HON HAI PRECISION IND T77H446 User Manual

T77H446.0X NFC Module

USER MANUAL

Project Name T77H446.0X NFC
Revision 00
Foxconn project code T77H446.0X

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1. Introduction

The T77H446.0X NFC module provides contactless payment, contactless ticketing,
service discovery, exchange information etc. This module is based on Broadcom
BCM20792S1 solution, which is integrated NFC subsystem, interfaces, and
microprocessor and memory unit.

1.1 Scope

The NFC module supports for the ISO/IEC 18092, ISO/IEC 21481, ISO/IEC 14443
Types A, B and B’, Japanese industrial standard (JIS)(X) 6319-4, and ISO/IEC 15693
standards, etc.

1.2 Function

• NFC Features

- Reader & Writer mode

- Peer-to-Peer Communication mode

- Card emulation mode

• BSC (I2C-compatible) and SM bus for host Interface,
For I2C -Bus support all speed mode:

- Low-speed mode (100 kbps)

- Fast mode (400 kbps)

- High-speed mode (3.4Mbps)

• On board XTAL of 26 MHz (+/- 10ppm)

• Option for on board embedded Secure Element (eSE) with 800kBytes flash

memory
Remark: eSE can be replaced by external SIM memory on platform.

• Windows 8 Logo Device Requirement compliant

- NFC Forum Wave1 Certification

- LLCP (Link Layer Control Protocol)

- SNEP (Simple NDEF Exchange Protocol)

• RoHS and Green Compliant

• Support Intel Windows 7, Windows 8 platform

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1.3 Electrical Characteristics

Parameter Minimum Typical Maximum Units

Frequency Range - 13.56 - MHz

Input Supply

Voltage

Power

consumption

Communication distance 20 - - mm

Peer to Peer Communication Speed - - 424 Kbps

NFC wake up

Operating Temperature 0 ~ 70

VBAT 2.3 3.3 5.5 V

VDD I/O 1.62 1.8 3.6 V
UICC (class C) 1.78 1.88 1.98 V
UICC (class B) 2.9 3.1 3.3 V

Reader mode - - 247 mA

Writer mode - - 247 mA
Peer to peer

communication

Polling mode - - 14 mA

Pre-poling mode - 0.15 - mA

I2C idle mode - 2.5 - mA

Sleep mode - - 7.0 uA

Snooze standby

mode

- - 247 mA

- 94 - uA

Wake up NFC module from sleep mode by

NFC_WAKE signal via I2C command

℃

Storage Temperature -20 ~ 85

Storage Humidity 0 ~ 85 %

ESD Level

*1 HBM ESD level is base on without ESD protection components on TX1 and TX2. When

assemble the ESD protection component, the ESD level can up to 8KV.

HBM*1 - 2.0K - V

MM - 200 - V

℃

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