HP HCPL-2730, HCPL-4701, HCPL-2731, HCPL-073A, HCPL-0731 Datasheet

Low Input Current, High Gain
Optocouplers

Technical Data

6N139 6N138 HCPL-0701 HCPL-0700 HCNW139 HCNW138

Features

• High Current Transfer Ratio
– 2000% Typical (4500%
Typical for HCNW139/138)

• Low Input Current
Requirements – 0.5 mA

• TTL Compatible Output –

0.1 V VOL Typical

• Performance Guaranteed
over Temperature 0°C
to 70°C

• Base Access Allows Gain
Bandwidth Adjustment

• High Output Current –
60 mA

• Safety Approval

UL Recognized – 2500 V rms

for 1 Minute and 5000 V rms*

for 1 Minute per UL 1577
CSA Approved
VDE 0884 Approved with

V

= 1414 V peak for

IORM

HCNW139 and HCNW138
BSI Certified (HCNW139 and

HCNW138)

• Available in 8-Pin DIP or
SOIC-8 Footprint or
Widebody Package

•MIL-STD-1772 Version
Available (HCPL-5700/1)

Applications

• Ground Isolate Most Logic
Families – TTL/TTL, CMOS/
TTL, CMOS/CMOS, LSTTL/
TTL, CMOS/LSTTL

• Low Input Current Line
Receiver

• High Voltage Insulation
(HCNW139/138)

• EIA RS-232C Line Receiver

• Telephone Ring Detector

• 117 V ac Line Voltage Status
Indicator – Low Input Power
Dissipation

• Low Power Systems –
Ground Isolation

Functional Diagram

NC

ANODE

CATHODE

NC

1

2

3

4

8

V

CC

7

V

B

6

V

O

5

GND

Description

These high gain series couplers
use a Light Emitting Diode and an
integrated high gain photodetec­tor to provide extremely high
current transfer ratio between
input and output. Separate pins
for the photodiode and output
stage result in TTL compatible
saturation voltages and high
speed operation. Where desired
the VCC and VO terminals may be
tied together to achieve conven­tional photodarlington operation.
A base access terminal allows a
gain bandwidth adjustment to be
made.

TRUTH TABLE

LED

ON

OFF

V



O


LOW
HIGH

*5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only.
A 0.1 µF bypass capacitor connected between pins 8 and 5 is recommended.

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.

2

The 6N139, HCPL-0701, and
CNW139 are for use in CMOS,
LSTTL or other low power appli­cations. A 400% minimum current
transfer ratio is guaranteed over
0 to 70°C operating range for only

0.5 mA of LED current.

(1 TTL Unit load ). A 300%
minimum CTR enables operation
with 1 TTL Load using a 2.2 kΩ
pull-up resistor.

Selection for lower input current
down to 250 µA is available upon
request.

The SOIC-8 does not require
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface

mount processes.
The 6N138, HCPL-0700, and
HCNW138 are designed for use
mainly in TTL applications.
Current Transfer Ratio (CTR) is
300% minimum over 0 to 70°C
for an LED current of 1.6 mA

The HCPL-0701 and HCPL-0700
are surface mount devices
packaged in an industry standard
SOIC-8 footprint.

The HCNW139 and HCNW138

are packaged in a widebody

encapsulation that provides creep-

age and clearance dimensions

suitable for safety approval by

regulatory agencies worldwide.

Selection Guide

Widebody

8-Pin DIP Package Hermetic

(300 Mil) Small Outline SO-8 (400 mil) Single and

Dual Single Dual Minimum Absolute Dual

Single Channel Channel Channel Single Input ON Maxi- Channel
Channel Package Package Package Channel Current Minimum mum Packages
Package HCPL- HCPL- HCPL- Package (I

4731

[1]

[1]

[1]

0701 0731 HCNW139 0.5 mA 400% 18 V
0700 0730 HCNW138 1.6 mA 300% 7 V

070A

[1]

073A

[1]

6N139 2731

6N138 2730

HCPL-4701

[1]

) CTR V

F

40 µA 800% 18 V

0.5 mA 300% 20 V 5701

CC

HCPL-

[1]
[1]

5700

[1]

5731

[1]

5730

Note:

1. Technical data are on separate HP publications.

3

Ordering Information

Specify Part Number followed by Option Number (if desired).

Example:

6N139#XXX

020 = 5000 V rms/1 Minute UL Rating Option*
300 = Gull Wing Surface Mount Option†
500 = Tape and Reel Packaging Option

Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for
information.

*For 6N139 and 6N138 only.
†Gull wing surface mount option applies to through hole parts only.

Schematic

ANODE

CATHODE

V

CC

8

I

CC

I

F

2
+

V

F

–

I

3

SHIELD

I

B

7

V

B

O

6

V

O

5

GND

Package Outline Drawings

8-Pin DIP Package (6N139/6N138)**

4

7.62 ± 0.25

(0.300 ± 0.010)

6.35 ± 0.25

(0.250 ± 0.010)

5° TYP.

TYPE NUMBER

1.19 (0.047) MAX.

1.080 ± 0.320

(0.043 ± 0.013)

**JEDEC Registered Data.

9.65 ± 0.25

(0.380 ± 0.010)

HP XXXXZ

YYWW

5678

OPTION CODE*
DATE CODE

UR

UL
RECOGNITION

4321

1.78 (0.070) MAX.

4.70 (0.185) MAX.

2.92 (0.115) MIN.

0.65 (0.025) MAX.

2.54 ± 0.25

(0.100 ± 0.010)

0.51 (0.020) MIN.

DIMENSIONS IN MILLIMETERS AND (INCHES).
*MARKING CODE LETTER FOR OPTION NUMBERS

"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.

8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138)

0.254

(0.010

+ 0.076

- 0.051

+ 0.003)

- 0.002)

1.19

(0.047)

MAX.

1.080 ± 0.320

(0.043 ± 0.013)

9.65 ± 0.25

(0.380 ± 0.010)

6

7

8

1

2

2.54

(0.100)

BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

5

6.350 ± 0.25

(0.250 ± 0.010)

3

4

1.780

(0.070)

MAX.

4.19

MAX.

(0.165)

0.635 ± 0.130

(0.025 ± 0.005)

PAD LOCATION (FOR REFERENCE ONLY)

1.016 (0.040)

1.194 (0.047)

4.826

TYP.

(0.190)



0.381 (0.015)

1.194 (0.047)

1.778 (0.070)

9.65 ± 0.25

(0.380 ± 0.010)

7.62 ± 0.25

(0.300 ± 0.010)

0.635 ± 0.25

(0.025 ± 0.010)

0.635 (0.025)

0.254

(0.010

12° NOM.

9.398 (0.370)

9.906 (0.390)

+ 0.076

- 0.051

+ 0.003)

- 0.002)

Small Outline SO-8 Package (HCPL-0701/HCPL-0700)

5

8765

3.937 ± 0.127

(0.155 ± 0.005)

PIN ONE

0.406 ± 0.076

(0.016 ± 0.003)

3.175 ± 0.127

(0.125 ± 0.005)

TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)

*

5.207 ± 0.254 (0.205 ± 0.010)

DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.

XXX

YWW

*

5.080 ± 0.127

(0.200 ± 0.005)

(0.236 ± 0.008)

4321

1.270

(0.050)

(0.060)

5.994 ± 0.203

TYPE NUMBER
(LAST 3 DIGITS)

DATE CODE

BSG

1.524

8-Pin Widebody DIP Package (HCNW139/HCNW138)

0 ~ 7°

7°

0.305

(0.012)

45° X

0.203 ± 0.102

(0.008 ± 0.004)

MIN.

0.432

(0.017)

0.228 ± 0.025

(0.009 ± 0.001)

2.54 (0.100)
TYP.

1.78 ± 0.15

(0.070 ± 0.006)

11.15 ± 0.15

(0.442 ± 0.006)

7

8

HP 

HCNWXXXX

YYWW

1

2

11.00

MAX.

(0.433)

6

5

TYPE NUMBER
DATE CODE



3

4

1.55

(0.061)

MAX.

3.10 (0.122)

3.90 (0.154)

0.40 (0.016)

0.56 (0.022)

0.51 (0.021) MIN.

9.00 ± 0.15

(0.354 ± 0.006)

10.16 (0.400)
TYP.

7° TYP.

5.10

MAX.

(0.201)

DIMENSIONS IN MILLIMETERS (INCHES).

0.254

(0.010

+ 0.076

- 0.0051
+ 0.003)

- 0.002)