HON HAI PRECISION IND T77H566 User Manual

COMPANY CONFIDENTIAL

Project Name

M.2 Type1216 BCM4356

WLAN + BT Combo Module

Foxconn Part No.

T77H566.01

Customer Model Name.

PK29S005P10

Product Revision

01S1

HON HAI PRECISION IND. CO., LTD. No.2, 2nd Dong Huan Road, 10th YouSong lndustrial District, Longhua Town, Baoan, ShenZhen Tel: +86-755-28128988#29413 Fax: +86-755-28129800#64886

Revision Note

WiFi/BT Module

Preliminary Datasheet

BCM4356 Dual-Band 2x2 802.11ac and Bluetooth v4.1

Combo Module

1

COMPANY CONFIDENTIAL

Preliminary Datasheet

Index

1. REVISION HISTORY ................................................................................................................................................... 3

2. INTRODUCTION .......................................................................................................................................................... 4

2.1 HARDWARE ARCHITECTURE .................................................................................................................................... 4

2.2 FEATURES ................................................................................................................................................................ 5

2.3 STANDARDS COMPLIANCE ....................................................................................................................................... 5

3. MECHANICAL SPECIFICATION .............................................................................................................................. 6

3.1 MECHANICAL DRAWING ............................................................................................................................................ 6

3.2 PCB STACK .............................................................................................................................................................. 6

3.3 RECOMMENDED LGA LAND PATTERN ..................................................................................................................... 7

3.4 RECOMMENDED STENCIL APERTURE ....................................................................................................................... 7

3.5 RF CONNECTOR TYPE ................................................................ ................................................................ ............. 8

3.6 RF CABLE ASSEMBLY NOTICE .................................................................................................................................. 9

3.7 RF PORT DEFINE ...................................................................................................................................................... 9

4. LGA PIN-OUT DEFINITION ..................................................................................................................................... 10

4.1 MODULE PIN-OUT DEFINITION ................................................................................................................................. 10

4.2 PIN DEFINITION ....................................................................................................................................................... 11

5. PRODUCT SPECIFICATION ................................................................................................................................... 13

5.1 DC ELECTRICAL SPECIFICATION ........................................................................................................................... 13

5.2 RF CHARACTERISTICS(TBD) ................................................................................................................................. 13

5.3 POWER UP SEQUENCE AND TIMING ...................................................................................................................... 15

5.3.1 Control signal Timing (WLAN=ON, BT=ON) ........................................................................................... 16

5.3.2 Control signal Timing (WLAN=OFF, BT=OFF) ....................................................................................... 16

5.3.3 Control signal Timing (WLAN=ON, BT=OFF) ......................................................................................... 17

5.3.3 Control signal Timing (WLAN=OFF, BT=ON) ......................................................................................... 17

5.3.4 WLAN Boot Up Sequence .......................................................................................................................... 17

5.4 UART HOST INTERFACE TIMING ........................................................................................................................... 18

5.5 PCM INTERFACE TIMING ....................................................................................................................................... 19

6.SCHEMATIC REFERENCE DESIGN ...................................................................................................................... 24

7. SOFTWARE REQUIREMENT(TBD) ....................................................................................................................... 26

8. REGULATORY(TBD) ................................................................................................................................................ 26

9. QUALITY ..................................................................................................................................................................... 26

10. PACKAGE INFORMATION ................................................................................................................................... 27

11. ENVIRONMENTAL REQUIREMENTS AND SPECIFICATIONS ..................................................................... 28

11.1 TEMPERATURE ..................................................................................................................................................... 28

11.2 PCB BENDING ...................................................................................................................................................... 28

11.3 HANDLING ENVIRONMENT .................................................................................................................................... 28

11.4 STORAGE CONDITION .......................................................................................................................................... 28

11.5 BAKING CONDITION .............................................................................................................................................. 28

11.6 SOLDERING AND REFLOW CONDITION .................................................................................................................. 29

2

Preliminary Datasheet

Date

Change Note

Author

REV Note

2014-07-25

Initial release(draft)

Robin Xu

0.1

2014-07-30

Add customer project code

Robin Xu

0.2

2014-08-21

1.Update the block diagram and support BTv4.1 in section2

2.Update the ME drawing in section3.1

3.Update the Recommended stencil aperture in setion3.4

Robin Xu

0.3

2014-11-14

Update WiFi Transmit Output Power

Ru-yan Li

0.4

2014-12-2

Add 3.7 RF port define

Ru-yan Li

0.5

2014-12-25

1.Update WLAN host interface description

2.Update BT RX sensitivity level

Ru-yan Li

0.6

1. Revision History

COMPANY CONFIDENTIAL

3

COMPANY CONFIDENTIAL

Form factor

M.2 Type 1216 LGA

Host Interface

WLAN: PCIe mode complies with PCI Express base specification revision 3.0 for x1 lane and power management running at Gen1 speeds. BT: UART for data, PCM for audio

PCB

6-layer HDI design

RF connector

Two MHF-4 RF connectors on module

WiFi/BT Module

Preliminary Datasheet

2. Introduction

Project Name: M.2 Type 1216 BCM4356 WLAN+BT Combo Module Project Number: T77H566.01

This documentation describes the engineering requirements specification of this M.2 1216 type module. WLAN is compliant with IEEE 802.11 a/b/g/n and 2x2 IEEE 802.11ac MAC/ baseband/radio, Bluetooth is compliant with Bluetooth v4.1+HS. This module takes advantage of the high throughput and extended range of Broadcom MIMO solution It is a confidential document of Foxconn.

* For b/g/n and a/b/g/n module, Foxconn HW/FW is the same, platform use different firmware and driver to enable or disable 5GHz 11ac function.

2.1 Hardware Architecture

The WLAN+BT combo module is designed base on BROADCOM BCM4356 chipset with external LNA for both 2.4G and 5GHz. The BCM4356 is a complete dual-band (2.4GHz and 5GHz) Wi-Fi 2X2 MIMO MAC/PHY/Radio System-on-a-Chip. This Wi-Fi single–chip device provides a high level of integration with dual-stream IEEE 802.11ac MAC/baseband/radio, Bluetooth v4.1 + HS. In IEEE802.11ac mode, the WLAN operation supports rates of MCS0-MCS9 (up to 256QAM) in 20MHz, 40MHz and 80MHz channels for data rates up to 866.7Mbps. In addition, all the rates specified in IEEE802.11a/b/g/n are supported. See the block diagram as below:

4

COMPANY CONFIDENTIAL

Preliminary Datasheet

2.2 Features

This module supports the following features:

 IEEE 802.11a/b/g/n/ac dual-band 2x2 MIMO radio with virtual-simultaneous dual-band operation  Bluetooth v4.1+EDR with integrated class1 PA  Enhanced Bluetooth and WLAN coexistence performance  WLAN PCIe module complies with PCI express base specification for x1 lane and power management

running at Gen1 speeds.

 Integrated ARMCR4

functionality minimizing the need to wake up the applications processor for standard WLAN functions. This allows for further minimization of power consumption, while maintaining the ability to field upgrade with features,

 On-chip memory includes 768KB SRAM and 640KB ROM.  OneDriverTM software architecture for easy migration from existing embedded WLAN and Bluetooth

devices as well as future devices.

 TX and RX low-density parity check (LDPC) support for improved range and power efficiency.  Supports IEEE802.11ac/n beam forming.  Bluetooth supports a high–speed UART interface(up to 4Mbps) and PCM for audio  Bluetooth Smart Audio technology improves voice and music quality to headsets  Bluetooth low power inquiry and page scan  Bluetooth low energy(BLE) support  Bluetooth Packet Loss Concealment(PLC)  Bluetooth Wide Band Speech(WBS)  GP/HF compliance

TM

processor with tightly coupled memory for complete WLAN subsystem

2.3 Standards Compliance

 Bluetooth 2.1+EDR  Bluetooth 3.0+HS  Bluetooth 4.1(Bluetooth Low Energy)  IEEE802.11ac mandatory and optional requirements for 20MHz,40MHz and 80MHz channels  IEEE802.11n  IEEE802.11a  IEEE802.11b  IEEE802.11g  IEEE802.11d  IEEE802.11h  IEEE802.11i  Security

- WEP

- WPA/WPA2

- WMM/WMM-PS(U-APSD)/WMM-SA

- AES(Hardware Accelerator)

- TKIP(Hardware Accelerator)

- CKIP(SW support)  Proprietary Protocols

- CCXv2

- CCXv3

- CCXv4

- CCXv5  IEEE802.15.2 coexistence compliance-on silicon solution compliant with IEEE 3wire requirements

The module will the following future draft/standards:

 IEEE802.11r-Fast Roaming (between APs)  IEEE802.11w-Secure Management Frames  IEEE802.11 Extensions:

- IEEE802.11e QoS Enhancements(In accordance with the WMM spec, QoS is already supported)

- IEEE802.11h 5GHz Extensions

- IEEE802.11i MAC Enhancements

- IEEE802.11k Radio Resource Measurement

5

COMPANY CONFIDENTIAL

Preliminary Datasheet

3. Mechanical Specification

3.1 Mechanical Drawing

Typical module dimension (W x L): 12mmx16mm. Max Z-height is 1.53mm.

Unit:mm

3.2 PCB stack

6 Layers, HDI, thickness:0.43mm +/-0.05mm

6

COMPANY CONFIDENTIAL

Preliminary Datasheet

3.3 Recommended LGA Land Pattern

Unit: mm

TOP VIEW

Suggest use “solder-mask on pad” design for main-board to avoid the soldering short.

3.4 Recommended stencil aperture

Remark: Red stencil layer Green (pad layer)

Below is recommendation about respectively defined apertures as A,B,B`,C and C`

 Stencil thickness=0.12mm

A=24*24 mil2 B=22*9 mil2 B`=24*9 mil2 C=40*40 mil2 C`=29.5*29.5mil2

 Define space between apertures as D and E

D=11mil E=19.5mil

7

COMPANY CONFIDENTIAL

Antenna

Interface

Remark

ANT1

WLAN/BT

Main

ANT2

WLAN

AUX

Preliminary Datasheet

3.5 RF Connector Type

 The standard 2x2mm size RF receptacle connectors to be used in conjunction with the M.2

boards/modules

 Same RF Receptacle on module supports either 0.81mm or 1.13mm diameter cable

Prefer to use 1.13mm diameter cable for lower cable loss

 1.2mm max. mated height for low profile design Example of IPEX RF connector

IPEX P/N: 20449-001E (MHF-4)

 Antenna Placement

8

COMPANY CONFIDENTIAL

Preliminary Datasheet

3.6 RF cable assembly notice 1> Mating/Unmating Jig

We recommend to use below Jig for mating/Unmating RF cable

2> Mating method of RF cable

Please push as gently as possible while mating plug with receptacle. (The force must be 30N Max.)

3.7 RF port define

Main ANT for WiFi and BT, Aux ANT for WiFi.

9

COMPANY CONFIDENTIAL

96

95

94

93

92

91

90

89

88

87

86

85

84

83

82

81

80

79

78

77

105

GND

108

1

NC

GND

76

2

NC

GND

75

3

NC

GND

74 4 3.3V

GND

3.3V

73

5

3.3V 97

104 3.3V

72

6

GND

71 7 NC

BT_USB_DP

70

8

NC

BT_USB_DN

69

9

NC

GND

68

10

NC

GND

NC

67

11

NC 98

103 NC

66

12

NC

WLAN_LED_L

65

13

NC

BT_LED_L

64

14

NC

BT_REG_ON

63

15

NC

GND

62

16

NC

GND

BT_PCM_CLK

61

17

GND 99

102 BT_PCM_OUT

60

18

NC

BT_PCM_IN

59

19

NC

BT_PCM_SYNC

58

20

GND

BT_UART_RTS_L

57

21

NC

BT_UART_RXD

56

22

NC

GND

BT_UART_TXD

55

23

GND 100

101 BT_UART_CTS_L

54

24

BT_DEV_WAKE

BT_UART_HOST_ WAKE_L

53 25

NC

SDIO_CLK

52

26

GND

SDIO_CMD

51

27

SUSCLK(32KHz)

SDIO_DATA0

50

28

WL_RFDISABLE_L

SDIO_DATA1

49

106

GND

PCIE_PME_L

PCIE_CLKREQ_L

PCIE_PERST_L

GND

PCIE_REFCLKN

PCIE_REFCLKP

GND

PCIE_TDN

PCIE_TDP

GND

PCIE_RDN

PCIE_RDP

GND

VIO

NC

WL_REG_ON

SDIO_WAKE_L

SDIO_DATA3

SDIO_DATA2

GND

107

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

Preliminary Datasheet

4. LGA Pin-out Definition

4.1 Module pin-out definition

Top view

10

Preliminary Datasheet

Pin No.

Pin Name

Type

Description

Voltage

Conne cting

1-3, 7-16, 18,19,21, 22,25, 43-44,66, 67

NC - No connection

-

No

4,5,72,73

3.3V

Power

DC 3.3V power input

3.3V

Yes

24

BT_DEV_WAKE

I

Bluetooth device wake-up: Signal from the host to the BCM4356 indicating that the host requires attention.

• Asserted: The Bluetooth device must

wake-up or remain

awake.

• Deasserted: The Bluetooth device may

sleep when sleep criteria are met. The polarity of this signal is software configurable and can be asserted high or low.

1.8V

Yes

27

SUSCLK (32KHz)

I

Suspend Clock is a 32.768 kHz clock supply input that is provided by platform to enable the add-in card to enter reduce power consumption modes. SUSCLK will have a duty cycle that can be as low as 30% or as high as 70%. Accuracy will be up to 200ppm. See the detail spec in section6.

1.8V (Note1)

Yes 28

WLAN_RFDISAB LE_L

I

Active low, debounced signal when applied by the system it will disable WLAN radio operation on the add-in cards that implement radio frequency applications. This signal is internal pull-up on the card by default.

1.8V (Note2)

No

29

PCIE_PME_L

OD

PCIe PME Wake. Open Drain with pull up on platform; Active Low

1.8V

Yes

30

PCIE_CLKREQ_ L

OD

Clock Request is a reference clock request signal as defined by the PCIe Mini Card CEM specification; Also used by L1 PM Substates.

1.8V

Yes

31

PCIE_PERST_L

I

PE-Reset is a functional reset to the Add-In card as defined by the PCIe Mini Card CEM specification

1.8V

Yes 33

PCIE_REFCLKN

I

PCIe Reference Clock signals (100 MHz) defined by the PCIe specification.

-

Yes 34

PCIE_REFCLKP

36

PCIE_TDN

O

PCIe TX differential signals defined by the PCIe specification

-

Yes 37

PCIE_TDP

39

PCIE_RDN

I

PCIe RX differential signals defined by the PCIe specification. Add AC cap 0.1uF on PCIe signals of host side.

-

Yes 40

PCIE_RDP

42

VIO

Power

Reserved for external 1.8V power source input. If don’t need, MUST keep it floating or open

1.8V (Note3)

Option

45

WL_REG_ON

I

SDIO sideband GPIO pin to enable/disable (reset) the WiFi function. Platform firmware is required to assert/de-assert this pin on every boot (warm and cold). High active. See the detail sequence timing in section5.3.

1.8V

Yes 46

SDIO_WAKE_L

O

SDIO Host Wake. Note in band SDIO wake is not used for non-active modes, Active Low. Require pull up on the host side ( recommended 15K to 100K )

1.8V

No

4.2 Pin definition

COMPANY CONFIDENTIAL

11