Holtek Semiconductor Inc HT16220 Datasheet

RAM Mapping 32´8 LCD Controller for I/O mC

Features

Operating voltage: 2.7V~5.2V

·

External Crystal 32.768kHz oscillator

·

1/4 bias, 1/8 duty, frame frequency is 64Hz

·

Max. 32´8 patterns, 8 commons, 32 segments

·

Built-in internal resistor type bias generator

·

3-wire serial interface

·

8 kinds of time base/WDT selection

·

Time base or WDT overflow output

·

Built-in LCD display RAM

·

R/W address auto increment

·

General Description

HT16220 is a peripheral device specially de signed for I/O type mC used to expand the dis play capability. The max. display segment of the device are 256 patterns (32´8). It also sup ports serial interface, buzzer sound, watchdog timer or time base timer functions. The HT16220 is a memory mapping and multi-function LCD controller. The software

HT16220

Two selectable buzzer frequencies

·

(2kHz/4kHz) Power down command reduces power

·

consumption Software configuration feature

·

Data mode and Command mode instructions

·

Three data accessing modes

·

VLCD pin to adjust LCD operating voltage

·

Cascade application

·

configuration feature of the HT16220 make it

suitable for multiple LCD applications includ

ing LCD modules and display subsystems. Only three lines are required for the interface be

tween the host controller and the HT16220. The HT162X series have many kinds of prod ucts that match various applications.

-

Selection Table

HT162X HT1620 HT1621 HT1622 HT16220 HT1623 HT1625 HT1626 HT1627 HT16270

COM

SEG

Built-in Osc.

Crystal Osc.

448 8 8 8 16 16 16

32 32 32 32 48 64 48 64 64

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1 April 21, 2000

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Block Diagram

HT16220

OSCO

OSCI

CS

RD

WR

DATA

VDD

VSS

BZ

Tone Frequency

BZ

Pin Assignment

CS NC

RD

WR

DATA

VSS

VDD

VLC D

IR Q

BZ

NC

OSCO

OSCI

T1

T2

T3

NC

COM 0

C ontrol

and Tim ing Circuit

G enerator

SEG30

SEG31

63

64

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

202122

19

W atchdog Tim er

Tim e B ase G enerator

SEG24

SEG25

SEG26

SEG27

SEG28

SEG29

57

58

59

60

61

62

H T16220

64 Q FP

23

242526272829303132

D ispla y R A M

LCD Driver/ Bias Circuit

and

SEG23

SEG20

SEG21

SEG22

56

53

54

55

NC

52

COM 0

COM 7

SEG 0

SEG 31

VLCD

IR Q

NC

51 50

NC

49

SEG19

48

SEG18

47

SEG17

46

SEG16

45

SEG15

44

SEG14

43

SEG13

42

SEG12

41

SEG11

40

SEG10

39

SEG9

38

SEG8

37

SEG7

36

NC

35

NC

34

SEG6

33

COM 4

COM 1

COM 2

COM 3

COM 5

COM 6

COM 7

SEG0

SEG1

SEG2

SEG3

SEG4

SEG5

2 April 21, 2000

Pad Assignment

CS

RD

WR

DATA

VSS

VDD

VLCD

IR Q

BZ

OSCO

OSCI

T1

T2

T3

4

5

6

7

8

9

10

11

12

13

14

15

HT16220

SEG 20

SEG 22

SEG 23

SEG 25

SEG 26

SEG 27

SEG 28

SEG 29

SEG 30

SEG 31

51

52

53

54

55

1

2

3

16

17

COM 1

COM 0

50

49

18

COM 2

SEG24

48

19

COM 3

47

46

20

COM 4

SEG 21

(0 ,0 )

21

COM 5

45

44

22

COM 6

23

COM 7

24

SEG 0

25

SEG 1

26

SEG 2

27

SEG 3

28

SEG 4

29

SEG 5

43

42

41

40

39

38

37

36

35

34

33

32

31

30

SEG 6

SEG 19

SEG 18

SEG 17 SEG 16

SEG 15

SEG 14

SEG 13

SEG 12

SEG 11

SEG 10

SEG 9

SEG 8

SEG 7

Chip size: 151 ´ 157 (mil)

2

* The IC substrate should be connected to VDD in the PCB layout artwork.

3 April 21, 2000

Pad Coordinates Unit: mil

Pad No. X Y Pad No. X Y

1 2 3 4 5 6 7 8

9 10 11 12 13 14 15 16 17 18 19 20 21 22 14.66 23 21.29 24 27.92 25 34.55 26 41.18 27 47.81 28 54.44

-68.76 72.04

-68.76 59.71

-68.76

-69.53

-69.70

-69.70 -10.28

-69.70 -23.55

-69.70 -38.93

-69.70 -45.56

-69.70 -56.53

-69.70 -63.83

-69.70 -70.46

-39.57 -71.57

-32.94 -71.57

-20.53 -71.57

-13.90 -71.57

-1.49 -71.57

5.14 -71.57

53.08 31 68.98

39.40 32 68.98

24.82 33 68.98 2.85

18.19 34 68.98 9.48

11.56 35 68.98 16.11

1.36 36 68.98 22.74

-72.33

29 61.07 30 67.70

37 68.98 29.37 38 68.98 36.00 39 68.98 42.63 40 68.98 49.26 41 68.98 55.89 42 68.98 62.52 43 68.98 69.15 44 13.85 72.04 45 7.22 72.04 46 0.60 72.04 47 48 49 50 51 52 53 54 55

-6.03

-12.66

-19.30

-25.92

-32.56

-39.19

-45.81

-52.44

-59.08

-72.33

-10.41

-3.78

72.04

HT16220

4 April 21, 2000

Pad Description

Pad No. Pad Name I/O Description

Chip selection input with pull-high resistor. When the CS logic high, the data and command read from or written to the

1CS

2RD

3WR

4 DATA I/O Serial data input/output with pull-high resistor

5 VSS

6 VDD

7 VLCD I LCD operating voltage input pad.

8 IRQ

9, 10 BZ, BZ

11 OSCO O Crystal oscillator output pin

12 OSCI I Crystal oscillator input pin

13~15 T1~T3 I Not connected

16~23 COM0~COM7 O LCD common outputs

24~55 SEG0~SEG31 O LCD segment outputs

HT16220 are disabled. The serial interface circuit is also reset

I

But if the CS data and command transmission between the host controller and the HT16220 are all enabled.

READ clock input with pull-high resistor. Data in the RAM of the HT16220 are clocked out on the rising edge of the RD nal. The clocked out data will appear on the data line. The host

I

controller can use the next falling edge to latch the clocked out data.

WRITE clock input with pull-high resistor. Data on the DATA

I

line are latched into the HT16220 on the rising edge of the WR signal.

Negative power supply, ground

¾

Positive power supply

¾

Time base or watchdog timer overflow flag, NMOS open drain

O

output.

O 2kHz or 4kHz tone frequency output pair

is at logic low level and is input to the CS pad, the

HT16220

is

sig

-

Absolute Maximum Ratings

Supply Voltage ..............................-0.3V to 5.5V

Input Voltage ................V

Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maxi

mum Ratings² may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged expo sure to extreme conditions may affect device reliability.

-0.3V to VDD+0.3V

SS

Storage Temperature ................-50°Cto125°C

Operating Temperature .............-25°Cto75°C

5 April 21, 2000

-

HT16220

D.C. Characteristics

Symbol Parameter

V

I

V

I

R

DD

DD1

DD2

STB

IL

IH

OL1

OH1

OL1

OH1

OL2

OH2

OL3

OH3

PH

Operating Voltage

Operating Current

Standby Current

Input Low Voltage

Input High Voltage

BZ, BZ, IRQ

BZ, BZ

DATA

LCD Common Sink Current

LCD Common Source Current

LCD Segment Sink Current

LCD Segment Source Current

Pull-high Resistor

Test Conditions

V

DD

Conditions

¾¾

3V

No load LCD ON Crystal oscillator

5V

3V

No load/LCD OFF Crystal oscillator

5V

3V

No load Power down mode

5V

3V

DATA, WR,CS,RD

5V 0

3V

DATA, WR,CS,RD

5V 4.0

V

3V

5V

3V

5V

3V

5V

3V

5V

3V

5V

3V

5V

3V

5V

3V

5V

3V

5V 50 100 150

=0.3V

OL

=0.5V

V

OL

V

=2.7V

OH

V

=4.5V

OH

V

=0.3V

OL

=0.5V

V

OL

V

=2.7V

OH

V

=4.5V

OH

V

=0.3V

OL

=0.5V

V

OL

V

=2.7V

OH

V

=4.5V

OH

V

=0.3V

OL

=0.5V

V

OL

V

=2.7V

OH

V

=4.5V

OH

DATA, WR,CS,RD

Min. Typ. Max. Unit

2.7

¾

5.2 V

¾¾ ¾¾ ¾¾ ¾¾

0

18

216

0.6 V

¾

1.0 V

¾ ¾

2.4

¾

0.9 1.8

1.7 3

-0.9 -1.8 ¾

-1.7 -3 ¾

200 450

250 500

-200 -450 ¾mA

-250 -500 ¾mA

15 40

100 200

-15 -30 ¾mA

-45 -90 ¾mA

15 30

70 150

-6 -13 ¾mA

-20 -40 ¾mA

100 200 300

Ta=25°C

50

mA

65

mA

20

mA

30

mA mA mA

3V

5V

mA

¾

mA

¾

mA

¾mA ¾mA

kW kW

6 April 21, 2000

Holtek Semiconductor Inc HT16220 Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

Features

General Description

Selection Table

Block Diagram

Pin Assignment

Pad Assignment

Pad Coordinates Unit: mil

Pad Description

Absolute Maximum Ratings

D.C. Characteristics