HP an1354 schematic

Practical Noise-Figure Measurement and Analysis for Low-Noise Amplifier Designs
Application Note 1354
Table of contents
Introduction
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
The design process . . . . . . . . . . . . . . . . . . . . . . . . .3
Software modeling . . . . . . . . . . . . . . . . . . . . . . . .3
Functional requirements . . . . . . . . . . . . . . . . . . . .3
Raw device modeling . . . . . . . . . . . . . . . . . . . . . .4
Design completion . . . . . . . . . . . . . . . . . . . . . . . .5
Design verification . . . . . . . . . . . . . . . . . . . . . . . . .6
Performance simulation . . . . . . . . . . . . . . . . . . . .6
Layout and prototype . . . . . . . . . . . . . . . . . . . . . .6
Design fine-tuning . . . . . . . . . . . . . . . . . . . . . . . . .7
Performance measurements . . . . . . . . . . . . . .7
Network measurements . . . . . . . . . . . . . . . . .7
Narrow band NF measurements . . . . . . . . . . . . .8
Receiver sensitivity . . . . . . . . . . . . . . . . . . . . .8
Why measure narrow band NF? . . . . . . . . . . .8
Narrow band example . . . . . . . . . . . . . . . . . . .9
Measuring narrow band NF . . . . . . . . . . . . . .9
Microwave NF measurements . . . . . . . . . . . . . .10
Swept LO . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Swept IF . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Mixer and receiver NF measurements . . . . . . . .12
Measurement uncertainty . . . . . . . . . . . . . . . . .13
Extraneous signals . . . . . . . . . . . . . . . . . . . . . . .13
Nonlinearities . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Instrumentation uncertainty . . . . . . . . . . . . . . . .14
Excess noise ratio (ENR) uncertainty . . . . . . . .15
Mismatch uncertainty . . . . . . . . . . . . . . . . . . . . .15
Instrument architecture uncertainty . . . . . . . . .16
Instrument NF . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Unwanted in-band power . . . . . . . . . . . . . . . . . .16
Overall uncertainty . . . . . . . . . . . . . . . . . . . . . . .17
Understanding and accurately measuring noise figure (NF) in low-noise elements has become particularly important to the development of next-generation communications systems. This application note examines the process of making practical noise­figure (NF) measurements of low-noise amplifiers (LNAs) – a capability that can have a significant impact on cost, performance, and required design time for wireless receivers.
The examination begins by looking at a representative LNA block design. Software simulation is leveraged as a vehicle for demonstration and provides a bench­mark for subsequent NF measurement and analysis. The design example reveals the typical steps required to take an LNA block from concept to production. At the prototype stage, actual NF measurements can be taken, and the data compared with simulated perfor­mance.
For nearly 20 years, standard techniques and methods for measuring the NF in LNAs for wireless receivers served the emerging commercial industry well, and have remained relatively unchanged. But over the past few years, the performance of RF systems has improved significantly, placing tighter limits on NF specifications and greater measurement accuracy. Some of the important features available in contem­porary NF analyzers are presented.
Going a step further, narrow bandwidth NF measure­ment concepts and requirements are introduced. For instance, a bandpass filter is combined with an amplifier block to yield a suitable method for making a practical narrow-band measurement. Further, NF measurements for frequency-conversion devices and systems are explored, as well as consideration of various options for measuring NF at microwave fre­quencies.
As the performance of RF devices continues to improve, assessing NF measurement uncertainty becomes increasingly valuable. The primary components affecting ambiguity in measurement are presented, as well as a useful methodology for approximating the overall effect of measurement uncertainty.
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The design process
Functional requirements
LNA design typically begins by assessing functional requirements for the application. Candidate devices are then selected based on specifications including NF, stability, unilateral gain, and dynamic range. The actual design work starts with S-parameters and choice of an appropriate bias technique for the device, followed by synthesis of matching networks. Layout includes choosing vendor-specific parts, adding inter­connections and pads, followed by floor planning. The performance is then analyzed, and the design is optimized to assure requirements can be met using specific vendor parts. Finally, the overall design is reviewed.
Software modeling
The development of cost-effective amplifier designs for wireless communications systems would be virtually impossible without the use of advanced software-based modeling technology. Today’s high­caliber tools typically provide an easy-to-use hierar­chical, windows-based user interface as illustrated in Figure 1.
For illustration, the example amplifier is intended for a handheld phone application, and will require a gen­eral low-noise receiver front-end to cover the 1.8GHz and 2.3GHz mobile phone bands. Additional functional requirements are listed below.
Frequency range: 1.5-2.5GHz
NF: <1dB
Gain: >10dB
VSWR: <2.0:1
Supply voltage: 3V
The sub 1dB NF is important in this application, taking on even greater importance than voltage standing wave ratio (VSWR). However, a VSWR of 2.0:1 or better is still highly desirable. Since the design is intended for a portable device, low voltage operation using a 3-volt battery is required. Cost is also a key constraint, while space is slightly less critical. A distributed, microstrip matching circuit will therefore be used to minimize component count.
Figure 1. Tools such as Agilent’s Advanced Design System (ADS) provide an intuitive, windows-based interface. Throughout this document, ADS is utilized to demonstrate all models, schematics and simulation results. The Main window in ADS, shown at the upper left, serves as a file manager and a portal to other ADS windows such as the Layout or Schematic & Test Bench windows. The Graphic Server window (upper right) offers a visual means of viewing, printing, and analyzing data from completed simulations.
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Selecting a device
Although an array of process and device technologies may be suitable for the intended application, the selected device for this example is an ultra low-noise amplifier fabricated in a pseudomorphic high-electron mobility transistor (PHEMT) gallium arsenide (GaAs) process. The device features 0.5dB NF, +14dBm third­order intercept point, and 17.5dB gain at 2GHz, 4V, 60mA. The transistor is optimized for 0.9GHz to 2.5GHz cellular PCS low-noise amplifiers (LNAs). The wide gate width of the this device exhibits impedances that are relatively easy to match, and the 1dB NF requirement should also be easy to meet. The S-para­meters and noise parameters for this device are shown in Figure 2.
Figure 3. This is the basic schematic of the amplifier using the ultra­low-noise ATF-34143 transistor. The model represents the raw device with source resistance indicated for a self-biased condition.
The model accounts for through-hole vias and selected source inductances produced by the printed circuit board. Some source inductance can be beneficial, because of its impact on input impedance and low­frequency stability. On the other hand, too much inductance can cause high-frequency gain peaking, which results in oscillations. With an 800 micron gate width, the device in the example design exhibits rea­sonable tolerance to these effects. However, these parasitics need to be included in the model since they affect input and output impedance, which must be matched.
Figure 2. S-parameters and noise parameters for the ultra-low noise transistor in the design example (the Agilent ATF-34143). The file, as shown, is downloadable from the Agilent website formatted for use directly with ADS.
Raw device modeling
The schematic of the amplifier device, shown in Figure 3, reveals some source resistance for self bias. This configuration forces the gate negative with respect to the source, allowing the drain current to be set with the source resistor (Rs=Vgs/Id). This simple biasing technique is very appealing, since it reduces the overall parts count. The source resistor is AC bypassed, using a low-impedance capacitor with the desired operating frequency.
The Smith chart in Figure 4 provides a convenient way to examine the various impedances for the tar­get device, which in turn can be leveraged to synthe­size an appropriate matching network.
Figure 4. Simulated noise and S-parameters for the transistor model, with S11, S22 and NFmin plotted on a Smith chart.
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Device matching
Design completion
From the Smith chart it is clear that the device exhibits some capacitive behavior. Therefore, the matching network can be a simple high-pass impedance circuit fashioned from a series capacitor and shunt inductor as seen in Figure 5.
Figure 5. Since the device is capacitive, a simple high-pass impedance circuit can be used for the matching network.
The high-pass topology is especially well suited for personal communications services (PCS) and wireless LAN applications since it offers sufficient low-frequency gain reduction, which can minimize the amplifier’s susceptibility to cellular and pager transmitter over­load. A similar high-pass structure is used for the output impedance matching network, which is opti­mized for best-return loss and output power.
There are a number of options to determine component parameters for the matching network. Manual calcu­lation using the device’s impedances represents the most basic approach. Alternately, while most engineers are reluctant to use the Smith chart, it provides a simple, intuitive way of manipulating impedance, and therefore developing matching networks. Modeling software is another method of synthesizing and opti­mizing matching networks based on input and output impedances.
After the initial optimization, finishing touches can be made to the amplifier model. Inductors are replaced with distributed elements and discrete components are replaced with parts from vendor libraries as seen in Figure 6.
Figure 6. Here are the synthesized matching circuits for the ultra-low­noise transistor example. After requirements for input and output return loss, NF and gain are entered, the software optimizes matching circuit parameters for best results. Inductances are substituted with distributed elements and discrete components are replaced with behavioral models of actual parts from vendor libraries.
The 50resistor between the input inductor and ground provides a DC return for the gate terminal of the device. This also supplies an effective low-frequency resistive termination for the device, which is necessary for stable device operation. In addition to being part of the matching network, the output inductor doubles as a way of decoupling the power supply.
With all components defined and the effects of through-hole vias included in the model, the circuit is once again optimized and its performance is assessed. At this point, parameters and components can be re-tuned if required.
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Design verification
Layout and prototype
Performance simulation
When the finished design is simulated, it looks like the effort is on track so far. NF for the amplifier easily meets the requirement of less than 1dB, peaking at around 0.85dB as seen in Figure 7. The design also supplies adequate gain. Input and output VSWRs are also entirely respectable, although they do peak at the specified upper limit of 2.0:1.
No matter how good simulations look, the ultimate goal is a working circuit. Simulations are wholly dependent on the accuracy of device models – they cannot replace actual measurements on real circuits. Simulation is merely a tool that speeds up the design process. The real ‘proof of the pudding’ is in the pro­totype circuit.
Creating the prototype starts by generating a layout for the amplifier as shown in Figure 8. Once the schemat­ic is imported into a layout tool, such as the Layout module in ADS, components, grounding planes, and transmission lines are placed. The distributed inductors, which can clearly be seen in Figure 8, were inten­tionally made longer than required to enable later modification.
Layouts created in one software modeling tool can usually be ported to other tools. This simplifies the task of developing sub-systems of a design indepen­dently, for later integration. The layout shown in Figure 8 was used to build the finished prototype in Figure 9.
Figure 7. These plots show simulated NF as well as gain and match for the finished amplifier design.
Figure 8. This layout was generated in a layout tool directly from the schematic. The layout was printed on high-quality film using a standard inkjet printer, which was then used to produce the PCB from Rogers 4350 material for the prototype.
Figure 9. The prototype amplifier.
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