EL-MF877-00 Page 1
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model
[List multiple models if applicable.]
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the
disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the
plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Quantity of
items
included in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
Batteries, excluding Li-Ion batteries.
All types including standard alkaline, coin or button style
batteries
Li-Ion batteries. Include all Li-Ion batteries if more than
one is provided with the product (such as a detachable
notebook keyboard battery, RTC coin cell, etc.)
Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[ ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1/3.2.
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater than
100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring greater
than 2.5 cm in diameter or height
None
External electrical cables and cords
DC Cable for External Power Supply
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
EL-MF877-00 Page 2
Template Revision C
Last revalidation date 04-01-2018
HPI instructions for this template are available at EL-MF877-01
Quantity of
items
included in
product
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
None
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove screws from Rear cover and Separate the Rear Cover Ass'y
2. Remove the connector(J2)and(BJ2) of the FCC cable.
3. Remove the connector(J3) of the Dispaly key bd cable.
4. Remove four screws① from Main shielding and Panel.And separate the tapes from the Main shielding.
5. Remove three screws②from MAIN SHIELDING ang Main BD.
6. Remove four screws① from Main shielding and Main BD.Separate the MAIN SHIELDING from Main BD.
7. Separate the MAIN BD.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).
24-07-201
HP Restricted
Page 1
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Quantity of
items included
in product.
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA)
With a surface greater than 10
square cm
All types including standard
alkaline and lithium coin or button
style batteries
Mercury containing components
For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
0
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm
Includes background illuminated
displays with gas discharge lamps
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing
PCB / PCT)
Electrolytic Capacitors / Condensers
measuring greater than 2.5 cm in
diameter or height
0
External electrical cables and cords
Plastics containing Brominated Flame
Retardants
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
0
Components and waste containing
Components, parts and materials
containing refractory ceramic fibers
0
Components, parts and materials