HP 580554-001 User Manual
HP ProLiant BL2x220c G6 Server Blade User Guide
Part Number 580554-001
November 2009 (First Edition)
© Copyright 2009 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP
shall not be liable for technical or editorial errors or omissions contained herein.
Microsoft, Windows, Windows Server, and Windows NT are U.S. registered trademarks of Microsoft Corporation.
Intel and Pentium are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.
AMD Athlon is a trademark of Advanced Micro Devices.
Intended audience
This document is for the person who installs, administers, and troubleshoots servers and storage systems.
HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards
in products with hazardous energy levels.
Contents
Component identification............................................................................................................... 6
Front panel components ............................................................................................................................. 6
Front panel LEDs ....................................................................................................................................... 6
System board components.......................................................................................................................... 7
Server A system board components ................................................................................................... 7
Server B system board components.................................................................................................... 8
DIMM slot numbering....................................................................................................................... 8
Mezzanine connector definitions ....................................................................................................... 9
System maintenance switch............................................................................................................. 10
Access components .................................................................................................................................10
Operations................................................................................................................................. 11
Power up the server blade........................................................................................................................ 11
Power down the server blade.................................................................................................................... 11
Remove the server blade .......................................................................................................................... 12
Access the internal server components ....................................................................................................... 12
Remove the server B assembly......................................................................................................... 12
Install the server B assembly............................................................................................................ 13
Setup......................................................................................................................................... 15
Overview ...............................................................................................................................................15
Installing an HP BladeSystem c-Class enclosure ...........................................................................................15
Installing server blade options................................................................................................................... 15
Installing interconnect modules.................................................................................................................. 15
Interconnect bay numbering and device mapping.............................................................................. 16
Connecting to the network........................................................................................................................ 16
Installing a server blade ........................................................................................................................... 16
Completing the configuration.................................................................................................................... 18
Hardware options installation....................................................................................................... 19
Introduction ............................................................................................................................................ 19
Hard drive option.................................................................................................................................... 19
Memory options...................................................................................................................................... 22
Memory subsystem architecture ....................................................................................................... 23
Single-, dual-, and quad-rank DIMMs ............................................................................................... 23
DIMM identification.......................................................................................................................23
Memory configurations................................................................................................................... 24
General DIMM slot population guidelines......................................................................................... 25
Installing a DIMM.......................................................................................................................... 27
Mezzanine card option............................................................................................................................ 27
SD card adapter option ........................................................................................................................... 29
Software and configuration utilities ............................................................................................... 31
Server blade deployment tools .................................................................................................................. 31
Software drivers and additional components..................................................................................... 31
HP BladeSystem c-Class Advanced management ............................................................................... 31
Network-based PXE deployment ...................................................................................................... 32
Deployment methods...................................................................................................................... 34
Configuration tools.................................................................................................................................. 37
SmartStart software........................................................................................................................ 37
HP ROM-Based Setup Utility............................................................................................................ 37
Array Configuration Utility.............................................................................................................. 40
Option ROM Configuration for Arrays ............................................................................................. 40
HP ProLiant Essentials Rapid Deployment Pack .................................................................................. 41
Re-entering the server serial number and product ID........................................................................... 41
Management tools................................................................................................................................... 41
Automatic Server Recovery .............................................................................................................41
ROMPaq utility.............................................................................................................................. 42
Integrated Lights-Out 2 technology................................................................................................... 42
Erase Utility ..................................................................................................................................42
StorageWorks library and tape tools................................................................................................ 43
HP Systems Insight Manager........................................................................................................... 43
Management Agents...................................................................................................................... 43
HP ProLiant Essentials Virtualization Management Software ................................................................43
HP ProLiant Essentials Vulnerability and Patch Management Pack ........................................................44
HP Insight Server Migration software for ProLiant............................................................................... 44
HP ProLiant Essentials Performance Management Pack .......................................................................44
HP Insight Control Environment Suites............................................................................................... 45
HP Insight Control Linux Edition ....................................................................................................... 45
Redundant ROM support ................................................................................................................ 45
USB support and functionality ......................................................................................................... 46
Diagnostic tools ...................................................................................................................................... 46
HP Insight Diagnostics.................................................................................................................... 46
HP Insight Diagnostics survey functionality ........................................................................................47
Integrated Management Log ...........................................................................................................47
Array Diagnostic Utility ..................................................................................................................47
Remote support and analysis tools............................................................................................................. 48
HP Insight Remote Support software ................................................................................................. 48
Keeping the system current .....................................................................................................
Drivers ......................................................................................................................................... 48
ProLiant Support Packs ................................................................................................................... 49
Operating system version support.................................................................................................... 49
HP Smart Update Manager............................................................................................................. 49
System Online ROM flash component utility ......................................................................................49
Change control and proactive notification ........................................................................................ 50
Care Pack ....................................................................................................................................50
.................. 48
Troubleshooting.......................................................................................................................... 51
Troubleshooting resources ........................................................................................................................51
Pre-diagnostic steps ................................................................................................................................. 51
Important safety information............................................................................................................ 51
Symptom information ..................................................................................................................... 53
Prepare the server for diagnosis ......................................................................................................53
Service notifications................................................................................................................................. 54
Loose connections ...................................................................................................................................54
Troubleshooting flowcharts .......................................................................................................................54
Start diagnosis flowchart ................................................................................................................55
General diagnosis flowchart ........................................................................................................... 56
Server blade power-on problems flowchart .......................................................................................57
POST problems flowchart ............................................................................................................... 59
OS boot problems flowchart ...........................................................................................................61
Server fault indications flowchart ..................................................................................................... 63
POST error messages and beep codes....................................................................................................... 65
Battery replacement .................................................................................................................... 66
Regulatory compliance notices ..................................................................................................... 67
Regulatory compliance identification numbers............................................................................................. 67
Federal Communications Commission notice............................................................................................... 67
FCC rating label............................................................................................................................ 67
Class A equipment......................................................................................................................... 67
Class B equipment......................................................................................................................... 67
Declaration of conformity for products marked with the FCC logo, United States only....................................... 68
Modifications.......................................................................................................................................... 68
Cables................................................................................................................................................... 68
Canadian notice (Avis Canadien).............................................................................................................. 69
European Union regulatory notice .............................................................................................................69
Disposal of waste equipment by users in private households in the European Union......................................... 69
Japanese notice ...................................................................................................................................... 70
BSMI notice............................................................................................................................................ 71
Chinese notice ........................................................................................................................................ 71
Korean notice ......................................................................................................................................... 71
Laser compliance .................................................................................................................................... 71
Battery replacement notice........................................................................................................................ 72
Taiwan battery recycling notice................................................................................................................. 72
Electrostatic discharge................................................................................................................. 73
Preventing electrostatic discharge.............................................................................................................. 73
Grounding methods to prevent electrostatic discharge.................................................................................. 73
Specifications............................................................................................................................. 74
Environmental specifications ..................................................................................................................... 74
Server blade specifications....................................................................................................................... 74
Technical support........................................................................................................................ 75
Before you contact HP.............................................................................................................................. 75
HP contact information............................................................................................................................. 75
Customer Self Repair ...............................................................................................................................75
Acronyms and abbreviations........................................................................................................ 83
Index......................................................................................................................................... 85
Component identification
Front panel components
Item Description
1 Server B Power On/Standby button
2 Server B serial label pull tab
3 Server blade release lever
4 Server A serial label pull tab
5 Server A Power On/Standby button
Front panel LEDs
Item Description Status
1 Server B system
power LED
2 Server B UID LED Blue = Identified
Green = On
Amber = Standby (auxiliary power
available)
Off = No power available to server
Blue flashing = Active remote management
Component identification 6
Item Description Status
Off = No active remote management
3 Server B health LED Green = Normal
Flashing = Booting
Amber = Degraded condition
Red = Critical condition
4 Server B NIC link
and activity LED*
5 Server A NIC link
and activity LED*
6 Server A health LED Green = Normal
7 Server A UID LED Blue = Identified
8 Server A system
power LED
* Actual NIC numbers depend on several factors, including the operating system installed on the server blade.
Green = Network linked
Green flashing = Network activity
Off = No link or activity
Green = Network linked
Green flashing = Network activity
Off = No link or activity
Flashing = Booting
Amber = Degraded condition
Red = Critical condition
Blue flashing = Active remote management
Off = No active remote management
Green = On
Amber = Standby (auxiliary power
available)
Off = No power available to server
System board components
Server A system board components
Item Description
1 Hard drive connector
2 DIMM slots (processor 2)
Component identification 7
Item Description
3 Server A serial number label
4 System battery
5 Processor socket 1 (populated)
6 Signal connector
7 Mezzanine connector 2
8 Enclosure connector
9 Mezzanine connector 1
10 System maintenance switch
11 DIMM slots (processor 1)
12 Processor socket 2 (populated)
13 Internal USB connector
Server B system board components
Item Description
1 Hard drive connector
2 Processor socket 1 (populated)
3 System battery
4 DIMM slots (processor 2)
5 Server B serial number label
6 Processor socket 2 (populated)
7 Signal connector
8 System maintenance switch
9 DIMM slots (processor 1)
10 Internal USB connector
DIMM slot numbering
For installation guidelines and population order, see "Memory options (on page 22)."
Component identification 8
Server A DIMM slots
Server B DIMM slots
Mezzanine connector definitions
Item PCIe support Server support
Mezzanine connector 1 x8, Type I mezzanine card
only
Mezzanine connector 2 x8, Type 1 mezzanine card
A PCIe x8 mezzanine connector supports x16 cards at up to x8 speeds.
only
Server A only
Server B only
Component identification 9
System maintenance switch
Position Function Default
1 iLO 2 security override Off
2 Configuration lock Off
3 Reserved Off
4 Reserved Off
5 Password disabled Off
6 Reset configuration Off
7 Reserved Off
8 Reserved Off
When the system maintenance switch position 6 is set to the On position, the system is prepared to erase
all system configuration settings from both CMOS and NVRAM.
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to
properly configure the server or data loss could occur.
Access components
CAUTION: The jackscrews control the unseating and seating of critical system connectors.
Failure to use the jackscrews to remove and install the server B assembly can cause the system
boards to fail.
Item Description
1 Jackscrew 1
2 Jackscrew 2
3 T-15 Torx wrench
Component identification 10
Operations
Power up the server blade
The Onboard Administrator initiates an automatic power-up sequence when the server blade is installed.
If the default setting is changed, use one of the following methods to power up the server blade:
• Use an iLO 2 virtual power button selection for server A and server B.
• Press and release the server A and server B Power On/Standby button.
When the server blade goes from the standby mode to the full power mode, the system power LED
changes from amber to green.
For more information about the Onboard Administrator, see the enclosure setup and installation guide on
the HP website (http://www.hp.com/support).
For more information about iLO 2, see "Integrated Lights-Out 2 technology (on page 42)."
Power down the server blade
Before powering down the server blade for any upgrade or maintenance procedures, perform a backup
of critical server data and programs on each server.
Depending on the Onboard Administrator configuration, use one of the following methods to power down
the server blade:
• Use the virtual power button selection through iLO 2 for both server A and server B.
This method initiates a controlled remote shutdown of applications and the OS before the server
blade enters standby mode.
• Press and release the server A and server B Power On/Standby buttons.
This method initiates a controlled shutdown of applications and the OS before the server blade
enters standby mode.
• Press and hold the server A and server B Power On/Standby buttons for more than 4 seconds to
force the server blade to shut down.
This method forces the server blade to enter standby mode without properly exiting applications and
the OS. It provides an emergency shutdown method in the event of a hung application.
CAUTION: To prevent damage to the server or the operating system, always power down
After initiating a virtual power down command, be sure that both server A and server B are in standby
mode by observing that the system power LEDs are amber.
both server A and server B before removing the server blade from the enclosure.
IMPORTANT: When the server blade is in standby mode, auxiliary power is still being
provided. To remove all power from the server blade, remove the server blade from the
enclosure.
Operations 11
Remove the server blade
To remove the component:
1. Identify the proper server blade.
2. Power down the server blade (on page 11).
3. Remove the server blade.
4. Place the server blade on a flat, level work surface.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: To prevent damage to electrical components, properly ground the server blade
before beginning any installation procedure. Improper grounding can cause ESD.
Access the internal server components
To access internal server components, remove server B assembly from server A assembly.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
Remove the server B assembly
internal system components to cool before touching them.
CAUTION: To prevent damage to electrical components, properly ground the server blade
before beginning any installation procedure. Improper grounding can cause ESD.
For access component identification, see "Access components (on page 10)."
To remove the component:
1. Power down the server blade (on page 11).
Operations 12
2.
Remove the server blade (on page 12).
3. Place the server blade on a flat, level work surface with the bezel facing away from you.
CAUTION: The jackscrews control the unseating and seating of critical system connectors.
Failure to use the jackscrews to remove and install the server B assembly can cause the system
4. Turn jackscrew 1 approximately six turns counterclockwise.
5. Turn jackscrew 2 counterclockwise until the threads are fully disengaged.
6. Turn jackscrew 1 counterclockwise until the threads are fully disengaged.
boards to fail.
CAUTION: To prevent damage to the server blade, do not apply pressure to the enclosure
connector.
7. Lift the server B assembly from the server A assembly, and then place it on the work surface with the
system board facing up.
Install the server B assembly
For access component identification, see "Access components (on page 10)."
1. Engage the front edge of the server B assembly with the front edge of the server A assembly.
CAUTION: To avoid possible damage to mezzanine card cables, route any cables so that
2. Lower the server B assembly onto the server A assembly.
3. Align the signal and power connectors on the server B assembly with the corresponding connectors
they do not become pinched when the server B assembly is installed.
IMPORTANT: To avoid possible damage to the serial label pull tab, extend the serial label
pull tab approximately 1 cm (0.4 in) before installing the server B assembly on the server A
assembly.
on the server A assembly.
Operations 13
CAUTION: The jackscrews control the unseating and seating of critical system connectors.
Failure to use the jackscrews to remove and install the server B assembly can cause the system
4. Engage the threads on jackscrew 1 and tighten six turns clockwise.
5. Engage the threads on jackscrew 2 and tighten fully.
6. Tighten jackscrew 1 fully.
boards to fail.
Operations 14
Setup
Overview
To install a server blade, complete the following steps:
1. Install and configure an HP BladeSystem c-Class enclosure.
2. Install any server blade options.
3. Install interconnect modules in the enclosure.
4. Connect the interconnect modules to the network.
5. Install a server blade.
6. Complete the server blade configuration.
Installing an HP BladeSystem c-Class enclosure
Before performing any server blade-specific procedures, install an HP BladeSystem c-Class enclosure.
The most current documentation for server blades and other HP BladeSystem components is available at
the HP website (http://www.hp.com/go/bladesystem/documentation).
Documentation is also available in the following locations:
• Documentation CD that ships with the enclosure
• HP Business Support Center website (http://www.hp.com/support)
Installing server blade options
Before installing and initializing the server blade, install any server blade options, such as additional
memory, hard drives, internal USB devices, or mezzanine cards.
Installing interconnect modules
For specific steps to install interconnect modules, see the documentation that ships with the interconnect
module.
Setup 15
Interconnect bay numbering and device mapping
To support network connections for specific signals, install an interconnect module in the bay
corresponding to the embedded NIC or mezzanine signals.
Server blade signal c7000 interconnect bay Interconnect bay labels
Server A NIC 1 (Embedded) 1
Server A NIC 2 (Embedded) 3
Server A mezzanine 5 and 6
Server B NIC 1 (Embedded) 2
Server B NIC 2 (Embedded) 4
Server B mezzanine 7 and 8
For detailed port mapping information, see the HP BladeSystem enclosure installation poster or the
HP BladeSystem enclosure setup and installation guide on the HP website
(http://www.hp.com/go/bladesystem/documentation).
Connecting to the network
To connect the HP BladeSystem to a network, each enclosure must be configured with network
interconnect devices to manage signals between the server blades and the external network.
Two types of interconnect modules are available for HP BladeSystem c-Class enclosures: Pass-thru modules
and switch modules. For more information about interconnect module options, see the HP website
(http://www.hp.com/go/bladesystem/interconnects).
Installing a server blade
CAUTION: To prevent improper cooling and thermal damage, do not operate the server
blade enclosure unless all bays are populated with either a component or a blank.
Setup 16
1.
Remove the device bay blank.
2. Remove the enclosure connector cover.
3. Install the server blade.
Setup 17
Completing the configuration
To complete the server blade and HP BladeSystem configuration, see the overview card that ships with the
enclosure.
Setup 18
Hardware options installation
Introduction
If more than one option is being installed, read the installation instructions for all the hardware options
and identify similar steps to streamline the installation process.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
CAUTION: To prevent damage to electrical components, properly ground the server before
beginning any installation procedure. Improper grounding can cause electrostatic discharge.
CAUTION: To avoid damage to the server blade, do not operate the server blade unless both
processor sockets are populated with a processor and heatsink.
Hard drive option
Each server supports one internal SATA drive.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
To install the component:
1. Power down the server blade (on page 11).
2. Remove the server blade (on page 12).
3. Access the internal server components (on page 12).
4. If installed, remove the USB device.
5. Remove the hard drive carrier:
internal system components to cool before touching them.
Hardware options installation 19
o
To remove the hard drive carrier from the server A assembly, remove the T-10 hard drive carrier
screw and loosen the two system board thumbscrews. Then, slide the system board toward the
rear of the enclosure and remove the hard drive carrier.
o To remove the hard drive carrier from the server B assembly, remove the T-10 hard drive carrier
screw and then remove the hard drive carrier.
Hardware options installation 20
6.
Prepare the hard drive carrier.
7. Install the hard drive in the carrier.
8. Install the hard drive assembly:
Hardware options installation 21
o
To install the hard drive assembly in server A, slide the hard drive assembly into position on the
hard drive connector, slide the system board into position in the enclosure, and tighten the system
board thumbscrews. Then, install the hard drive carrier retention screw.
o To install the hard drive assembly in server B, first slide the hard drive assembly into position on
the hard drive connector and then install the hard drive carrier retention screw.
9. If removed, install the USB device.
10. Install the server B assembly (on page 13).
11. Install the server blade ("Installing a server blade" on page 16).
Memory options
IMPORTANT: This server blade does not support mixing RDIMMs and UDIMMs. Attempting to
mix these two types causes the server to halt during BIOS initialization.
Hardware options installation 22
The memory subsystem in this server blade can support RDIMMs or UDIMMs. Both types are referred to as
DIMMs when the information applies to both types. When specified as RDIMM or UDIMM, the
information applies to that type only. All memory installed in the server blade must be the same type.
The server blade supports the following DIMM speeds:
• Single- and dual-rank PC3-10600 (DDR-1333) DIMMs operating at 1333 and 1066 MHz
• Quad-rank PC3-8500 (DDR-1067) DIMMs operating at 1066 MHz
Depending on the processor model, the number of DIMMs installed, and whether UDIMMs or RDIMMs
are installed, the memory clock speed may be reduced to 1066 or 800 MHz. For more information on
the effect of DIMM slot population, see "General DIMM slot population guidelines (on page 25)."
Memory subsystem architecture
The memory subsystem in this server blade is divided into channels. Each processor supports three
channels, and each channel supports one DIMM slot, as shown in the following table.
Channel Slot Slot number
1 A 1
2 B 2
3 C 3
This multi-channel architecture provides enhanced performance in Advanced ECC mode. This architecture
also enables the Mirrored Memory and Lockstep memory modes. This server blade supports either
Registered PC3 DIMMs (RDIMMs) or Unbuffered DIMMs (UDIMMs).
DIMM slots in this server are identified by number and by letter. Letters identify the slots to populate for
specific AMP modes. Slot numbers are reported by ROM messages during boot and for error reporting.
Single-, dual-, and quad-rank DIMMs
To understand and configure memory protection modes properly, an understanding of single-, dual-, and
quad-rank DIMMs is helpful. Some DIMM configuration requirements are based on these classifications.
A single-rank DIMM has one set of memory chips that is accessed while writing to or reading from the
memory. A dual-rank DIMM is similar to having two single-rank DIMMs on the same module, with only
one rank accessible at a time. A quad-rank DIMM is, effectively, two dual-rank DIMMs on the same
module. Only one rank is accessible at a time. The server blade memory control subsystem selects the
proper rank within the DIMM when writing to or reading from the DIMM.
Dual- and quad-rank DIMMs provide the greatest capacity with the existing memory technology. For
example, if current DRAM technology supports 2-GB single-rank DIMMs, a dual-rank DIMM would be 4GB, and a quad-rank DIMM would be 8-GB.
DIMM identification
IMPORTANT: This server blade does not support mixing RDIMMs and UDIMMs. Attempting to
mix these two types causes the server to halt during BIOS initialization.
Hardware options installation 23
The memory subsystem may be populated with either RDIMMs or UDIMMs, but mixing the two types is not
supported. To determine DIMM characteristics, use the label attached to the DIMM and the following
illustration and table.
Item Description Definition
1 Size —
2 Rank 1R = Single-rank
2R = Dual-rank
4R = Quad-rank
3 Data width x4 = 4-bit
x8 = 8-bit
4 Memory speed 10600 = 1333-MHz
8500 = 1067-MHz
5 DIMM type R = RDIMM (registered)
E = UDIMM (unbuffered with ECC)
For the latest supported memory information, see the QuickSpecs on the HP website
(http://www.hp.com).
Memory configurations
To optimize server blade availability, the server blade supports the following AMP modes:
• Advanced ECC—provides the greatest memory capacity for a given DIMM size, while providing up
to 8-bit error correction, depending on the specific DIMM type. This mode is the default option for
this server blade.
• Mirrored Memory—provides maximum protection against failed DIMMs. Uncorrectable errors in one
channel are corrected by the mirror channel.
• Lockstep—provides enhanced protection while making all installed memory available to the
operating system. The server blade can continue to function if a single- or mulit-bit memory failure
within a single DRAM device occurs.
Hardware options installation 24
Advanced Memory Protection options are configured in RBSU. If the requested AMP mode is not
supported by the installed DIMM configuration, the server blade boots in Advanced ECC mode. For more
information, see "HP ROM-Based Setup Utility (on page 37)."
For the latest memory configuration information, see the QuickSpecs on the HP website
(http://www.hp.com).
RDIMM maximum memory configurations
The following table lists the maximum memory configuration possible with 16-GB RDIMMs.
Rank Maximum memory configuration
Single-rank 96 GB
Dual-rank 96 GB
Quad-rank 64 GB
UDIMM maximum memory configurations
The server blade supports a maximum memory configuration of 12 GB using 2-GB single- or dual-rank
UDIMMs.
Advanced ECC memory configuration
Advanced ECC memory is the default memory protection mode for this server blade. Standard ECC can
correct single-bit memory errors and detect multi-bit memory errors. When multi-bit errors are detected
using Standard ECC, the error is signaled to the server blade and causes the server blade to halt.
Advanced ECC protects the server blade against some multi-bit memory errors. Advanced ECC can
correct both single-bit memory errors and 4-bit memory errors if all failed bits are on the same DRAM
device on the DIMM.
Advanced ECC provides additional protection over Standard ECC because it is possible to correct certain
memory errors that would otherwise be uncorrected and result in a server blade failure. The server blade
provides notification that correctable error events have exceeded a pre-defined threshold rate.
Mirrored memory configuration
Mirroring provides protection against uncorrected memory errors that would otherwise result in server
blade downtime. Mirroring is performed at the channel level. Channels 1 and 2 are used; channel 3 is
not populated.
Data is written to both memory channels. Data is read from one of the two memory channels. If an
uncorrectable error is detected in the active memory channel, data is retrieved from the mirror channel.
This channel becomes the new active channel, and the system disables the channel with the failed DIMM.
General DIMM slot population guidelines
Observe the following guidelines for all AMP modes:
• Always populate channels 1 and 2 for both processors.
• To maximize performance, distribute the total memory capacity between both processors in a server
as evenly as possible.
Hardware options installation 25
• Do not mix Unbuffered and Registered PC3 DIMMs.
DIMM speeds are supported as indicated in the following table.
Rank Speeds supported (MHz)
Single- or dual-rank 1333, 1066
Quad-rank 1066
Advanced ECC population guidelines
For Advanced ECC mode configurations, observe the following guidelines:
• Observe the general DIMM slot population guidelines (on page 25).
• DIMMs may be installed individually.
Multi-processor Advanced ECC population order
For Advanced ECC mode configurations with multiple processors, populate the DIMM slots for each
processor sequentially in alphabetical order (A through C).
Mirrored Memory population guidelines
For Mirrored Memory mode configurations, observe the following guidelines:
• Observe the general DIMM slot population guidelines (on page 25).
• Always install DIMMs in channels 1 and 2 for each installed processor.
• Do not install DIMMs in channel 3 for any processor.
• DIMMs installed on channel 1 and channel 2 of an installed processor must be identical.
• In multi-processor configurations, each processor must have a valid Mirrored Memory configuration.
• In multi-processor configurations, each processor may have a different valid Mirrored Memory
configuration.
Multi-processor Mirrored Memory population order
For Mirrored Memory mode configurations with multiple processors, populate DIMM slots A and B for
each processor. Do not populate slot C.
After installing the DIMMs, use RBSU to configure the system for mirrored memory support ("Configuring
mirrored memory" on page 39).
Lockstep Memory population guidelines
For Lockstep memory mode configurations, observe the following guidelines:
• Observe the general DIMM slot population guidelines (on page 25).
• Always install DIMMs in channels 1 and 2 for each installed processor.
• Do not install DIMMs in channel 3 for any processor.
• DIMM configuration on channel 1 and channel 2 of a processor must be identical.
• In multi-processor configurations, each processor must have a valid Lockstep Memory configuration.
Hardware options installation 26
• In multi-processor configurations, each processor may have a different valid Lockstep Memory
configuration.
Multi-processor Lockstep population order
For Lockstep memory mode configurations with multiple processors, populate DIMM slots A and B for
each processor. Do not populate slot C.
After installing the DIMMs, use RBSU to configure the system for Lockstep memory support ("Configuring
lockstep memory" on page 40).
Installing a DIMM
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
To install the component:
1. Power down the server blade (on page 11).
2. Remove the server blade (on page 12).
3. Access the internal server components (on page 12).
4. Open the DIMM slot latches.
5. Install the DIMM.
internal system components to cool before touching them.
6. Install the server B assembly (on page 13).
7. Install the server blade ("Installing a server blade" on page 16).
If you are installing DIMMs in mirrored or lock-step configuration, configure this mode in RBSU ("HP ROMBased Setup Utility" on page 37).
Mezzanine card option
Optional mezzanine cards are classified as Type I mezzanine cards and Type II mezzanine cards. The
server blade supports only Type I mezzanine cards.
Hardware options installation 27
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