Holtek Semiconductor Inc HT812L0 Datasheet
HT812L0
2.8 Second Enhanced Tone Voice
Pin Assignment
Features
•
Operating voltage: 2.4V~5.0V
•
Low standby current (1µA Typ.)
•
Voice/sound effect/simple melody output
•
2.8-second voice capacity
•
32 tone sections
•
16 words for each tone section
•
Current type D/A output
•
Mask option s
–
Pull-high resi stor: 20kΩ/50kΩ/100kΩ
–
KEY1: Direct or sequential/random key
–
Trigger mode: Retriggerable/Non-retriggerable
–
KEY1 play normal mode or twin mode
Normal mode: one group for KEY1
Twin mode: Two groups for KEY1
–
8 direct key or 4×4 MATRIX keys
–
Two-page trigger
–
Key debounce time: 22ms/45ms
–
Trigger function:
Level hold/one shot/level trigger
–
FLAG1, FLAG2 outputs:
3Hz/sound level/busy/6Hz/endp
–
Melody/tone decay time:
2 sec/1 sec/0.5 sec/0.25 sec
–
Four kinds of envelope shapes for melody
•
Tone shape: tone+2kHz/noise/tone/silence
•
Tempo: 16ms/section~1 sec/section
•
Dice form or 16-pin DIP
Applications
•
Toys
•
Alarm clocks
•
Public address system
•
Alert & warning system
•
Sound effect generators
•
Voice interface products
General Description
The HT812L0 is a single chip PCM voice and
sound effect synthesizer . It provides 2.8 seconds
of voice capacity at a 6kHz sampling rate
(F
SR
=6kHz) and 32 sections of sound effects/simple melodies. A maximum of 8 keys or
4
×4 MATRIX are available. Of the 8 keys or 4×4
MATRIX, KEY1 can be optioned as a direct or
sequential/random key, so that it can play an
interlaced voice/sound effect/simple melody and
generate various speci al sound effects for toys
and sound effect generator applications.
1 5th May ’98
Block Diagram
Pad Coordinates
Unit: µm
Pad No. X Y
1 –822.65 828.40
2 –855.15 –900.10
3 26.65 –823.00
4 176.65 –828.00
5 516.25 –827.60
6 666.25 –827.60
7 830.65 –819.30
8 824.55 394.80
9 816.55 828.40
10 654.75 828.40
11 493.55 828.40
12 331.75 828.40
13 –338.55 828.40
14 –497.15 828.40
15 –664.15 828.40
Chip size: 1970
× 2120 (µm)
2
*The IC substrate should be connected to VSS in the PCB layout artwork.
HT812L0
2 5th May ’98
Pad Description
Pad No. Pad Name I/O
Internal
Connection
Description
2 VDD I — Positive power supply
3AUD O
PMOS
Open Drain
Voice/tone output driving an external transistor
4 OSC2 O — Oscillator output pin
5 OSC1 I — Oscillator input pin
6
FLAG1 O
NMOS
Open Drain
3Hz flash/busy output/6Hz (by code o ption), active
low
7 VSS I — Negative power supply (GND)
8 FLAG2 O
NMOS
Open Drain
3Hz flash/busy output/ENDP/sound level display
(by mask option), active low
9~15, 1 KEY1~KEY8 I Pull-High
Trigger key, active low. KEY1 can be optioned as a
direct or sequential/random key, the 7 keys as
direct keys only or by mask option as 4
×4 matrix
key
Absolu te Maxim um Ratings *
Supply Voltage.................................–0.3V to 6V Storage Temperature.................–50°C to 125°C
Input Voltage................. V
SS
–0.3V to VDD+0.3V Operating Temperature...............–20°C to 70°C
*Note: These are stress ra tings on ly. Stresses exceeding the range specifie d under “Ab solute Maxi -
mum Ratings” ma y cause substantial damage to the device. Functional operation of this
device at other conditions beyond those listed in the specification is not implied and prolonged
exposure to extreme conditions may affect device reliability.
Electrical Characteristics (Ta=25°C)
Symbol Parameter
Test Conditions
Min. Typ. Max. Unit
V
DD
Conditions
V
DD
Operating Voltage — — 2.4 — 5.0 V
I
OP
Operating Current 3V
No load,
f
OSC
=96kHz
—200400
µA
I
STB
Standby Current 3V — — 1 3 µA
I
O
Max. AUD Output Current 3V VOH=0.6V –1.5 –2 — mA
I
OL
FLAG Sink Current 3V VOL=0.3V 2 3 — mA
V
IH
“H” Input Voltage — — 0.8V
DD
—VDDV
V
IL
“L” Input Voltage — — 0 — 0.2V
DD
V
f
OSC
Oscillating Frequency 3V — — 96 — kHz
HT812L0
3 5th May ’98
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