HP 280 G3, 280 Pro G3, 290 G1 Disassembly Instructions Manual

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model
[List multiple models if applicable.]

HP 280 G3 SFF Business PC
HP 290 G1 SFF Business PC
HP 280 Pro G3 SFF Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for
the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on
the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.

Quantity of

Item Description Notes

Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)

Batteries, excluding Li-Ion batteries. All types including standard alkaline, coin or button

Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin cell,
etc.)

Mercury-containing components For example, mercury in lamps, display backlights,

Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm

Cathode Ray Tubes (CRT) N/A 0

Capacitors / condensers (Containing PCB/PCT) N/A 0

Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height

External electrical cables and cords DC Cable for External Power Supply 0

Gas Discharge Lamps N/A 0

With a surface greater than 10 sq cm

style batteries

Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[x] snaps
[ ] adhesive
[ ] other. Explain N/A
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.

scanner lamps, switches, batteries N/A

Includes background illuminated displays with gas
discharge lamps N/A

N/A 0

items
included in
product

1

1

1

0

0

EL-MF877-00 Page 1
Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Quantity of

g

g

Item Description Notes

items
included in
product

Plastics containing Brominated Flame Retardants

N/A 0
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)

Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations. N/A

0

Components and waste containing asbestos N/A 0

Components, parts and materials containing

N/A 0
refractory ceramic fibers

Components, parts and materials containing

N/A 0
radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

#1 screw driver ( Disassemble 1 pcs screw for access panel)

T15 screw driver ( Disassemble 3 pcs screw for HDD bracket)

T15 screw driver ( Disassemble 7 pcs screw for MB)

T15 screw driver ( Disassemble 4 pcs screw for MB)

T15 screw driver ( Disassemble 4 pcs screw for CPU cooler)

#1 screw driver ( Disassemble 4 pcs screw CPU Fan)

2.0~4.0
Kgf-cm

3.0~4.0

f-cm

K

3.0~4.0

Kgf-cm

3.0~4.0

f-cm

K

3.0~4.0

Kgf-cm

4.0~5.0

Kgf-cm

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:

1. Loosen 1 screw and remove access panel from housing.

2. Pull off ODD and HDD cable connector then remove ODD module by pushing ODD Latch.

3. Unlock 4 hooks then rotate to remove Front Bezel from housing.

4. Remove Dust filter from Front Bezel

5. Disassemble Front Cover

6. Loosen 3 screws then remove HDD BKT ASSY from housing.

7. Pull off all cables on MB.

8. Push 2 hooks then remove Fan duct.

9. Loosen 7 screws then remove MB

10. Loosen 4 screws then remove CPU cooler from MB.

11. Loosen 4 screws then Remove CPU Fan.

12. Loosen 4 screws then remove PSU.

EL-MF877-00 Page 2
Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained
in the product that require selective treatment (with descriptions and arrows identifying locations).

1. Loosen 1 screw and remove access panel from housing.

2. Pull off ODD and HDD cable connector then remove

ODD module by pushing ODD Latch.

3. Unlock 4 hooks then rotate to remove Front Bezel from housing

4. Pry 6 hooks to remove Dust Filter from Front Bezel

EL-MF877-00 Page 3
Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01