HP 24 Disassembly Instructions Manual

Product Category: Personal Computers

Marketing Name / Model
[List multiple models if applicable.]

HP 24 All-in-One PC (Touch)

1.0 Items Requiring Selective Treatment

Item Description

Notes

Quantity
of items
included
in product

Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)

With a surface greater than 10 sq cm
Motherboard, RAM, WIRE LAN

3

Batteries

All types including standard alkaline and lithium coin
or button style batteries RTC battery

1

Mercury-containing components

For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm

Includes background illuminated displays with gas
discharge lamps LCD

1
Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height

External electrical cables and cords

EPS and power cord

2

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)

Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent
chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing
refractory ceramic fibers

Product End-of-Life Disassembly Instructions

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.

EL-MF877-00 Page 1
Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing
radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

Tool Description

Tool Size (if
applicable)

Description #1 Screwdiver

TORX T8

Description #2

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

and materials requiring selective treatment can be removed.

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Removed Rear Cover

2. Removed LCD Bezel

3. Removed Stand base

4. Removed Hinge

5. Removed Converter board & others

6. Removed ODD module

7. Removed HDD module

8. Remove MB Shielding

9. Removed Thermal module

10. Removed Fan module

11. Removed MB

12. Removed Speaker module

13. Removed Camera module

14. Removed LCD panel

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1. Removed Rear Cover

EL-MF877-00 Page 2
Template Revision B

PSG instructions for this template are available at EL-MF877-01