HON HAI PRECISION IND T77H462 User Manual

COMPANY CONFIDENTIAL

(Sp

)

HONHAIPRECISIONIND.CO.,LTD.
5F1,5HsinAnRoad,Hsinchu,
ScienceBasedIndustrialPark
300,Taiwan
Tel:+88635784975 

Revision Note

ecification Sheet

PartName 802.11a/g/n+BT4.0Module

RevisionNoteRev. 3.2

FoxconnPartNo. T77H462.02

LenovoPartNo.

Prepared by Reviewed by Approved by

Jason Hu Gary Su Chang-fu Lin

!

TotalPages ProductRev. Date Sales

39 01S1 20130725 EagleWei

1

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COMPANY CONFIDENTIAL

Index

1. REVISION HISTORY ................................................................................................................................................... 3

2. INTRODUCTION .......................................................................................................................................................... 4

2.1 SCOPE ...................................................................................................................................................................... 4

2.2 FUNCTION ................................................................................................................................................................. 4

3. PRODUCT SPECIFICATION ..................................................................................................................................... 5

3.1 HARDWARE CHARACTERISTIC ................................................................................................................................. 5

3.2 HARDWARE ARCHITECTURE .................................................................................................................................... 5

3.3 ELECTRICAL SPECIFICATION .................................................................................................................................... 6

3.4 WLAN RF CHARACTERISTICS ................................................................................................................................. 7

3.4.1 IEEE802.11b .................................................................................................................................................. 7

3.4.2 IEEE802.11g .................................................................................................................................................. 8

3.4.4 IEEE802.11a ................................................................................................................................................ 12

3.5 BLUETOOTH RF SPECIFICATIONS .......................................................................................................................... 18

3.6 INTERFACE TIMING .................................................................................................................................................. 23

3.6.1 SDIO INTERFACE TIMING .................................................................................................................................... 23

3.6.2 UART INTERFACE TIMING ................................................................................................................................... 25

3.7 LGA PIN DEFINITION .............................................................................................................................................. 26

4. MECHANICAL DRAWING ....................................................................................................................................... 30

5. SCHEMATIC REFERENCE DESIGN ..................................................................................................................... 33

6. PCB STACK ............................................................................................................................................................... 34

7. SOFTWARE SUPPORT ............................................................................................................................................ 35

8. REGULATORY ........................................................................................................................................................... 36

9. ENVIRONMENTAL REQUIREMENTS AND SPECIFICATIONS ....................................................................... 37

9.1 TEMPERATURE ....................................................................................................................................................... 37

9.2 PCB BENDING ........................................................................................................................................................ 37

9.3 HANDLING ENVIRONMENT ....................................................................................................................................... 37

9.4 STORAGE CONDITION ............................................................................................................................................. 37

9.5 BAKING CONDITION ................................................................................................................................................ 37

9.6 SOLDERING AND REFLOW CONDITION .................................................................................................................... 38

10 PACKAGE INFORMATION ..................................................................................................................................... 39

2

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p

1. Revision History

Date Change Note Rev.

2012-12-26 Initial release 1.0

2013-01-18

2013-04-08

2013-04-12

2013-04-26

2013-06-28

2013-07-02

Modify the Pin definition to PCIeM.2_Rev0.7a and RF connector
information

Modify
Section 3.2: Hardware Architecture
Section 3.4: WLAN RF Characteristics
Section 3.6: LGA Pin Definition: add note to some pins
Chapter 4: add note to the mechanical drawing

Modify
Section 3.2: Hardware Architecture
Section 3.4: WLAN RF Characteristics
Section 3.6: LGA Pin Definition
Section 5: Schematics reference design

Add
Section 3.6: signal level voltage
Modify
Section 3.6: UART_WAKE from platform signal Output to Signal
Input

Modify
Section 3.4: WLAN RF Characteristics
Section 3.5: BT RF Characteristics
Add 3.6 interface timing
Section 3.7: Pin definition
Section 4: Mechanical drawing
Section 5: schematics reference design
Section 7: Software support
Section 8: Regulatory
Section 9: environment specification
Section 10:

Modify
Section 3.7: Pin definition, The I/O type of UART pin 54-58

ackage information

1.1

2.0

2.1

2.2

3.0

3.1

2013-07-25 Add FCC power table 3.2

3

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COMPANY CONFIDENTIAL

2. Introduction

Project Name: 802.11abgn (2X2) + BT4.0 combo module

This documentation describes the product specification of the WLAN+BT combo Module. WLAN is
Compliant with IEEE 802.11 a/b/g and 2x2 IEEE 802.11n MAC/ baseband/radio, Bluetooth is compliant with
Bluetooth 4.0+HS. This module takes advantage of the high throughput and extended range of Broadcom
second-generation MIMO solution. It is a confidential document of Foxconn.

* For b/g/n and a/b/g/n module, Foxconn HW/FW are the same, platform use different firmware and
driver to enable or disable 5GHz

2.1 Scope

This combo Module combines WLAN, Bluetooth in one module, the WLAN is available in the 2.4GHz
and 5GHz band, it is compatible with the IEEE 802.11 a/b/g standard and the 802.11n standard. It allow
user to switch to different vendors’ Access Points through the wireless networks and to prevent from
eavesdropping. The 802.11 a/g data rate provides for 54, 48, 36, 24, 18, 12, 9, 6Mbps, 802.11b data rate
provides for 11, 5.5, 2, 1 Mbps, it can also support 11n high data rate up to MCS15(HT40) with PHY data
rate to 300Mbps by dual stream. Bluetooth is compliant to Core Specification version 4.0.

2.2 Function

¾ Single stream 802.11n support for 20MHz channels provide PHY Layer rates up to 72Mbps.
¾ Dual stream 802.11n support for 20MHz/40MHz channels provide PHY Layer rates up to 300Mbps.
¾ Bluetooth supports Class 1 and Class 2 output power.
¾ Provides a small form factor solution and ultra low power consumption to support low cost

requirement.

¾ Host interface supports:

 WLAN: SDIO
 BT data: UART
 BT digital audio: PCM

4

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COMPANY CONFIDENTIAL

3. Product Specification

3.1 Hardware Characteristic

Form factor 12mmx16mmx1.5mm
Host Interface WLAN: SDIO
BT: UART for data, PCM for Audio
PCB 6-layer HDI design
RF connector Two MHF4 RF connectors on module

3.2 Hardware Architecture

The WLAN+BT combo module is designed base on BROADCOM BCM43241 chip, the Broadcom
BCM43241 is a highly integrated single chip solution for single and dual stream dual-band WLAN and
BT4.0. Single and dual Antenna support, a 37.4MHz crystal is used for reference clock generation, see
the block diagram as below:

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3.3 Electrical Specification

Absolute Maximum Ratings

These specifications indicate levels where permanent damage to the device can occur. Functional
operation is not guaranteed under these conditions. Operation at absolute maximum conditions for extended
can adversely affect long-term reliability of the device.

Rating Symbol Value Unit

DC supply voltage for the device 3.3V 2.3 to 4.8 V

Recommended Operating Condition

Element Symbol Value Unit

Minimum Typical Maximum

DC supply voltage for the device 3.3V 3.0 3.3 3.6 V

Power-Up Sequence Timing

Current Consumption

TBD

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6

3.4 WLAN RF Characteristics

COMPANY CONFIDENTIAL

3.4.1 IEEE802.11b

Parameter Condition Min. Type Max. Units

Target Power CH1~CH13, 1~11Mbps 14.5 16.5 17.5 dBm

Spectrum Mask

Transmission Spurious
Emission-1

Transmission Spurious
Emission-2

fc-22MHz<f< fc-11MHz
fc+11MHz<f<fc+22MHz
f<fc-22MHz
f>fc+22MHz

f<2.387GHz -26

2.387 GHz< f<2.400 GHz -16

2.4835 GHz<f<2.4965 GHz -16

f>2.4965 GHz -26

470~805MHz -125

869~894MHz -130

925~960MHz -130

1,805~1,880MHz -130

1,930~1,990MHz -130

2,110~2,170MHz -130

-30

-50

dBr

dBm

dBm/Hz

1,574.4~1,576.4MHz -145

OBW -- 26

MHz

Spread Bandwidth -- 7

RF Carrier Suppression

Transmit power –on ramp 10% to 90% of max power 2 us

Transmit power –down
ramp
Center Frequency
Tolerance

EVM (peak)

Receiver Minimum Input
Level Sensitivity at Antenna

Adjacent Channel
Rejection
Receiver Maximum
Input Level

Data=0101 and DQPSK
modulation

90% to 10% of max power 2 us

-20 20 ppm

1Mbps 35

2Mbps 35

5.5Mbps 35

11M b ps 35

1 Mbps -95.5 -93

2 Mbps -93 -90

5.5 Mbps -91 -88

11 Mbps -87.5 -85

11Mbps 35 dB

ALL -6 dBm

15 dB

%

dBm

7

!

3.4.2 IEEE802.11g

Parameter Min. Type Max. Units

Target Power

COMPANY CONFIDENTIAL

CH1~CH13,6~24Mbps 13.5 15.5 16.5

dBm

CH1~CH13, 36~54Mbps 12.5 14.5 15.5

+/- 11MHz -20

Spectrum Mask

+/- 30MHz -40

f<2.387GHz -26

Transmission Spurious
Emission-1

Transmission Spurious
Emission-2

Output Center
Frequency Tolerance

OBW -- 26 MHz

Output Center
Frequency Leakage

Output Spectrum Flatness

2.387 GHz< f<2.400 GHz -16

2.4835 GHz<f<2.4965 GHz -16

f>2.4965 GHz -26

470~805MHz -125

869~894MHz -130

925~960MHz -130

1,805~1,880MHz -130

1,930~1,990MHz -130

2,110~2,170MHz -130

1,574.4~1,576.4MHz -145

Overall -20 +20 ppm

-- -15 dB

In-band -2 2

Out-band -4 2

dBr +/- 20MHz -28

dBm

dBm/
Hz

dB

EVM

!

6 Mbps -5

9 Mbps -8

12 Mbps -10

18 Mbps -13

dB

24 Mbps -16

36 Mbps -19

48 Mbps -22

54 Mbps -25

8

COMPANY CONFIDENTIAL

Parameter Min. Type Max. Units

6 Mbps -91.5 -89

9 Mbps -89 -86

12 Mbps -87.5 -85

Receiver Minimum Input
Level Sensitivity at the
Antenna

Adjacent Channel Rejection

Receiver Maximum Input
Level

18 Mbps -85.5 -83

dBm

24 Mbps -81.5 -79

36 Mbps -79 -76

48 Mbps -75.5 -73

54 Mbps -73 -70

6 Mbps 16

9 Mbps 15

12 Mbps 13

18 Mbps 11

dB

24 Mbps 8

36 Mbps 4

48 Mbps 0

54 Mbps -1

ALL -16 dBm

<1GHz -54

Receiver Spurious

dBm 1~10GHz -54

10GHz~ -54

9

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COMPANY CONFIDENTIAL

3.4.3 IEEE802.11gn HT20 Single chain

Parameter Min. Type Max. Units

CH1~CH13,MCS0~MCS4 12.5 14.5 15.5

Target Power

CH1~CH13,MCS5~MCS7 11.5 13.5 14.5

+/- 11MHz -20

dBm

Spectrum Mask

+/- 30MHz -45

f<2.387GHz -26

Transmission Spurious
Emission-1

Transmission Spurious
Emission-2

Output Center
Frequency Tolerance

OBW -- 26 MHz

Output Center
Frequency Leakage

Output Spectrum Flatness

2.387 GHz< f<2.400 GHz -16

2.4835 GHz<f<2.4965 GHz -16

f>2.4965 GHz -26

470~805MHz -125

869~894MHz -130

925~960MHz -130

1,805~1,880MHz -130

1,930~1,990MHz -130

2,110~2,170MHz -130

1,574.4~1,576.4MHz -145

Overall -20 +20 ppm

-- -20 dB

Inband -2 2

Outband -4 2

dBr +/- 20MHz -28

dBm

dBm/
Hz

dB

EVM

!

MCS0 Mbps -5

MCS1 Mbps -10

MCS2 Mbps -13

MCS3 Mbps -16

dB

MCS4 Mbps -19

MCS5 Mbps -22

MCS6 Mbps -25

MCS7 Mbps -28

10

COMPANY CONFIDENTIAL

Parameter Min. Type Max. Units

MCS0 Mbps -89.5 -87

MCS1 Mbps -86.5 -84

MCS2 Mbps -84 -81

Receiver Minimum Input
Level Sensitivity at the
Antenna

Adjacent Channel Rejection

Receiver Maximum Input
Level

MCS3 Mbps -80.5 -78

dBm

MCS4 Mbps -77.5 -75

MCS5 Mbps -73 70

MCS6 Mbps -72 -69

MCS7 Mbps -71 -68

MCS0 Mbps 16

MCS1 Mbps 13

MCS2 Mbps 11

MCS3 Mbps 8

dB

MCS4 Mbps 4

MCS5 Mbps 0

MCS6 Mbps -1

MCS7 Mbps -2

ALL -16 dBm

<1GHz -54

Receiver Spurious

dBm 1~10GHz -54

10GHz~ -54

11

!

3.4.4 IEEE802.11a

Parameter Min. Type Max. Units

Target Power

COMPANY CONFIDENTIAL

B1,B2,B3,B4,6~24Mbps 13.5 15.5 16.5

dBm

B1,B2,B3,B4, 36~54Mbps 12.5 14.5 15.5

+/- 11MHz -20

Spectrum Mask

+/- 30MHz -40

f<2.387GHz -26

Transmission Spurious
Emission-1

Transmission Spurious
Emission-2

Output Center
Frequency Tolerance

OBW -- 26 MHz

Output Center
Frequency Leakage

Output Spectrum Flatness

2.387 GHz< f<2.400 GHz -16

2.4835 GHz<f<2.4965 GHz -16

f>2.4965 GHz -26

470~805MHz -125

869~894MHz -130

925~960MHz -130

1,805~1,880MHz -130

1,930~1,990MHz -130

2,110~2,170MHz -130

1,574.4~1,576.4MHz -145

Overall -20 +20 ppm

-- -15 dB

In-band -2 2

Out-band -4 2

dBr +/- 20MHz -28

dBm

dBm/
Hz

dB

EVM

!

6 Mbps -5

9 Mbps -8

12 Mbps -10

18 Mbps -13

dB

24 Mbps -16

36 Mbps -19

48 Mbps -22

54 Mbps -25

12

COMPANY CONFIDENTIAL

Parameter Min. Type Max. Units

6 Mbps -92 -89

9 Mbps -88.5 -86

12 Mbps -86.5 -84

Receiver Minimum Input
Level Sensitivity at the
Antenna

Adjacent Channel Rejection

Receiver Maximum Input
Level

18 Mbps -84.5 -82

dBm

24 Mbps -81.5 -79

36 Mbps -78.5 -76

48 Mbps -74.5 -72

54 Mbps -73 -70

6 Mbps 16

9 Mbps 15

12 Mbps 13

18 Mbps 11

dB

24 Mbps 8

36 Mbps 4

48 Mbps 0

54 Mbps -1

ALL -26 dBm

<1GHz -54

Receiver Spurious

10GHz~ -54

B1:5180~5240MHz; B2: 5260~5320MHz; B3:5500~5700MHz; B4:5745~5825MHz

dBm 1~10GHz -54

13

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3.4.5 IEEE802.11an HT20 Single chain

Parameter Min. Type Max. Units

B1,B2,B3,B4;MCS0~MCS4 12.5 14.5 15.5

Target Power

B1,B2,B3,B4;MCS5~MCS7 11.5 13.5 14.5

+/- 11MHz -20

dBm

Spectrum Mask

+/- 30MHz -45

f<2.387GHz -26

Transmission Spurious
Emission-1

Transmission Spurious
Emission-2

Output Center
Frequency Tolerance

OBW -- 26 MHz

Output Center
Frequency Leakage

Output Spectrum Flatness

2.387 GHz< f<2.400 GHz -16

2.4835 GHz<f<2.4965 GHz -16

f>2.4965 GHz -26

470~805MHz -125

869~894MHz -130

925~960MHz -130

1,805~1,880MHz -130

1,930~1,990MHz -130

2,110~2,170MHz -130

1,574.4~1,576.4MHz -145

Overall -20 +20 ppm

-- -20 dB

In-band -2 2

Out-band -4 2

dBr +/- 20MHz -28

dBm

dBm/
Hz

dB

EVM

!

MCS0 Mbps -5

MCS1 Mbps -10

MCS2 Mbps -13

MCS3 Mbps -16

dB

MCS4 Mbps -19

MCS5 Mbps -22

MCS6 Mbps -25

MCS7 Mbps -28

14

COMPANY CONFIDENTIAL

Parameter Min. Type Max. Units

Receiver Minimum Input
Level Sensitivity at the
Antenna

Adjacent Channel Rejection

MCS0 Mbps

MCS1 Mbps -87.5 -85

MCS2 Mbps -84.5 -82

MCS3 Mbps -81.5 -79

MCS4 Mbps -78.5 -76

MCS5 Mbps -74 -71

MCS6 Mbps -72.5 -70

MCS7 Mbps -71 -68

MCS0 Mbps 16

MCS1 Mbps 13

MCS2 Mbps 11

MCS3 Mbps 8

MCS4 Mbps 4

MCS5 Mbps 0

MCS6 Mbps -1

-90 -87

dBm

dB

MCS7 Mbps -2

Receiver Maximum Input
Level

Receiver Spurious

ALL -26 dBm

<1GHz -54

10GHz~ -54

B1:5180~5240MHz; B2:5260~5320MHz; B3:5500~5700MHz; B4:5745~5825MHz

dBm 1~10GHz -54

15

!

COMPANY CONFIDENTIAL

3.4.6 IEEE802.11an HT40 Single chain

Parameter Min. Type Max. Units

B1,B2,B3,B4;MCS0~MCS4 12.5 14.5 15.5

Target Power

B1,B2,B3,B4;MCS5~MCS7 11.5 13.5 14.5

+/- 11MHz -20

dBm

Spectrum Mask

+/- 30MHz -45

f<2.387GHz -26

Transmission Spurious
Emission-1

Transmission Spurious
Emission-2

Output Center
Frequency Tolerance

OBW -- 26 MHz

Output Center
Frequency Leakage

Output Spectrum Flatness

2.387 GHz< f<2.400 GHz -16

2.4835 GHz<f<2.4965 GHz -16

f>2.4965 GHz -26

470~805MHz -125

869~894MHz -130

925~960MHz -130

1,805~1,880MHz -130

1,930~1,990MHz -130

2,110~2,170MHz -130

1,574.4~1,576.4MHz -145

Overall -20 +20 ppm

-- -20 dB

In-band -2 2

Out-band -4 2

dBr +/- 20MHz -28

dBm

dBm/
Hz

dB

EVM

!

MCS0 Mbps -5

MCS1 Mbps -10

MCS2 Mbps -13

MCS3 Mbps -16

dB

MCS4 Mbps -19

MCS5 Mbps -22

MCS6 Mbps -25

MCS7 Mbps -28

16

COMPANY CONFIDENTIAL

Parameter Min. Type Max. Units

Receiver Minimum Input
Level Sensitivity at the
Antenna

Adjacent Channel Rejection

MCS0 Mbps

MCS1 Mbps -84.5 -82

MCS2 Mbps -82.5 -80

MCS3 Mbps -78.5 -76

MCS4 Mbps -75.5 -73

MCS5 Mbps -71 -68

MCS6 Mbps -69.5 -67

MCS7 Mbps -68 -65

MCS0 Mbps

MCS1 Mbps

MCS2 Mbps

MCS3 Mbps

MCS4 Mbps

MCS5 Mbps

MCS6 Mbps

-87.5 -85

dBm

dB

MCS7 Mbps

Receiver Maximum Input
Level

Receiver Spurious

ALL -26 dBm

<1GHz -54

10GHz~ -54

B1:5190~5230MHz; B2:5270~5310MHz; B3:5510~5670MHz; B4:5755~5795MHz

dBm 1~10GHz -54

17

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COMPANY CONFIDENTIAL

3.5 Bluetooth RF Specifications

Bluetooth Core Specification version 4.0:

¾

Host interface: UART, baud rates up to 4Mbps

¾

Support all Bluetooth 4.0+HS packet types.

¾

Operating frequency range: 2400MHz ~2483.5MHz

¾

Modulation type:

¾

Basic rate 1Mbps: GFSK,



Enhanced data rate 2Mbps: QPSK



Enhanced data rate 3Mbps: 8PSK



Parameter Condition

Basic Data Rate – Transmit Performance

RF Transmit Power at the Antenna +5 8 +11 dBm

Specification

Min Typ Max

Units

-20 dB Bandwidth

Tx Output Spectrum

Frequency range 83.5

Initial Carrier Frequency Tolerance  ±75 KHz

DH1/3/5 Drift rate  ±20 kHz/50 s

DH1 <±20

Carrier Frequency Drift

DH3  ±40

DH5 <±40

F1avg 140<f1avg<175

Modulation Characteristics

Adjacent Channel Transmit
Power

Transmission Spurious
Emission-1

F2max  115

F2avg/F1avg 80 %

+/-500KHz -27 dBc

|M-N|=2 -20

|M-N|3 -40

f<2.387GHz -26

2.387 GHz< f<2.400 GHz -16

2.4835 GHz<f<2.4965 GHz -16

1

MHz

KHz

kHz

dBm

dBm

Transmission Spurious
Emission-2

!

f>2.4965 GHz -26

470~805MHz -130

869~894MHz -135

925~960MHz -135

1,805~1,880MHz -135

1,930~1,990MHz -135

2,110~2,170MHz -135

1,574.4~1,576.4MHz -150

dBm/
Hz

18

COMPANY CONFIDENTIAL

Parameter Condition

Enhanced Data Rate – Transmit Performance

/4 DQPSK +3 6 +9

RF Transmit Power

8DPSK +3 6 +9

Specification

Min Typ Max

Units

dBm

Relative Transmit Power Pdpsk (P

i

Carrier Frequency Stability

Modulation Accuracy – RMS
DEVM

Modulation Accuracy – Peak
DEVM

Modulation Accuracy – 99%
DEVM

In-band Spurious Emissions

0

i +Ԁ0

/4 DQPSK  20

8DPSK  13

/4 DQPSK  35

8DPSK  25

/4 DQPSK  30

8DPSK  20

+3 MHz  -40

f>f

0

f<f0-3 MHz  -40

f=f0-3 MHz  -40

f=f0-2 MHz  -20

f=f0-1 MHz  -26

f=f0+1 MHz  -26

-4 dB)<P

GFSK

-75 75

-10 10

-75 75

DPSK

<(P

GFSK

kHz

%

dBm

dBr

+1 dB)

f=f0+2 MHz  -20

dBm

f=f0+3 MHz  -40

19

!

Parameter Condition

EDR Differential Phase Coding

COMPANY CONFIDENTIAL

Specification

Min Typ Max

f<2.387GHz -26

Units

Transmission Spurious
Emission-1

2.387 GHz< f<2.400 GHz -16

2.4835 GHz<f<2.4965 GHz -16

dBm

f>2.4965 GHz -26

470~805MHz -130

869~894MHz -135

dBm/

Hz
Transmission Spurious
Emission-2

925~960MHz -135

1,805~1,880MHz -135

1,930~1,990MHz -135

2,110~2,170MHz -135

1,574.4~1,576.4MHz -150

Basic Data Rate – Receiver Performance at the Antenna

Sensitivity (DH1) at 0.1% BER Nominal -90 -88 dBm

C/I Performance at BER0.1%

Co-ch interface C/I

Adjacent Chanel Sensitivity C/I
f=f

±1 MHz

0

Adjacent Chanel Sensitivity C/I

±2 MHz

f=f

0

Adjacent Chanel Sensitivity C/I

±3 MHz

ff

0

Image Ch interference C/I

Image Ch interference C/I

1MHz

<11

co

< 0

<-30

dB

< -40

< -9

image

image

< -20

30MHz~2GHz -10

Blocking Performance at
BER0.1%

2GHz~2.4GHz -27

dBm

2.5GHz~3GHz -27

3GHz~12.75GHz -10

Intermodulation Performance at
BER0.1%

Carrier Level:-64dBm -39 dBm

Max input Level -20 dBm

<1GHz -54

Receiver Spurious

dBm 1~10GHz -54

10GHz~ -54

20

!

COMPANY CONFIDENTIAL

Parameter Condition

Enhanced Data Rate – Receiver Performance at the Antenna

Specification

Min Typ Max

Units

Sensitivity at
BER0.01%

Nominal

/4 DQPSK(ch0~78) -92 -90

dBm

8DPSK(ch0~78) -86 -84

/4 DQPSK -20

Max input Level

dBm

8DPSK -20

<13

co

< 0

<-30

dB

< -40

< -7

image

image

<21

co

< -20

< 5

<-25

dB

< -33

C/I Performance at
BER0.1%(/4 DQPSK)

C/I Performance at
BER0.1%(8DPSK)

Co-ch interface C/I

Adjacent Chanel Sensitivity C/I

±1 MHz

f=f

0

Adjacent Chanel Sensitivity C/I
f=f

±2 MHz

0

Adjacent Chanel Sensitivity C/I

±3 MHz

ff

0

Image Ch interference C/I

Image Ch interference C/I

1MHz

Co-ch interface C/I

Adjacent Chanel Sensitivity C/I

±1 MHz

f=f

0

Adjacent Chanel Sensitivity C/I
f=f

±2 MHz

0

Adjacent Chanel Sensitivity C/I

±3 MHz

ff

0

Receiver Spurious

Image Ch interference C/I

Image Ch interference C/I

1MHz

< -0

image

image

< -13

<1GHz -54

dBm 1~10GHz -54

10GHz~ -54

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BLE RF specification:

COMPANY CONFIDENTIAL

Parameter Condition

BLE RF specification:

Sensitivity at
BER0.01%

RF Transmit Power GFSK 2 5 8 dBm

Mod char:delta f1 average 225 275 kHz

Mod char:delta f2 max 99.9 %

Receiver Spurious

Transmission Spurious
Emission-1

Transmission Spurious
Emission-2

Nominal GFSK 0.1%, 1M -91.5 -89.5 dBm

<1GHz -54

10GHz~ -54

f<2.387GHz -26

2.387 GHz< f<2.400 GHz -16

2.4835 GHz<f<2.4965 GHz -16

f>2.4965 GHz -26

470~805MHz -130

869~894MHz -135

925~960MHz -135

1,805~1,880MHz -135

1,930~1,990MHz -135

Specification

Min Typ Max

Units

dBm 1~10GHz -54

dBm

dBm/

Hz

2,110~2,170MHz -135

1,574.4~1,576.4MHz -150

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3.6 Interface timing

3.6.1 SDIO Interface timing

COMPANY CONFIDENTIAL

SDIO Default Mode Timing

SDIO Bus Timing Parameters (Default Mode)

Parameter Symbol Minimum Typical Maximum Unit

SDIO CLK (All values are referred to minimum VIH and maximum VILb)

Frequency – Data Transfer mode fPP 0 - 25 MHz

Frequency – Identification mode fOD 0 - 400 kHz

Clock low time tWL 10 - - ns

Clock high time tWH 10 - - ns

Clock rise time tTLH - - 10 ns

Clock low time tTHL - - 10 ns

Inputs: CMD DAT (referenced to CLK)

Input setup time tISU 5 - - ns

Input hold time tIH 5 - - ns

Outputs: CMD, DAT (referenced to CLK)

Output delay time – Data Transfer mode tODLY 0 - 14 ns

Output delay time – Identification mode tODLY 0 - 50 ns

a. TimingisbasedonCL Љ 40pFloadonCMDandData.
b. min(Vih)=0.7xVDDIOandmax(ViL)=0.2xVDDIO.

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COMPANY CONFIDENTIAL

SDIO High-Speed Mode Timing

SDIO Bus Timing Parameters (High-Speed Mode)

Parameter Symbol Minimum Typical Maximum Unit

SDIO CLK (All values are referred to minimum VIH and maximum VILb)

Frequency – Data Transfer mode fPP 0 - 50 MHz

Frequency – Identification mode fOD 0 - 400 kHz

Clock low time tWL 7 - - ns

Clock high time tWH 7 - - ns

Clock rise time tTLH - - 3 ns

Clock low time tTHL - - 3 ns

Inputs: CMD DAT (referenced to CLK)

Input setup time tISU 6 - - ns

Input hold time tIH 2 - - ns

Outputs: CMD, DAT (referenced to CLK)

Output delay time – Data Transfer mode tODLY - - 14 ns

Output hold time tOH 2.5 - - ns

Total system capacitance (each line) CL - - 40 pF

a. TimingisbasedonCL Љ 40pFloadonCMDandData.
b. min(Vih)=0.7xVDDIOandmax(ViL)=0.2xVDDIO.

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COMPANY CONFIDENTIAL

3.6.2 UART Interface timing

25

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3.7 LGA Pin Definition

- Module pin-out definition:

COMPANY CONFIDENTIAL

- Platform pin-out definition:

ToP View

26

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COMPANY CONFIDENTIAL

- Pin definition (module point of view):

Pin No. Pin Name Type Description Voltage

UIM_power_in/GPIO1

1-3

4-5 3.3V Power Power voltage input pin 3.3V

6 GND GND Ground -

7 Reserved I/O Reserved LGA pin -

8*(a) ALERT - No connection

UIM_power_out
UIM_SWP

I/O No connection -

-

9*(a) I2C CLK - No connection

10*(a) I2C DATA - No connection -

11*(a) COEX1 - No connection -

12*(a) COEX2 - No connection -

13*(a) COEX3 - No connection -

14-15

16 Reserved I/O Reserved LGA pin, No connection

17 GND GND Ground

18-19 Reserved - Reserved LGA pin, No connection

20 GND GND Ground

21-22 Reserved - Reserved LGA pin, No connection

23 GND GND Ground

24-25 Reserved - Reserved LGA pin, No connection

26 GND GND Ground

27 SUSCLK (32KHz) I

28 W_DISABLE#1 I No connection

SYSCLK/GNSS0
TX_Blanking/GNSS1

-

Reserved LGA pin, No connection

32.768 kHz clock supply input that is provided by
PCH to reduce power and cost for the module.
SUSCLK will have a duty cycle that can be as low
as 30% or as high as 70%. 200ppm.

-

3.3V

29*(a) PEWAKE# - No connection -

30*(a) CLKREQ# - No connection -

31*(a) PERST# - No connection -

32 GND GND Ground

33*(a) REFCLKN0

- No connection -

34*(a) REFCLKP0

35 GND GND Ground

36*(a) PETn0 - No connection -

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COMPANY CONFIDENTIAL

37*(a) PETp0

38 GND GND Ground

39*(a) PERn0

- No connection -

40*(a) PERp0

41 GND GND Ground

42-44 Reserved - Reserved LGA pin, No connection

SDIO sideband GPIO pin to enable/disable (reset)
the WiFi function. Platform firmware is required to

45 SDIO Reset I

46 SDIO Wake O

47 SDIO DATA3 I/O 4 lines for SDIO data exchange 1.8V

48 SDIO DATA2 I/O 4 lines for SDIO data exchange 1.8V

assert/de-assert this pin on every boot (warm and
cold). The WiFi device may use 0.5 to 1 mW in
reset, Active Low
SDIO Host Wake. Note in band SDIO wake is not
used for non-active modes, Active Low. Require
pull up on the host side ( recommended 15K to
100K )

1.8V

1.8V

49 SDIO DATA1 I/O 4 lines for SDIO data exchange 1.8V

50 SDIO DATA0 I/O 4 lines for SDIO data exchange 1.8V

51 SDIO CMD I/O SDIO Command Interface 1.8V

52 SDIO CLK I SDIO 3.0 Clock 1.8V

53 UART WAKE O Bluetooth host Wake. Active Low 3.3V

54 UART CTS I

55 UART TX O

56 UART RX I

58 UART RTS O

58 PCM FR1 I/O PCM Synchronous data sync/ I2S Word Select 1.8V

59 PCMIN I PCM Synchronous data input/ I2S Serial Data IN 1.8V

60 PCMOUT O

61 PCMCLK I/O PCM Clock/ I2S Continuous Serial Clock (SCK) 1.8V

62 GND GND Ground

63 W_DISABLE#2 I

64 LED#2 - No connection -

UART Clear To Send, Active low, connected to
UART RTS on the platform.
UART Transmit Data, connected to UART RX on
the platform.
UART Receive Data, connected to UART TX on
the platform.
UART Request To Send, Active low, connected to
UART CTS on the platform.

PCM Synchronous data output/ I2S Serial Data
OUT

Active low, debounced signal when applied by the
platform it will disable BT radio operation

1.8V

1.8V

1.8V

1.8V

1.8V

3.3V

65 LED#1 - No connection -

66-67 Reserved - Reserved LGA pin

68 GND GND Ground

69*(a) USB_D-

- No connection -

70*(a) USB _D+

28

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COMPANY CONFIDENTIAL

71 GND GND Ground

72-73 3.3V Power Power voltage input pin 3.3V

74-76,
others

The pin-out definition is following NGFF1216, but removed some functions such as PCIE, BT_USB.

*(a) FOXCONN remove the function according to BCM43241function.

GND GND Ground

29

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COMPANY CONFIDENTIAL

4. Mechanical Drawing

4.1 NGFF Type 1216 specification from PCI-e M.2_Rev0.7a

- The on board RF connector and plug mating height would be 1.2 mm max.

- Only Ant1 and Ant3 on this module.

4.2 T77H462.02 module drawing

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COMPANY CONFIDENTIAL

4.3 RF connector:

- New RF connector is needed, for lower z-height and smaller footprint

- Same RF Receptacle on module supports either 0.81mm or 1.13mm diameter cable

- Cable diameter determines mated height: 1.2mm mated height with 0.81mm cable

4.4 Example of IPEX RF connector

IPEX P/N: 20449-001E (MHF4)
IPEX P/N: 20448-001R-081

31

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COMPANY CONFIDENTIAL

32

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COMPANY CONFIDENTIAL

5. Schematic Reference Design

z Module pin-out & 32.768kHz

33

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z Audio PCM interface:

COMPANY CONFIDENTIAL

6. PCB Stack

6-layer, 2 order HDI FR-4 (Halogen Free) design, total thickness 0.3+/-0.03mm

34

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COMPANY CONFIDENTIAL

7. Software Support

- Operating System Support

 Windows 8

 Windows Blue or later Android 4.3 and above

- WLAN Feature Support

 WiFi Direct
 WiFi Display

 Wi-Fi Miracast (Intel will support WiDi with Miracast interoperability)

- WLAN Security Support

 WPA/WPA2 Enterprise
 CCX Lite or higher
 WMM/AES/TKIP/CKIP

- WLAN Transmit Power Reduction

 Software control to meet FCC SAR requirement
 Capability to disable 5GHz operation

- Bluetooth Profile Support

 A2DP-Sink
 A2DP-Source
 AV R C P - T a r g e t
 DUN-DT
 FTP-Client
 FTP-Server
 HCRP-Client
 HID-Host
 MCAP
 OPP-Client
 OPP-Server
 PAN-User
 SDP
 Serial-DevA
 Serial-DevB

- BLE (Bluetooth Low Energy) Support

 Windows 8

 Windows Blue or later

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COMPANY CONFIDENTIAL

BCM43241 module 5GHz power table :

˧˼˶˴˿ʳ˸ʳʻ˿˼˼ʳ˼ʳʾ˄˂ˀ˅˷˕ʼʳʻ˼ˍ˷˕ʼ

˛˧˅˃ ˖˛ˆˉ ˖˛ˇˋ ˖˛ˈ˅ ˖˛ˉˇ ˖˛˄˃˃ ˖˛˄˅˃ ˖˛˄ˇ˃ ˖˛˄ˇˌ ˖˛˄ˉˈ

˛˧ˇ˃ ˖˛ˆˋ ˖˛ˇˉ ˖˛ˈˇ ˖˛ˉ˅ ˖˛˄˃˅ ˖˛˄ˆˇ ˖˛˄ˈ˄ ˖˛˄ˈˌ

BCM43241 module 2.4GHz power table

˧˼˶˴˿ʳ˸ʳʻ˿˼˼ʳ˼ʳʾ˄˂ˀ˅˷˕ʼʳʻ˼ˍ˷˕ʼ

˛˧˅˃ ˖˛˄ ˖˛˅ ˖˛ˆ ˖˛ˇ ˖˛ˈ ˖˛ˉ ˖˛ˊ ˖˛ˋ ˖˛ˌ ˖˛˄˃ ˖˛˄˄

8. Regulatory

¾ USA : FCC P15B / FCC P15C / FCC P15E
¾ Canada : IC RSS-210
¾ Japan : TELEC
¾ EU : EN300328 V1.8.1 , EN301893 V1.6.1 , EN301489-1/-17 , EN 60950-1 2nd

ˉ˅ˇˠ˵ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˇ ˄ˈˁˈ ˄ˈˁˈ ˄ˆˁˈ ˄ˈˁˈ ˄ˈˁˈ
ˆˉˈˇˠ˵ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇ ˄ˇˁˈ ˄ˇˁˈ ˄ˆˁˈ ˄ˇˁˈ ˄ˇˁˈ
ˠ˖˦˃ˠ˖˦ˇ ˄ˆ ˄ˆ ˄ˇˁˈ ˄ˆˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄˅ˁˈ ˄ˇˁˈ ˄ˇˁˈ
ˠ˖˦ˈˠ˖˦ˊ ˄ˆ ˄ˆ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄˅ˁˈ ˄ˆˁˈ ˄ˆˁˈ
ˠ˖˦ˋˠ˖˦˄˅ ˄ˉ ˄ˉ ˄ˊˁˈ ˄ˉˁˈ ˄ˊˁˈ ˄ˊˁˈ ˄ˈˁˈ ˄ˊˁˈ ˄ˊˁˈ
ˠ˖˦˄ˆˠ˖˦˄ˈ ˄ˉ ˄ˉ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˈˁˈ ˄ˉˁˈ ˄ˉˁˈ
ˡ˸ˍ˹ʳ˙˖˖ʿ˻˸ʳ˸ʳ˿˼˼ʳ˼ʳ˄ˊ˷˕ʳ˹ʳ˕˔ˡ˗˜ʳʻˈ˄ˋ˃ˈ˅ˇ˃ˠ˛ʼ

ˠ˖˦˃ˠ˖˦ˇ ˄˄ˁˈ ˄ˆ ˄ˇˁˈ ˄˄ˁˈ ˄ˆˁˈ ˄ˆ ˄ˇˁˈ ˄ˇˁˈ
ˠ˖˦ˈˠ˖˦ˊ ˄˄ˁˈ ˄ˆ ˄ˆˁˈ ˄˄ˁˈ ˄ˆˁˈ ˄ˆ ˄ˆˁˈ ˄ˆˁˈ
ˠ˖˦ˋˠ˖˦˄˅ ˄ˇˁˈ ˄ˉ ˄ˊˁˈ ˄ˇˁˈ ˄ˉˁˈ ˄ˉ ˄ˊˁˈ ˄ˊˁˈ
ˠ˖˦˄ˆˠ˖˦˄ˈ ˄ˇˁˈ ˄ˉ ˄ˉˁˈ ˄ˇˁˈ ˄ˉˁˈ ˄ˉ ˄ˉˁˈ ˄ˉˁˈ

˄˄˄ˠ˵ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉ
ˉ˅ˇˠ˵ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˈˁˈ ˄ˆ
ˆˉˈˇˠ˵ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˆ
ˠ˖˦˃ˠ˖˦ˇ ˄ˇ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˇˁˈ ˄ˆˁˈ
ˠ˖˦ˈˠ˖˦ˊ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ ˄ˆˁˈ
ˠ˖˦ˋˠ˖˦˄˅ ˄ˊ ˄ˊˁˈ ˄ˊˁˈ ˄ˊˁˈ ˄ˊˁˈ ˄ˊˁˈ ˄ˊˁˈ ˄ˊˁˈ ˄ˊˁˈ ˄ˊˁˈ ˄ˉˁˈ
ˠ˖˦˄ˆˠ˖˦˄ˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ ˄ˉˁˈ

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COMPANY CONFIDENTIAL

9. Environmental Requirements and Specifications

9.1 Temperature

9.1.1 Operating Temperature Conditions

The product shall be capable of continuous reliable operation when operating in ambient temperature of
0 °C to +70°C.

9.1.2 Non-Operating Temperature Conditions

Neither subassemblies shall be damaged nor shall the operational performance be degraded when restored
to the operating temperature when exposed to storage temperature in the range of -10°C to +85°C.

9.2 PCB bending

The PCB bending spec limits plainness under 0.1mm for both Foxconn and end assembly customer.

9.3 Handling environment

ESD:

There are semiconductors on the module, please handle the module under ESD protected and
well-controlled environment (<100V).

Terminals Handling Notice

The product is mounted with motherboard through Land Grid Array. In order to prevent poor soldering,
please do not touch LGA portion by hand.

Notes: As a rule, baking the components in accordance with condition mentioned above, because tape and
real for packaging materials have no heat resistance, please bake the components moved into another
container such as heat resistance trays.

Others:

1. Please make sure to avoid mechanical shock and vibration for this module.

2. Please do not drop the module.

3. Please do not clean the module.

9.4 Storage Condition

1. Moisture barrier bag must be stored under 40 к, humidity under 90% RH, when the moisture barrier bag
is sealed by Foxconn.

2. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date.

3. If Moisture barrier bag is open, the component must be stored in an environment of <25 5 /10%RH

4. Please keep the module at 30

к/70% RH.

9.5 Baking Condition

The module would be required for baking if:

1. Humidity indicator cards read >30%

2. Temp < 30 к, Humidity <70%RH, moisture barrier bag open over 96 hours

The baking criteria would be:

1. Baking condition: 90

2. Baking times: Max. 2 times

к, 12-22 hours

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COMPANY CONFIDENTIAL

9.6 Soldering and reflow condition

1. Heating method:
Conventional Convection or IR/convection

2. Temperature measurement:
Thermocouple d=0.1mm ~ 0.2mm CA (K) or CC (T) at soldering portion or equivalent method.

3. Solder paste composition:
Sn/3.0Ag/0.5Cu

4. Allowable reflow soldering times: 2 times, based on the below reflow soldering profile

5. Temperature profile:
Reflow soldering shall be done according to the below temperature profile.

6. Peak temp: 245 degree C

Temperature profile for evaluation of solder heat resistance of a
component (at solder joint)

38

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COMPANY CONFIDENTIAL

f

A

Federal Communication Commission Interference Statement

10 Package information

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device
may not cause harmful interference, and (2) this device must accept any interference received, including interference

TBD

that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 o
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in
accordance with the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to
radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try
to correct the interference by one of the following measures:

- Reorient or relocate the receiving antenna.

- Increase the separation between the equipment and receiver.

- Connect the equipment into an outlet on a circuit different from that
to which the receiver is connected.

- Consult the dealer or an experienced radio/TV technician for help.

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate this equipment.

This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Operations in the 5.15-5.25GHz band are restricted to indoor usage only.

Radiation Exposure Statement:

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment
should be installed and operated with minimum distance 20cm between the radiator & your body.

This device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and

2) The transmitter module may not be co-located with any other transmitter or antenna.

s long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still

responsible for testing their end-product for any additional compliance requirements required with this module installed

IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co­location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be
used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end
product (including the transmitter) and obtaining a separate FCC authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be
maintained between the antenna and users. The final end product must be labeled in a visible area with the following:
“Contains FCC ID: MCLT77H462”. The grantee's FCC ID can be used only when all FCC compliance requirements are
met.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this
RF module in the user's manual of the end product which integrates this module.
The end user manual shall include all required regulatory information/warning as show in this manual.

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