVIDIA Tesla P40 GPU, or NVIDIA Tesla P100 GPU, install it into slot 3 and leave slot 4 empty.

◦ For all other accelerator models, and to ensure proper thermal cooling, populate both slot 3 and slot 4

with accelerators.

◦ The mixing of different accelerator models is not supported.

• If installing an NVIDIA Tesla P100 GPU or NVIDIA Tesla P40 GPU, note the following guidelines and limitations:

◦ The HPE Apollo r2800 Chassis does not support server nodes installed with NVIDIA Tesla P100 GPUs. ◦ If NVIDIA Tesla P40 GPUs are installed in the server node, and the server node is installed in the HPE

Apollo r2200 Chassis, the inlet ambient temperature must be maintained at or below 30°C (86°F).

◦ If NVIDIA Tesla P40 GPUs are installed in the server node, and the server node is installed in the HPE

Apollo r2600 Chassis or HPE Apollo r2800 Chassis, the inlet ambient temperature must be maintained at or below 25°C (77°F).

◦ If NVIDIA Tesla P100 GPUs are installed in the server node, and the server node is installed in the HPE

Apollo r2200 Chassis, the inlet ambient temperature must be maintained at or below 24°C (75.2°F).

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◦ If NVIDIA Tesla P100 GPUs are installed in the server node, and the server node is installed in the HPE

Apollo r2600 Chassis, the inlet ambient temperature must be maintained at or below 20°C (68°F).

◦ To ensure proper thermal cooling when NVIDIA Tesla P40 or NVIDIA Tesla P100 GPUs are installed in

the server node, bezel blanks must be installed in specific drive bays. For more information on supported drive configurations, see the server user guide on the Hewlett Packard Enterprise website.

For more information on the riser board slot specifications, see "PCIe riser board slot definitions."

Supported riser cage assemblies and accelerator power cables

FlexibleLOM 2U node riser cage assembly (PN 798184-B21)

Single accelerator options Power cable 2-pin adapter cable

• Intel Xeon Phi Coprocessor

800288-001 Not supported

5110P

• AMD FirePro S9150 GPU

• NVIDIA Quadro M4000 GPU

• NVIDIA Quadro K4200 GPU Accelerator

• NVIDIA Tesla K40 GPU Accelerator

Three-slot 11OS PCI riser cage assembly (PN 798186-B21)

Dual accelerator options Power cable 2-pin adapter cables

• Intel Xeon Phi Coprocessor 5110P

• AMD FirePro S9150 GPU

Both 825634-001 and 825635-001 are required

Not supported

• NVIDIA Tesla K40 GPU Accelerator

• NVIDIA Tesla M40 GPU Accelerator

Both 825636-001 and 825637-001

are required

Not supported

• NVIDIA Tesla P40 GPU Accelerator

• NVIDIA Tesla P100 GPU Accelerator

• NVIDIA GRID K2 Reverse Air Flow GPU Accelerator

Dual accelerator configurations only. If installing this accelerator model, populate both slot 3 and slot 4 with

Both 825634-001 and 825635-001 are required

accelerators to ensure proper thermal cooling.

The riser cage supports both single and dual accelerator configurations for this accelerator model. If installing a single accelerator, install it into slot 3 and leave slot 4 empty.

Three-slot Enhanced 11OS PCI riser cage assembly (PN 852767-B21)

Dual accelerator options Power cable 2-pin adapter cables

• AMD FirePro S9150 GPU

Both 825634-001 and 825635-001 are required

Dual accelerator configurations only. If installing this accelerator model, populate both slot 3 and slot 4 with accelerators to ensure proper thermal cooling.

98 Supported riser cage assemblies and accelerator power cables

805206-001 required for each accelerator

Not supported

Page 99

Three-slot GPU-direct PCI riser cage assembly (PN 798188-B21)

Dual accelerator options Power cable 2-pin adapter cables

• Intel Xeon Phi Coprocessor 5110P

• AMD FirePro S9150 GPU

Both 825634-001 and 825635-001 are required

Not supported

• NVIDIA Tesla K40 GPU Accelerator

• NVIDIA GRID K2 Reverse Air Flow GPU Accelerator

• NVIDIA Tesla P40 GPU Accelerator

Dual accelerator configurations only. If installing this accelerator model, populate both slot 3 and slot 4 with

Both 825634-001 and 825635-001

are required

Both 826636-001 and 825637-001

are required

805206-001 required for each accelerator

Not supported

accelerators to ensure proper thermal cooling.

The riser cage supports both single and dual accelerator configurations for this accelerator model. If installing a single accelerator, install it into slot 3 and leave slot 4 empty.

Three-slot Enhanced GPU-direct PCI riser cage assembly (PN 852769-B21)

Dual accelerator options Power cable 2-pin adapter cables

• AMD FirePro S9150 GPU

Both 825634-001 and 825635-001

Not supported

are required

Dual accelerator configurations only. If installing this accelerator model, populate both slot 3 and slot 4 with accelerators to ensure proper thermal cooling.

Three-slot GPU-direct with re-timer PCI riser cage assembly (PN 827353-B21)

Dual accelerator options Power cable 2-pin adapter cables

• AMD FirePro S7150 GPU

Both 825634-001 and 825635-001

Not supported

are required

• NVIDIA Tesla K80 GPU Accelerator

Both 825636-001 and 825637-001 are required

Not supported

• NVIDIA Tesla M60 GPU Accelerator

• NVIDIA Tesla M40 GPU Accelerator

• NVIDIA Tesla P100 GPU Accelerator

Dual accelerator configurations only. If installing this accelerator model, populate both slot 3 and slot 4 with

accelerators to ensure proper thermal cooling.

The riser cage supports both single and dual accelerator configurations for this accelerator model. If installing a single accelerator, install it into slot 3 and leave slot 4 empty.

For more information, see "Accelerator cabling."

Replacing Accelerator 1 in the FlexibleLOM 2U node riser cage assembly

About this task

To remove the component:

Replacing Accelerator 1 in the FlexibleLOM 2U node riser cage assembly 99

Page 100

Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis .

4. Place the node on a flat, level surface.

5. Remove the FlexibleLOM 2U node riser cage assembly.

6. Disconnect the accelerator power cable from the bayonet board.

7. Disconnect the accelerator power cable from Accelerator 1.

8. Remove Accelerator 1 from the FlexibleLOM 2U node riser cage assembly.

9. If replacing a NVIDIA Tesla K40 GPU, remove the front support bracket. Keep this bracket and install it

onto the new K40 GPU.

To replace the component, reverse the removal procedure.

Replacing Accelerator 1 in a three-slot riser cage assembly

About this task

Procedure

1. Power down the node .

2. Disconnect all peripheral cables from the node .

3. Remove the node from the chassis .

4. Place the node on a flat, level surface.

5. Remove the three-slot riser cage assembly.

6. Disconnect the accelerator power cable from the bayonet board.

7. Remove the riser cage bracket from the three-slot riser cage assembly.

8. Disconnect all cables from the accelerators.

9. Remove Accelerator 2 from the three-slot riser cage assembly.

10. Remove Accelerator 1 from the three-slot riser cage assembly.

To replace the component:

1. If replacing a NVIDIA Tesla K40 GPU, remove the front support bracket. Keep this bracket and install it

onto the new K40 GPU.

100 Replacing Accelerator 1 in a three-slot riser cage assembly

HP Apollo 2000 System Maintenance And Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

HPE Apollo 2000 System Maintenance and Service Guide

Contents

HPE Apollo 2000 System

Introduction

Customer self repair

Illustrated parts catalog

System components

Chassis system components

Node system components

Removal and replacement procedures

Required tools

Safety considerations

Preventing electrostatic discharge

Symbols on equipment

Server warnings and cautions

Rack warnings

Preparation procedures

Power down the system

Power down the node

Remove the node from the chassis

Remove the node blank from the chassis

Remove the power supply

Remove the chassis from the rack

Remove the security bezel

Remove the PDB cover

Remove the chassis access panel

Remove the fan cages

Remove the chassis PDB assembly

Remove the rear I/O blank

Remove the air baffle

Remove the bayonet board assembly

Remove the PCI riser cage assembly

Single-slot left PCI riser cage assembly

Single-slot 1U node right PCI riser cage assemblies

FlexibleLOM 1U node riser cage assembly

Single-slot 2U node PCI riser cage assembly

FlexibleLOM 2U node riser cage assembly

Three-slot riser cage assemblies

Remove the riser cage bracket from the three-slot riser cage assembly

Remove Accelerator 1 from the FlexibleLOM 2U node riser cage assembly

Remove Accelerator 1 from the three-slot riser cage assembly

Remove Accelerator 2 from the three-slot riser cage assembly

Chassis assembly

Power distribution board (PDB)

Drive bay mapping for the HPE Apollo r2800 Chassis

Factory default configuration

Mapping drive bays

PDB pass-through board

RPS link board

RCM 2.0 cable

Drive backplane

Storage expander card (HPE Apollo r2800 Chassis only)

Fan module

HPE Smart Storage Battery

RCM module

RCM 2.0 to 1.0 adapter cable

Hot-plug drive

Bezel ear

FBWC module

Dedicated iLO management port module

Enabling the dedicated iLO management module

Riser boards

PCIe transfer board

M.2 SATA SSD enablement board

Heatsink

Processor

Accelerators

Accelerator population rules

Supported riser cage assemblies and accelerator power cables

Replacing Accelerator 1 in the FlexibleLOM 2U node riser cage assembly

Replacing Accelerator 1 in a three-slot riser cage assembly