T77H519 NFC Module
USER MANUAL
Project Name NFC module
Revision 00
Foxconn project code T77H519
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Contents
1. INTRODUCTION .......................................................................... 錯誤! 尚未定義書籤。
2. HARDWARE SPECIFICATION.................................................................................... 6
3. PRODUCT REQUIREMENTS ...................................................................................... 6
4. INTERFACE OF CONNECTOR OF NFC MODULE .................................................... 7
5. ANTENNA CONNECTOR OF NFC MODULE.............................................................. 8
6. TEST OPERATING INSTRUCTIONS INFO................................................................. 9
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1. Introduction
The T77H519 NFC module provides contactless payment, contactless ticketing, service
discovery, exchange information etc. This module is based on Broadcom BCM20792M
solution, which is integrated NFC subsystem, interfaces, and microprocessor and memory
unit.
1.1 Scope
The NFC module supports for the ISO/IEC 18092, ISO/IEC 21481, ISO/IEC 14443
Types A, B and B’, Japanese industrial standard (JIS)(X) 6319-4, and ISO/IEC 15693
standards.
1.2 Function
• NFC Features
- Reader & Writer mode
- Peer-to-Peer Communication mode
- Card emulation mode
• BSC (I2C-compatible) and SM bus for host Interface,
For I2C -Bus support all speed mode:
- Low-speed mode (100 kbps)
- Fast mode (400 kbps)
- High-speed mode (3.4Mbps)
• On board XTAL of 26 MHz (+/- 10ppm)
• On board embedded Secure Element (eSE) with 800kBytes flash memory(option)
• Windows 8x Logo Device Requirement compliant
- NFC Forum Wave1 Certification
- LLCP (Link Layer Control Protocol)
- SNEP (Simple NDEF Exchange Protocol)
• RoHS and Green Compliant
A. Support Microsoft windows7, Windows 8, Windows 8.1(Blue) platform
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1.3 Electrical Characteristics
Parameter Minimum Typical Maximum Units
Frequency Range - 13.56 - MHz
Input Supply
Voltage
Power
consumption
Communication distance 20 - - mm
Peer to Peer Communication Speed - - 424 Kbps
NFC wake up
Operating Temperature 0 ~ 70
VBAT 2.8 3.3 5.5 V
VDD I/O 1.62 1.8 3.6 V
UICC (class C) 1.78 1.88 1.98 V
UICC (class B) 2.9 3.1 3.3 V
Reader mode - - 247 mA
Writer mode - - 247 mA
Peer to peer
communication
Polling mode - - 14 mA
Target mode - 4.1 - mA
Sleep mode - - 7.0 uA
Snooze standby
mode
- - 247 mA
- 94 - uA
Wake up NFC module from sleep mode by
NFC_WAKE signal via I2C command
℃
Storage Temperature -20 ~ 85
Storage Humidity 0 ~ 85 %
ESD Level
*1 HBM ESD level is base on without ESD protection components on TX1 and TX2. When
assemble the ESD protection component, the ESD level can up to 8KV.
HBM*1 - 2.0K - V
MM - 200 - V
℃
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