Honeywell HP02-500 User Manual
High-Performance
Process Manager
Planning
HP02-500
System Site Planning - 2
High-Performance
Process Manager
Planning
HP02-500
Release 530
CE Compliant
3/98
Copyright, Notices, and Trademarks
© Copyright 1995 - 1998 by Honeywell Inc.
Revision 05 – March 20, 1998
While this information is presented in good faith and believed to be accurate,
Honeywell disclaims the implied warranties of merchantability and fitness for a
particular purpose and makes no express warranties except as may be stated in its
written agreement with and for its customer.
In no event is Honeywell liable to anyone for any indirect, special or consequential
damages. The information and specifications in this document are subject to
change without notice.
TotalPlant, TDC 3000, Process Manager, and SMARTLINE are U.S. registered
trademarks of Honeywell Inc.
Honeywell
Industrial Automation and Control
Automation College
2820 West Kelton Lane
Phoenix, AZ 85023
1-800-852-3211
ii HPM Planning 3/98
About This Publication
This manual provides information necessary to properly plan the installation of a High-Performance
Process Manager (HPM) subsystem at a TPS system site. The subsystem encompasses the HighPerformance Process Manager and the Network Interface Module (NIM), which is resident on the
Universal Control Network (UCN), a network associated with the TPS system Local Control
Network (LCN). The amount of information that this publication provides depends on your
personal experience and the process that the High-Performance Process Manager will control and
monitor.
The experienced planner, a person involved in the installation of TPS system’s Basic or LCN
equipment, will find that some information is familiar. However, regardless of your past
experience, you must read Section 4 in this manual to enhance your knowledge of the process
control connections available, and also reference the TPS System Site Planning, Universal Control
Network Planning, and Universal Control Network Installation manuals to prepare yourself for the
connection of the High-Performance Process Manager to the Universal Control Network.
In some cases, control room expansion will be part of installing the High-Performance Process
Manager. If this is the case, use the LCN Planning and LCN Installation manuals to plan for
expansion of the network.
This publication supports TotalPlant Solution (TPS) system network software Release 530 or earlier
software releases. TPS is the evolution of TDC 3000X.
The publication supports CE Compliant equipment. Any equipment designated as “CE Compliant”
complies with the European Union EMC and its health and safety directives. All equipment entering
the European countries after January 1, 1996 require this type of compliance, denoted by the
“CE Mark.”
3/98 HPM Planning iii
Standard Symbols
53896
Scope
ATTENTION
CAUTION
WARNING
OR
The standard symbols used in this publication are defined as follows.
Notes inform the reader about information that is required, but not
immediately evident.
Cautions tell the user that damage may occur to equipment if proper care is
not exercised.
Warnings tell the reader that potential personal harm or serious economic
loss may happen if instructions are not followed.
Ground connection to building safety ground.
53893
Ground stake for building safety ground.
53894
DANGER
SHOCK HAZARD
DANGER
HIGH VOLTAGE
!
Electrical Shock Hazard—can be lethal.
53895
Electrical Shock Hazard—can be lethal.
Rotating Fan—can cause personal injury.
53897
Caution—refer to the appropriate installation document.
iv HPM Planning 3/98
Table of Contents
SECTION 1 – INTRODUCTION.................................................................................... 1
1.1 Overview.............................................................................................. 1
SECTION 2 – HPM DESCRIPTION.............................................................................. 3
2.1 Overview.............................................................................................. 3
2.2 Card Files ............................................................................................. 5
2.2.1 HPMM Card Files................................................................................... 6
2.2.2 Input/Output Processor (IOP) Card Files............................................... 12
2.3 Input/Output Processor (IOP) Cards..................................................... 16
2.3.1 IOP Redundancy................................................................................ 17
2.4 I/O Link Extender (Fiber Optic Link)...................................................... 19
2. 5 Field Termination Assemblies (FTAs).................................................... 24
2.6 Power Systems................................................................................... 36
2.7 Cabinet Configurations........................................................................ 41
SECTION 3 – POWER REQUIREMENTS.................................................................. 45
3.1 Overview............................................................................................ 45
3.2 Backup Strategy................................................................................. 46
3.3 Quality................................................................................................ 48
3.4 Power Draw ........................................................................................ 51
3.4.1 Typical 24 Vdc Power Draw Calculations ............................................... 53
3.4.2 Single Power System Calculation Example........................................... 58
3.4.3 Dual Power System Calculation Example .............................................. 59
3.4.4 HPM AC Power Draw........................................................................... 60
3.4.5 Crest Factor........................................................................................ 61
3.4.6 Inrush Current..................................................................................... 62
3.5 Substation Sizing................................................................................ 64
3.6 Circuit Breaker Sizing .......................................................................... 65
3.7 Custom UPS and Power Factor............................................................ 66
3.8 Automatic Bypass Switch..................................................................... 66
3. 9 Surge Protection ................................................................................ 67
3.10 Grounded Conductor .......................................................................... 68
3.11 Redundant Safety Grounds ................................................................. 68
3.12 Emergency Shutdown ........................................................................ 68
3.13 Trays and Conduits............................................................................. 68
3.14 Existing TPS System AC Power........................................................... 69
SECTION 4 – PROCESS WIRING.............................................................................. 71
4.1 Overview............................................................................................ 71
4.2 FTA Selection..................................................................................... 72
4.3 Cabinet Entry...................................................................................... 80
4.4 Signal Tray Wiring Compatibility............................................................ 81
4.5 Process Wiring Termination ................................................................. 82
SECTION 5 – HAZARDOUS ENVIRONMENT PLANNING........................................... 83
5.1 Overview............................................................................................ 83
5. 2 Hazardous Area Classifications............................................................. 84
5.3 Mounting and Operating the HPM in a Division 2 Location...................... 86
5.4 Field Wiring in Hazardous Locations ................................................... 100
SECTION 6 – CORROSION PROTECTION PLANNING ............................................ 103
6.1 Overview.......................................................................................... 103
6.2 Model Numbers................................................................................ 106
3/98 HPM Planning v
Table of Contents
SECTION 7 – CE COMPLIANCE............................................................................. 115
7.1 Overview.......................................................................................... 115
7.2 Card Files ......................................................................................... 116
7.3 HPMM Cards..................................................................................... 117
7.4 IOPs................................................................................................. 117
7.5 FTAs................................................................................................ 120
7.6 I/O Link Extender.............................................................................. 129
7. 7 IOP to FTA Cables............................................................................. 130
7.8 Power Cables ................................................................................... 131
7.9 I/O Link Interface Cables.................................................................... 136
7.10 UCN Trunk Cable Taps...................................................................... 137
7.11 Cabinets........................................................................................... 139
SECTION 8 – MODEL MU-CBSM01/MU-CBDM01 CABINETS.................................. 141
8.1 Overview.......................................................................................... 141
8.2 Cabinet Description........................................................................... 144
8. 3 Card File and Power System Configurations........................................ 148
8. 4 Card File and Power System Description............................................. 150
8. 5 FTA Mounting Channel Description.................................................... 154
8.5.1 Vertical FTA Mounting Channels........................................................ 155
8.5.2 Horizontal FTA Mounting Channel...................................................... 159
8.6 Cabinet Floor Planning...................................................................... 163
SECTION 9 – MODEL MU-CBSX01/MU-CBDX01 CABINETS ................................... 165
9.1 Overview.......................................................................................... 165
9.2 Cabinet Description........................................................................... 169
9. 3 Card File and Power System Configurations........................................ 173
9. 4 Card File and Power System Description............................................. 175
9.5 FTA Mounting Channel Descriptions.................................................. 179
9.5.1 Vertical FTA Mounting Channels........................................................ 180
9.5.2 Horizontal FTA Mounting Channel...................................................... 184
9.6 Cabinet Floor Planning...................................................................... 188
SECTION 10 – REDUNDANCY PLANNING.............................................................. 189
10.1 Overview.......................................................................................... 189
10.2 Redundant HPMM Configurations...................................................... 189
10.3 Redundant IOP Placement ................................................................ 194
10.4 Redundancy Support........................................................................ 195
10.4.1 Power System.................................................................................. 195
10.4.2 HPMM to I/O ..................................................................................... 195
vi HPM Planning 3/98
Table of Contents
SECTION 11 – I/O LINK EXTENDER PLANNING...................................................... 197
11.1 Overview.......................................................................................... 197
11.2 Description....................................................................................... 198
11.3 Fiber Optic Cable Routing.................................................................. 204
11.3.1 Direct Burial...................................................................................... 204
11.3.2 Aerial Lashing................................................................................... 204
11.3.3 Vertical Installations........................................................................... 205
11.3.4 Indoor Requirements........................................................................ 205
11.3.5 Loose Buffered Cable ....................................................................... 205
11.3.6 Number of Fibers.............................................................................. 206
11.3.7 Cable Installation............................................................................... 206
11.4 Indoor Cable Bend Radius................................................................. 207
11.5 Cable Construction........................................................................... 207
11.6 Cable Splices and Connections......................................................... 208
11.7 Signal Loss Budget........................................................................... 210
11.7.1 Standard I/O Link Extender................................................................ 210
11.7.2 Long Distance I/O Link Extender........................................................ 212
11.8 Power Level Measurement ................................................................ 213
SECTION 12 – LOW LEVEL MULTIPLEXER PLANNING.......................................... 215
12.1 Overview.......................................................................................... 215
12.2 LLMux Version................................................................................. 216
12.2.1 LLMux Configurations ....................................................................... 216
12.2.2 LLMux IOP Placement....................................................................... 219
12.2.3 LLMux Power Adapter Placement...................................................... 219
12.2.4 LLMux FTA Placement...................................................................... 219
12.2.5 Remote CJR Installation..................................................................... 222
12.3 RHMUX Version................................................................................ 223
12.3.1 RHMUX Configurations...................................................................... 223
12.3.2 RHMUX IOP Placement ..................................................................... 228
12.3.3 RHMUX Power Adapter Placement..................................................... 228
12.3.4 RHMUX FTA Placement..................................................................... 228
SECTION 13 – SERIAL DEVICE INTERFACE PLANNING......................................... 233
13.1 Overview.......................................................................................... 233
13.2 Serial Device Interface Configurations................................................ 233
13.3 Serial Device Interface IOP Placement................................................ 235
13.4 Power Adapter Placement................................................................. 235
13.5 IOP to Power Adapter Cabling............................................................ 235
13.6 Serial Device Interface FTA Placement............................................... 236
13.7 FTA to Power Adapter Cabling........................................................... 236
13.8 FTA Field Cabling.............................................................................. 238
13.9 Serial Device Interface FTA Models.................................................... 239
SECTION 14 – SERIAL INTERFACE PLANNING...................................................... 241
14.1 Overview.......................................................................................... 241
14.2 Serial Interface Configurations ........................................................... 241
14.3 Serial Interface IOP Placement........................................................... 247
14.4 Power Adapter Placement................................................................. 247
14.5 IOP to Power Adapter Cabling............................................................ 247
14.6 Serial Interface FTA Placement .......................................................... 248
14.7 FTA to Power Adapter Cabling........................................................... 248
14.8 FTA Field Cabling.............................................................................. 250
14.9 Serial Interface FTA Models............................................................... 251
14.10 Communications Interface Specifications............................................ 252
3/98 HPM Planning vii
Table of Contents
SECTION 15 – GALVANICALLY ISOLATED FTA PLANNING.................................... 253
15.1 Overview.......................................................................................... 253
15.2 Description....................................................................................... 255
15.3 Features........................................................................................... 264
15.3.1 IOP Redundancy.............................................................................. 264
15.3.2 Analog and Digital Output Standby Manual Devices............................. 264
15.3.3 Auxiliary Inputs/Outputs.................................................................... 265
15.3.4 Power Requirements........................................................................ 267
15.3.5 Field Wiring Connections................................................................... 268
15.3.6 Ambient Temperature Limits.............................................................. 268
15.3.7 FTA Mounting Channels.................................................................... 269
15.4 Power Distribution............................................................................. 273
15.4.1 Power Distribution Assembly............................................................. 274
15.4.2 Cabling to Power Distribution Assemblies........................................... 275
15.4.3 Cabling to FTAs................................................................................ 275
15.4.4 Power Considerations ....................................................................... 276
15.5 High Level Analog Input (HLAI) FTAs.................................................. 277
15.5.1 Model MU-GAIH12/MU-GAIH82 FTA................................................... 277
15.5.1.1 Description....................................................................................... 277
15.5.1.2 Connectors...................................................................................... 277
15.5.1.3 Field Wiring Input Signals................................................................... 277
15.5.1.4 Auxiliary Connector Output................................................................ 278
15.5.1.5 Indicators.......................................................................................... 278
15.5.1.6 Current Consumption........................................................................ 278
15.5.1.7 Isolation and Safety........................................................................... 278
15.5.2 Model MU-GAIH13/MU-GAIH83 FTA................................................... 279
15.5.2.1 Description....................................................................................... 279
15.5.2.2 Connectors...................................................................................... 279
15.5.2.3 Field Wiring Input Signals................................................................... 280
15.5.2.4 Auxiliary Connector Output................................................................ 280
15.5.2.5 Indicators.......................................................................................... 280
15.5.2.6 Hand-Held Communicator.................................................................. 281
15.5.2.7 Current Consumption........................................................................ 281
15.5.2.8 Isolation and Safety........................................................................... 281
15.5.3 Model MU-GAIH14/MU-GAIH84 FTA................................................... 282
15.5.3.1 Description....................................................................................... 282
15.5.3.2 Connectors...................................................................................... 282
15.5.3.3 Field Wiring Input Signals................................................................... 283
15.5.3.4 Auxiliary Connector Output................................................................ 283
15.5.3.5 Indicators.......................................................................................... 283
15.5.3.6 Hand-Held Communicator.................................................................. 284
15.5.3.7 Current Consumption........................................................................ 284
15.5.3.8 Isolation and Safety........................................................................... 284
15.5.4 Model MU-GAIH22/MU-GAIH92 FTA................................................... 285
15.5.4.1 Description....................................................................................... 285
15.5.4.2 Connectors...................................................................................... 285
15.5.4.3 Field Wiring Input Signals................................................................... 286
15.5.4.4 Auxiliary Connector Output................................................................ 286
15.5.4.5 Indicators.......................................................................................... 286
15.5.4.6 Current Consumption........................................................................ 287
15.5.4.7 Isolation and Safety........................................................................... 287
viii HPM Planning 3/98
Table of Contents
15.6 24 Vdc Digital Input FTAs................................................................... 288
15.6.1 Model MU-GDID12/MU-GDID82 FTA................................................... 288
15.6.1.1 Description....................................................................................... 288
15.6.1.2 Connectors...................................................................................... 288
15.6.1.3 Field Wiring Input Signals................................................................... 289
15.6.1.4 Line-Fault Detection.......................................................................... 289
15.6.1.5 Auxiliary Connector Output................................................................ 289
15.6.1.6 Indicators.......................................................................................... 290
15.6.1.7 Current Consumption........................................................................ 290
15.6.1.8 Isolation and Safety........................................................................... 290
15.6.2 Model MU-GDID13/MU-GDID83 FTA................................................... 291
15.6.2.1 Description....................................................................................... 291
15.6.2.2 Connectors...................................................................................... 291
15.6.2.3 Field Wiring Input Signals................................................................... 291
15.6.2.4 Indicators.......................................................................................... 292
15.6.2.5 Current Consumption........................................................................ 292
15.6.2.6 Isolation and Safety........................................................................... 292
15.7 Analog Output FTAs......................................................................... 293
15.7.1 Model MU-GAOX02/72 and MU-GAOX12/82 FTAs.............................. 293
15.7.1.1 Description....................................................................................... 293
15.7.1.2 Connectors...................................................................................... 293
15.7.1.3 Field Wiring Output Signals................................................................ 293
15.7.1.4 Line-Fault Detection.......................................................................... 294
15.7.1.5 Calibration........................................................................................ 294
15.7.1.6 Indicators.......................................................................................... 294
15.7.1.7 Current Consumption........................................................................ 294
15.7.1.8 Isolation and Safety........................................................................... 295
15.8 24 Vdc Digital Output FTAs................................................................ 296
15.8.1 Model MU-GDOD12/MU-GDOD82 FTA............................................... 296
15.8.1.1 Description....................................................................................... 296
15.8.1.2 Signal Connectors............................................................................ 296
15.8.1.3 Field Wiring Output Signals................................................................ 296
15.8.1.4 Auxiliary Connector........................................................................... 297
15.8.1.5 Indicators.......................................................................................... 297
15.8.1.6 Standby Manual Device Connector.................................................... 297
15.8.1.7 Current Consumption........................................................................ 298
15.8.1.8 Isolation and Safety........................................................................... 298
15.8.2 Model MU-GDOL12/MU-GDOL82 FTA............................................... 299
15.8.2.1 Description....................................................................................... 299
15.8.2.2 Signal Connectors............................................................................ 299
15.8.2.3 Field Wiring Output Signals................................................................ 299
15.8.2.4 Auxiliary Connector........................................................................... 300
15.8.2.5 Indicators.......................................................................................... 300
15.8.2.6 Standby Manual Device Connector.................................................... 301
15.8.2.7 Current Consumption........................................................................ 301
15.8.2.8 Isolation and Safety........................................................................... 301
15.9 Combiner Panel................................................................................ 302
15.10 Marshalling Panel.............................................................................. 303
15.10.1 Description....................................................................................... 303
15.10.2 Configurations.................................................................................. 304
15.10.2.1 High Level Analog Input FTAs............................................................ 304
15.10.2.2 Digital Input FTAs.............................................................................. 305
15.10.2.3 Digital Output FTAs........................................................................... 306
3/98 HPM Planning ix
Figures
Figure 2-1 Nonredundant HPMM Cabinet Layout................................................. 4
Figure 2-2 Left 7-Slot HPMM Card File................................................................. 7
Figure 2-3 Right 7-Slot HPMM Card File............................................................... 9
Figure 2-4 15-Slot HPMM Card File.................................................................... 11
Figure 2-5 Left 7-Slot IOP Card File................................................................... 13
Figure 2-6 Right 7-Slot IOP Card File................................................................. 14
Figure 2-7 15-Slot IOP Card File........................................................................ 15
Figure 2-8 HLAI FTA with Redundant HLAI IOPs................................................ 17
Figure 2-9 Analog Output FTA with Redundant Analog Output IOPs................... 18
Figure 2-10 Standard I/O Link Extender Interconnections
with Nonredundant HPMM................................................................ 20
Figure 2-11 Standard I/O Link Extender Interconnections
with Redundant HPMMs................................................................... 21
Figure 2-12 Long Distance I/O Link Extender Interconnections
with Nonredundant HPMM................................................................ 22
Figure 2-13 Long Distance I/O Link Extender Interconnections
with Redundant HPMMs................................................................... 23
Figure 2-14 Field Termination Assembly (FTA) Sizes............................................ 28
Figure 2-15 Typical Vertical FTA Mounting Channel Layout................................... 30
Figure 2-16 Typical FTA Compression Terminal Connector................................... 31
Figure 2-17 Typical FTA Fixed-Screw Terminal Connector .................................... 32
Figure 2-18 Typical FTA Removable-Screw Terminal Connector............................ 32
Figure 2-19 Crimp-Pin Galvanic Isolation Module Terminal Connector.................... 33
Figure 2-20 Compression-Type Galvanic Isolation Module .................................... 34
Figure 2-21 FTA Marshalling Panel Assembly Layout............................................ 35
Figure 2-22 Standard Power System—Model MU-PSRX03................................... 37
Figure 2-23 Standard Power System—Model MU-PSRX04................................... 38
Figure 2-24 AC Only Power System—Not for CE Compliant Applications............... 40
Figure 2-25 Single Cabinet with Redundant HPMMs............................................ 42
Figure 2-26 Complexed Cabinets with Redundant HPMMs................................... 43
Figure 2-27 Local Complexed Cabinets with Redundant HPMMs .......................... 44
Figure 3-1 Subsystem AC Power and Ground Connections—
Multi-Ground System........................................................................ 49
Figure 3-2 Subsystem AC Power and Ground Connections—
Single-Ground System ..................................................................... 50
Figure 4-1 Field Termination Assembly (FTA) Sizes............................................ 73
Figure 4-2 Field Termination Assembly (FTA) Mounting Dimensions.................... 74
Figure 6-1 Conformal Coating Symbol............................................................. 105
Figure 7-1 I/O Link Extender Adapter Kit.......................................................... 129
Figure 7-2 Two-Port UCN Cable Tap................................................................ 137
Figure 7-3 Four-Port UCN Cable Tap............................................................... 138
Figure 7-4 Eight-Port UCN Cable Tap.............................................................. 138
Figure 8-1 Single-Access Cabinet ................................................................... 142
Figure 8-2 Dual-Access Cabinet...................................................................... 143
Figure 8-3 Single-Access Cabinet Bottom Cable Entry Slots ............................. 144
Figure 8-4 Dual-Access Cabinet Bottom Cable Entry Slots................................ 145
Figure 8-5 Cabinet Interior Dimensions............................................................ 147
Figure 8-6 Typical Single-Access Cabinet Assembly Layout.............................. 148
Figure 8-7 Typical Dual-Access Cabinet Assembly Layout................................. 149
Figure 8-8 7-Slot Card File Installation Dimensions............................................ 150
Figure 8-9 15-Slot Card File Installation Dimensions.......................................... 151
Figure 8-10 Installation of 7-Slot and 15-Slot Card Files....................................... 152
Figure 8-11 Power System Installation Dimensions............................................. 153
Figure 8-12 Typical Vertical FTA Mounting Channel Configurations..................... 156
Figure 8-13 Vertical FTA Mounting Channel Dimensions .................................... 157
Figure 8-14 Vertical FTA Mounting Channel Installation Holes............................. 158
Figure 8-15 Horizontal FTA Mounting Channel Cabinet Layout ........................... 160
Figure 8-16 Horizontal FTA Mounting Channel Dimensions ................................ 161
x HPM Planning 3/98
Figures
Figure 8-17 Horizontal FTA Mounting Channel Installation Holes......................... 162
Figure 8-18 Cabinet Floor Planning Template .................................................... 163
Figure 9-1 Single-Access Cabinet................................................................... 166
Figure 9-2 Dual-Access Cabinet...................................................................... 167
Figure 9-3 Cabinet Base Panel Grounding Procedure ...................................... 168
Figure 9-4 Cabinet Panel and Door Grounding Procedure ................................ 168
Figure 9-5 Single-Access Cabinet Bottom Cable Entry ..................................... 169
Figure 9-6 Dual-Access Cabinet Bottom Cable Entry........................................ 170
Figure 9-7 Cabinet Interior Dimensions............................................................ 172
Figure 9-8 Typical Single-Access Cabinet Assembly Layout.............................. 173
Figure 9-9 Typical Dual-Access Cabinet Assembly Layout................................. 174
Figure 9-10 7-Slot Card File Installation Dimensions............................................ 175
Figure 9-11 15-Slot Card File Installation Dimensions.......................................... 176
Figure 9-12 Installation of 7-Slot and 15-Slot Card Files....................................... 177
Figure 9-13 Power System Installation Dimensions............................................. 178
Figure 9-14 FTA Mounting Channel Configurations............................................ 181
Figure 9-15 FTA Mounting Channel Dimensions ................................................ 182
Figure 9-16 FTA Mounting Channel Mounting FTA Installation Holes................... 183
Figure 9-17 Horizontal FTA Mounting Channel Cabinet Layout ........................... 185
Figure 9-18 Horizontal FTA Mounting Channel Dimensions ................................ 186
Figure 9-19 Horizontal FTA Mounting Channel Installation Holes......................... 187
Figure 9-20 Cabinet Floor Planning Template .................................................... 188
Figure 10-1 Single Cabinet with Redundant HPMMs.......................................... 191
Figure 10-2 Dual Cabinets with Redundant HPMMs............................................ 192
Figure 10-3 Redundant HPMM Configuration Cabling ........................................ 193
Figure 10-4 Local/Remote Cabinet Configuration............................................... 196
Figure 11-1 Standard I/O Link Extender Interconnections
with Single HPMM.......................................................................... 199
Figure 11-2 Standard I/O Link Extender Interconnections
with Redundant HPMMs................................................................. 200
Figure 11-3 Long Distance I/O Link Extender Interconnections
with Single HPMM.......................................................................... 201
Figure 11-4 Long Distance I/O Link Extender Interconnections
with Redundant HPMMs................................................................. 202
Figure 11-5 Remote Site Multi-IOP Card File I/O Link Interface Cabling................. 203
Figure 11-6 ST-Type Connector....................................................................... 209
Figure 12-1 LLMux Configuration Interconnections – CE Compliant.................... 218
Figure 12-2 Remote CJR Installation.................................................................. 222
Figure 12-3 Nonincendive RHMUX Configuration Interconnections..................... 226
Figure 12-4 Intrinsically Safe RHMUX Configuration Interconnections.................. 227
Figure 13-1 Serial Device Interface Interconnections.......................................... 234
Figure 14-1 Serial Interface FTA to Modbus Device EIA-232 and EIA-422/485
Interconnections............................................................................ 243
Figure 14-2 Serial Interface FTA to Modbus Device EIA-422/485
Interconnections............................................................................ 244
Figure 14-3 Serial Interface FTA to Peripheral Device EIA-422/485
Interconnections............................................................................ 245
Figure 14-4 Serial Interface FTA to Allen-Bradley Device EIA-232
Interconnections............................................................................ 246
Figure 15-1 Typical Galvanically Isolated FTA...................................................... 259
Figure 15-2 Galvanic Isolation Module................................................................ 260
Figure 15-3 Crimp-Type Galvanic Isolation Module Terminal Connector................ 261
Figure 15-4 Compression-Type Galvanic Isolation Module Terminal Connector .... 262
Figure 15-5 Galvanically Isolated FTA with Auxiliary Connector............................ 266
Figure 15-6 Cabinet with Horizontally Installed FTA Mounting Channels............... 270
3/98 HPM Planning xi
Tables
Table 2-1 Card File Models ................................................................................ 5
Table 2-2 Standard Field Termination Assembly Types...................................... 25
Table 2-3 Galvanically Isolated Field Termination Assembly Types...................... 27
Table 3-1 HPM Assembly 24 Vdc Power Usage ................................................ 54
Table 3-2 Single Power System Calculation Example ........................................ 58
Table 3-3 Dual Power System Calculation Example (Power System 1)................ 59
Table 3-4 Dual Power System Calculation Example (Power System 2)................ 60
Table 4-1 Standard FTAs and Associated Assemblies....................................... 75
Table 4-2 Galvanically Isolated FTAs and Associated Assemblies ....................... 78
Table 5-1 Hazardous Area Classifications.......................................................... 84
Table 5-2 HPM Equipment Approved for Use in a Division 2 Area....................... 87
Table 5-3 Nonincendive FTA Types ............................................................... 101
Table 5-4 FTA Cable and Load Parameters..................................................... 102
Table 6-1 Environment Minimum Equipment Requirement .............................. 103
Table 6-2 Harsh Environment Definitions from ANSI/ISA-S71.04-1985............ 104
Table 6-3 Conformally Coated Assembly Model Numbers................................ 107
Table 7-1 Card Files ...................................................................................... 116
Table 7-2 IOPs—Nonconformally Coated ....................................................... 118
Table 7-3 IOPs—Conformally Coated............................................................. 119
Table 7-4 Field Termination Assemblies—Nonconformally Coated................... 120
Table 7-5 Field Termination Assemblies—Conformally Coated......................... 125
Table 7-6 IOP to FTA Cables.......................................................................... 130
Table 7-7 Non-CE Compliant Subsystem Power Cables .................................. 133
Table 7-8 CE Compliant Subsystem Power Cables.......................................... 134
Table 7-9 Power Cables without I/O Link Protector Module.............................. 135
Table 7-10 I/O Link Interface Cable Sets........................................................... 136
Table 11-1 Minimum Bend Radius for Indoor Cable ........................................... 207
Table 11-2 Standard Optical Power Loss.......................................................... 211
Table 11-3 Standard Fiber Optic Cable Losses (@ 850 nm) ............................... 211
Table 11-4 Long Distance Optical Power Loss.................................................. 213
Table 11-5 Long distance Fiber Optic Cable Losses (@ 1300 nm)...................... 213
Table 12-1 LLMux Assembles......................................................................... 216
Table 12-2 RHMUX Assemblies ....................................................................... 223
Table 14-1 Serial Interface FTAs ...................................................................... 241
Table 14-2 Serial Interface EIA-232 Specifications ............................................ 252
Table 14-3 Serial Interface EIA-422/485 Specifications ..................................... 252
Table 15-1 CE Compliant Galvanically Isolated FTAs—Nonconformally Coated ... 256
Table 15-2 CE Compliant Galvanically Isolated FTAs—Conformally Coated ......... 257
Table 15-3 Galvanically Isolated FTA Power Requirements................................ 267
xii HPM Planning 3/98
Acronyms
AC.................................................................................................. Alternating Current
ANSI.................................................................... American National Standards Institute
AO........................................................................................................ Analog Output
AWG........................................................................................... American Wire Gauge
CJR........................................................................................ Cold Junction Reference
CMOS ........................................................ Complementary Metal Oxide Semiconductor
DC.......................................................................................................... Direct Current
DISOE........................................................................ Digital Input Sequence of Events
DI............................................................................................................... Digital Input
DO.......................................................................................................... Digital Output
EIA.............................................................................. Electronic Industries Association
EMI.................................................................................. Electromagnetic Interference
FM................................................................................... Factory Mutual Research, Inc.
FTA.................................................................................... Field Termination Assembly
GI ....................................................................................................... Galvanic Isolation
HLAI......................................................................................... High Level Analog Input
HPM...................................................................... High-Performance Process Manager
HPMM....................................................... High-Performance Process Manager Module
IS........................................................................................................... Intrinsic Safety
I/O............................................................................................................ Input/Output
IEC................................................................ International Electrotechnical Commission
IEEE.................................................... Institute of Electrical and Electronic Engineering
ISA.................................................................................. Instrument Society of America
ISO....................................................................... International Standards Organization
LCN............................................................................................ Local Control Network
LFD............................................................................................... Line Fault Detection
LLAI ......................................................................................... Low Level Analog Input
LLMux..................................................................... Low Level Analog Input Multiplexer
MRG...................................................................................... Master Reference Ground
NE........................................................................................... National Electrical Code
NEMA....................................................... National Electrical Manufacturer’s Association
NFPA........................................................................... National Fire Protection Agency
NiCad................................................................................................... Nickel Cadmium
NIM....................................................................................... Network Interface Module
PI............................................................................................................... Pulse Input
PSM........................................................................................... Power Supply Module
PS ......................................................................................................... Power System
PVC.................................................................................................. Polyvinyl Chlorine
PV ..................................................................................................... Process Variable
RHMUX ....................................... Remote Hardened Low Level Analog Input Multiplexer
RTD................................................................................ Resistive Temperature Device
RTU............................................................................................ Remote Terminal Unit
SDI............................................................................................. Serial Device Interface
SI.......................................................................................................... Serial Interface
STI....................................................................................... Smart Transmitter Interface
STIM ................................................................. Smart Transmitter Interface Multivariable
TC......................................................................................................... Thermocouple
UCN...................................................................................... Universal Control Network
UV.............................................................................................................. Ultra Violet
3/98 HPM Planning xiii
References
Publication
Title
High-Performance Process Manager
Specification and Technical Data
High-Performance Process Manager
Installation
High-Performance Process Manager
Checkout
High-Performance Process Manager
Service
Process Manager I/O Specification and
Technical Data
Process Manager I/O Installation
TPS System Site Planning
Publication
Number
HP03-500 System Summary - 2 TPS 3010-2
HP20-500 Implementation/
High-Performance Process
Manager - 3
HP20-510 Implementation/
High-Performance Process
Manager - 3
HP13-500 PM/APM/HPM Service - 1 TPS 3061-1
IO03-500 System Summary - 2 TPS 3010-2
PM20-520 Implementation/
High-Performance Process
Manager - 3
SW02-550 System Site Planning - 1 TPS 3020-1
Binder
Title
Binder
Number
TPS 3066-3
TPS 3066-3
TPS 3066-3
Universal Control Network Specification
and Technical Data
Universal Control Network Planning
Universal Control Network Installation
Universal Control Network Guidelines
Local Control Network Planning
LCN System Installation
LCN System Checkout
LCN Guidelines - Implementation,
Troubleshooting, and Service
UN03-500 System Summary - 2 TPS 3010-2
UN02-501 System Site Planning - 1 TPS 3020-1
UN20-500 Installation/Universal Control
Network
UN12-510 Installation/Universal Control
Network
SW02-501 System Site Planning - 1 TPS 3020-1
SW20-500 LCN Installation TPS 3025
SW20-510 LCN Installation TPS 3025
LC09-510 LCN Installation TPS 3025
TPS 3041
TPS 3041
xiv HPM Planning 3/98
1.1 Overview
Section 1 – Introduction
Section contents
1. 1 Overview............................................................................................... 1
The manual’s purpose
The manual’s contents
The topics covered in this section are:
Topic See Page
This manual is intended for planning the installation of a High-Performance
Process Manager (HPM) subsystem at a TPS
system site. The
High-Performance Process Manager subsystem is a device on the Universal
Control Network (UCN) that includes the Network Interface Module
(NIM). Process Managers (PMs), Advanced Process Managers (APMs),
and Logic Managers (LMs) may also be resident on the network.
Planning includes the consideration of the High-Performance Process
Manager cabinet layout, process wiring techniques, Division 2 environment
equipment approval, conformal coating of the assemblies to protect against
a corrosive environment, HPMM and IOP redundancy, and unique
hardware features, such as fiber optic I/O Link Extenders, Low Level
Analog Input Multiplexer FTAs, Serial Device Interface FTAs, Serial
Interface FTAs, and Galvanically Isolated FTAs.
Information not covered
Neither installation, power on checkout, or service of the
High-Performance Process Manager, nor planning for the Local Control
Network (LCN) is addressed in this manual. See the related reference
documentation for information about these topics.
3/98 HPM Planning 1
2 HPM Planning 3/98
2.1 Overview
Section 2 – HPM Description
Section contents
2. 1 Overview............................................................................................... 3
2.2 Card Files.............................................................................................. 5
2.2.1 HPMM Card Files ................................................................................... 6
2.2.2 Input/Output Processor (IOP) Card Files................................................ 13
2. 3 Input/Output Processor (IOP) Cards...................................................... 17
2.3.1 IOP Redundancy ................................................................................. 18
2. 4 I/O Link Extender (Fiber Optic Link)....................................................... 20
2.5 Field Termination Assemblies (FTAs) .................................................... 25
2.6 Power Systems................................................................................... 36
2. 7 Cabinet Configurations ........................................................................ 41
HPM major assemblies
The topics covered in this section are:
Topic See Page
The High-Performance Process Manager subsystem (HPM) consists of
major assemblies described in the following subsections. The major
High-Performance Process Manager assemblies are
• High-Performance Process Manager Module (HPMM) card file
• Input/Output Processor (IOP) card file
• Input/Output Processor (IOP) card
• I/O Link Extender
• Field Termination Assembly (FTA)
• Power System
Continued on next page
3/98 HPM Planning 3
2.1 Overview, Continued
P
P
P
Digital
P
P
P
High L
l
Anal
L
l
Digital
P
Digital
P
P
P
P
High L
l
Anal
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l
Digital
P
Digital
P
P
P
P
High L
l
Anal
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l
Digital
P
P
Digital
P
P
P
High L
l
Anal
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P
Digital
P
P
P
P
High L
l
Anal
L
l
Digital
P
Digital
P
P
P
P
High
High
L
l
Digital
P
P
Nonredundant HPM
cabinet layout
Figure 2-1 is an illustration of a single High-Performance Process Manager
cabinet containing a nonredundant High-Performance Process Manager
Module (HPMM) with supporting assemblies. The HPMM cards (2) and
the IOPs cards are installed in 15-Slot HPMM card files. IOP cards occupy
the IOP card files.
Figure 2-1 Nonredundant HPMM Cabinet Layout
FTAs are installed in the
rear on an FTA Mounting
Channel.
ower
Power
Power
Power
Status
Status
Status
Status
Analog
Low Level
Digital
Digital
Output
Analog
Input
Output
Input
ower
ower
ower
ower
Status
Status
Status
Status
og
ow Leve
Output
Input
Analog
Output
Input
IOP Card File #2
IOP Card File #1
ower
ower
Power
Power
Status
Status
High Level
Analog
Analog
Input
Output
ower
ower
Status
Status
eve
og
Output
Analog
Input
Power
Power
Power
Status
Status
Status
Status
Status
Low Level
Analog
Input
ower
Status
ow Leve
Analog
Input
Analog
High Level
Digital
Digital
Output
Analog
Input
Output
Input
ower
ower
ower
ower
Status
Status
Status
Status
eve
og
Output
Analog
Input
Output
Input
Power
Power
Power
Power
Status
Status
Status
Status
Low Level
High Level
Digital
Digital
Analog
Analog
Input
Output
Input
Input
ower
ower
ower
ower
Status
Status
Status
Status
eve
ow Leve
Analog
Input
Analog
Output
Input
Input
HPMM Card File
Power System
Performan
Comm/Cntl
ower
ower
ower
ower
ower
ower
ower
ower
ower
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ower
ower
Status
Status
Status
Status
Status
ow Leve
Analog
Input
Performan
Analog
Output
I/O Link
Input
Input
ower
Status
Status
Status
Status
Status
eve
og
ow Leve
Output
Analog
Input
Analog
Output
Input
Input
ower
Status
eve
ower
Status
Status
Status
Status
og
ow Leve
Output
Input
Analog
Output
Input
32747
4 HPM Planning 3/98
2.2 Card Files
Introduction
There are nine card file models. Three models are not CE Compliant and
six models are CE Compliant. Table 2-1 lists the nine card file models. All
models are also available with conformal coating (a model number with a
prefix of MC, rather than MU).
Table 2-1 Card File Models
Card File Description CE Compliant Non-CE Compliant
Left 7-Slot HPMM or IOP N/A MU-HPFH01
Right 7-Slot HPMM or IOP N/A MU-HPFH11
15-Slot HPMM or IOP N/A MU-HPFX02
Left 7-Slot HPMM MU-HPFH03 N/A
Right 7-Slot HPMM MU-HPFH13 N/A
15-Slot HPMM MU-HPFX03 N/A
Left 7-Slot IOP MU-HPFI03 N/A
Right 7-Slot IOP MU-HPFI13 N/A
15-Slot IOP MU-HPFI23 N/A
Non-CE Compliant card
file models
CE Compliant card file
models
Conversion kit
The non-CE Compliant card file models can be designated as an HPMM
card file or an IOP card file by either installing an HPMM card set in the
two left-most card slots or installing IOP cards.
Unlike the non-CE Compliant card file models, the CE Compliant card file
models are designated either an HPMM card file or an IOP card file because
even though their is no electrical difference in the backpanel, they differ
mechanically. The addition of a ground plate and filtered IOP connectors in
the two left-most slots prohibits the installation of an HPMM card set.
The card file is designated an IOP card file when the ground plate and
filtered connectors are present.
The card file is designated an HPMM card file when the ground plate and
filtered connectors are absent.
A CE Compliant HPMM card file can be converted to an IOP card file with
a model MU-ZPFI03 upgrade kit. The kit adds 2 filtered IOP adapter
connectors to the two left-most card slots and a ground plate extension.
3/98 HPM Planning 5
2.2.1 HPMM Card Files
Three types of HPM
card files
HPMM description
There are three types of HPMM card files. The two left-most slots of each
type are populated by the three assemblies that comprise the HPMM. The
remaining slots accommodate IOPs.
If the card file is a non-CE Compliant card file, the two left-most slots of
each type can also accommodate IOPs with no alterations. The card file is
then designated an IOP card file.
The High-Performance Process Manager Module (HPMM) is composed of
two card assemblies that install in the two left-most slots in a 7-Slot or
15-Slot card file, and a UCN interface module that mounts and connects to
the 50-pin connector that is directly below the left-most card.
The three HPMM assemblies are identified as follows:
• High-Performance Communications/Control (High-Performance
Comm/Control) card
• High-Performance I/O Link Interface (High-Performance I/O Link) card
• High-Performance UCN Interface (HPM UCN Interface) module
The HPM UCN Interface module connects to the 50-pin connector below
the High-Performance Comm/Control card.
Left 7-Slot HPMM card
file description
The Left 7-Slot card file accepts the two HPMM cards and the HPM UCN
Interface module that comprise the HPMM, and accommodates up to five
IOP cards. The card slots are numbered 1 through 7, starting at the
left-most position.
The High-Performance Comm/Control and High-Performance I/O Link
cards occupy slots 1 and 2, while the HPM UCN Interface module mounts
below slot 1 and connects to its 50-pin connector.
Slots 3 through 7 can accommodate IOP cards. The IOP card slots assume
numerical I/O Link Interface addresses of 3 through 7 and binary I/O Link
Interface addresses of 2 through 6.
Continued on next page
6 HPM Planning 3/98
2.2.1 HPMM Card Files, Continued
Left 7-Slot HPMM
card file illustration
Figure 2-2 is an illustration of a Left 7-Slot HPMM card file and the two
HPMM cards that occupy slots 1 and 2.
Figure 2-2 Left 7-Slot HPMM Card File
1A15
Power
Status
High
Performance
Comm/Cntrl
Power
Status
High
Performance
I/O Link
HPMM
1 2 3 4 5 6 7
IOPs
16000
Continued on next page
3/98 HPM Planning 7
2.2.1 HPMM Card Files, Continued
Right 7-Slot HPMM card
file description
The description of the Right 7-Slot HPMM card file is identical to the Left
7-Slot HPMM card file, except the two HPMM cards and the UCN
interface module occupy slots 9 and 10. The card slots are numbered
9 through 15.
Slots 11 through 15 accommodate IOP cards. The IOP card slots assume
numerical I/O Link Interface addresses of 11 through 15 and binary
I/O Link Interface addresses of 10 through 14.
Continued on next page
8 HPM Planning 3/98
2.2.1 HPMM Card Files, Continued
Right 7-Slot HPMM
card file illustration
Figure 2-3 is an illustration of a Right 7-Slot HPMM card file and the two
HPMM cards that occupy slots 9 and 10.
Figure 2-3 Right 7-Slot HPMM Card File
1A15
Power
Status
High
Performance
Comm/Cntrl
Power
Status
High
Performance
I/O Link
HPMM
9 10 11 12 13 14 15
IOPs
16001
Continued on next page
3/98 HPM Planning 9
2.2.1 HPMM Card Files, Continued
15-Slot HPMM card file
description
The 15-Slot card file accepts the two HPMM cards and the UCN interface
module that comprise the HPMM, and accommodates up to thirteen IOP
cards. The card slots are numbered 1 through 15, starting at the left-most
position.
The High-Performance Comm/Control and High-Performance I/O Link
cards occupy slots 1 and 2, while the HPM UCN Interface module mounts
below slot 1 in its 50-pin connector.
Slots 3 through 15 can accommodate IOP cards. The IOP card slots
assume numerical I/O Link Interface addresses of 3 through 15 and binary
I/O Link Interface addresses of 2 through 14.
When populated with the HPMM cards, the card file is designated a 15-Slot
HPMM card file.
Continued on next page
10 HPM Planning 3/98
2.2.1 HPMM Card Files, Continued
r
s
r
s
15-Slot HPMM
card file illustration
Figure 2-4 is an illustration of a 15-Slot HPMM card file and the two
HPMM cards that occupy slots 1 and 2.
Figure 2-4 15-Slot HPMM Card File
Powe
Statu
High
Performance
Comm/Cntrl
Powe
Statu
High
Performance
I/O Link
HPMM
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
IOPs
32745
Continued on next page
3/98 HPM Planning 11
2.2.1 HPMM Card Files, Continued
7-Slot HPMM card file
usage
15-Slot HPMM card file
usage
HPMM functionality
The two types of 7-Slot HPMM card files are intended to be used in a small
HPM subsystem.
When the subsystem consists of nonredundant HPMMs, a Left 7-Slot
HPMM card file must be installed. For a subsystem that requires redundant
HPMMs, Left and Right 7-Slot HPMM card files are installed. Both card
files are assigned the same the same I/O Link Interface address. There is no
slot 8 because the card file slots are numbered 1 through 7 and 9 through
15.
The 15-Slot HPMM card file is intended for use in a larger HPM
subsystem, either with nonredundant or redundant HPMMs. Unlike the
7-Slot HPMM card file, there is no “loss” of a card slot.
The HPMM provides the following functions:
• Communications with the Local Control Network (LCN) Network
Interface Module (NIM) through the Universal Control Network (UCN)
• A Communications processor ( Motorola 68LC040)
• Communications through the I/O Link Interface with Input/Output
Processors (IOPs) and I/O Link Extenders
• A Control processor (Motorola 68040)
• Separate and shared memory for the Communications and Control
processors
• An I/O Link processor (Intel 80C32) with SRAM
• HPMM redundancy control
2.2.2 Input/Output Processor (IOP) Card Files
IOP card file
descriptions
Non-CE Compliant card
files
CE Compliant card files
The 7-Slot and 15-Slot IOP card files are electrically identical to the HPMM
card files, except that an HPMM card set is not installed in the card file.
IOPs can be installed in the two left-most card slots.
Non-CE Compliant HPMM and IOP card files differ only in the application.
Electrically and mechanically, their backpanels are the same. The card file
model numbers are the same.
CE Compliant HPMM and IOP card files differ mechanically. IOP card
files have filtered IOP connectors and connector ground plates. Electrically,
their backpanels are the same. The card file model numbers are different.
Continued on next page
12 HPM Planning 3/98
2.2.2 Input/Output Processor (IOP) Card Files, Continued
Left 7-Slot IOP card file
Figure 2-5 illustrates a Left 7-Slot IOP card file.
Figure 2-5 Left 7-Slot IOP Card File
7 IOPs
1234567
Power
Status
Analog
Output
16004
Continued on next page
3/98 HPM Planning 13
2.2.2 Input/Output Processor (IOP) Card Files, Continued
5
Right 7-Slot IOP card
file
Figure 2-6 illustrates a Left 7-Slot IOP card file.
Figure 2-6 Right 7-Slot IOP Card File
7 IOPs
9 10111213141
Power
Status
Analog
Output
16005
Continued on next page
14 HPM Planning 3/98
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