Holtek Semiconductor Inc HT1622 Datasheet

RAM Mapping 32´8 LCD Controller for I/O mC

Features

Operating voltage: 2.7V~5.2V

·

Built-in RC oscillator

·

1/4 bias, 1/8 duty, frame frequency is 64Hz

·

Max. 32´8 patterns, 8 commons, 32 segments

·

Built-in internal resistor type bias generator

·

3-wire serial interface

·

8 kinds of time base/WDT selection

·

Time base or WDT overflow output

·

Built-in LCD display RAM

·

R/W address auto increment

·

General Description

HT1622 is a peripheral device specially de signed for I/O type mC used to expand the dis play capability. The max. display segment of the device are 256 patterns (32´8). It also sup ports serial interface, buzzer sound, Watchdog Timer or time base timer functions. The HT1622 is a memory mapping and multi-func tion LCD controller. The software configuration

HT1622

Two selectable buzzer frequencies

·

(2kHz/4kHz) Power down command reduces power

·

consumption Software configuration feature

·

Data mode and Command mode instructions

·

Three data accessing modes

·

VLCD pin to adjust LCD operating voltage

·

Cascade application

·

feature of the HT1622 make it suitable for mul

tiple LCD applications including LCD modules

and display subsystems. Only three lines are required for the interface between the host con

troller and the HT1622. The HT162X series have many kinds of products that match vari ous applications.

-

Selection Table

HT162X HT1620 HT1621 HT1622 HT16220 HT1623 HT1625 HT1626 HT1627 HT16270

COM 44

SEG 32 32

Built-in Osc.

Crystal Osc.

Ö Ö Ö ÖÖÖ Ö

Ö Ö ÖÖÖÖ

8

32

888161616

32 48 64 48 64 64

1 April 21, 2000

Block Diagram

OSCI

CS

RD

WR

DATA

C ontrol

and Tim ing Circuit

D isp lay R A M

LC D D river/ Bias Circuit

HT1622

COM 0

COM 7

SEG 0

Pin Assignment

VDD

VSS

BZ

CS

NC

RD

WR

DATA

VSS

OSCI

VDD

VLCD

IR Q

BZ

NC

BZ

T1

T2

T3

COM 0

COM 1

NC

Tone Frequency

G enerator

SEG28

SEG29

SEG30

SEG31

61

62

63

64

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

23

2021222425262728293031

W atchdog Tim er

Tim e B ase G enerator

SEG23

SEG24

SEG25

SEG26

SEG27

56

57

58

59

60

H T1622

-

64 Q FP

and

SEG22

55

SEG 31

VLCD

IR Q

SEG20

SEG21

NC

52

53

54

NC

51 50

NC

49

SEG19

48

SEG18

47

SEG17

46

SEG16

45

SEG15

44

SEG14

43

SEG13

42

SEG12

41

SEG11

40

SEG10

39

SEG9

38

SEG8

37

SEG7

36

NC

35

NC

34

32

NC

33

COM 5

COM 2

COM 3

COM 4

COM 6

COM 7

SEG0

SEG1

SEG2

SEG3

SEG4

SEG5

SEG6

2 April 21, 2000

Pad Assignment

CS

RD

WR

DATA

VSS

OSCI

VDD

VLCD

IR Q

BZ

T1

T2

T3

COM 0

COM 1

HT1622

SEG 31

SEG 30

SEG 29

SEG 28

SEG 27

SEG 26

SEG 25

SEG 24

SEG 23

SEG 22

SEG 21

SEG 20

1

3

4

5

6

7

8

9

10

11

12

13

14

15

16

COM 2

COM 3

COM 4

COM 5

4317441845194620472148224923502451255226532754

(0 ,0 )

28229

COM 6

COM 7

SEG 0

SEG 1

SEG 2

SEG 3

SEG 4

SEG 5

42

SEG19

41

SEG18

40

SEG17

39

SEG16

38

SEG15

37

SEG14

36

SEG13

35

SEG12

34

SEG11

33

SEG10

32

SEG9

31

SEG8

30

SEG7

SEG 6

Chip size: 149 ´ 155 (mil)

2

* The IC substrate should be connected to VDD in the PCB layout artwork.

3 April 21, 2000

HT1622

Pad Coordinates Unit: mil

Pad No. X Y Pad No. X Y

1 2 3 4 5 6 7 8

9 10 11 12 13 14 15 16 17 18 19 20 21 22 5.48 23 15.00 24 21.63 25 28.26 26 34.89 27 41.52

-68.43

-69.19

-69.36

-69.36 -3.57

-69.36 -16.92

-69.36 -33.83

-69.36 -43.52

-69.36 -50.15

-69.36 -56.78

-69.36 -63.41

-69.36 -70.04

-39.23 -71.14

-32.60 -71.14

-20.19 -71.14

-13.56 -71.14

-1.15 -71.14

71.78 28 48.15

59.46 29 54.78

52.83 30 69.32

39.14 31 69.32

23.89 32 69.32 2.59

16.32 33 69.32 9.22

9.69 34 69.32 15.85

3.06 35 69.32 22.48 36 69.32 29.11 37 69.32 35.74 38 69.32 42.37 39 69.32 49.00 40 69.32 55.63 41 69.32 62.26 42 69.32 68.89 43 14.19 71.78 44 7.57 71.78 45 0.94 71.78

-71.14

-71.91

46 47 48 49 50 51 52 53 54

-5.70

-12.32

-18.95

-25.58

-32.22

-38.85

-45.47

-52.10

-58.74

-71.91

-10.67

-4.04

71.78

4 April 21, 2000

Pad Description

Pad No. Pad Name I/O Description

Chip selection input with Pull-high resistor. When the CS high, the data and command read from or written to the HT1622

1CS

2RD

3WR

4 DATA I/O Serial data input/output with Pull-high resistor

5 VSS

6 OSCI I

7 VDD

8 VLCD I LCD operating voltage input pad

9 IRQ O

10, 11 BZ, BZ

12~14 T1~T3 I Not connected

15~22 COM0~COM7 O LCD common outputs

23~54 SEG0~SEG31 O LCD segment outputs

are disabled. The serial interface circuit is also reset. But if CS

I

at logic low level and is input to the CS mand transmission between the host controller and the HT1622 are all enabled.

READ clock input with Pull-high resistor. Data in the RAM of the HT1622 are clocked out on the rising edge of the RD

I

The clocked out data will appear on the data line. The host con troller can use the next falling edge to latch the clocked out data.

WRITE clock input with Pull-high resistor. Data on the DATA

I

line are latched into the HT1622 on the rising edge of the WR sig nal.

Negative power supply, ground

¾

If the system clock comes from an external clock source, the ex ternal clock source should be connected to the OSCI pad.

Positive power supply

¾

Time base or Watchdog Timer overflow flag, NMOS open drain output

O 2kHz or 4kHz tone frequency output pair

pad, the data and com

HT1622

is logic

is

-

signal.

-

Absolute Maximum Ratings

Supply Voltage..............................-0.3V to 5.5V

Input Voltage ................V

Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maxi

mum Ratings may cause substantial damage to the device. Functional operation of this de vice at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.

-0.3V to VDD+0.3V

SS

Storage Temperature.................-50°Cto125°C

Operating Temperature ..............-25°Cto75°C

5 April 21, 2000

-

HT1622

D.C. Characteristics

Symbol Parameter

V

I

V

I

R

DD

DD1

DD2

STB

IL

IH

OL1

OH1

OL1

OH1

OL2

OH2

OL3

OH3

PH

Operating Voltage

Operating Current

Standby Current

Input Low Voltage

Input High Voltage

BZ, BZ, IRQ

BZ, BZ

DATA

LCD Common Sink Current

LCD Common Source Current

LCD Segment Sink Current

LCD Segment Source Current

Pull-high Resistor

Test Conditions

V

DD

Conditions

¾¾

3V

No load/LCD ON On-chip RC oscillator

5V

3V

No load/LCD OFF On-chip RC oscillator

5V

3V

No load Power down mode

5V

3V

DATA, WR,CS,RD

5V 0

3V

DATA, WR,CS,RD

5V 4.0

V

3V

5V

3V

5V

3V

5V

3V

5V

3V

5V

3V

5V

3V

5V

3V

5V

3V

5V 50 100 150

=0.3V

OL

=0.5V

V

OL

V

=2.7V

OH

V

=4.5V

OH

V

=0.3V

OL

=0.5V

V

OL

V

=2.7V

OH

V

=4.5V

OH

V

=0.3V

OL

=0.5V

V

OL

V

=2.7V

OH

V

=4.5V

OH

V

=0.3V

OL

=0.5V

V

OL

V

=2.7V

OH

V

=4.5V

OH

DATA, WR,CS,RD

Min. Typ. Max. Unit

2.7

¾ ¾ ¾ ¾ ¾ ¾

0

¾

80 210

135 415

830

20 55

18

216

¾ ¾

2.4

¾ ¾

0.9 1.8

1.7 3

-0.9 -1.8 ¾

-1.7 -3 ¾

200 450

250 500

-200 -450 ¾mA

-250 -500 ¾mA

15 40

100 200

-15 -30 ¾mA

-45 -90 ¾mA

15 30

70 150

-6 -13 ¾mA

-20 -40 ¾mA

100 200 300

Ta=25°C

5.2 V

mA mA mA mA mA mA

0.6 V

1.0 V

3V

5V

mA

¾

mA

¾

mA

¾mA ¾mA

kW kW

6 April 21, 2000

Holtek Semiconductor Inc HT1622 Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

Features

General Description

Selection Table

Block Diagram

Pin Assignment

Pad Assignment

Pad Coordinates Unit: mil

Pad Description

Absolute Maximum Ratings

D.C. Characteristics