Holtek Semiconductor Inc HT23C010 Datasheet

Features

Operating voltage: 2.7V ~5.5V
Low power consumption
Operation: 25mA Max. (VCC=5V) 10mA Max. (V
Standby: 30µA Max. (VCC=5V) 10
Access time:150ns Max. (VCC=5V)
µA Max. (V
250ns Max. (V
CC
CC
=3V)
CC
=3V)
=3V)

General Description

The HT23C010 is a read-only memory with high performance CMOS storage device whose 1024K of memory is arranged into 131072 words by 8 bits.
For applica tion flexibility, the chip enable and output enabl e control pins can be selected a s active high or active low. This flexibility not only allows easy interface with most microproc­essors, but also eliminates bus contention in
HT23C010
CMOS 128K×8-Bit Mask ROM
131072×8 bits of mask ROM
Mask options: chip enable CE/CE/OE1/ OE1B and output enable OE/
TTL compatible inputs and outputs
Tristate outputs
Fully static operation
Package type: 28-pin DIP/SOP 32-pin DIP/SOP/PLCC
multiple bus mi cropro cessor syste ms. An add i­tional feature of the HT23C010 is its ability to enter the standb y mode wh enever the chip en­able (CE/ consumption to below 30
CE) is inactive, thus reducing current
µA. The combination of
these functions makes the chip suitable for high density low power memory applications.
OE/NC

Block Diagram

1 24th Aug ’98

Pin Assignment

Pin Description

Pin Name I/O Description
HT23C010
A0~A16 I Address input s D0~D7 O Data outputs CE/
CE/OE1/OE1 I Chip enable output enable input VSS I Negative power supply VCC I Positive power supply OE/
OE/NC I Output enable input NC No connection

Operation Truth Table

Mode CE/CE OE/OE A0~A16 D0~D7
Read H/L H/L Valid Data Out Deselect H/L L/H X High Z Standby L/H X X High Z
Note: H=V
, L=VIL, X=VIH or V
IH
IL
2 24th Aug ’98
HT23C010

Absolu te Maxim um Ratings *

Supply Voltage.................................–0.3V to 6V Storage Temperature.................–50°C to 125°C
Input Voltage........................–0.3V to V
*Note: These are stress ra tings on ly. Stresses exceeding the range specified under “Abso lute Maxi -
mum Ratings” ma y cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme condition s may affect device reliability.

D.C. Characteristics

Supply voltage: 2.7V~3.6V Ta=–40°C to 85°C
+0.3V Operating Temperature...............–40°C to 85°C
CC
Symbol Pa ra meter
V
CC
I
CC
V
IL
V
IH
V
OL
V
OH
I
LI
I
LO
I
STB1
I
STB2
C
IN
C
OUT
Operating Voltage 2.7 3.6 V Operating Current 3V Input Low Voltage 3V V
Input High Voltage 3V 2.0 V Output Low Voltage 3V IOL=2.1mA 0.4 V Output High Voltage 3V IOH=–0.4mA 2.4 V Input Leakage Current 3V VIN=0 to V Output Leakage Current 3V V
Standby Current 3V
Standby Current 3V Input Capacitance (See note) f=1MHz 10 pF
Output Capacitance (See note) f=1MHz 10 pF
Test Conditions
V
CC
Conditions
O/P Unload, f=5MHz
=0 to V
OUT
CE=V CE=V
0.2V
CE CEVCC-0.2V
IL IH
CC
Min. Typ. Max. Unit
——10mA
0.4 V
SS
——10µA
CC
——10µA ——500µA
——10
CC
CC
V
V
µA
Note: These parameters are periodically sampled but not 100% tested.
Supply voltage: 4.5V~5.5V Ta=–40°C to 85°C
Symbol Pa ra meter
V
CC
I
CC
Operating Voltage 4.5 5.5 V Operating Current 5V
Test Conditions
V
CC
Conditions
O/P Unload, f=5MHz
3 24th Aug ’98
Min. Typ. Max. Unit
——25mA
Loading...
+ 5 hidden pages