HP 22f, 22fw, 24fw Disassembly Instructions Manual

EL-MF877-00 Page 1 Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Marketing Name / Model [List multiple models if applicable.]
HP 22f Display
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description
Notes
Quantity of items included in product
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button style batteries
None
Li-Ion batteries. Include all Li-Ion batteries if more than one is provided with the product (such as a detachable notebook keyboard battery, RTC coin cell, etc.)
Battery(ies) are attached to the product by (check all that apply with an “x” inside the “[ ]”): [ ] screws [ ] snaps [ ] adhesive [ ] other. Explain NOTE: Add detailed removal procedures including required tools in the sections 3.1/3.2.
None
Mercury-containing components
For example, mercury in lamps, display backlights, scanner lamps, switches, batteries
None
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm
Includes background illuminated displays with gas discharge lamps
1 Cathode Ray Tubes (CRT)
None
Capacitors / condensers (Containing PCB/PCT)
None
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height
None External electrical cables and cords
DC Cable for External Power Supply
4
Gas Discharge Lamps
None
Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs
None
EL-MF877-00 Page 2 Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
Item Description
Notes
Quantity of items included in product
already listed as a separate item above)
Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent chambers, and service stations.
None Components and waste containing asbestos
None
Components, parts and materials containing refractory ceramic fibers
None
Components, parts and materials containing radioactive substances
None
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if applicable)
Plastic shovel
Screwdriver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including the required steps to remove the external enclosure:
1. Remove screws from Rear cover and Separate the Rear Cover Ass'y
2. Remove the connector(J2)and(BJ2) of the FCC cable.
3. Remove the connector(J3) of the Dispaly key bd cable.
4. Remove four screws from Main shielding and Panel.And separate the tapes from the Main shielding.
5. Remove three screwsfrom MAIN SHIELDING ang Main BD.
6. Remove four screws from Main shielding and Main BD.Separate the MAIN SHIELDING from Main BD.
7. Separate the MAIN BD.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
24-07-201
HP Restricted
Page 1
Appendix 3 Product End-of-Life Disassembly instructions Product Identification:
Marketing Name / Model
Description
HP 22f Display
HP 22f 22-inch Display
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description
Notes
Quantity of items included in product.
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)
With a surface greater than 10 square cm
2
Batteries
All types including standard alkaline and lithium coin or button style batteries
0
Mercury containing components
For example, mercury in lamps, display backlights, scanner lamps, switches, batteries
0 Liquid Crystal Displays (LCD) with a surface greater than 100 square cm
Includes background illuminated displays with gas discharge lamps
1 Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB / PCT)
0
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height
0 External electrical cables and cords
3 Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
0
Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent chambers, and service stations.
0 Components and waste containing
asbestos
0
Components, parts and materials containing refractory ceramic fibers
0 Components, parts and materials
0
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