HP HCPL-530K, HCPL-5301, HCPL-5300, 5962-9685201HYC, 5962-9685201HYA Datasheet

...
1-498
H
Intelligent Power Module and Gate Drive Interface Optocouplers
Technical Data
Applications
• Military and Space
• Harsh Industrial Environments
• Transportation, Medical, and Life Critical Systems
• IPM Isolation
• Isolated IGBT/MOSFET Gate Drive
• AC and Brushless DC Motor Drives
• Industrial Inverters
Description
The HCPL-5300/5301 devices consist of a GaAsP LED optically coupled to an integrated high gain photo detector in a hermetically sealed package. The
The connection of a 0.1 µF bypass capacitor between pins 5 and 8 is recommended.
products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF­38534 Class Level H or K testing or from the DESC Drawing 5962-
96852. All devices are manufactured and tested on a MIL-PRF-38534 certified line and are included in the DESC Qualified Manufacturers List QML-38534 for Hybrid Micro­circuits. Minimized propagation delay difference between devices make these optocouplers excellent solutions for improving inverter efficiency through reduced switching dead time. An on chip 20 k output pull-up resistor can be enabled by shorting output pins 6 and 7, thus eliminating the need for an external pull-up resistor in common IPM applica­tions. Specifications and performance plots are given for typical IPM applications.
HCPL-5300 HCPL-5301 5962-96852
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
Features
• Performance Specified Over Full Military Temperature Range: -55°C to 125°C
• Fast Maximum Propagation Delays t
PHL
= 450 ns,
t
PLH
= 650 ns
• Minimized Pulse Width Distortion (PWD = 450 ns)
• High Common Mode Rejection (CMR): 10 kV/µs at VCM = 1000 V
• CTR > 30% at IF = 10 mA
• 1500 Vdc Withstand Test Voltage
• Manufactured and Tested on a MIL-PRF-38534 Certified Line
• Hermetically Sealed Packages
• Dual Marked with Device Part Number and DESC Drawing Number
• QML-38534, Class H and K
• HCPL-4506 Function Compatibility
8
7
6
1
3
SHIELD
5
2
4
20 k
Schematic Diagram
Truth Table
LED V
O
ON L
OFF H
5964-9648E
1-499
Selection Guide-Package Styles and Lead Configuration Options
HP Part # and Options
Commercial HCPL-5300
MIL-PRF-38534, Class H HCPL-5301
MIL-PRF-38534, Class K HCPL-530K
Standard Lead Finish Gold Plate
Solder Dipped Option #200 Butt Cut/Gold Plate Option #100 Gull Wing/Soldered Option #300
SMD Part #
Prescript for all below 5962-
Either Gold or Solder 9685201HPX
Gold Plate 9685201HPC
Solder Dipped 9685201HPA Butt Cut/Gold Plate 9685201HYC
Butt Cut/Soldered 9685201HYA
Gull Wing/Soldered 9685201HXA
Outline Drawing
3.81 (0.150) MIN.
4.32 (0.170)
MAX.
9.40 (0.370)
9.91 (0.390)
0.51 (0.020) MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020) MIN.
0.76 (0.030)
1.27 (0.050)
8.13 (0.320) MAX.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
7.16 (0.282)
7.57 (0.298)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1-500
Device Marking
Hermetic Optocoupler Options
Option Description
100 Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This
option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details).
200 Lead finish is solder dipped rather than gold plated. This option is available on commercial
and hi-rel product in 8 pin DIP. DESC Drawing part numbers contain provisions for lead finish.
300 Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly.
This option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details). This option has solder dipped leads.
1.14 (0.045)
1.40 (0.055)
4.32 (0.170) MAX.
0.51 (0.020) MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020) MIN.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED)
HP QYYWWZ
XXXXXX
XXXXXXX
XXX USA
50434
COUNTRY OF MFR. HP FSCN*
HP LOGO
DESC SMD*
PIN ONE/
ESD IDENT
HP P/N
DESC SMD*
* QUALIFIED PARTS ONLY
0.51 (0.020) MIN.
5.57 (0.180) MAX.
0.51 (0.020) MAX.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
9.65 (0.380)
9.91 (0.390)
5° MAX.
5.57 (0.180) MAX.
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1-501
Absolute Maximum Ratings
Storage Temperature (TS) ............................................................................................................. -65 to 150°C
Operating Temperature (TA) ......................................................................................................... -55 to 125°C
Junction Temperature (TJ) ...................................................................................................................... 175°C
Average Input Current (I
F(AVG)
) ............................................................................................................... 25 mA
Peak Input Current (50% duty cycle, 1 ms pulse width) (I
F(PEAK)
) ........................................................ 50 mA
Peak Transient Input Current (<1 µs pulse width, 300 pps) (I
F(TRAN)
) ..................................................... 1.0 A
Reverse Input Voltage (Pin 3-2) (VR)............................................................................................................ 5 V
Average Output Current (Pin 6) (I
O(AVG)
) ................................................................................................ 15 mA
Resistor Voltage (Pin 7) (V7) ......................................................................................................... -0.5 V to V
CC
Output Voltage (Pin 6-5) (VO) ........................................................................................................ -0.5 to 30 V
Supply Voltage (Pin 8-5) (VCC) ....................................................................................................... -0.5 to 30 V
Output Power Dissipation (PO)............................................................................................................. 100 mW
Total Power Dissipation (PT)................................................................................................................ 145 mW
Lead Solder Temperature (soldering, 10 seconds) .................................................................................. 260°C
ESD Classification
(MIL-STD-883, Method 3015)
HCPL-5300/5301 ......................(),Class 1
Recommended Operating Conditions
Parameter Symbol Min. Max. Units
Power Supply Voltage V
CC
4.5 30 Volts
Output Voltage V
O
0 30 Volts
Input Current (ON) I
F(ON)
10 20 mA
Input Voltage (OFF) V
F(OFF)
-5 0.8 V
1-502
Electrical Specifications
Over recommended operating conditions (TA = -55°C to +125°C, VCC = +4.5 V to 30 V, I
F(ON)
= 10 mA to 20 mA, V
F(OFF)
= -5 V to 0.8 V) unless otherwise specified.
Group A
Sub-
Parameter Symbol groups
[12]
Min. Typ.* Max. Units Test Conditions Fig. Note
Current Transfer CTR 1, 2, 3 30 90 % IF = 10 mA, VO = 0.6 V 1 Ratio
Low Level Output I
OL
1, 2, 3 3.0 9.0 mA IF = 10 mA, VO = 0.6 V 1, 2
Current Low Level Output V
OL
1, 2, 3 0.3 0.6 V IO = 2.4 mA
Input Threshold I
TH
1, 2, 3 1.5 5.0 mA VO = 0.8 V, 1 7
Current IO = 0.75 mA High Level I
OH
1, 2, 3 5 75 µAVF = 0.8 V 3
Output Current High Level Supply I
CCH
1, 2, 3 0.6 1.5 mA VF = 0.8 V, VO = Open 7
Current Low Level Supply I
CCL
1, 2, 3 0.6 1.5 mA IF = 10 mA, VO = Open 7
Current Input Forward V
F
1, 2, 3 1.0 1.5 1.8 V IF = 10 mA 4
Voltage Temperature VF/ -1.6 mV/°CIF = 10 mA
Coefficient of T
A
Forward Voltage Input Reverse BV
R
1, 2, 3 5 V IR = 100 µA
Breakdown Voltage Input Capacitance C
IN
90 pF f = 1 MHz, VF = 0 V
Input-Output I
I-O
1 1.0 µA RH = 45%, t = 5 sec, 2
Insulation Leakage V
I-O
= 1500 Vdc,
Current TA = 25° C Resistance R
I-O
10
12
V
I-O
= 500 Vdc 2
(Input-Output) Capacitance C
I-O
2.4 pF f = 1 MHz 2
(Input-Output) Internal Pull-up R
L
1 142028kΩTA = 25° C 4, 5,
Resistor 6 Internal Pull-up RL/ 0.014 k/°C
Resistor T
A
Temperature Coefficient
*All typical values at 25°C, VCC = 15 V.
Voltage
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