Honeywell HP02-500 User Manual

High-Performance

Process Manager

Planning

HP02-500

System Site Planning - 2

High-Performance

Process Manager

Planning

HP02-500

Release 530

CE Compliant

3/98

Revision 05 – March 20, 1998

While this information is presented in good faith and believed to be accurate, Honeywell disclaims the implied warranties of merchantability and fitness for a particular purpose and makes no express warranties except as may be stated in its written agreement with and for its customer.

In no event is Honeywell liable to anyone for any indirect, special or consequential damages. The information and specifications in this document are subject to change without notice.

TotalPlant, TDC 3000, Process Manager, and SMARTLINE are U.S. registered trademarks of Honeywell Inc.

Honeywell

Industrial Automation and Control

Automation College

2820 West Kelton Lane

Phoenix, AZ 85023

1-800-852-3211

HPM Planning

3/98

About This Publication

This manual provides information necessary to properly plan the installation of a High-Performance Process Manager (HPM) subsystem at a TPS system site. The subsystem encompasses the HighPerformance Process Manager and the Network Interface Module (NIM), which is resident on the Universal Control Network (UCN), a network associated with the TPS system Local Control Network (LCN). The amount of information that this publication provides depends on your personal experience and the process that the High-Performance Process Manager will control and monitor.

The experienced planner, a person involved in the installation of TPS system’s Basic or LCN equipment, will find that some information is familiar. However, regardless of your past experience, you must read Section 4 in this manual to enhance your knowledge of the process control connections available, and also reference the TPS System Site Planning, Universal Control Network Planning, and Universal Control Network Installation manuals to prepare yourself for the connection of the High-Performance Process Manager to the Universal Control Network.

In some cases, control room expansion will be part of installing the High-Performance Process Manager. If this is the case, use the LCN Planning and LCN Installation manuals to plan for expansion of the network.

This publication supports TotalPlant Solution (TPS) system network software Release 530 or earlier software releases. TPS is the evolution of TDC 3000X.

The publication supports CE Compliant equipment. Any equipment designated as “CE Compliant” complies with the European Union EMC and its health and safety directives. All equipment entering the European countries after January 1, 1996 require this type of compliance, denoted by the

“CE Mark.”

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HPM Planning

iii

Scope

ATTENTION

CAUTION

WARNING

53893

53894

Standard Symbols

The standard symbols used in this publication are defined as follows.

Notes inform the reader about information that is required, but not immediately evident.

Cautions tell the user that damage may occur to equipment if proper care is not exercised.

Warnings tell the reader that potential personal harm or serious economic loss may happen if instructions are not followed.

Ground connection to building safety ground.

Ground stake for building safety ground.

Electrical Shock Hazard—can be lethal.

DANGER

SHOCK HAZARD

53895

Electrical Shock Hazard—can be lethal.

DANGER

HIGH VOLTAGE

53896

Rotating Fan—can cause personal injury.

53897

Caution—refer to the appropriate installation document.

HPM Planning

3/98

Table of Contents

SECTION 1 – INTRODUCTION....................................................................................		1
1.1	Overview..............................................................................................	1
SECTION 2 – HPM DESCRIPTION..............................................................................		3
2.1	Overview..............................................................................................	3
2.2	Card Files .............................................................................................	5
2.2.1	HPMM Card Files...................................................................................	6
2.2.2	Input/Output Processor (IOP) Card Files...............................................	12
2.3	Input/Output Processor (IOP) Cards.....................................................	16
2.3.1	IOP Redundancy ................................................................................	17
2.4	I/O Link Extender (Fiber Optic Link)......................................................	19
2.5	Field Termination Assemblies (FTAs)....................................................	24
2.6	Power Systems...................................................................................	36
2.7	Cabinet Configurations........................................................................	41
SECTION 3 – POWER REQUIREMENTS ..................................................................		45
3.1	Overview............................................................................................	45
3.2	Backup Strategy .................................................................................	46
3.3	Quality................................................................................................	48
3.4	Power Draw ........................................................................................	51
3.4.1	Typical 24 Vdc Power Draw Calculations ...............................................	53
3.4.2	Single Power System Calculation Example ...........................................	58
3.4.3	Dual Power System Calculation Example ..............................................	59
3.4.4	HPM AC Power Draw...........................................................................	60
3.4.5	Crest Factor........................................................................................	61
3.4.6	Inrush Current.....................................................................................	62
3.5	Substation Sizing................................................................................	64
3.6	Circuit Breaker Sizing ..........................................................................	65
3.7	Custom UPS and Power Factor............................................................	66
3.8	Automatic Bypass Switch.....................................................................	66
3.9	Surge Protection ................................................................................	67
3.10	Grounded Conductor..........................................................................	68
3.11	Redundant Safety Grounds.................................................................	68
3.12	Emergency Shutdown ........................................................................	68
3.13	Trays and Conduits .............................................................................	68
3.14	Existing TPS System AC Power ...........................................................	69
SECTION 4 – PROCESS WIRING..............................................................................		71
4.1	Overview............................................................................................	71
4.2	FTA Selection.....................................................................................	72
4.3	Cabinet Entry......................................................................................	80
4.4	Signal Tray Wiring Compatibility............................................................	81
4.5	Process Wiring Termination .................................................................	82
SECTION 5 – HAZARDOUS ENVIRONMENT PLANNING...........................................		83
5.1	Overview............................................................................................	83
5.2	Hazardous Area Classifications.............................................................	84
5.3	Mounting and Operating the HPM in a Division 2 Location......................	86
5.4	Field Wiring in Hazardous Locations ...................................................	100
SECTION 6 – CORROSION PROTECTION PLANNING ............................................		103
6.1	Overview..........................................................................................	103
6.2	Model Numbers ................................................................................	106

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Table of Contents

SECTION 7 – CE COMPLIANCE .............................................................................		115
7.1	Overview..........................................................................................	115
7.2	Card Files .........................................................................................	116
7.3	HPMM Cards.....................................................................................	117
7.4	IOPs.................................................................................................	117
7.5	FTAs................................................................................................	120
7.6	I/O Link Extender..............................................................................	129
7.7	IOP to FTA Cables.............................................................................	130
7.8	Power Cables ...................................................................................	131
7.9	I/O Link Interface Cables....................................................................	136
7.10	UCN Trunk Cable Taps ......................................................................	137
7.11	Cabinets...........................................................................................	139
SECTION 8 – MODEL MU-CBSM01/MU-CBDM01 CABINETS..................................		141
8.1	Overview..........................................................................................	141
8.2	Cabinet Description...........................................................................	144
8.3	Card File and Power System Configurations........................................	148
8.4	Card File and Power System Description.............................................	150
8.5	FTA Mounting Channel Description....................................................	154
8.5.1	Vertical FTA Mounting Channels........................................................	155
8.5.2	Horizontal FTA Mounting Channel......................................................	159
8.6	Cabinet Floor Planning......................................................................	163
SECTION 9 – MODEL MU-CBSX01/MU-CBDX01 CABINETS ...................................		165
9.1	Overview..........................................................................................	165
9.2	Cabinet Description...........................................................................	169
9.3	Card File and Power System Configurations........................................	173
9.4	Card File and Power System Description.............................................	175
9.5	FTA Mounting Channel Descriptions..................................................	179
9.5.1	Vertical FTA Mounting Channels........................................................	180
9.5.2	Horizontal FTA Mounting Channel......................................................	184
9.6	Cabinet Floor Planning......................................................................	188
SECTION 10 – REDUNDANCY PLANNING..............................................................		189
10.1	Overview..........................................................................................	189
10.2	Redundant HPMM Configurations......................................................	189
10.3	Redundant IOP Placement................................................................	194
10.4	Redundancy Support........................................................................	195
10.4.1	Power System ..................................................................................	195
10.4.2	HPMM to I/O .....................................................................................	195

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SECTION 11 – I/O LINK EXTENDER PLANNING......................................................		197
11.1	Overview..........................................................................................	197
11.2	Description.......................................................................................	198
11.3	Fiber Optic Cable Routing..................................................................	204
11.3.1	Direct Burial ......................................................................................	204
11.3.2	Aerial Lashing...................................................................................	204
11.3.3	Vertical Installations...........................................................................	205
11.3.4	Indoor Requirements ........................................................................	205
11.3.5	Loose Buffered Cable.......................................................................	205
11.3.6	Number of Fibers ..............................................................................	206
11.3.7	Cable Installation...............................................................................	206
11.4	Indoor Cable Bend Radius.................................................................	207
11.5	Cable Construction ...........................................................................	207
11.6	Cable Splices and Connections .........................................................	208
11.7	Signal Loss Budget...........................................................................	210
11.7.1	Standard I/O Link Extender................................................................	210
11.7.2	Long Distance I/O Link Extender........................................................	212
11.8	Power Level Measurement................................................................	213
SECTION 12 – LOW LEVEL MULTIPLEXER PLANNING ..........................................		215
12.1	Overview..........................................................................................	215
12.2	LLMux Version .................................................................................	216
12.2.1	LLMux Configurations.......................................................................	216
12.2.2	LLMux IOP Placement.......................................................................	219
12.2.3	LLMux Power Adapter Placement......................................................	219
12.2.4	LLMux FTA Placement......................................................................	219
12.2.5	Remote CJR Installation.....................................................................	222
12.3	RHMUX Version................................................................................	223
12.3.1	RHMUX Configurations......................................................................	223
12.3.2	RHMUX IOP Placement .....................................................................	228
12.3.3	RHMUX Power Adapter Placement.....................................................	228
12.3.4	RHMUX FTA Placement.....................................................................	228
SECTION 13 – SERIAL DEVICE INTERFACE PLANNING.........................................		233
13.1	Overview..........................................................................................	233
13.2	Serial Device Interface Configurations ................................................	233
13.3	Serial Device Interface IOP Placement................................................	235
13.4	Power Adapter Placement.................................................................	235
13.5	IOP to Power Adapter Cabling............................................................	235
13.6	Serial Device Interface FTA Placement ...............................................	236
13.7	FTA to Power Adapter Cabling...........................................................	236
13.8	FTA Field Cabling..............................................................................	238
13.9	Serial Device Interface FTA Models ....................................................	239
SECTION 14 – SERIAL INTERFACE PLANNING......................................................		241
14.1	Overview..........................................................................................	241
14.2	Serial Interface Configurations ...........................................................	241
14.3	Serial Interface IOP Placement...........................................................	247
14.4	Power Adapter Placement.................................................................	247
14.5	IOP to Power Adapter Cabling............................................................	247
14.6	Serial Interface FTA Placement ..........................................................	248
14.7	FTA to Power Adapter Cabling...........................................................	248
14.8	FTA Field Cabling..............................................................................	250
14.9	Serial Interface FTA Models ...............................................................	251
14.10	Communications Interface Specifications............................................	252

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Table of Contents

SECTION 15 – GALVANICALLY ISOLATED FTA PLANNING....................................		253
15.1	Overview..........................................................................................	253
15.2	Description.......................................................................................	255
15.3	Features...........................................................................................	264
15.3.1	IOP Redundancy ..............................................................................	264
15.3.2	Analog and Digital Output Standby Manual Devices.............................	264
15.3.3	Auxiliary Inputs/Outputs ....................................................................	265
15.3.4	Power Requirements ........................................................................	267
15.3.5	Field Wiring Connections...................................................................	268
15.3.6	Ambient Temperature Limits..............................................................	268
15.3.7	FTA Mounting Channels....................................................................	269
15.4	Power Distribution.............................................................................	273
15.4.1	Power Distribution Assembly .............................................................	274
15.4.2	Cabling to Power Distribution Assemblies...........................................	275
15.4.3	Cabling to FTAs ................................................................................	275
15.4.4	Power Considerations.......................................................................	276
15.5	High Level Analog Input (HLAI) FTAs..................................................	277
15.5.1	Model MU-GAIH12/MU-GAIH82 FTA...................................................	277
15.5.1.1	Description.......................................................................................	277
15.5.1.2	Connectors ......................................................................................	277
15.5.1.3	Field Wiring Input Signals...................................................................	277
15.5.1.4	Auxiliary Connector Output................................................................	278
15.5.1.5	Indicators..........................................................................................	278
15.5.1.6	Current Consumption........................................................................	278
15.5.1.7	Isolation and Safety...........................................................................	278
15.5.2	Model MU-GAIH13/MU-GAIH83 FTA...................................................	279
15.5.2.1	Description.......................................................................................	279
15.5.2.2	Connectors ......................................................................................	279
15.5.2.3	Field Wiring Input Signals...................................................................	280
15.5.2.4	Auxiliary Connector Output................................................................	280
15.5.2.5	Indicators..........................................................................................	280
15.5.2.6	Hand-Held Communicator..................................................................	281
15.5.2.7	Current Consumption........................................................................	281
15.5.2.8	Isolation and Safety...........................................................................	281
15.5.3	Model MU-GAIH14/MU-GAIH84 FTA...................................................	282
15.5.3.1	Description.......................................................................................	282
15.5.3.2	Connectors ......................................................................................	282
15.5.3.3	Field Wiring Input Signals...................................................................	283
15.5.3.4	Auxiliary Connector Output................................................................	283
15.5.3.5	Indicators..........................................................................................	283
15.5.3.6	Hand-Held Communicator..................................................................	284
15.5.3.7	Current Consumption........................................................................	284
15.5.3.8	Isolation and Safety...........................................................................	284
15.5.4	Model MU-GAIH22/MU-GAIH92 FTA...................................................	285
15.5.4.1	Description.......................................................................................	285
15.5.4.2	Connectors ......................................................................................	285
15.5.4.3	Field Wiring Input Signals...................................................................	286
15.5.4.4	Auxiliary Connector Output................................................................	286
15.5.4.5	Indicators..........................................................................................	286
15.5.4.6	Current Consumption........................................................................	287
15.5.4.7	Isolation and Safety...........................................................................	287

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15.6	24 Vdc Digital Input FTAs...................................................................	288
15.6.1	Model MU-GDID12/MU-GDID82 FTA...................................................	288
15.6.1.1	Description.......................................................................................	288
15.6.1.2	Connectors ......................................................................................	288
15.6.1.3	Field Wiring Input Signals...................................................................	289
15.6.1.4	Line-Fault Detection..........................................................................	289
15.6.1.5	Auxiliary Connector Output................................................................	289
15.6.1.6	Indicators..........................................................................................	290
15.6.1.7	Current Consumption........................................................................	290
15.6.1.8	Isolation and Safety...........................................................................	290
15.6.2	Model MU-GDID13/MU-GDID83 FTA...................................................	291
15.6.2.1	Description.......................................................................................	291
15.6.2.2	Connectors ......................................................................................	291
15.6.2.3	Field Wiring Input Signals...................................................................	291
15.6.2.4	Indicators..........................................................................................	292
15.6.2.5	Current Consumption........................................................................	292
15.6.2.6	Isolation and Safety...........................................................................	292
15.7	Analog Output FTAs .........................................................................	293
15.7.1	Model MU-GAOX02/72 and MU-GAOX12/82 FTAs..............................	293
15.7.1.1	Description.......................................................................................	293
15.7.1.2	Connectors ......................................................................................	293
15.7.1.3	Field Wiring Output Signals................................................................	293
15.7.1.4	Line-Fault Detection..........................................................................	294
15.7.1.5	Calibration ........................................................................................	294
15.7.1.6	Indicators..........................................................................................	294
15.7.1.7	Current Consumption........................................................................	294
15.7.1.8	Isolation and Safety...........................................................................	295
15.8	24 Vdc Digital Output FTAs................................................................	296
15.8.1	Model MU-GDOD12/MU-GDOD82 FTA...............................................	296
15.8.1.1	Description.......................................................................................	296
15.8.1.2	Signal Connectors ............................................................................	296
15.8.1.3	Field Wiring Output Signals................................................................	296
15.8.1.4	Auxiliary Connector...........................................................................	297
15.8.1.5	Indicators..........................................................................................	297
15.8.1.6	Standby Manual Device Connector ....................................................	297
15.8.1.7	Current Consumption........................................................................	298
15.8.1.8	Isolation and Safety...........................................................................	298
15.8.2	Model MU-GDOL12/MU-GDOL82 FTA ...............................................	299
15.8.2.1	Description.......................................................................................	299
15.8.2.2	Signal Connectors ............................................................................	299
15.8.2.3	Field Wiring Output Signals................................................................	299
15.8.2.4	Auxiliary Connector...........................................................................	300
15.8.2.5	Indicators..........................................................................................	300
15.8.2.6	Standby Manual Device Connector ....................................................	301
15.8.2.7	Current Consumption........................................................................	301
15.8.2.8	Isolation and Safety...........................................................................	301
15.9	Combiner Panel................................................................................	302
15.10	Marshalling Panel..............................................................................	303
15.10.1	Description.......................................................................................	303
15.10.2	Configurations..................................................................................	304
15.10.2.1	High Level Analog Input FTAs............................................................	304
15.10.2.2	Digital Input FTAs..............................................................................	305
15.10.2.3	Digital Output FTAs...........................................................................	306

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HPM Planning

	Figures
Figure 2-1	Nonredundant HPMM Cabinet Layout.................................................	4
Figure 2-2	Left 7-Slot HPMM Card File.................................................................	7
Figure 2-3	Right 7-Slot HPMM Card File...............................................................	9
Figure 2-4	15-Slot HPMM Card File....................................................................	11
Figure 2-5	Left 7-Slot IOP Card File ...................................................................	13
Figure 2-6	Right 7-Slot IOP Card File .................................................................	14
Figure 2-7	15-Slot IOP Card File........................................................................	15
Figure 2-8	HLAI FTA with Redundant HLAI IOPs ................................................	17
Figure 2-9	Analog Output FTA with Redundant Analog Output IOPs...................	18
Figure 2-10	Standard I/O Link Extender Interconnections
	with Nonredundant HPMM................................................................	20
Figure 2-11	Standard I/O Link Extender Interconnections
	with Redundant HPMMs...................................................................	21
Figure 2-12	Long Distance I/O Link Extender Interconnections
	with Nonredundant HPMM................................................................	22
Figure 2-13	Long Distance I/O Link Extender Interconnections
	with Redundant HPMMs...................................................................	23
Figure 2-14	Field Termination Assembly (FTA) Sizes............................................	28
Figure 2-15	Typical Vertical FTA Mounting Channel Layout...................................	30
Figure 2-16	Typical FTA Compression Terminal Connector...................................	31
Figure 2-17	Typical FTA Fixed-Screw Terminal Connector ....................................	32
Figure 2-18	Typical FTA Removable-Screw Terminal Connector............................	32
Figure 2-19	Crimp-Pin Galvanic Isolation Module Terminal Connector ....................	33
Figure 2-20	Compression-Type Galvanic Isolation Module ....................................	34
Figure 2-21	FTA Marshalling Panel Assembly Layout............................................	35
Figure 2-22	Standard Power System—Model MU-PSRX03...................................	37
Figure 2-23	Standard Power System—Model MU-PSRX04...................................	38
Figure 2-24	AC Only Power System—Not for CE Compliant Applications ...............	40
Figure 2-25	Single Cabinet with Redundant HPMMs ............................................	42
Figure 2-26	Complexed Cabinets with Redundant HPMMs...................................	43
Figure 2-27	Local Complexed Cabinets with Redundant HPMMs ..........................	44
Figure 3-1	Subsystem AC Power and Ground Connections—
	Multi-Ground System........................................................................	49
Figure 3-2	Subsystem AC Power and Ground Connections—
	Single-Ground System.....................................................................	50
Figure 4-1	Field Termination Assembly (FTA) Sizes ............................................	73
Figure 4-2	Field Termination Assembly (FTA) Mounting Dimensions....................	74
Figure 6-1	Conformal Coating Symbol .............................................................	105
Figure 7-1	I/O Link Extender Adapter Kit..........................................................	129
Figure 7-2	Two-Port UCN Cable Tap................................................................	137
Figure 7-3	Four-Port UCN Cable Tap ...............................................................	138
Figure 7-4	Eight-Port UCN Cable Tap ..............................................................	138
Figure 8-1	Single-Access Cabinet...................................................................	142
Figure 8-2	Dual-Access Cabinet ......................................................................	143
Figure 8-3	Single-Access Cabinet Bottom Cable Entry Slots.............................	144
Figure 8-4	Dual-Access Cabinet Bottom Cable Entry Slots................................	145
Figure 8-5	Cabinet Interior Dimensions............................................................	147
Figure 8-6	Typical Single-Access Cabinet Assembly Layout..............................	148
Figure 8-7	Typical Dual-Access Cabinet Assembly Layout.................................	149
Figure 8-8	7-Slot Card File Installation Dimensions............................................	150
Figure 8-9	15-Slot Card File Installation Dimensions..........................................	151
Figure 8-10	Installation of 7-Slot and 15-Slot Card Files.......................................	152
Figure 8-11	Power System Installation Dimensions.............................................	153
Figure 8-12	Typical Vertical FTA Mounting Channel Configurations.....................	156
Figure 8-13	Vertical FTA Mounting Channel Dimensions ....................................	157
Figure 8-14	Vertical FTA Mounting Channel Installation Holes .............................	158
Figure 8-15	Horizontal FTA Mounting Channel Cabinet Layout ...........................	160
Figure 8-16	Horizontal FTA Mounting Channel Dimensions ................................	161

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	Figures
Figure 8-17	Horizontal FTA Mounting Channel Installation Holes.........................	162
Figure 8-18	Cabinet Floor Planning Template ....................................................	163
Figure 9-1	Single-Access Cabinet...................................................................	166
Figure 9-2	Dual-Access Cabinet ......................................................................	167
Figure 9-3	Cabinet Base Panel Grounding Procedure ......................................	168
Figure 9-4	Cabinet Panel and Door Grounding Procedure ................................	168
Figure 9-5	Single-Access Cabinet Bottom Cable Entry .....................................	169
Figure 9-6	Dual-Access Cabinet Bottom Cable Entry ........................................	170
Figure 9-7	Cabinet Interior Dimensions............................................................	172
Figure 9-8	Typical Single-Access Cabinet Assembly Layout..............................	173
Figure 9-9	Typical Dual-Access Cabinet Assembly Layout.................................	174
Figure 9-10	7-Slot Card File Installation Dimensions............................................	175
Figure 9-11	15-Slot Card File Installation Dimensions..........................................	176
Figure 9-12	Installation of 7-Slot and 15-Slot Card Files.......................................	177
Figure 9-13	Power System Installation Dimensions.............................................	178
Figure 9-14	FTA Mounting Channel Configurations............................................	181
Figure 9-15	FTA Mounting Channel Dimensions................................................	182
Figure 9-16	FTA Mounting Channel Mounting FTA Installation Holes...................	183
Figure 9-17	Horizontal FTA Mounting Channel Cabinet Layout ...........................	185
Figure 9-18	Horizontal FTA Mounting Channel Dimensions ................................	186
Figure 9-19	Horizontal FTA Mounting Channel Installation Holes.........................	187
Figure 9-20	Cabinet Floor Planning Template ....................................................	188
Figure 10-1	Single Cabinet with Redundant HPMMs ..........................................	191
Figure 10-2	Dual Cabinets with Redundant HPMMs............................................	192
Figure 10-3	Redundant HPMM Configuration Cabling ........................................	193
Figure 10-4	Local/Remote Cabinet Configuration...............................................	196
Figure 11-1	Standard I/O Link Extender Interconnections
	with Single HPMM..........................................................................	199
Figure 11-2	Standard I/O Link Extender Interconnections
	with Redundant HPMMs.................................................................	200
Figure 11-3	Long Distance I/O Link Extender Interconnections
	with Single HPMM..........................................................................	201
Figure 11-4	Long Distance I/O Link Extender Interconnections
	with Redundant HPMMs.................................................................	202
Figure 11-5	Remote Site Multi-IOP Card File I/O Link Interface Cabling.................	203
Figure 11-6	ST-Type Connector .......................................................................	209
Figure 12-1	LLMux Configuration Interconnections – CE Compliant....................	218
Figure 12-2	Remote CJR Installation..................................................................	222
Figure 12-3	Nonincendive RHMUX Configuration Interconnections.....................	226
Figure 12-4	Intrinsically Safe RHMUX Configuration Interconnections..................	227
Figure 13-1	Serial Device Interface Interconnections..........................................	234
Figure 14-1	Serial Interface FTA to Modbus Device EIA-232 and EIA-422/485
	Interconnections............................................................................	243
Figure 14-2	Serial Interface FTA to Modbus Device EIA-422/485
	Interconnections............................................................................	244
Figure 14-3	Serial Interface FTA to Peripheral Device EIA-422/485
	Interconnections............................................................................	245
Figure 14-4	Serial Interface FTA to Allen-Bradley Device EIA-232
	Interconnections............................................................................	246
Figure 15-1	Typical Galvanically Isolated FTA......................................................	259
Figure 15-2	Galvanic Isolation Module................................................................	260
Figure 15-3	Crimp-Type Galvanic Isolation Module Terminal Connector................	261
Figure 15-4	Compression-Type Galvanic Isolation Module Terminal Connector ....	262
Figure 15-5	Galvanically Isolated FTA with Auxiliary Connector ............................	266
Figure 15-6	Cabinet with Horizontally Installed FTA Mounting Channels...............	270

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	Tables
Table 2-1	Card File Models ................................................................................	5
Table 2-2	Standard Field Termination Assembly Types......................................	25
Table 2-3	Galvanically Isolated Field Termination Assembly Types......................	27
Table 3-1	HPM Assembly 24 Vdc Power Usage ................................................	54
Table 3-2	Single Power System Calculation Example ........................................	58
Table 3-3	Dual Power System Calculation Example (Power System 1) ................	59
Table 3-4	Dual Power System Calculation Example (Power System 2) ................	60
Table 4-1	Standard FTAs and Associated Assemblies.......................................	75
Table 4-2	Galvanically Isolated FTAs and Associated Assemblies .......................	78
Table 5-1	Hazardous Area Classifications..........................................................	84
Table 5-2	HPM Equipment Approved for Use in a Division 2 Area .......................	87
Table 5-3	Nonincendive FTA Types...............................................................	101
Table 5-4	FTA Cable and Load Parameters.....................................................	102
Table 6-1	Environment Minimum Equipment Requirement..............................	103
Table 6-2	Harsh Environment Definitions from ANSI/ISA-S71.04-1985 ............	104
Table 6-3	Conformally Coated Assembly Model Numbers................................	107
Table 7-1	Card Files ......................................................................................	116
Table 7-2	IOPs—Nonconformally Coated .......................................................	118
Table 7-3	IOPs—Conformally Coated .............................................................	119
Table 7-4	Field Termination Assemblies—Nonconformally Coated ...................	120
Table 7-5	Field Termination Assemblies—Conformally Coated.........................	125
Table 7-6	IOP to FTA Cables..........................................................................	130
Table 7-7	Non-CE Compliant Subsystem Power Cables ..................................	133
Table 7-8	CE Compliant Subsystem Power Cables..........................................	134
Table 7-9	Power Cables without I/O Link Protector Module..............................	135
Table 7-10	I/O Link Interface Cable Sets ...........................................................	136
Table 11-1	Minimum Bend Radius for Indoor Cable ...........................................	207
Table 11-2	Standard Optical Power Loss..........................................................	211
Table 11-3	Standard Fiber Optic Cable Losses (@ 850 nm) ...............................	211
Table 11-4	Long Distance Optical Power Loss ..................................................	213
Table 11-5	Long distance Fiber Optic Cable Losses (@ 1300 nm)......................	213
Table 12-1	LLMux Assembles .........................................................................	216
Table 12-2	RHMUX Assemblies .......................................................................	223
Table 14-1	Serial Interface FTAs ......................................................................	241
Table 14-2	Serial Interface EIA-232 Specifications ............................................	252
Table 14-3	Serial Interface EIA-422/485 Specifications .....................................	252
Table 15-1	CE Compliant Galvanically Isolated FTAs—Nonconformally Coated ...	256
Table 15-2	CE Compliant Galvanically Isolated FTAs—Conformally Coated .........	257
Table 15-3	Galvanically Isolated FTA Power Requirements ................................	267

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	Acronyms

AC ..................................................................................................	Alternating Current
ANSI ....................................................................	American National Standards Institute
AO........................................................................................................	Analog Output
AWG ...........................................................................................	American Wire Gauge
CJR........................................................................................	Cold Junction Reference
CMOS........................................................	Complementary Metal Oxide Semiconductor
DC ..........................................................................................................	Direct Current
DISOE........................................................................	Digital Input Sequence of Events
DI...............................................................................................................	Digital Input
DO..........................................................................................................	Digital Output
EIA..............................................................................	Electronic Industries Association
EMI ..................................................................................	Electromagnetic Interference
FM ...................................................................................	Factory Mutual Research, Inc.
FTA....................................................................................	Field Termination Assembly
GI.......................................................................................................	Galvanic Isolation
HLAI.........................................................................................	High Level Analog Input
HPM......................................................................	High-Performance Process Manager
HPMM.......................................................	High-Performance Process Manager Module
IS...........................................................................................................	Intrinsic Safety
I/O............................................................................................................	Input/Output
IEC................................................................	International Electrotechnical Commission
IEEE ....................................................	Institute of Electrical and Electronic Engineering
ISA..................................................................................	Instrument Society of America
ISO .......................................................................	International Standards Organization
LCN ............................................................................................	Local Control Network
LFD...............................................................................................	Line Fault Detection
LLAI.........................................................................................	Low Level Analog Input
LLMux.....................................................................	Low Level Analog Input Multiplexer
MRG......................................................................................	Master Reference Ground
NE ...........................................................................................	National Electrical Code
NEMA .......................................................	National Electrical Manufacturer’s Association
NFPA...........................................................................	National Fire Protection Agency
NiCad...................................................................................................	Nickel Cadmium
NIM .......................................................................................	Network Interface Module
PI...............................................................................................................	Pulse Input
PSM...........................................................................................	Power Supply Module
PS .........................................................................................................	Power System
PVC..................................................................................................	Polyvinyl Chlorine
PV .....................................................................................................	Process Variable
RHMUX .......................................	Remote Hardened Low Level Analog Input Multiplexer
RTD ................................................................................	Resistive Temperature Device
RTU ............................................................................................	Remote Terminal Unit
SDI.............................................................................................	Serial Device Interface
SI..........................................................................................................	Serial Interface
STI.......................................................................................	Smart Transmitter Interface
STIM .................................................................	Smart Transmitter Interface Multivariable
TC.........................................................................................................	Thermocouple
UCN......................................................................................	Universal Control Network
UV ..............................................................................................................	Ultra Violet

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References

Publication	Publication
Title	Number
High-Performance Process Manager	HP03-500
Specification and Technical Data
High-Performance Process Manager	HP20-500
Installation
High-Performance Process Manager	HP20-510
Checkout
High-Performance Process Manager	HP13-500
Service
Process Manager I/O Specification and	IO03-500
Technical Data
Process Manager I/O Installation	PM20-520
TPS System Site Planning	SW02-550
Universal Control Network Specification	UN03-500
and Technical Data
Universal Control Network Planning	UN02-501
Universal Control Network Installation	UN20-500
Universal Control Network Guidelines	UN12-510
Local Control Network Planning	SW02-501
LCN System Installation	SW20-500
LCN System Checkout	SW20-510
LCN Guidelines - Implementation,	LC09-510
Troubleshooting, and Service

Binder	Binder
Title	Number
System Summary - 2	TPS 3010-2
Implementation/	TPS 3066-3
High-Performance Process
Manager - 3
Implementation/	TPS 3066-3
High-Performance Process
Manager - 3
PM/APM/HPM Service - 1	TPS 3061-1
System Summary - 2	TPS 3010-2
Implementation/	TPS 3066-3
High-Performance Process
Manager - 3
System Site Planning - 1	TPS 3020-1
System Summary - 2	TPS 3010-2
System Site Planning - 1	TPS 3020-1
Installation/Universal Control	TPS 3041
Network
Installation/Universal Control	TPS 3041
Network
System Site Planning - 1	TPS 3020-1
LCN Installation	TPS 3025
LCN Installation	TPS 3025
LCN Installation	TPS 3025

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Section 1 – Introduction

1.1Overview

Section contents	The topics covered in this section are:
	Topic	See Page
1.1	Overview...............................................................................................	1

The manual’s purpose	This manual is intended for planning the installation of a High-Performance
	Process Manager (HPM) subsystem at a TPS system site. The
	High-Performance Process Manager subsystem is a device on the Universal
	Control Network (UCN) that includes the Network Interface Module
	(NIM). Process Managers (PMs), Advanced Process Managers (APMs),
	and Logic Managers (LMs) may also be resident on the network.

The manual’s contents	Planning includes the consideration of the High-Performance Process
	Manager cabinet layout, process wiring techniques, Division 2 environment
	equipment approval, conformal coating of the assemblies to protect against
	a corrosive environment, HPMM and IOP redundancy, and unique
	hardware features, such as fiber optic I/O Link Extenders, Low Level
	Analog Input Multiplexer FTAs, Serial Device Interface FTAs, Serial
	Interface FTAs, and Galvanically Isolated FTAs.

Information not covered	Neither installation, power on checkout, or service of the
	High-Performance Process Manager, nor planning for the Local Control
	Network (LCN) is addressed in this manual. See the related reference
	documentation for information about these topics.

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Section 2 – HPM Description

2.1Overview

Section contents	The topics covered in this section are:
	Topic	See Page
2.1	Overview...............................................................................................	3
2.2	Card Files..............................................................................................	5
2.2.1	HPMM Card Files ...................................................................................	6
2.2.2	Input/Output Processor (IOP) Card Files................................................	13
2.3	Input/Output Processor (IOP) Cards......................................................	17
2.3.1	IOP Redundancy.................................................................................	18
2.4	I/O Link Extender (Fiber Optic Link).......................................................	20
2.5	Field Termination Assemblies (FTAs) ....................................................	25
2.6	Power Systems ...................................................................................	36
2.7	Cabinet Configurations ........................................................................	41
HPM major assemblies	The High-Performance Process Manager subsystem (HPM) consists of
	major assemblies described in the following subsections. The major
	High-Performance Process Manager assemblies are

•High-Performance Process Manager Module (HPMM) card file

•Input/Output Processor (IOP) card file

•Input/Output Processor (IOP) card

•I/O Link Extender

•Field Termination Assembly (FTA)

•Power System

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2.1 Overview, Continued

Nonredundant HPM cabinet layout

Figure 2-1 is an illustration of a single High-Performance Process Manager cabinet containing a nonredundant High-Performance Process Manager Module (HPMM) with supporting assemblies. The HPMM cards (2) and the IOPs cards are installed in 15-Slot HPMM card files. IOP cards occupy the IOP card files.

Figure 2-1 Nonredundant HPMM Cabinet Layout

FTAs are installed in the rear on an FTA Mounting Channel.

IOP Card File #2

Power

Status

High Level

Analog

Low Level

Digital

High Level

Analog

Low Level

Digital

High Level

Analog

Low Level

Digital

Analog

Input

Output

Analog

Output

Input

Analog

Output

Analog

Output

Input

Analog

Output

Analog

Output

Input

IOP Card File #1

Power

Status

High Level

Analog

Low Level

Digital

High Level

Analog

Low Level

Digital

High Level

Analog

Low Level

Digital

Analog

Output

Analog

Output

Input

Analog

Output

Analog

Output

Input

Analog

Output

Analog

Output

Input

HPMM Card File

Power

Status

High

Low Level

Digital

High Level

Analog

Low Level

Digital

High Level

Analog

Low Level

Digital

PerformanPerforman

Analog

Output

Input

Analog

Output

Analog

Output

Input

Analog

Output

Analog

Output

Input

Comm/CntlI/O Link

Input

Power System

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2.2Card Files

Introduction

Non-CE Compliant card file models

CE Compliant card file models

Conversion kit

There are nine card file models. Three models are not CE Compliant and six models are CE Compliant. Table 2-1 lists the nine card file models. All models are also available with conformal coating (a model number with a prefix of MC, rather than MU).

Table 2-1	Card File Models

Card File Description		CE Compliant	Non-CE Compliant

Left 7-Slot HPMM or IOP		N/A	MU-HPFH01

Right 7-Slot HPMM or IOP		N/A	MU-HPFH11

15-Slot HPMM or IOP		N/A	MU-HPFX02

Left 7-Slot HPMM		MU-HPFH03	N/A

Right 7-Slot HPMM		MU-HPFH13	N/A

15-Slot HPMM		MU-HPFX03	N/A

Left 7-Slot IOP		MU-HPFI03	N/A

Right 7-Slot IOP		MU-HPFI13	N/A

15-Slot IOP		MU-HPFI23	N/A

The non-CE Compliant card file models can be designated as an HPMM card file or an IOP card file by either installing an HPMM card set in the two left-most card slots or installing IOP cards.

Unlike the non-CE Compliant card file models, the CE Compliant card file models are designated either an HPMM card file or an IOP card file because even though their is no electrical difference in the backpanel, they differ mechanically. The addition of a ground plate and filtered IOP connectors in the two left-most slots prohibits the installation of an HPMM card set.

The card file is designated an IOP card file when the ground plate and filtered connectors are present.

The card file is designated an HPMM card file when the ground plate and filtered connectors are absent.

A CE Compliant HPMM card file can be converted to an IOP card file with a model MU-ZPFI03 upgrade kit. The kit adds 2 filtered IOP adapter connectors to the two left-most card slots and a ground plate extension.

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2.2.1HPMM Card Files

Three types of HPM card files

HPMM description

Left 7-Slot HPMM card file description

There are three types of HPMM card files. The two left-most slots of each type are populated by the three assemblies that comprise the HPMM. The remaining slots accommodate IOPs.

If the card file is a non-CE Compliant card file, the two left-most slots of each type can also accommodate IOPs with no alterations. The card file is then designated an IOP card file.

The High-Performance Process Manager Module (HPMM) is composed of two card assemblies that install in the two left-most slots in a 7-Slot or 15-Slot card file, and a UCN interface module that mounts and connects to the 50-pin connector that is directly below the left-most card.

The three HPMM assemblies are identified as follows:

•High-Performance Communications/Control (High-Performance Comm/Control) card

•High-Performance I/O Link Interface (High-Performance I/O Link) card

•High-Performance UCN Interface (HPM UCN Interface) module

The HPM UCN Interface module connects to the 50-pin connector below the High-Performance Comm/Control card.

The Left 7-Slot card file accepts the two HPMM cards and the HPM UCN Interface module that comprise the HPMM, and accommodates up to five IOP cards. The card slots are numbered 1 through 7, starting at the left-most position.

The High-Performance Comm/Control and High-Performance I/O Link cards occupy slots 1 and 2, while the HPM UCN Interface module mounts below slot 1 and connects to its 50-pin connector.

Slots 3 through 7 can accommodate IOP cards. The IOP card slots assume numerical I/O Link Interface addresses of 3 through 7 and binary I/O Link Interface addresses of 2 through 6.

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2.2.1 HPMM Card Files, Continued

Left 7-Slot HPMM card file illustration

Figure 2-2 is an illustration of a Left 7-Slot HPMM card file and the two HPMM cards that occupy slots 1 and 2.

Figure 2-2 Left 7-Slot HPMM Card File

HPMM IOPs

1 2 3 4 5 6 7

1A15

Power

Status

High

Performance

Comm/Cntrl

Power

Status

High

Performance

I/O Link

16000

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2.2.1 HPMM Card Files, Continued

Right 7-Slot HPMM card file description

The description of the Right 7-Slot HPMM card file is identical to the Left 7-Slot HPMM card file, except the two HPMM cards and the UCN interface module occupy slots 9 and 10. The card slots are numbered

9 through 15.

Slots 11 through 15 accommodate IOP cards. The IOP card slots assume numerical I/O Link Interface addresses of 11 through 15 and binary

I/O Link Interface addresses of 10 through 14.

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2.2.1 HPMM Card Files, Continued

Right 7-Slot HPMM card file illustration

Figure 2-3 is an illustration of a Right 7-Slot HPMM card file and the two HPMM cards that occupy slots 9 and 10.

Figure 2-3 Right 7-Slot HPMM Card File

HPMM IOPs

9 10 11 12 13 14 15

1A15

Power

Status

High

Performance

Comm/Cntrl

Power

Status

High

Performance

I/O Link

16001

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2.2.1 HPMM Card Files, Continued

15-Slot HPMM card file description

The 15-Slot card file accepts the two HPMM cards and the UCN interface module that comprise the HPMM, and accommodates up to thirteen IOP cards. The card slots are numbered 1 through 15, starting at the left-most position.

The High-Performance Comm/Control and High-Performance I/O Link cards occupy slots 1 and 2, while the HPM UCN Interface module mounts below slot 1 in its 50-pin connector.

Slots 3 through 15 can accommodate IOP cards. The IOP card slots assume numerical I/O Link Interface addresses of 3 through 15 and binary I/O Link Interface addresses of 2 through 14.

When populated with the HPMM cards, the card file is designated a 15-Slot HPMM card file.

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2.2.1 HPMM Card Files, Continued

15-Slot HPMM card file illustration

Figure 2-4 is an illustration of a 15-Slot HPMM card file and the two HPMM cards that occupy slots 1 and 2.

Figure 2-4 15-Slot HPMM Card File

	HPMM						IOPs
	1	2	3	4	5	6	7	8	9	10	11 12	13 14 15
Power	Power
Status	Status
High	High
Performance	Performance
Comm/Cntrl	I/O Link
												32745

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2.2.1 HPMM Card Files, Continued

7-Slot HPMM card file usage

15-Slot HPMM card file usage

HPMM functionality

The two types of 7-Slot HPMM card files are intended to be used in a small HPM subsystem.

When the subsystem consists of nonredundant HPMMs, a Left 7-Slot HPMM card file must be installed. For a subsystem that requires redundant HPMMs, Left and Right 7-Slot HPMM card files are installed. Both card files are assigned the same the same I/O Link Interface address. There is no slot 8 because the card file slots are numbered 1 through 7 and 9 through 15.

The 15-Slot HPMM card file is intended for use in a larger HPM subsystem, either with nonredundant or redundant HPMMs. Unlike the 7-Slot HPMM card file, there is no “loss” of a card slot.

The HPMM provides the following functions:

•Communications with the Local Control Network (LCN) Network Interface Module (NIM) through the Universal Control Network (UCN)

•A Communications processor ( Motorola 68LC040)

•Communications through the I/O Link Interface with Input/Output Processors (IOPs) and I/O Link Extenders

•A Control processor (Motorola 68040)

•Separate and shared memory for the Communications and Control processors

•An I/O Link processor (Intel 80C32) with SRAM

•HPMM redundancy control

2.2.2Input/Output Processor (IOP) Card Files

IOP card file descriptions

Non-CE Compliant card files

CE Compliant card files

The 7-Slot and 15-Slot IOP card files are electrically identical to the HPMM card files, except that an HPMM card set is not installed in the card file. IOPs can be installed in the two left-most card slots.

Non-CE Compliant HPMM and IOP card files differ only in the application. Electrically and mechanically, their backpanels are the same. The card file model numbers are the same.

CE Compliant HPMM and IOP card files differ mechanically. IOP card files have filtered IOP connectors and connector ground plates. Electrically, their backpanels are the same. The card file model numbers are different.

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2.2.2Input/Output Processor (IOP) Card Files, Continued

Left 7-Slot IOP card file Figure 2-5 illustrates a Left 7-Slot IOP card file.

Figure 2-5 Left 7-Slot IOP Card File

Power

Status

Analog

Output

			7 IOPs
1	2	3	4	5	6	7

16004

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2.2.2Input/Output Processor (IOP) Card Files, Continued

Right 7-Slot IOP card	Figure 2-6 illustrates a Left 7-Slot IOP card file.
file	Figure 2-6	Right 7-Slot IOP Card File

Power

Status

Analog

Output

		7 IOPs
9	10	11	12	13	14	15

16005

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