
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
1.0 Items Requiring Selective Treatment
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
All types including standard alkaline and lithium coin
or button style batteries
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
2
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Product End-of-Life Disassembly Instructions
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
Tool Size (if
applicable)
Cross head
of screwdriver
3.0 Product Disassembly Process
and materials requiring selective treatment can be removed.
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Follow steps described in Disassembly instruction (file attached)
2. If parts can be removed without using a tool, remove it first.
3. Use correct screwdriver and torque value before unlock the screw.
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01

Deschutes Disassembly
Deschutes Disassembly Introduction
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Deschutes Disassembly
This chapter contains step-by-step procedures on how to disassemble and
reassemble the PAD for maintenance and troubleshooting.
IMPORTANT:
1. The use of metal tools during disassembly may damage the casing. Use
plastic tools where possible.
2. Cover the work area with a clean, dry, lint-free cloth before placing the PAD face
down.
3. Please turn off your device before disassembly
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Deschutes Disassembly
NOTE: PLEASE ENSURE THE SD CARD AND SIM CARD HAVE BEEN REMOVED BEFORE
TEARDOWN THE TABLET.
Remove SD card and SIM card
Open the SD/SIM card cap as shown in picture and remove the SD/SIM card from its slot.
Remove the battery cover.
Insert the pry bar as shown in picture, slide up and down to release battery cover.
Below is the general view after the battery cover is removed.
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Deschutes Disassembly
Remove the Battery
Lift up the battery connector gently as shown in picture.
Lift up and remove the battery as shown in picture.
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Deschutes Disassembly
Remove the side key
Remove the side key with tweezers as shown in picture.
Remove the diversity antenna
Disconnect the RF connector.
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Deschutes Disassembly
Unscrew below 2 screws as shown in picture.
Lift up the frame and peel off it from front cover gently.
Remove the Sub-mainboard
Disconnect the TP connector as shown in picture.
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Deschutes Disassembly
Release the mic by using tweezers as shown in picture.
Disconnect the BTB connector as below and remove the connector FPC.
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Deschutes Disassembly
Unsolder the connector as marked in picture to remove the mic.
Separate the sub-mainboard from front cover assy.
Remove the Audio frame
Unscrew below 2 screws by using Philips screwdriver then remove the audio frame.
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Deschutes Disassembly
Remove the speaker frame assy
Take apart three screws below by using Philips screwdriver.
Unsolder the speaker connector with soldering iron.
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Deschutes Disassembly
Lift up the speaker frame assy and separate the speaker from antenna frame by using tweezers.
Remove the Rear Camera
Disconnect the Rear Camera connector by using tweezers and remove it.
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Deschutes Disassembly
Separate the rear camera rubber from camera
Remove the Mainboard
Unsnap the LCD FPC connector by using tweezers and disconnect FPC.
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Deschutes Disassembly
Unsnap the Front camera connector as shown in picture.
Unsnap the Side key FPC connector by using tweezers as shown in picture and peel off it from
front cover assy gently.
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Deschutes Disassembly
Remove below four screws by using Philips screwdriver.
Lift up and remove the Mainboard gently.
Remove Front Camera
Remove the front camera from Mainboard gently.
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Deschutes Disassembly
Separate the camera and camera rubber below.
The end
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