Holtek Semiconductor Inc HT93LC56 Datasheet

2K 3-Wire CMOS Serial EEPR O M

Features

Operating voltage V
Write: 2.4V~5.5V
Low power consumption
Operating: 5mA max.
Standby: 10µA max.
User selectable internal organization
2K(HT93LC56): 256×8 or 128×16
3-wire Serial Interface
Write cycle time: 5ms max.

General Description

The HT93LC56 is a 2K-bit low voltage nonvola­tile, serial electrically erasable programmable read only memory device using the CMOS float­ing gate process. Its 2048 bits of memory are organized into 128 words of 16 bits each when the ORG pin is connected to VCC or organized into 256 words of 8 bits each when it is tied to VSS. The
CC
HT93LC56
Automatic erase-before-write operation
Word/chip erase and write operation
Write operation with built-in timer
Software controlled write protection
10-year data retention after 100K rewrite cycles
106 rewrite cycles per word
8-pin DIP/SOP package
Commercial temp erature range (0
°C to +70°C)
device is optimized for use in many industrial and commercial applications where low power and low voltage operation are essential. By popular microcontroller, the versatile serial in­terface including chip select (CS), serial clock (SK), data input (DI) and data output (DO) can be easily controlled.

Block Diagram

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Pin Assignment

Pin Description

Pin Name I/O Description
CS I Chip select input SK I Serial clock input DI I Serial data input DO O Serial data output VSS I Negative power supply ORG I Internal Organization NC No connection VCC I Positive power supply
HT93LC56
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HT93LC56

Absolute Maximum Ratings

Operation Temperature (Commercial)..................................................................................0°C to 70°C
Applied V Applied Voltage on any Pin with Respect to VSS
Supply READ Voltage ...................................... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... .... ....2V to 5.5V
Note: These are stress ratings only. Stresses exceeding the range speci fied under “Absolute Ma xi-

D.C. Characteristics

Voltage with Respect to VSS.......................... .. .... .. .. .... .. .. .... .. .. .... .. .. .... .. .. .... .–0.3V to 6.0V
CC
............................................................VSS
–0.3V to VCC+0.3V
mum Ratings” may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
Symbol Parameter
V
I
I
I I
I
V
V
V
V
C C
Operating Voltage
CC
Operating Current
CC1
(TTL) Operating Current
CC2
(CMOS) Standby Current
STB
(CMOS) Input Leakage Current 5V VIN=VSS~V
LI
Output Leakage
LO
Current
Input Low Voltage
IL
Input High Voltage
IH
Output Low Voltage
OL
Output High Voltage
OH
Input Capacitance VIN=0V, f=250kHz 5 pF
IN
Output Capacitance V
OUT
Test Conditions
V
CC
Conditions
Min. Typ. Max. Unit
Read 2.0 5.5 V
Write 2.4 5.5 V 5V DO unload, SK=1MHz 5 mA 5V DO unload, SK=1MHz 5 mA
2~5.5V DO unload, SK=250kHz 5 mA
5V CS=SK=DI=0V 10
0—1 0—1
5V
V
OUT=VSS~VCC
CS=0V
CC
µA
µA µA
5V 0 0.8 V
2~5.5V 0 — 0.1V
5V 2 V
2~5.5V 0.9V
5V I
2~5.5V
5V
2~5.5V
=2.1mA 0.4 V
OL
=10µA
I
OL
=–400µA
I
OH
=–10µA
I
OH
=0V, f=250kHz 5 pF
OUT
——0.2V
2.4 V
V
CC
—VCCV
CC
–0.2 — V
CC
CC
V V
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