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发光二极管产品规格书
Specification for LED Product
Part Number: DLE5MMBT
■ 尺寸规格(毫米)
Package Dimensions(mm)
注解:
Notes:
1．所有尺寸单位是mm
All dimension units are millimeters.
2．所有未标注尺寸公差为±0.2mm
All dimension tolerance is ±0.2mm unless otherwise noted.
3．所有胶体底部与引脚处多胶部分大约为1.5mm
An epoxy meniscus may extend about 1.5mm down the leads.
4．胶体底部毛边小于等于0.5mm
Burr around bottom of epoxy may be 0.5mm max.
简 介:
Synopsis: 5mm Round Type Water Clear Lens
5mm 圆形
蓝色发光二极管
Blue LED Lamp
无色透明胶体
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Part Number: DLE5MMBT
Forward Voltage
■ 分类（室温=25℃） Categorize (Ta = 25℃)
项目
ITEMS
主波长
455-460 460-465 465-470 470-475
Dominant Wavelength
正向电压
发光强度
Luminous Intensity
项目
ITEMS
反向电流
Reverse Current
50%能量发光视角
50% Power Viewing Angle
3.2-3.4 3.0-3.2 3.2-3.4 3.0-3.2 V
4000-6000 4000-6000
10000-12000 8000-10000
最小值 典型值 最大值
MIN TYP. MAX.
--- --- 1.1 μΑ
11 13 14 deg
■ 最大绝对额定值(室温 = 25℃)Absolute Maximum Ratings at (Ta = 25℃)
项目
ITEMS
正向电流
Forward Current
峰值正向电流
Peak Forward Current
连续工作电流
Continuous Forward Current
反向电压
Reverse Voltage
功耗
Power Dissipation
工作温度
Operation Temperature
贮存温度
Storage Temperature
引脚镀锡温度
Lead Soldering Temperature
符号 最大绝对额定值
SYMBOL ABSOLUTE MAXIMUM RATING
IF 50
IFP 220 mA
IL 20 mA
VR 5 V
PD 170 mW
Topr -40 ~ +80
Tstg -40 ~ +80
Tsol
最大温度260℃,最长时间5 秒
Max.260°C for 5 sec Max.
IFP 条件：脉冲宽度小于等于10 分钟
IFP Conditions：Pulse Width≤10msec duty≤1/10
Tsol 条件：离胶体底部4mm 处为基础
Tsol Conditions：4mm from the base of the epoxy bulb
单位
UNIT
nm
mcd
单位
UNIT
单位
UNIT
mA
℃
℃
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Part Number: DLE5MMBT
■ 半功视角
Spatial Distribution
■ 可靠性试验
Reliability Performance
测试分类 测试项目 测试条件
Test Classification Test Item Test Conditions
寿命测试 寿命测试
Life Test Life Test
热冲击测试
Thermal Shock Test
冷热循环测试
Temperature Cycle Test
高温高湿测试
High Temperature ＆
环境测试
Environment Test
High Humidity Test
高温贮存测试
Storage
低温贮存测试
Low Temperature
Storage
持续时间 抽样大小 判定
Test Duration Sample Size Standard
Ta=25℃±5 ℃，IF=20mA
-10℃±5 ℃←→+100℃±5℃
5min. 10sec. 5min.
-55℃±5 ℃←→+85℃±5℃
30min. 5min. 30min.
Ta=85℃±5 ℃
RH =85%±0.5 %RH
Ta=100℃±5 ℃ 1000小时(hrs)
Ta=-55℃±5 ℃ 1000小时(hrs)
1000小时(hrs)
100循环(cycles)
100循环(cycles)
240小时(hrs)
10PCS
10PCS
10PCS
10PCS
10PCSHigh Temperature
10PCS
机械测试
Mechanical Test
抗焊接热度
Resistance to
Soldering Heat
引脚折弯
Lead Integrity
Ta=260℃±5 ℃ 5 秒(sec.)
负荷2.5 牛顿(0.25 千克)
0° ~ 90° ~ 0°
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3 回合(times)
10PCS
10PCS
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Part Number: DLE5MMBT
■典型的光电特性曲线 (Ta=25℃ 除非不同地方)
Typical Optical/Electrical Characteristics Curves (Ta=25℃ Unless Otherwise Noted)
电流-电压曲线
Current-Voltage Curve
电流-光强曲线 电流-光通量曲线
Current-Luminous intensity Curve Current-Luminous flux Curve
相对光谱分布曲线
Relative Spectral Distribution Curve
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Part Number: DLE5MMBT
1.应用
Application
此LED可使用于一些普通的电子设备，例如办公设备，通信设备、房屋装饰，若LED用在一些可靠
性要求较高的情况下，如航空运输，交通控制及医辽器械时，一定需参考销售提供之资料进行使用。
This LED can be used in some of common electronic devices,such as office
equipment,communications devices,buliding decoration,if LED also can be used in some
higher reliability equipments,such as air transport,traffic control and medical
devices,please do refer to products manual.
2.贮存
Storage
贮存LED的环境，温度不超过30℃，相对湿度不超过70%。 建议LED在原包装箱里日期不超过三个
月进行使用，如果需加长贮存时间，建议放在干燥箱内，并加放干燥剂，或者充入氮气。
Storage environment of LED,the temperature should be less than 30℃,relative humidity
should be less than 70%.We strongly suggest that use up all the leds within 3months
after purchase.If you would like to keep longer time,please keep in drying oven,put
desiccant,or filled with nitrogen gas.
3.清洗
Cleaning
当用化学品清洗胶体时必须特别小心，因为有些化学品对胶体表面有损伤并引起褪色，如三氯乙
烯、丙酮等。可用乙醇擦拭、浸渍，时间在常温下不超过3分钟。
Causion on the chemical when doing the cleaning.Because some chemical supplies can
cause damage to the surface of colloid with fade,such as three vinyl
chloride,Acetone,etc.It can be wiped and infused by alcohol,but please keep the time in
three minutes at normal temperature.
4.引脚装配(Pins assembly)
（1）必需离胶体2毫米才能折弯支架。
Keep 2mm from the colloid when blending the stents.
（2）支架成形必须用夹具或由专业人员来完成。
Stents forming must use fixture or taken by professional.
（3）支架成形必须在焊接前完成。
Stents forming must be done before welding.
（4）支架成形需保证引脚和间距与线路板上一致。
Stents forming should guarantee that pins and spacing should be in line with
（5）焊接必须在正常温度下进行，当LED正常焊接到PCB板上后，应避免在LED引脚处施加机械压力。
The welding must be processed under normal temperature,when LEC is used into PCB.It
is necessarry to avoid a mechanical pressure on the pins of LED.
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5.焊接(Welding)
当焊接时，必需在胶体底部2mm以下进行焊接，在焊接时，应尽力避免浸渍LED胶体，在刚焊接完
后，应避免在引脚上加外力或者摇动LED胶体。
In the welding process,it is necessary to weld in 2mm below the bottom colloid,also
should try to avoid dipping LED colloid,in just after welding,has to avoid an external
force on the lead pins or a shake on the LED colloid.
6.驱动方式(Driving way)
LED的当前驱动方式 (The Driver of LED)
若LED为多颗并联时，建议采用线路A，在每颗LED处加一限流电阻，以保证LED之亮度一致。
If for A parallel circuit,it is suggested that a resistor is assembled with each LED
in the line A,this is to ensure the same luminace of each LED.
Circuit model A Circuit model B
7.静电防护(Static Electronic Protective)
静电和电流的急剧升高将会对LED产生损害，KENTO系列产品使用时请使用防静电装置，如防护带或手套。
注意：使用时人体放电模式HBM<1000V；机器放电模式<100V。
Electrostatic and current of a sharp rise will cause damage on LEDs,when using KENTO
serises products,please use antistatic device,such as protective belt and gloves.
Note:when using it,human body discharge HBM mode "1000 V; The machine discharge < 100
V model.
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