HP HCPL-5401, HCPL-5400, HCPL-543K, HCPL-643K, HCPL-6431 Datasheet

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GND

Hermetically Sealed, Very High Speed, Logic Gate Optocouplers

Technical Data

Features

• Dual Marked with Device Part Number and DESC Drawing Number

• Manufactured and Tested on a MIL-PRF-38534 Certified Line

• QML-38534, Class H and K

• Three Hermetically Sealed Package Configurations

• Performance Guaranteed over -55°C to +125°C

• High Speed: 40 M bit/s

• High Common Mode Rejection 500 V/µs Guaranteed

• 1500 Vdc Withstand Test Voltage

• Active (Totem Pole) Outputs

• Three Stage Output Available

• High Radiation Immunity

• HCPL-2400/30 Function Compatibility

• Reliability Data

• Compatible with TTL, STTL, LSTTL, and HCMOS Logic Families

Applications

• Military and Space

• High Reliability Systems

• Transportation, Medical, and Life Critical Systems

• Isolation of High Speed Logic Systems

Each channel contains an AlGaAs light emitting diode which is optically coupled to an integrated high gain photon detector. This combination results in very high

HCPL-540X* 5962-89570 HCPL-543X

Functional Diagram

Multiple Channel Devices Available

Single Channel DIP

Input Enable Output

On (H) L L Off (L) L H On (H) H Z Off (L) H Z

Truth Tables

(Positive Logic)

Multichannel Devices

Input Output

On (H) H Off (L) L

HCPL-643X 5962-89571

*See matrix for available extensions.

• Computer-Peripheral Interfaces

• Switching Power Supplies

• Isolated Bus Driver (Networking Applications)(5400/1 Only)

• Pulse Transformer Replacement

• Ground Loop Elimination

• Harsh Industrial Environments

• High Speed Disk Drive I/O

• Digital Isolation for A/D, D/A Conversion

Description

These units are single and dual channel, hermetically sealed optocouplers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level H or K testing or from the appropriate DESC Drawing. All devices are manufactured and tested on a MIL-PRF-38534 certified line and are included in the DESC Qualified Manufacturers List QML-38534 for Hybrid Microcircuits.

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.

5965-3004E

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Selection Guide–Package Styles and Lead Configuration Options

Package 8 Pin DIP 8 Pin DIP 20 Pad LCCC

Lead Style Through Hole Through Hole Surface Mount Channels 1 2 2 Common Channel None VCC, GND None

Wiring

HP Part # & Options

Commercial HCPL-5400 HCPL-5430 HCPL-6430 MIL-PRF-38534, Class H HCPL-5401 HCPL-5431 HCPL-6431 MIL-PRF-38534, Class K HCPL-540K HCPL-543K HCPL-643K Standard Lead Finish Gold Plate Gold Plate Solder Pads Solder Dipped Option #200 Option #200 Butt Cut/Gold Plate Option #100 Option #100 Gull Wing/Soldered Option #300 Option #300

SMD Part #

Prescript for all below 5962- 5962- 5962Either Gold or Solder 8957001PX 8957101PX 89571022X Gold Plate 8957001PC 8957101PC Solder Dipped 8957001PA 8957101PA 89571022A Butt Cut/Gold Plate 8957001YC 8957101YC Butt Cut/Soldered 8957001YA 8957101YA Gull Wing/Soldered 8957001XA 8957101XA

data rate capability. The detector has a threshold with hysteresis, which typically provides 0.25 mA of differential mode noise immunity and minimizes the potential for output signal chatter. The detector in the single channel units has a three state output stage which eliminates the need for a pull-up resistor and allows for direct drive of a data bus.

All units are compatible with TTL, STTL, LSTTL, and HCMOS logic families. The 35 ns pulse width distortion specification guarantees a 10 MBd signaling rate at +125°C with 35% pulse width

distortion. Figures 13 through 16 show recommended circuits for reducing pulse width distortion and optimizing the signal rate of the product. Package styles for these parts are 8 pin DIP through hole (case outlines P), and leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options. See Selection Guide Table for details. Standard Military Drawing (SMD) parts are available for each package and lead style.

Because the same electrical die (emitters and detectors) are used for each channel of each device

listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are similar for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other part’s performance for die related reliability and certain limited radiation test results.

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GND

Functional Diagrams

8 Pin DIP 8 Pin DIP 20 Pad LCCC

Through Hole Through Hole Surface Mount

1 Channel 2 Channels 2 Channels

Note: All DIP devices have common VCC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground connections.

Outline Drawings

GND

19 20

2 3

CC2

CC1

GND

13 12

20 Terminal LCCC Surface Mount, 2 Channels

8.70 (0.342)

9.10 (0.358)

4.95 (0.195)

5.21 (0.205)

1.78 (0.070)

2.03 (0.080)

1.02 (0.040) (3 PLCS)

4.95 (0.195)

5.21 (0.205)

8.70 (0.342)

9.10 (0.358)

1.78 (0.070)

2.03 (0.080)

0.51 (0.020)

0.64 (0.025) (20 PLCS)

1.52 (0.060)

2.03 (0.080)

METALIZED CASTILLATIONS (20 PLCS)

2.16 (0.085)

TERMINAL 1 IDENTIFIER

NOTE: DIMENSIONS IN MILLIMETERS (INCHES). SOLDER THICKNESS 0.127 (0.005) MAX.

1.14 (0.045)

1.40 (0.055)

3.81 (0.150) MIN.

4.32 (0.170)

MAX.

9.40 (0.370)

9.91 (0.390)

0.51 (0.020) MAX.

2.29 (0.090)

2.79 (0.110)

0.51 (0.020) MIN.

0.76 (0.030)

1.27 (0.050)

8.13 (0.320) MAX.

7.36 (0.290)

7.87 (0.310)

0.20 (0.008)

0.33 (0.013)

7.16 (0.282)

7.57 (0.298)

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

8 Pin DIP Through Hole, 1 and 2 Channel

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0.51 (0.020) MIN.

5.57 (0.180) MAX.

0.51 (0.020) MAX.

2.29 (0.090)

2.79 (0.110)

1.40 (0.055)

1.65 (0.065)

9.65 (0.380)

9.91 (0.390)

5° MAX.

5.57 (0.180) MAX.

0.20 (0.008)

0.33 (0.013)

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

Leadless Device MarkingLeaded Device Marking

Hermetic Optocoupler Options

Option Description

100 Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This

option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details).

200 Lead finish is solder dipped rather than gold plated. This option is available on commercial

and hi-rel product in 8 pin DIP. DESC Drawing part numbers contain provisions for lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a standard feature.

300 Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This

option is available on commercial and hi-rel product in 8 pin DIP (see drawings below for details). This option has solder dipped leads.

1.14 (0.045)

1.40 (0.055)

4.32 (0.170) MAX.

0.51 (0.020) MAX.

2.29 (0.090)

2.79 (0.110)

0.51 (0.020) MIN.

7.36 (0.290)

7.87 (0.310)

0.20 (0.008)

0.33 (0.013)

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED)

HP QYYWWZ

XXXXXX

XXXXXXX

XXX USA

* 50434

COUNTRY OF MFR. HP FSCN*

HP LOGO

DESC SMD*

PIN ONE/

ESD IDENT

HP P/N

DESC SMD*

* QUALIFIED PARTS ONLY

COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED)

HP QYYWWZ

XXXXXX

* XXXX

XXXXXX

USA 50434

DESC SMD* HP FSCN*

HP LOGO

COUNTRY OF MFR.

HP P/N

PIN ONE/

ESD IDENT

DESC SMD*

* QUALIFIED PARTS ONLY

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