HON HAI PRECISION IND J20H085 User Manual
Ambit
Microsystems
(Shanghai
) LTD.
J20H085
No 1925, Nanle Road Songjiang Export
Processing Zone Shanghai, China
Tel :86-21-61206688 Ext:22165
FAX:86-21-57749230
User Manual
Project Name MT7650 IEEE802.11a/b/g/n 1×1 +
Bluetooth3.0, WiFi+BT module
Approval Sheet Rev.
Foxconn Part No. J20H085.00
Sony Part No. 1-458-765-31 (J20H085.00)
1-458-765-21 (J20H085.01)
1.0
J20H085.01
Prepared by Reviewed by Approved by
Clon Liu Eddie Huang
1
CONTENTS
1 REVISION HISTORY
2 MANUFACTURING INFORMATION
3 PRODUCT OVERVIEW
3.1
A
PPLICATION SCOPE
3.2
R
EGULATION OF EACH COUNTRIES
4 MODULE HARDWARE OVERVIEW
4.1
B
LOCK DIAGRAM
4.2
F
EATURES
4.3
I
NTERFACE AND CONNECTOR
5 GENERAL SPECIFICATION
6 ELECTRICAL SPECIFICATION
6.1
A
BSOLUTE MAXIMUM RATING
6.2
R
ECOMMENDED OPERATING RATING
6.3
DC C
HARACTERISTICS
6.4
ESD I
NFORMATION
6.5
E
NVIRONMENT STORAGE CONDITION
7 RF SPECIFICATION
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1010
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7.1
IEEE802.11
7.2
IEEE802.11
7.3
IEEE 802.11N HT20 .................................................................. 14
7.4
IEEE 802.11
7.5
IEEE 802.11
7.6
IEEE 802.11
7.7
B
LUETOOTH
7.8
A
NTENNA ELECTRICAL SPECIFICATION
7.9
P
OWER UP SEQUENCE
8 MECHANICAL SPECIFICATIONS
8.1
S
HIELDING COVER DIMENSION
8.2
PCB A
8.3
M
OUNT POSITION OF MATERIALS
9 SCHEMATICS
10 LAYOUT PATTERN
10.1 M
10.2 A
10.3 PCB S
11 BOM (BILL OF MATERIALS)
12 OTP CONTENT
AIN
NTENNA
B
........................................................................ 12
G
........................................................................ 13
A
........................................................................ 15
AN
HT20 ................................................................. 16
AN
HT40 ................................................................. 17
3.0 ....................................................................... 18
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SSEMBLY DIMENSION
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PCB
LAYOUT (TOP VIEW
PCB
LAYOUT
PECIFICATION
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13 LABEL INFORMATION
13.1 MAC ID L
14 PACKAGE AND STACK INFORMATION
14.1 C
14.2 P
ARTON
ALLET
ABEL (FOR
ASSY .........................................................................
ASSY ..........................................................................
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PVT, MP) ............................................................
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14.3 T
14.4 C
14.5 P
RAY ID LABEL
ARTON LABEL
ALLET LABEL
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15 RELIABILITY TEST PLAN
16 HANDLING NOTICE
18 NOTIFICATION
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2020
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2121
3
1 Revision History
Date Revision
2014/10/18
1.0
Change Description
Initial release
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2 Manufacturing Information
Manufacture Country:
Made in China
Manufacturer:
Ambit Microsystems (Shanghai) LTD.
Manufacture Address:
No 1925, Nanle Road Songjiang Export Processing Zone Shanghai, China
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3 Product Overview
The J20H085 802.11a/b/g/n and BT3.0 module provides wireless modem functionality
utilizing direct sequence spread spectrum and OFDM/CCK technology. This module is
based on MTK MT7650U solution .It fully complies with IEEE 802.11n,IEEE 802.11 a/b/g
and ,Bluetooth v2.1+EDR, v3.0 standard, offering feature-rich wireless connectivity at high
standards, and delivering reliable, cost-effective throughput from an extended distance.
Optimized RF architecture and baseband algorithms provide superb performance and low
power consumption. Intelligent MAC design deploys a high efficient DMA engine and
hardware data processing accelerators which offloads the host processor.
3.1 Application scope
The wireless LAN is compliant to IEEE 802.11n,IEEE 802.11 a/b/g standards. The data
rate of 802.11b is up to 11Mbps and fallback rates of 5.5, 2, 1Mbps. The data rate of
802.11a/g is up to 54Mbps and fallback rates of 48,36,24,18,12,9, 6Mbps. The data rate of
802.11n HT20 is up to 65Mbps and fallback rates of 58.5, 52, 39, 26, 19.5, 13, 6.5Mbps;
The data rate of 802.11n HT40 is up to 130Mbps and fallback rates of 117, 104, 78, 52, 39,
26, 13Mbps;
The BT Module is compliant to Bluetooth 3.0 and EDR standard:
Carrier Frequency: 2402MHz ~ 2480 MHz
Carrier Spacing: 1.0MHz
Duplexing: TDD
Modulation: FHSS
GFSK, pi/4-DQPSK, 8DPSK
Symbol Rate: 1Mbps (GFSK), 2Mbps (pi/4-DQPSK), 3Mbps (8DPSK)
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3.2 Regulation of each countries
Country Approval Certification Certification No. Description
United States Module FCC Part 15C/E
Canada Module RSS-210 issue8
EN 300 328 v1.8.1
EN 301 893 v1.7.1
Europe Plug-in
Russia Module FAC
Japan Module TECEC
Taiwan Module NCC
Malaysia Module SIRIM
South Africa Module ICASA
UAE Module TRA
EN 301 489
EN 60950
EN 62311
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4 Module Hardware Overview
4.1 Block Diagram
The general HW architecture is shown below Figure:
.
4.2 Features
♦ IEEE802.11a/b/g/n (1X1) based on MTK MT7650U solution.
♦ Support BT3.0
♦ USB 2.0 Interface, High and Full Speeds supported.
♦ Module is powered by the host with a 5.0V +/- 10% supply.
♦ External PCB printed antennas.
♦ 4 layers through hole PCB design with FR4 with TG-150 material
4.3 Interface and Connector
♦ Pin definition:
♦ Vendor: JST
♦ Vendor P/N: SM05B-GHS-TB
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Pin Number
1
2
3
4
5
S1
S2
Symbol Name Status Pin definition
GND Ground
DP I/O USB positive data
DM I/O USB negative data
UV+ P USB +5V power input
GND Ground
GND Ground
GND Ground
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