HON HAI PRECISION IND T77H526 User Manual

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Project Name

Approval Sheet Rev. FOXCONN Part No. Module Rev. 015 Customer Part No. TBD

Approval Sheet

IEEE802.11 ac/n/a/b/g

Bluetooth 4.0

NFC (Near Field Communication)

NGFF1216-S3 Card

0.2

T77H526.01

Prepared by Reviewed by Approved by

Wei.Liao

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Revision History

Revision Date Originator Comment

0.1 2013/11/26 Wei.Liao Initial

1> Add BAW Filter design as option

0.2 2014/03/03 Wei.Liao

T77H526.01 is made in China, Manufactured by HongFuJin Precision Industry Co., LTD Manufacture Site: ShenZhen, Chongqing, Nanning http://www.foxconn.com

2> Add RF performance specification 3> Add package type

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Content

REVISION HISTORY .......................................................................................................................................................2

1. INTRODUCTION .......................................................................................................................................................... 4

2. MODULE HARDWARE OVERVIEW.........................................................................................................................5

3. ELECTRICAL CHARACTERISTICS .........................................................................................................................6

4. MECHANICAL DRAWING .......................................................................................................................................... 9

5. WLAN RF SPECIFICATION..................................................................................................................................... 11

6. REFERENCE PERIPHERAL CIRCUIT.................................................................................................................. 23

7. SOFTWARE REQUIREMENT..................................................................................................................................26

8. PACKING SPECIFICATION .....................................................................................................................................27

9. ENVIRONMENTAL REQUIREMENTS ................................................................................................................... 28

10. SOLDERING AND REFLOW CONDITION..........................................................................................................29

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1. Introduction

The T77H526.01 NGFF1216-S3 Card is based on Marvell 88W8897-B0-CBK2-T solution with WLAN/Bluetooth/NFC functions and provides DSSS and OFDM baseband modulation, MAC, CPU, OTP (one time programmable) memory, host interfaces, power management unit (PMU) and direct conversion WLAN RF radio.

1.1 Scope

IEEE 802.11 Standards

 802.11 data rates of 1 and 2 Mbps  802.11b data rates of 5.5 and 11 Mbps  802.11a/g data rates of 6, 9, 12, 18, 24, 36, 48, and 54 Mbps  802.11n HT20 with 800ns GI data rates of 6.5, 13, 19.5, 26, 39, 52, 58.5 and 65Mbps  802.11n HT20 with 400ns GI data rates of 7.2,14.4, 21.7, 28.9, 43.3, 57.8, 65 and

72.2Mbps

 802.11n HT40 with 800ns GI data rates of 13.5, 27, 40.5, 54, 81, 108, 121.5 and

135Mbps

 802.11n HT40 with 400ns GI data rates of 15, 30, 45, 60, 90, 120, 135 and 150Mbps  802.11ac VHT80 with 800ns GI data rates of 29.3, 58.5, 87.8, 117, 175.5, 234, 263.3,

292.5, 351 and 390Mbps

 802.11ac VHT80 with 400ns GI data rates of 32.5, 65, 97.5, 130, 195, 260, 292.5,

325, 390 and 433.3Mbps

 802.11n up to 144.4Mbps (20 MHz), 300Mbps (40 MHz) for 2X2 MIMO.  802.11ac up to 173.3Mbps (20 MHz), 400Mbps (40 MHz), 866.7Mbps (80 MHz) for 2X2

MIMO.

Bluetooth

 Bluetooth 4.0 + HS  Bluetooth Class 2  Bluetooth Class 1  Baseband and radio BDR and EDR packet types—1 Mbps (GFSK), 2 Mbps (π /4-

DQPSK), and 3 Mbps (8DPSK)

 Supports Low Energy (LE)

NFC (Near field communication)

 Full protocol support ISO 14443A/B, ISO 18092, ISO 15693,NFCIP-1, NFC Forum,

EMV contactless targets with data rates up to 848Kbps.

 Support Reader/Writer, Card Emulation, and Peer-to-Peer (P2P) modes.

Module

Configure from platform.

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2. Module Hardware Overview

Block Diagram

Features

 IEEE802.11a/b/g/n /ac (2X2 MIMO) + BT4.0 + NFC Module.

 2.4GHz + 5GHz bands RF interface.

 Host interface for WLAN, Bluetooth and NFC Configure from platform.

 PCIE M.2 Type 1216-S3 card with 76 pins Soldered down solution Module.

 +3.3V +/- 5% supply power from host platform for VBAT.

 +1.8V +/- 5% supply power from host platform for digital IO SDIO.

 Two RF micro-coaxial connectors (2.0mmx2.0mm), One for Wi-Fi1 antenna port,

Another antenna port shared by Wi-Fi2 and BT

 Uses MRVL 88W8897 integrated OTP memory instead of external EEPROM.

 Use LGA PAD connects for NFC external antenna.

 Provide coexistence interface for connecting to an external LTE (Long Term Evolution)

device.

 RoHS and Green Compliant.

3. Electrical Characteristics

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3.1 DC Characteristics (recommended operating rating)

Parameter Minimum Typical Maximum Units

+3.3V (Analog power supply) 2.97 3.3 3.63 V

+3.3V_USB (USB power supply) 2.97 3.3 3.63 V

+VIO (Digital I/O power supply)

VIO_SD (Digital I/O SDIO power

supply)

Storage Temperature -30 ~ +85 ℃

Storage Humidity 0 ~ 90 %

Operation Temperature 0 ~ 60 ℃

ESD Level

HBM - 1.0K - V

MM - 200 - V

2.97 3.3 3.63 V

1.62 1.8 1.98 V

3.3 Host interface

Configure table

Configuration WLAN BT / NFC BTAMPS

CONFIG_HOST [3:0] = b1111 PCIE UART N/A CONFIG_HOST [3:0] = b1110 CONFIG_HOST [3:0] = b1101 SDIO UART SDIO

CONFIG_HOST [3:0] = b0111 SDIO SDIO SDIO CONFIG_HOST [3:0] = b0110 USB USB USB CONFIG_HOST [3:0] = b0010 USB UART USB

PCIE USB USB

PCIe Interface

The 88W8897 PCI Express Interface Unit (PCIe) functions as a PCI Express endpoint

device that conforms to the following standards:

 PCI Express Base Specification, Revision 3.0

 PCI Express Card Electromechanical Specification, Revision 1.1

 PCI Express Bus Power Management Interface Specification, Revision 1.2

 PCI Express Mini Card Electromechanical Specification, Revision 1.2

 Express Card Standard, Revision 1.1   Latency Tolerance Reporting (LTR) Capability

 L1 Substates ECR Capability

USB 2.0 Device Interface

The USB device interface is compliant with the Universal Serial Bus Specification,

Revision 2.0, April 27, 2000. A USB host uses the USB cable bus and the USB 2.0 device

Interface to communicate with the chip.

The main features of the USB device interface include:

 High/full speed operation (480/12 Mbps)

 Suspend/host resume/device resume (remote wake-up)

 Built-in DMA engine that reduces interrupt loads on the embedded processor and

reduces the system bus bandwidth requirement for serving the USB device operation

 Supports Link Power Management (LPM), corresponding host resume or device resume

(remote wakeup) to exit from L1 sleep state

The USB 2.0 device interface is designed with 3.3V signal level pads.

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SDIO Device Interface

The 88W8897 supports a SDIO device interface that conforms to the industry standard SDIO full-speed card specification and allows a host controller using the SDIO bus protocol to access the wireless SoC device.

The SDIO device interface main features include:

 Supports SDIO 3.0 standard

 On chip memory used for CIS

 Supports SPI, 1-bit SDIO, and 4-bit SDIO transfer modes at the full clock range of 0 to

208MHz

 Special interrupt register for information exchange

 Allows card to interrupt host

High-Speed UART Interface

The 88W8897 supports a high-speed Universal asynchronous receiver/transmitter interface, compliant to the industry standard 16650 specification.

The UART interface features include:

 FIFO mode permanently selected for transmit and receive operations

 2 pins for transmit and receive operations

 2 flow control pins

 Interrupt triggers for low power, high throughput operation

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3.4 Power up sequence

The following requirements must be met for correct power up:

 Ramp-up time of +3.3V should be < 5ms.

 PDn is tied to +3.3V directly.

 External +3.3V/+VIO/+3.3V_USB



VIO_SD is provided by host if SDIO interface is used.



GPIO_3 need tied to +VIO by host if SDIO interface is used.

from host

4. Mechanical Drawing

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4.1 Module dimension

4.2 Antenna of Connector location

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4.3 Card Pin-mapping

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