HON HAI PRECISION IND T77W980 Users Manual

COMPANY CONFIDENTIAL

SDR845 Gigabit RF Card

Engineering Requirements Specification

Project code: T77W980T00
Solution: SDR845

Copyright © 2017. Foxconn Communications Inc. All rights reserved.

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COMPANY CONFIDENTIAL

Department

Name

Signature

Review Dates

* Plan

** Results

Project Manager

Choro Chung

ProjectLeader

Jeff Guo

Hardware Engineer

Neil Li

Rev

Date

Originator

Comment

V1.0

2018/01/11

Neil Li

Initial release for carrier engagement, will update it after fix
hardware design

V1.1

2018/02/03

Neil Li

Update the mechanical drawing

V1.2

2018/02/06

Neil Li

Update the soldering condition

V1.3

2018/02/22

Neil Li

Update the soldering information

V1.4

2018/04/14

Neil Li

Update the Qlink information

V1.5

2018/05/22

Neil Li

Add the Qlink length information

V1.6

2018/06/13

Neil Li

Add the label information

Reviewers

Modification History

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COMPANY CONFIDENTIAL

CONTENTS

1. GENERAL DESCRIPTION........................................................................ 5

1.1 SYSTEM MAIN FEATURE ...................................................................... 6

1.2 CARRIER AGGREGATION COMBINATION ..................................... 8

1.3 SYSTEM BLOCK DIAGRAM .................................................................. 8

1.4 PIN DEFINITION ...................................................................................... 8

1.5 PLATFORM CONNECTION DESIGN ................................................. 13

2. HARDWARE FEATURES ........................................................................ 15

2.1 RF TRANSCEIVER ................................................................................. 15

2.2 ANTENNA DESIGN ................................................................................ 16

4.1RECOMMENDED OPERATING CONDITIONS ................................ 17

4.2 STORAGE REQUIREMENT ................................................................. 17

4.3 THERMAL DISSIPATION PROPOSAL .............................................. 17

4.4CRYSTAL MATERIAL ........................................................................... 17

4.5ELECTROSTATIC DISCHARGE .......................................................... 18

5. MECHANICS, MOUNTING AND PACKAGING ................................. 19

5.1MECHANICS ............................................................................................. 19

5.2MOUNTING ONTO THE APPLICATION PLATFORM ................... 22

5.2.1SMT PCB ASSEMBLY .......................................................................... 22

5.2.1.1LAND PATTERN AND STENCIL .................................................... 22

5.2.1.2BOARD LEVEL CHARACTERIZATION ...................................... 23

5.2.2MOISTURE SENSITIVITY LEVEL ................................................... 23

5.2.3SOLDERING CONDITIONS AND TEMPERATURE ...................... 24

5.2.3.1REFLOW PROFILE ........................................................................... 24

5.2.3.2MAXIMUM TEMPERATURE AND DURATION ......................... 25

5.2.4DURABILITY AND MECHANICAL HANDLING ........................... 25

5.2.4.1STORAGE LIFE .................................................................................. 25

5.2.4.2PROCESSING LIFE ........................................................................... 25

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COMPANY CONFIDENTIAL

5.2.4.3 BAKING .............................................................................................. 25

5.2.4.4 ELECTROSTATIC DISCHARGE ................................................... 26

5.3PACKAGING ............................................................................................. 26

5.3.1TAPE AND REEL .................................................................................. 26

5.3.1.1 ORIENTATION .................................................................................. 26

5.3.1.2BARCODE LABEL ............................................................................. 26

5.3.2SHIPPING MATERIALS ...................................................................... 26

5.3.2.1MOISTURE BARRIER BAG ............................................................. 27

5.3.2.2TRANSPORTATION BOX ................................................................ 27

6. SAMPLE APPLICATION ......................................................................... 28

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COMPANY CONFIDENTIAL

5

Form Fact

LGA 31x31 Module

Carrier Support

North America: AT&T, Verizon, T-Mobile, Sprint, Bell, Rogers

Europe: Vodafone, EE, DT, H3G, Orange, TEF, TIM, Swisscom

Russia: MTS

China: CMCC, CT, CU

Australia: Telstra, Optus

South Korea: SKT

Japan: KDDI, DCM, SBM

Carriers above is subject to biz discussion

QCT Solution

SDR845

LTE

Mode

FDD / TDD

Band

LB:B8/12(17)/13/14/20/26(5/18/19)/28/29 /B71

MB:B1/2(25)/3/4(66)/32/B39/B34

HB:B7/30/40/41(38)

3.5G:B42/43/48

LAA/LTE-U (DL only): B46

CA

5xDL CA (Up to 100MHz, 256QAM)

2xUL CA (Up to 40MHz. 64QAM) -- intra-band contiguous CA

MIMO

4X4(band plan: B1/2(25)/3/4(66)/7/30/40/41(38)/, 4X2, 2X2

Cat

(DL/UL Mbps)

ue-CategoryUL 13 (UL: 150Mbps) + ue-CategoryDL 16 (DL: 1.0Gbps) @ 2X2

ue-CategoryUL 13 (UL: 150Mbps) + ue-CategoryDL 18 (DL: 1.2Gbps) @ 4X4

3G

WCDMA

HSPA+ Rel8 (DL/UL: up to 42/11 Mbps)

Band

Band1/2/4/5(6/19)/8/9

GNSS

GPS/GLONASS/Beidou/Galileo

Interface

Qlink/MIPI/GRFC

1. General Description

T77W980T00 is designed to enable wireless data connectivity for notebook computer or any other
device which runs on Qualcomm Snapdragon SDM845/ SDM850, it is compatible with the LGA
interface 31x31type. It delivers wireless wide-area network (WWAN) connectivity for the LTE,
UMTS and GPS/GLONASS/Beidou/Galileo protocols in one hardware configuration.

6

Feature

Description

Physical

LTE module, 31 x 31 mm, 183 pin LGA

Electrical

No single voltage supply

Dimension

Dimensions (L × W × H): 31 mm × 31 mm × 2.05 mm

Shielding design

Shield case on board design, no additional shielding requirement

Weight

4.4g

USIM

Off-board USIM connector supported

Operating Bands

WCDMA/HSDPA/HSUPA/HSPA+ operating bands:
Band 2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL)
Band 4: 1710 to 1755 MHz (UL), 2110 to 2155 MHz (DL)
Band 5: 824 to 849 MHz (UL), 869 to 894 MHz (DL)

LTE bands:
Band 2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL)
Band 4: 1710 to 1755 MHz (UL), 2110 to 2155 MHz (DL)
Band 5: 824 to 849 MHz (UL), 869 to 894 MHz (DL)
Band 7: 2500 to 2570 MHz (UL), 2620 to 2690 MHz (DL)
Band 12: 699 to 716 MHz (UL), 729 to 746 MHz (DL)
Band 13: 777 to 787 MHz (UL), 746 to 756 MHz (DL)
Band 14: 788 to 798 MHz (UL), 758 to 768 MHz (DL)
Band 17: 704 to 716 MHz (UL), 734 to 746 MHz (DL)
Band 25: 1850 to 1915 MHz (UL), 1930 to 1995 MHz (DL))
Band 26: 814 to 849 MHz (UL), 859 to 894 MHz (DL)
Band 29: 717 to 728 MHz (DL)
Band 30: 2305 to 2315 MHz (UL) 2350 to 2360 MHz (DL)
Band 38: 2570 to 2620 MHz (UL/DL)
Band 41: 2496 to 2690 MHz (UL/DL)
Band 66: 1710 to 1800 MHz (UL), 2110 to 2200 MHz (DL)
Band 71:663 to 698 MHz (UL), 617 to 652 MHz (DL)

Diversity/2nd Rx

All UMTS operating bands
All LTE operating bands

GNSS

GPS: L1 (1575.42MHz)
GLONASS: L1 (1602MHz)
Beidou (1561.098MHz)
Galileo (1575.42MHz)

Antenna connectors

MAIN and AUX(supports Diversity and GPS simultaneously)

Throughput

WCDMA CS: DL 64 kbps /UL 64 kbps
WCDMA PS: DL 384 kbps /UL 384 kbps

1.1 System Main Feature

COMPANY CONFIDENTIAL

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HSPA+:DL 21.6 Mbps /UL 5.76 Mbps
DC-HSPA+: DL 42 Mbps/UL 5.76 Mbps
LTE Cat4: DL:150 Mbps/UL 50 Mbps
LTE Cat6: DL:300 Mbps/UL 50 Mbps
LTE Cat9: DL:450 Mbps/UL 50 Mbps
LTE Cat11: DL:585 Mbps/UL 50 Mbps
LTE Cat16: DL:1Gbps/UL 150Mbps
LTE Cat18: DL:1.2Gbps/UL 150Mbps

LTE air interface
LTE Rel13

 DL – 1.2 Gbps / 12-layer / 100 MHz CA
 UL - 150 Mbps / 40 MHz CA
 256 QAM DL / 64 QAM UL
 4 × 2 MIMO 5x CA (R13)
 4 × 4 MIMO 3x CA
 FDD + TDD CA
 3.5 GHz and 600 MHz Bands
 LAA and LTE-U (up to 80 MHz of unlicens)
 Advance LTE IC + NAIC (with CRS only)

WCDMA/HSPA air interface
 R99:

All modes and data rates for WCDMA FDD

 R5 HSDPA

PS data speeds up to 7.2 Mbps on the downlink

 R6 HSUPA

E-DCH data rates of up to 5.76 Mbps for 2 ms TTI (UE category 6) uplink

 R7 HSPA+

Downlink 64 QAM SISO: up to 21 Mbps
Downlink 16 QAM 2X2 MIMO: up to 28 Mbps
Uplink 16 QAM: up to 5.76 Mbps

 R8 DC-HSPA+

Downlink dual carrier with 64 QAM (SISO); up to 42 Mbps

GNSS
 Customizable tracking session

• Automatic tracking session on startup

• Concurrent standalone GPS, GLONASS, Beidou and Galileo

COMPANY CONFIDENTIAL

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• gpsOneXTRA with GPS + GLONASS + Beidou + Galileo support

1.2 Carrier aggregation combination

1.2.1. Refer to Qualcomm documents 80-P8641-123 Rev. A, Published: 2017/7/31.
Remark: T77W980 hardware design can support follow CA combination, but the Final CA
combinations plan depends on carrier engagement and Qualcomm software design.

1.2.2. Qualcomm SDX20 support 5CA+256QAM (up to Cat18) and Rel13 (FDD+TDD CA)
which is mandatory for AU/JP/China carriers.
Update the Carrier CA combination, please refer the document:
SDR845_CA_list_20180508 .xlsx

1.3 System Block Diagram

1. GRC is the RF only module, it doesn’t include the CPU & memory. So GRC doesn’t have the SW
image.

2. Each GRC will have its unique QCN data, it will use the GRC SN to name it, and provide these
data to one ftp server. OEM can scan the SN to get the QCN data then load it to the platform memory.

1. Just one antenna to support Tx;

2.Support 2 or 4 antennas simultaneously (2 ANTs up to Cat16: 2X2 MIMO+5CA, 4 ANTs up to
Cat18: 4X4 MIMO+3CA and 2X2 MIMO+5CA)

1.Single main antenna design with Pentaplexer;

2.All the PAMiD with PA+SW+Filter+LNA+ASM.
Figure 1-3-2 RF Block Diagram-DRX

1.Single aux antenna design with Pentaplexer;

2.Add QLN2042 for 3.5GHz

1.4 Pin definition

1.4.1 LGA interface Pin sequence

1.4.2 Pin definition
Table 1-4-2Definitions of pins on the LGA interface

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PIN #

Signal Name^

Description

Comments

A3

GND

GND

A4

GND

GND

A5

GND

GND

A6

GND

GND

A7

GND

GND

A8

GND

GND

A9

GND

GND

A10

GND

GND

A11

GND

GND

A12

GND

GND

B3

GND

GND

B4

GND

GND

B5

GND

GND

B6

GND

GND

B7

GND

GND

B8

GND

GND

B9

GND

GND

B10

GND

GND

B11

GND

GND

B12

GND

GND

B13

GND

GND

C1

GND

GND

C2

GND

GND

C3

GND

GND

C4

GND

GND

C5

GND

GND

C6

GND

GND

C7

GND

GND

C8

GND

GND

C9

GND

GND

C10

GND

GND

C11

GND

GND

C12

GND

GND

C13

GND

GND

C14

GND

GND

D1

GND

GND

D2

GNSS_EN

GNSS Enable

D3

GRFC4

Generic RF control

D4

VREG_L12M_2P7

Power supply input

For switch, for
FEM VDD

D5

VREG_L12M_2P7

Power supply input

D6

VREG_L12M_2P7

Power supply input

D7

VREG_L6M_1P8

VDD_1P8_DIG

For PA ,LNA,
FEM VIO,for

SDR845

D8

VREG_L6M_1P8

VDD_1P8_DIG

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PIN #

Signal Name^

Description

Comments

1P8_DIG, for ET

D9

GRFC2

Generic RF control

D10

GND

GND

D11

GND

GND

D12

GND

GND

D13

GND

GND

D14

GND

GND

E1

GND

GND

E2

GND

GND

E3

GPIO_1

HW Version check

E4

GPIO_2

HW Version check

E5

GRFC6

Generic RF control

E6

GND

GND

E7

GND

GND

E8

GRFC7

Generic RF control

E9

GND

GND

E10

GND

GND

E11

PA_THERM_2

AMUX input for 3.5G PA thermistor

It is a NTC --

100Kohm 1%

170mW

E12

GND

GND

E13

GND

GND

E14

GND

GND

F1

GND

GND

F2

GND

GND

F3

RFFE3_DATA

MIPI RFFE data

F4

RFFE3_CLK

MIPI RF front end (RFFE) clock

F5

GND

GND

F6

RFFE4_CLK

MIPI RF front end (RFFE) clock

F7

RFFE4_DATA

MIPI RFFE data

F8

GND

GND

F9

RFFE6_CLK

MIPI RF front end (RFFE) clock

F10

GND

GND

F11

GND

GND

F12

GND

GND

F13

GND

GND

F14

GND

GND

G1

GND

GND

G2

GND

GND

G3

GND

GND

G4

GND

GND

G5

GND

GND

G6

GND

GND

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PIN #

Signal Name^

Description

Comments

G7

GND

GND

G8

GND

GND

G9

RFFE6_DATA

MIPI RFFE data

G10

GND

GND

G11

GRFC1

Generic RF control

G12

GND

GND

G13

VREG_L5M

VDD_1P8_ANA_W0

G14

GND

GND

H1

GND

GND

H2

VREG_L6M_1P8

VDD_1P8_DIG

H3

VREG_L6M_1P8

VDD_1P8_DIG

H4

GND

GND

H5

QLINK_REQ

QLink request from SDR845

H6

QPHY_DL2_P

QLink downlink lane 2 – plus

H7

QPHY_DL1_P

QLink downlink lane 1 – plus

H8

GND

GND

H9

GND

GND

H10

GRFC3

Generic RF control

H11

VREG_L1M

VDD_1P2_ANA_W0

H12

VREG_L1M

VDD_1P2_ANA_W0

H13

VREG_L5M

VDD_1P8_ANA_W0

H14

GND

GND

I1

GND

GND

I2

VREG_L5M

VDD_1P8_ANA_W0

I3

VREG_L5M

VDD_1P8_ANA_W0

I4

GND

GND

I5

QLINK_EN

QLink Enable for SDR845

I6

QPHY_DL2_M

QLink downlink lane 2 – minus

I7

QPHY_DL1_M

QLink downlink lane 1 – minus

I8

GND

GND

I9

RFFE5_CLK

MIPI RF front end (RFFE) clock

I10

GND

GND

I11

PA_THERM_1

AMUX input for M/HB PA thermistor

It is a NTC --

100Kohm 1%

170mW

I12

VREG_L1M

VDD_1P2_ANA_W0

I13

VREG_L5M

VDD_1P8_ANA_W0

I14

GND

GND

J1

GND

GND

J2

VREF_DAC

Transmitter DAC voltage reference

J3

VREF_DAC

Transmitter DAC voltage reference

J4

GND

GND

J5

QPHY_DL0_P

QLink downlink lane 0 – plus

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PIN #

Signal Name^

Description

Comments

J6

QPHY_CLK_M

QLink clock – minus

J7

QPHY_UL0_P

QLink uplink lane 0 – plus

J8

GND

GND

J9

RFFE5_DATA

MIPI RFFE data

J10

GND

GND

J11

VREG_L8M

VDD_1P0_DIG_W0

For SDR845

J12

VREG_L6M_1P8

VDD_1P8_DIG

J13

GND

GND

J14

GND

GND

K1

GND

GND

K2

WMSS_RESET

Reset functionality for the digital sections

inside the transceiver

K3

VREF_DAC

Transmitter DAC voltage reference

K4

GND

GND

K5

QPHY_DL0_M

QLink downlink lane 0 – minus

K6

QPHY_CLK_P

QLink clock – plus

K7

QPHY_UL0_M

QLink uplink lane 0 – minus

K8

GND

GND

K9

GND

GND

K10

VREG_L8M

VDD_1P0_DIG_W0

K11

VREG_L8M

VDD_1P0_DIG_W0

K12

VREG_L6M_1P8

VDD_1P8_DIG

K13

VPH_QFE

Power supply input for RF

K14

GND

GND

L1

GND

GND

L2

GND

GND

L3

GRFC5

Generic RF control

L4

GND

GND

L5

GND

GND

L6

GND

GND

L7

GND

GND

L8

GND

GND

L9

GND

GND

L10

VREG_L3M

VDD_1P0_ANA_W0

For SDR845

L11

VREG_L6M_1P8

VDD_1P8_DIG

L12

VPH_QFE

Power supply input for RF -- 3.3V~4.4V

L13

VPH_QFE

Power supply input for RF -- 3.3V~4.4V

L14

GND

GND

M2

GND

GND

M3

GND

GND

M4

RF_CLK1

38.4 MHz reference input forPLLs and other
circuits

M5

GND

GND

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PIN #

Signal Name^

Description

Comments

M6

RFFE1_CLK

MIPI RF front end (RFFE) clock

M7

RFFE1_DATA

MIPI RFFE data

M8

GND

GND

M9

VREG_L3M

VDD_1P0_ANA_W0

M10

VREG_L3M

VDD_1P0_ANA_W0

M11

VPH_QFE

Power supply input for RF -- 3.3V~4.4V

M12

VPH_QFE

Power supply input for RF -- 3.3V~4.4V

M13

GND

GND

N3

GND

GND

N4

GND

GND

N5

GND

GND

N6

GND

GND

N7

GND

GND

N8

GND

GND

N9

GND

GND

N10

GND

GND

N11

GND

GND

N12

GND

GND

Metrics

Guidance

Comments

Total channel bus length

<=60mm

Maximun PCB bus routing length for entire ch
annel between SDM845 to GRC

Impedance

Diff Z0 min/max

Field route

85Ω +/- 10Ω

Differential PCB routing Z0

Length Match

Intrapair match

0.7mm

Length match between P and N side of differe
ntial pair, need to include the GRC internal
trace length

1.5 Platform connection design

1.5.1 For signal line impedance control

For Qlink signal line:
For Qlink line, shall shielding well for themself, difference control for each pair lines.
Please refer Qualcomm document: 80-P6348-3 Rev. A

1.5.2 For GRC mother board layout suggestion
a: Please put the Q-link signals routing on the first priority, Q-link signal frequency will be up to
6GHz. If GRC module mounts on the mother board top side, that on the mother board PCB top layer,
please don’t have the other signal trace during the position of these Q-link signals. Detail location
please see the below pictures.

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b: For Q-link signal lines’ upper and lower layers must be GND, they should be wrapped up in GND
well. GRC also have the MIPI line, suggest to route by differential.
If GRC module mounts on the mother board top side, please reserve the relative position clearance
on the back side. We need to consider the thermal, reserve the location for future thermal solution. So
it is better that don’t put the components on the GRC module back side.
Please refer the below picture, suggest to reserve the red dotted line location (31L * 25H mm).

Figure 1-5-2PC mother board (Top/bottom view)

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2. Hardware features

T77W980T00 consists of the following key engine components, in addition to the required front-end
RF and other discrete components.
Modem engine

■ RF: SDR845
Connectivity engine

■ Antenna: connectors for the off board antennas

2.1 RF transceiver

The SDR845 device is a highly-integrated multimode, multiband RF CMOS transceiver IC that
interfaces with the SDX20 device through QLink. The SDR845 is the first integrated single-chip
RFIC for LTE downlink carrier aggregation (CA) up to 100 MHz BW supporting 5DL CA (two of the
carriers must be contiguous). It also supports LTE uplink carrier aggregation up to 20 MHz + 20
MHz for interband and 40 MHz for contiguous intraband.

2.1.1 For Key features of SDR845
 Qualcomm Technologies, Inc. (QTI) 28 nm RF CMOS device with an integrated modem

subsystem in a PSP package (0.35 mm pitch)

 Integrating RF receive, transmit, and the QLink controller
 First QTI single-chip RF device to support three-carrier
 4 × 4 MIMO (where two carriers are contiguous)
 First QTI single-chip RF device to have dedicated MIMO inputs
 SDR845 is the first QTI RF transceiver to support 12-layer DL MIMO

2.1.1 For Key benefits of SDR845
 First QTI single-chip RF device to support three-carrier 4 × 4 MIMO (where two carriers are

contiguous)

 This device is also capable of supporting two-carrier 4 × 4 MIMO and two-carrier 4x HORxD
 First QTI single-chip RF device to have dedicated MIMO inputs
 SDR845 is the first QTI RF transceiver to support 12-layer DL MIMO
 QTI RF device that supports high-speed digital interface (QLink) between SDR845 and
 SDX20/SDM845
 QTI RF device supporting external GRFCs that can be used for RF front-end communication

and general-purpose functions

 QTI single-chip RF transceiver with integrated LTE-unlicensed (LTE-U)/LAA support
 QTI RF device that supports B42, B43, B46, and B48

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Antenna

Interface

Frequencies [MHz]

0

WWANMain

600~6000

1

WWAN MIMO 1

1700~2700

2

WWAN MIMO 2

1700~2700

3

WWAN Aux/GPS

600~6000

 QTI single-chip RF device that supports uplink carrier aggregation (using two Tx chains)
 QTI single-chip RF device that supports the integrated envelope tracking (ET) feature for both

Tx chains (ETDAC0 and ETDAC1)

 QTI single-chip RF transceiver that supports up to five downlink (DL) carrier aggregation
 One independent differential low noise amplifier (LNA) port, supporting Tx feedback for all

WAN bands (UL)

 Most highly integrated RF transceiver
 Up to 10 receivers running concurrently
 Simplified DC power requirements for this highly integrated RFIC with built-in microprocessor

2.2 Antenna Design

The antenna elements are typically integrated into the notebook/ultrabook /tablet and connected to
T77W980T00module via flexible RF coaxial cables. T77W980T00 provides four RF connectors
(MHF4 type), one for the primary transmitter/receiver port and one for the diversity receiver and
GNSS the others for the 4*4 MIMO. To ensure customer has a clear knowledge of the four antennas,
check below product picture.

Figure 2-2-1 Antenna connector location and type

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Parameter

Min

Type

Max

Units

Storage temperature

-30

+25

+85

°C

Recommend operating temperature
(3GPP compliant with mitigation plan) (*1)

-30

+25

+70

°C

Extendable (with limited performance)
Temperature measure on T77W980 module(*2)

-40 +85

°C

3.1 commended operating conditions

Table 4-1 Recommended operating conditions

3.2 Storage Requirement

The module must be stored and sealed properly in vacuum package under a temperature below 40°
C and the relative humidity less than 90% in order to ensure the weldability within 12 months.

3.3 Crystal material

For T77W980T00 OEM main board crystal , please OEM choose the same material TXC

-OW38477001, when mount the GRC on the mother board, for OEM just redo the XO_Calibration,
and leverage the RF QCN parameter.

OEM vendor needs to set up a RF calibration station for crystal, Using IQXStream or 8820C to

re-calirbate the XO then rewrite the XO NV.

NV items list will provide later.

Figure 4-2 RF calibration station

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Specification / Requirements

Contact discharge

Air discharge

JEDEC JESD22-A114D

All SMT interfaces

± 1kV Human Body Model

n.a.

ETSI EN 301 489-1/7

All antenna interfaces
(LTE/WCDMA/GPS)

± 4kV

± 8kV
BATT+

± 4kV

± 8kV

4. Electrostatic Discharge

The module is not protected against Electrostatic Discharge (ESD) in general. Consequently, it is
subject to ESD handling precautions that typically apply to ESD sensitive components.
Proper ESD handling and packaging procedures must be applied throughout the processing,
handling and operation of any application that incorporates a T77W980T00 LTE module.

The remaining interfaces of T77W980T00 LTE module are not accessible to the user of the final
product (since they are installed within the device) and are therefore only protected according to the
JEDEC JESD22-A114D requirements.
T77W980T00 LTE module has been tested according to the following standards. Electrostatic values
can be gathered from the following table.

Table 4-5: Electrostatic values

Note: Please note that the values may vary with the individual application design. For example, it
matters whether or not the application platform is grounded over external devices like a computer or
other equipment

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5. Mechanics, Mounting and Packaging

5.1Mechanics

5.1.1 Overview
The T77W980T00 LTE module uses the 183-pin LGA as their external interface. For details about
the module and dimensions, see 5.1.2 Dimensions and Interfaces (Tolerance:+/-0.10).
Typical module dimension (W x L): 31mmx31mm. Max Z-height is 2.15mm
Pin1

Figure 5-1-1Top & side view

5.1.2 Dimensions and Interfaces
Figure 5-1-2 shows the dimensions in details.

Figure 5-1-2 Dimensions Top view (Unit: mm)

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5.1.2 Recommended LGA Land Pattern(bottom view), unit:mm

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5.1.3PCB stacking
10 Layers, HDI, thickness:0.8mm +/-0.05mm

5.1.4 label information

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5.2Mounting onto the Application Platform

This section describes how to mount T77W980T00 LTE Module onto the PCBs (=printed circuit
boards), includingland pattern and stencil design, board-level characterization, soldering conditions,
durabilityand mechanical handling.

Note: All SMT module pads need to be soldered to the application’s PCB. Not only must all supply

pads and signals be connected appropriately, but all pads denoted as “Do not use” will alsohave to be

soldered (but not electrically connected) in order to ensure the best possible mechanical stability.

5.2.1SMT PCB Assembly

5.2.1.1Land Pattern and Stencil
Recommended design of the solder pads on customers' PCBs (Unit: mm)
Non Solder Mask Defined (NSMD) is recommended. In addition, the solder mask of the NSMD pad
design is larger than the pad so the reliability of the solder joint can be improved.

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Figure 5-2-1Land pattern (top view)

It is recommended that the stencil for the LGA module be at least 0.15 mm in thickness. For
the recommended stencil aperture design, refer figure 5-2-1.（Unit: mm）
The solder paste dosage(0.1587g/pcs) is a theoretical value for reference.

5.2.1.2Board Level Characterization

Board level characterization issues should also be taken into account if devising an SMT process.
Characterization tests should attempt to optimize the SMT process with regard to board
levelreliability. This can be done by performing the following physical tests on sample boards:
Peeltest, bend test, tensile pull test, drop shock test and temperature cycling.

It is recommended to characterize land patterns before an actual PCB production, taking individual
processes, materials, equipment, stencil design, and reflow profile into account. For landand stencil
pattern design recommendations see also Section 5.2.1.1. Optimizing the solderstencil pattern design
and print process is necessary to ensure print uniformity, to decrease solder voids, and to increase
board level reliability.
Generally, solder paste manufacturer recommendations for screen printing process parameters and
reflow profile conditions should be followed. Maximum ratings are described in Section5.2.3.

5.2.2Moisture Sensitivity Level

T77W980T00 LTE Module comprises components that are susceptible to damage induced by
absorbed moisture.

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Profile Feature

Pb-Free Assembly

Preheat & Soak
Temperature Minimum (TSmin )
Temperature Maximum (TSmax )
Time (tSminto t Smax ) (tS )

150℃
180℃

60~120 seconds

Average ramp up rate (TSmax to TP )

3 K/second max

Liquidous temperature (TL )
Time at liquidous (tL )

217℃
50~90 seconds

Peak package body temperature (TP )

240~250℃

Time (tP ) within 5 °C of the peak package body
temperature (TP )

30 seconds max.
Average ramp-down rate (TP to TSmax )

3 K/second max.

Time 25°C to maximum temperature

8 minutes max.

T77W980T00 LTE Module complies with the latest revision of the IPC/JEDEC J-STD-020 Standard
for moisture sensitive surface mount devices and is classified as MSL 4.For additional MSL
(=moisture sensitivity level) related information see Section 5.2.4 and Section 5.3.2.

5.2.3Soldering Conditions and Temperature

5.2.3.1Reflow Profile

Figure 5-2-3: Reflow Profile

Table 5-2: Reflow temperature ratings

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5.2.3.2Maximum Temperature and Duration

The following limits are recommended for the SMT board-level soldering process to attach the
module:

• A maximum module temperature of 245°C. This specifies the temperature as measured atthe
module’s top side.

• A maximum duration of 30 seconds at this temperature.
Please note that while the solder paste manufacturers' recommendations for best temperature
and duration for solder reflow should generally be followed, the limits listed above must not be
exceeded.
T77W980T00 LTE Module is specified for one soldering cycle only.Once T77W980T00 LTE module
is removed from the application, themodule will very likely be destroyed and cannot be soldered onto
another application.

5.2.4Durability and Mechanical Handling

5.2.4.1Storage Life

T77W980T00 LTE modules, as delivered in tape and reel (TBD) carriers, must be stored in sealed,
moisture barrieranti-static bags. The shelf life in a sealed moisture bag is an estimated 12 month.
However, sucha life span requires a non-condensing atmospheric environment, ambient temperatures
below
40°C and a relative humidity below 90%. Additional storage conditions are listed in Table 3-1.

5.2.4.2Processing Life

T77W980T00 LTE module must be soldered to an application within 72 hours after opening the
MBB (=moisturebarrier bag) it was stored in.As specified in the IPC/JEDEC J-STD-033 Standard,
the manufacturing site processing themodules should have ambient temperatures below 30°C and a
relative humidity below 60%.

5.2.4.3 Baking

Baking conditions are specified on the moisture sensitivity label attached to each MBB (see
Figure 49 for details):

• It is not necessary to bake T77W980T00 LTE module , if the conditions specified in Section

5.2.4.1 and Section5.2.4.2 were not exceeded.

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• It is necessary to bake T77W980T00 LTE module , if any condition specified in Section 5.2.4.1
and Section 5.2.4.2 was exceeded.

If baking is necessary, the modules must be put into trays that can be baked to at least 125°C.
Devices should not be baked in tape and reel carriers at any temperature.

5.2.4.4 Electrostatic Discharge

ESD (=electrostatic discharge) may lead to irreversible damage for the module. It is
thereforeadvisable to develop measures and methods to counter ESD and to use these to control the
electrostatic environment at manufacturing sites.
Please refer to Section 4.5 for further information on electrostatic discharge.

5.3Packaging

5.3.1Tape and Reel(TBD)

The single-feed tape carrier for T77W980T00 LTE is illustrated in Figure 45. The figure also shows
the proper part orientation.

5.3.1.1 Orientation

Figure 5-3-1: Carrier tape

Figure 5-3-2: Roll direction

5.3.1.2Barcode Label

A barcode label provides detailed information on the tape and its contents. It is attached to thereel.

Figure 5-3-3: Barcode label on tape reel

5.3.2Shipping Materials

T77W980T00 LTE module is distributed in tape and reel carriers. The tape and reel carriers used to
distribute T77W980T00 LTE module are packed as described below, including the following required
shipping materials:

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• Moisture barrier bag, including desiccant and humidity indicator card

• Transportation bag

5.3.2.1Moisture Barrier Bag

The tape reels are stored inside an MBB (=moisture barrier bag), together with a humidity indicator
card and desiccant pouches - see Figure 48. The bag is ESD protected and delimits moisture
transmission. It is vacuum-sealed and should be handled carefully to avoid puncturing ortearing. The
bag protects the T77W980T00 LTE modules from moisture exposure. It should not be openeduntil
the devices are ready to be soldered onto the application.

Figure 5-3-4: Moisture barrier bag (MBB) with imprint

The label shown in Figure 5-3-5 summarizes requirements regarding moisture sensitivity, including
shelf life and baking requirements. It is attached to the outside of the moisture barrier bag.

Figure 5-3-5: Moisture Sensitivity Label
MBBs contain one or more desiccant pouches to absorb moisture that may be in the bag.
Thehumidity indicator card described below should be used to determine whether the
enclosedcomponents have absorbed an excessive amount of moisture.
The desiccant pouches should not be baked or reused once removed from the MBB.
The humidity indicator card is a moisture indicator and is included in the MBB to show the
approximate relative humidity level within the bag. Sample humidity cards are shown in Figure
5-3-6.If the components have been exposed to moisture above the recommended limits, the units
willhave to be rebaked.

Figure 5-3-6: Humidity Indicator Card - HIC

A baking is required if the humidity indicator inside the bag indicates 10% RH or more.

5.3.2.2Transportation Box

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Tape and reel carriers are distributed in a box, marked with a barcode label for identificationpurposes.
A box contains 2 reels with 500 modules each.

3. Sample Application

TBD

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GNSS

Customizable tracking session

• Automatic tracking session on startup

• Concurrent standalone GPS, GLONASS, Beidou and Galileo

• gpsOneXTRA with GPS + GLONASS + Beidou + Galileo support

1.2 Carrier aggregation combination

1.2.1. Refer to Qualcomm documents 80-P8641-123 Rev. A, Published: 2017/7/31.

Remark: T77W980 hardware design can support follow CA combination, but the Final CA

combinations plan depends on carrier engagement and Qualcomm software design.

1.2.2. Qualcomm SDX20 support 5CA+256QAM (up to Cat18) and Rel13 (FDD+TDD CA)

which is mandatory for AU/JP/China carriers.

Update the Carrier CA combination list later

1.3 System Block Diagram

Figure 1-3-1 GRC Architecture

1. GRC is the RF only module, it doesn’t include the CPU & memory. So GRC doesn’t have the SW

image.

2. Each GRC will have its unique QCN data, it will use the GRC SN or IMEI to name it, and provide

these data to one ftp server. OEM can scan the SN or IMEI to get the QCN data then load it to the

platform memory.

Host integration instructions

Install module through golden finger.

The End Host information:

MT code : 81JL
Marketing name : Lenovo YOGA C630-13Q50

Federal Communication Commission Interference Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the

following two conditions: (1) This device may not cause harmful interference,

and (2) this device must accept any interference received, including

interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class

B digital device, pursuant to Part 15 of the FCC Rules. These limits are

designed to provide reasonable protection against harmful interference in a

residential installation. This equipment generates, uses and can radiate radio

frequency energy and, if not installed and used in accordance with the

instructions, may cause harmful interference to radio communications.

However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or

television reception, which can be determined by turning the equipment off and

on, the user is encouraged to try to correct the interference by one of the

following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that

to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: Any changes or modifications not expressly approved by the

party responsible for compliance could void the user's authority to operate this

equipment.

This transmitter must not be co-located or operating in conjunction with any other

antenna or transmitter.

This device is intended only for OEM integrators under the following

conditions:

The antenna must be installed such that 20 cm is maintained between the antenna

and users, and

The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required.

However, the OEM integrator is still responsible for testing their end-product for any

additional compliance requirements required with this module installed

IMPORTANT NOTE: In the event that these conditions can not be met

certain laptop configurations or co-location with another transmitter), then the FCC

authorization is no longer considered valid and the FCC ID can not

final product. In these circumstances, the OEM integrator will be responsible for

re-evaluating the end product (including the transmitter) and obtaining a separate

FCC authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may

be installed such that 20 cm may be maintained between the antenna and users. The

final end product must be labeled in a visible area with the following: “Contains FCC

ID:MCLT77W980”. The grantee's FCC ID can be used only when all FCC compliance

requirements are met.

(for example

be used on the

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user

regarding how to install or remove this RF module in the user’s manual of the

end product which integrates this module.

The end user manual shall include all required regulatory information/warning

as show in this manual.

Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an

uncontrolled environment. This equipment should be installed and operated

with minimum distance 20cm between the radiator & your body.

Industry Canada statement:

This device complies with ISED’s licence-exempt RSSs. Operation is subject to the

following two conditions: (1) This device may not cause harmful interference, and (2)

this device must accept any interference received, including interference that may

cause undesired operation.

Le présent appareil est conforme aux CNR d’ ISED applicables aux appareils radio

exempts de licence. L’exploitation est autorisée aux deux conditions suivantes : (1) le

dispositif ne doit pas produire de brouillage préjudiciable, et (2) ce dispositif doit

accepter tout brouillage reçu, y compris un brouillage susceptible de provoquer un

Antenna spec:

Antenna

No.

1
2
3
4
5

Antenna Gain(dBi)

Please refer to below

table

Please refer to below

table

Please refer to below

table

Please refer to below

table

Please refer to below

table

Frequency

range (MHz)

Antenna Type

Connecter

Type

699~803 PIFA i-pex(MHF)
791~960

1447.9~1606
1710~2170
2500~2690
5110~5925

(for LAA RX)

PIFA i-pex(MHF)
PIFA i-pex(MHF)
PIFA i-pex(MHF)

2305~2315 Dipole i-pex(MHF)

Antenna gain list

Antenna

No.

Band Freq. Range (MHz) Gain (dBi)

3 WCDMA II (B2) 1850~1910 4.92
3 WCDMA IV (B4) 1710~1755 5.99
2 WCDMA V (B5) 824~849 2.68
3 LTE Band (2) 1850~1910 4.92
3 LTE Band (4) 1710~1755 5.99
2 LTE Band (5) 824~849 2.68
3 LTE Band (7) 2500~2570 5.2
1 LTE Band (12) 698~716 4.17
1 LTE Band (13) 777~787 3.05
1 LTE Band (14) 788~798 2.87
1 LTE Band (17) 704~716 4.17
3 LTE Band (25) 1850~1915 4.92
2 LTE Band (26) 814~849 2.92
5 LTE Band (30) 2305~2315 3.02
3 LTE Band (38) 2570~2620 4.82
3 LTE Band (41) 2496~2690 5.38
3 LTE Band (66) 1710~1780 5.99
1 LTE Band (71) 663~698 3.83

Cable

Length

100mm
100mm
100mm
100mm

80mm