HON HAI PRECISION IND T77W980 Users Manual

COMPANY CONFIDENTIAL

SDR845 Gigabit RF Card

Engineering Requirements Specification

Project code: T77W980T00 Solution: SDR845

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COMPANY CONFIDENTIAL

Department

Name

Signature

Review Dates

* Plan

** Results

Project Manager

Choro Chung

ProjectLeader

Jeff Guo

Hardware Engineer

Neil Li

Rev

Date

Originator

Comment

V1.0

2018/01/11

Neil Li

Initial release for carrier engagement, will update it after fix hardware design

V1.1

2018/02/03

Neil Li

Update the mechanical drawing

V1.2

2018/02/06

Neil Li

Update the soldering condition

V1.3

2018/02/22

Neil Li

Update the soldering information

V1.4

2018/04/14

Neil Li

Update the Qlink information

V1.5

2018/05/22

Neil Li

Add the Qlink length information

V1.6

2018/06/13

Neil Li

Add the label information

Reviewers

Modification History

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COMPANY CONFIDENTIAL

CONTENTS

1. GENERAL DESCRIPTION........................................................................ 5

1.1 SYSTEM MAIN FEATURE ...................................................................... 6

1.2 CARRIER AGGREGATION COMBINATION ..................................... 8

1.3 SYSTEM BLOCK DIAGRAM .................................................................. 8

1.4 PIN DEFINITION ...................................................................................... 8

1.5 PLATFORM CONNECTION DESIGN ................................................. 13

2. HARDWARE FEATURES ........................................................................ 15

2.1 RF TRANSCEIVER ................................................................................. 15

2.2 ANTENNA DESIGN ................................................................................ 16

4.1RECOMMENDED OPERATING CONDITIONS ................................ 17

4.2 STORAGE REQUIREMENT ................................................................. 17

4.3 THERMAL DISSIPATION PROPOSAL .............................................. 17

4.4CRYSTAL MATERIAL ........................................................................... 17

4.5ELECTROSTATIC DISCHARGE .......................................................... 18

5. MECHANICS, MOUNTING AND PACKAGING ................................. 19

5.1MECHANICS ............................................................................................. 19

5.2MOUNTING ONTO THE APPLICATION PLATFORM ................... 22

5.2.1SMT PCB ASSEMBLY .......................................................................... 22

5.2.1.1LAND PATTERN AND STENCIL .................................................... 22

5.2.1.2BOARD LEVEL CHARACTERIZATION ...................................... 23

5.2.2MOISTURE SENSITIVITY LEVEL ................................................... 23

5.2.3SOLDERING CONDITIONS AND TEMPERATURE ...................... 24

5.2.3.1REFLOW PROFILE ........................................................................... 24

5.2.3.2MAXIMUM TEMPERATURE AND DURATION ......................... 25

5.2.4DURABILITY AND MECHANICAL HANDLING ........................... 25

5.2.4.1STORAGE LIFE .................................................................................. 25

5.2.4.2PROCESSING LIFE ........................................................................... 25

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COMPANY CONFIDENTIAL

5.2.4.3 BAKING .............................................................................................. 25

5.2.4.4 ELECTROSTATIC DISCHARGE ................................................... 26

5.3PACKAGING ............................................................................................. 26

5.3.1TAPE AND REEL .................................................................................. 26

5.3.1.1 ORIENTATION .................................................................................. 26

5.3.1.2BARCODE LABEL ............................................................................. 26

5.3.2SHIPPING MATERIALS ...................................................................... 26

5.3.2.1MOISTURE BARRIER BAG ............................................................. 27

5.3.2.2TRANSPORTATION BOX ................................................................ 27

6. SAMPLE APPLICATION ......................................................................... 28

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COMPANY CONFIDENTIAL

5

Form Fact

LGA 31x31 Module

Carrier Support

North America: AT&T, Verizon, T-Mobile, Sprint, Bell, Rogers

Europe: Vodafone, EE, DT, H3G, Orange, TEF, TIM, Swisscom

Russia: MTS

China: CMCC, CT, CU

Australia: Telstra, Optus

South Korea: SKT

Japan: KDDI, DCM, SBM

Carriers above is subject to biz discussion

QCT Solution

SDR845

LTE

Mode

FDD / TDD

Band

LB:B8/12(17)/13/14/20/26(5/18/19)/28/29 /B71

MB:B1/2(25)/3/4(66)/32/B39/B34

HB:B7/30/40/41(38)

3.5G:B42/43/48

LAA/LTE-U (DL only): B46

CA

5xDL CA (Up to 100MHz, 256QAM)

2xUL CA (Up to 40MHz. 64QAM) -- intra-band contiguous CA

MIMO

4X4(band plan: B1/2(25)/3/4(66)/7/30/40/41(38)/, 4X2, 2X2

Cat

(DL/UL Mbps)

ue-CategoryUL 13 (UL: 150Mbps) + ue-CategoryDL 16 (DL: 1.0Gbps) @ 2X2

ue-CategoryUL 13 (UL: 150Mbps) + ue-CategoryDL 18 (DL: 1.2Gbps) @ 4X4

3G

WCDMA

HSPA+ Rel8 (DL/UL: up to 42/11 Mbps)

Band

Band1/2/4/5(6/19)/8/9

GNSS

GPS/GLONASS/Beidou/Galileo

Interface

Qlink/MIPI/GRFC

1. General Description

T77W980T00 is designed to enable wireless data connectivity for notebook computer or any other device which runs on Qualcomm Snapdragon SDM845/ SDM850, it is compatible with the LGA interface 31x31type. It delivers wireless wide-area network (WWAN) connectivity for the LTE, UMTS and GPS/GLONASS/Beidou/Galileo protocols in one hardware configuration.

6

Feature

Description

Physical

LTE module, 31 x 31 mm, 183 pin LGA

Electrical

No single voltage supply

Dimension

Dimensions (L × W × H): 31 mm × 31 mm × 2.05 mm

Shielding design

Shield case on board design, no additional shielding requirement

Weight

4.4g

USIM

Off-board USIM connector supported

Operating Bands

WCDMA/HSDPA/HSUPA/HSPA+ operating bands: Band 2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL) Band 4: 1710 to 1755 MHz (UL), 2110 to 2155 MHz (DL) Band 5: 824 to 849 MHz (UL), 869 to 894 MHz (DL)

LTE bands: Band 2: 1850 to 1910 MHz (UL), 1930 to 1990 MHz (DL) Band 4: 1710 to 1755 MHz (UL), 2110 to 2155 MHz (DL) Band 5: 824 to 849 MHz (UL), 869 to 894 MHz (DL) Band 7: 2500 to 2570 MHz (UL), 2620 to 2690 MHz (DL) Band 12: 699 to 716 MHz (UL), 729 to 746 MHz (DL) Band 13: 777 to 787 MHz (UL), 746 to 756 MHz (DL) Band 14: 788 to 798 MHz (UL), 758 to 768 MHz (DL) Band 17: 704 to 716 MHz (UL), 734 to 746 MHz (DL) Band 25: 1850 to 1915 MHz (UL), 1930 to 1995 MHz (DL)) Band 26: 814 to 849 MHz (UL), 859 to 894 MHz (DL) Band 29: 717 to 728 MHz (DL) Band 30: 2305 to 2315 MHz (UL) 2350 to 2360 MHz (DL) Band 38: 2570 to 2620 MHz (UL/DL) Band 41: 2496 to 2690 MHz (UL/DL) Band 66: 1710 to 1800 MHz (UL), 2110 to 2200 MHz (DL) Band 71:663 to 698 MHz (UL), 617 to 652 MHz (DL)

Diversity/2nd Rx

All UMTS operating bands All LTE operating bands

GNSS

GPS: L1 (1575.42MHz) GLONASS: L1 (1602MHz) Beidou (1561.098MHz) Galileo (1575.42MHz)

Antenna connectors

MAIN and AUX(supports Diversity and GPS simultaneously)

Throughput

WCDMA CS: DL 64 kbps /UL 64 kbps WCDMA PS: DL 384 kbps /UL 384 kbps

1.1 System Main Feature

COMPANY CONFIDENTIAL

7

HSPA+:DL 21.6 Mbps /UL 5.76 Mbps DC-HSPA+: DL 42 Mbps/UL 5.76 Mbps LTE Cat4: DL:150 Mbps/UL 50 Mbps LTE Cat6: DL:300 Mbps/UL 50 Mbps LTE Cat9: DL:450 Mbps/UL 50 Mbps LTE Cat11: DL:585 Mbps/UL 50 Mbps LTE Cat16: DL:1Gbps/UL 150Mbps LTE Cat18: DL:1.2Gbps/UL 150Mbps

LTE air interface LTE Rel13

 DL – 1.2 Gbps / 12-layer / 100 MHz CA  UL - 150 Mbps / 40 MHz CA  256 QAM DL / 64 QAM UL  4 × 2 MIMO 5x CA (R13)  4 × 4 MIMO 3x CA  FDD + TDD CA  3.5 GHz and 600 MHz Bands  LAA and LTE-U (up to 80 MHz of unlicens)  Advance LTE IC + NAIC (with CRS only)

WCDMA/HSPA air interface  R99:

All modes and data rates for WCDMA FDD

 R5 HSDPA

PS data speeds up to 7.2 Mbps on the downlink

 R6 HSUPA

E-DCH data rates of up to 5.76 Mbps for 2 ms TTI (UE category 6) uplink

 R7 HSPA+

Downlink 64 QAM SISO: up to 21 Mbps Downlink 16 QAM 2X2 MIMO: up to 28 Mbps Uplink 16 QAM: up to 5.76 Mbps

 R8 DC-HSPA+

Downlink dual carrier with 64 QAM (SISO); up to 42 Mbps

GNSS  Customizable tracking session

• Automatic tracking session on startup

• Concurrent standalone GPS, GLONASS, Beidou and Galileo

COMPANY CONFIDENTIAL

8

• gpsOneXTRA with GPS + GLONASS + Beidou + Galileo support

1.2 Carrier aggregation combination

1.2.1. Refer to Qualcomm documents 80-P8641-123 Rev. A, Published: 2017/7/31. Remark: T77W980 hardware design can support follow CA combination, but the Final CA combinations plan depends on carrier engagement and Qualcomm software design.

1.2.2. Qualcomm SDX20 support 5CA+256QAM (up to Cat18) and Rel13 (FDD+TDD CA) which is mandatory for AU/JP/China carriers. Update the Carrier CA combination, please refer the document: SDR845_CA_list_20180508 .xlsx

1.3 System Block Diagram

1. GRC is the RF only module, it doesn’t include the CPU & memory. So GRC doesn’t have the SW image.

2. Each GRC will have its unique QCN data, it will use the GRC SN to name it, and provide these data to one ftp server. OEM can scan the SN to get the QCN data then load it to the platform memory.

1. Just one antenna to support Tx;

2.Support 2 or 4 antennas simultaneously (2 ANTs up to Cat16: 2X2 MIMO+5CA, 4 ANTs up to Cat18: 4X4 MIMO+3CA and 2X2 MIMO+5CA)

1.Single main antenna design with Pentaplexer;

2.All the PAMiD with PA+SW+Filter+LNA+ASM. Figure 1-3-2 RF Block Diagram-DRX

1.Single aux antenna design with Pentaplexer;

2.Add QLN2042 for 3.5GHz

1.4 Pin definition

1.4.1 LGA interface Pin sequence

1.4.2 Pin definition Table 1-4-2Definitions of pins on the LGA interface

COMPANY CONFIDENTIAL

9

PIN #

Signal Name^

Description

Comments

A3

GND

A4

GND

A5

GND

A6

GND

A7

GND

A8

GND

A9

GND

A10

GND

A11

GND

A12

GND

B3

GND

B4

GND

B5

GND

B6

GND

B7

GND

B8

GND

B9

GND

B10

GND

B11

GND

B12

GND

B13

GND

C1

GND

C2

GND

C3

GND

C4

GND

C5

GND

C6

GND

C7

GND

C8

GND

C9

GND

C10

GND

C11

GND

C12

GND

C13

GND

C14

GND

D1

GND

D2

GNSS_EN

GNSS Enable

D3

GRFC4

Generic RF control

D4

VREG_L12M_2P7

Power supply input

For switch, for FEM VDD

D5

VREG_L12M_2P7

Power supply input

D6

VREG_L12M_2P7

Power supply input

D7

VREG_L6M_1P8

VDD_1P8_DIG

For PA ,LNA, FEM VIO,for

SDR845

D8

VREG_L6M_1P8

VDD_1P8_DIG

COMPANY CONFIDENTIAL

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PIN #

Signal Name^

Description

Comments

1P8_DIG, for ET

D9

GRFC2

Generic RF control

D10

GND

D11

GND

D12

GND

D13

GND

D14

GND

E1

GND

E2

GND

E3

GPIO_1

HW Version check

E4

GPIO_2

HW Version check

E5

GRFC6

Generic RF control

E6

GND

E7

GND

E8

GRFC7

Generic RF control

E9

GND

E10

GND

E11

PA_THERM_2

AMUX input for 3.5G PA thermistor

It is a NTC --

100Kohm 1%

170mW

E12

GND

E13

GND

E14

GND

F1

GND

F2

GND

F3

RFFE3_DATA

MIPI RFFE data

F4

RFFE3_CLK

MIPI RF front end (RFFE) clock

F5

GND

F6

RFFE4_CLK

MIPI RF front end (RFFE) clock

F7

RFFE4_DATA

MIPI RFFE data

F8

GND

F9

RFFE6_CLK

MIPI RF front end (RFFE) clock

F10

GND

F11

GND

F12

GND

F13

GND

F14

GND

G1

GND

G2

GND

G3

GND

G4

GND

G5

GND

G6

GND